JPH0648860Y2 - 半導体ウエハ用治具 - Google Patents
半導体ウエハ用治具Info
- Publication number
- JPH0648860Y2 JPH0648860Y2 JP7933785U JP7933785U JPH0648860Y2 JP H0648860 Y2 JPH0648860 Y2 JP H0648860Y2 JP 7933785 U JP7933785 U JP 7933785U JP 7933785 U JP7933785 U JP 7933785U JP H0648860 Y2 JPH0648860 Y2 JP H0648860Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- type
- jig
- molten
- sintered body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 28
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 27
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 13
- 239000011148 porous material Substances 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 25
- 238000000034 method Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021426 porous silicon Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Furnace Charging Or Discharging (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933785U JPH0648860Y2 (ja) | 1985-05-29 | 1985-05-29 | 半導体ウエハ用治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7933785U JPH0648860Y2 (ja) | 1985-05-29 | 1985-05-29 | 半導体ウエハ用治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61197498U JPS61197498U (cg-RX-API-DMAC10.html) | 1986-12-09 |
| JPH0648860Y2 true JPH0648860Y2 (ja) | 1994-12-12 |
Family
ID=30624156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7933785U Expired - Lifetime JPH0648860Y2 (ja) | 1985-05-29 | 1985-05-29 | 半導体ウエハ用治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648860Y2 (cg-RX-API-DMAC10.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009078605A3 (en) * | 2007-12-14 | 2010-07-22 | Worldex Industry & Trading Co., Ltd. | SIC MATERIAL COMPRISING COMBINATION OF α-SIC AND β-SIC AND TWO-PART PLASMA CHAMBER CATHODE MANUFACTURED USING THE SAME |
| US8834520B2 (en) | 2007-10-10 | 2014-09-16 | Wake Forest University | Devices and methods for treating spinal cord tissue |
| US9289193B2 (en) | 2008-07-18 | 2016-03-22 | Wake Forest University Health Sciences | Apparatus and method for cardiac tissue modulation by topical application of vacuum to minimize cell death and damage |
| US9737455B2 (en) | 2007-01-10 | 2017-08-22 | Wake Forest Univeristy Health Sciences | Apparatus and method for wound treatment employing periodic sub-atmospheric pressure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2507213Y2 (ja) * | 1989-02-28 | 1996-08-14 | 京セラ株式会社 | 半導体ウエハ−の加工、測定用真空吸着盤 |
-
1985
- 1985-05-29 JP JP7933785U patent/JPH0648860Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9737455B2 (en) | 2007-01-10 | 2017-08-22 | Wake Forest Univeristy Health Sciences | Apparatus and method for wound treatment employing periodic sub-atmospheric pressure |
| US8834520B2 (en) | 2007-10-10 | 2014-09-16 | Wake Forest University | Devices and methods for treating spinal cord tissue |
| WO2009078605A3 (en) * | 2007-12-14 | 2010-07-22 | Worldex Industry & Trading Co., Ltd. | SIC MATERIAL COMPRISING COMBINATION OF α-SIC AND β-SIC AND TWO-PART PLASMA CHAMBER CATHODE MANUFACTURED USING THE SAME |
| US9289193B2 (en) | 2008-07-18 | 2016-03-22 | Wake Forest University Health Sciences | Apparatus and method for cardiac tissue modulation by topical application of vacuum to minimize cell death and damage |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61197498U (cg-RX-API-DMAC10.html) | 1986-12-09 |
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