JPH0645659A - Multiple-color light emitting chip led - Google Patents
Multiple-color light emitting chip ledInfo
- Publication number
- JPH0645659A JPH0645659A JP4216639A JP21663992A JPH0645659A JP H0645659 A JPH0645659 A JP H0645659A JP 4216639 A JP4216639 A JP 4216639A JP 21663992 A JP21663992 A JP 21663992A JP H0645659 A JPH0645659 A JP H0645659A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- led chip
- led
- color
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、基板上に複数の発光
色のＬＥＤチップを載置した表面実装型多色発光チップ
ＬＥＤに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted multicolor light emitting chip LED in which LED chips of a plurality of light emitting colors are mounted on a substrate.
【０００２】[0002]
【従来の技術】従来、このような表面実装型多発光チッ
プＬＥＤは、例えば図５に示すように構成されている。
即ち、図５において、チップＬＥＤ１は、ガラスエポキ
シ樹脂等から成る基板２の表面に複数の発光色のＬＥＤ
チップ３を載置して、ダイボンディング等により固定す
ると共に、該ＬＥＤチップ３の上面と上記基板２の表面
の隣接した領域に備えられたボンディングパッド５との
間をボンディングワイヤ４により接続した後、上記基板
２の上からそのＬＥＤチップ３を覆うように、透明樹脂
により樹脂モールド部６を成形することにより、構成さ
れている。2. Description of the Related Art Conventionally, such a surface-mounted multi-light emitting chip LED is constructed as shown in FIG. 5, for example.
That is, in FIG. 5, the chip LED 1 is an LED of a plurality of emission colors on the surface of a substrate 2 made of glass epoxy resin or the like.
After the chip 3 is mounted and fixed by die bonding or the like, the upper surface of the LED chip 3 and the bonding pad 5 provided in the adjacent region of the surface of the substrate 2 are connected by the bonding wire 4. The resin mold portion 6 is formed of a transparent resin so as to cover the LED chip 3 from above the substrate 2.
【０００３】このように構成されたチップＬＥＤ１によ
れば、ＬＥＤチップ３のうち、各発光色のＬＥＤチッ
プ、即ち例えば図５（Ｂ）に示すように、赤色ＬＥＤチ
ップ３ｒまたは緑色ＬＥＤチップ３ｇを適宜に発光させ
ることにより、本チップＬＥＤ１から、赤色光または緑
色光が上方に向かって出射せしめられるようになってい
る。According to the chip LED 1 thus constructed, among the LED chips 3, the LED chips of each emission color, that is, the red LED chip 3r or the green LED chip 3g as shown in FIG. By appropriately emitting light, red light or green light can be emitted upward from the chip LED 1.
【０００４】[0004]
【発明が解決しようとする課題】ところで、このような
構成のチップＬＥＤ１においては、基板２の表面の中央
領域に、赤色ＬＥＤチップ３ｒまたは緑色ＬＥＤチップ
３ｇを並べて実装するようにしていることから、これら
のＬＥＤチップ３をどんなに接近させて実装したとして
も、その発光中心が互いにずれてしまい、混色発光の場
合に十分に混色が行なわれ得ず、従って色ムラが生じて
しまい、発光品質が低下してしまうという問題があっ
た。By the way, in the chip LED 1 having such a structure, since the red LED chip 3r or the green LED chip 3g is mounted side by side in the central region of the surface of the substrate 2, No matter how close these LED chips 3 are mounted, their light emission centers are displaced from each other, and in the case of mixed color light emission, sufficient color mixing cannot be performed, resulting in color unevenness and deterioration in light emission quality. There was a problem of doing.
【０００５】この発明は、以上の点に鑑み、複数の発光
色のＬＥＤチップの発光中心を一致させることにより、
混色発光の際に、十分な混色により色ムラが生ずること
なく発光品質が向上され得るようにした、多色発光チッ
プＬＥＤを提供することを目的とする。In view of the above points, the present invention makes the emission centers of LED chips of a plurality of emission colors coincide with each other,
An object of the present invention is to provide a multicolor light emitting chip LED capable of improving light emission quality without causing color unevenness due to sufficient color mixing during mixed color light emission.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、この発明による表面実装型多色発光チップＬＥＤの
一つは、略環状の貫通孔を有する基板と、この貫通孔に
囲まれた部分の上面に配設された第一の発光色のＬＥＤ
チップと、上記貫通孔に囲まれた部分の下面に配設され
た第二の発光色のＬＥＤチップと、上記基板の上面で上
記第一の発光色のＬＥＤチップを覆うように透明樹脂に
より成形された樹脂モールド部と、上記基板の下面で第
二の発光色のＬＥＤチップからの光を上方に向かって反
射するように設けられた反射面とを含んでいることを特
徴としている。また、この発明による表面実装型多色発
光チップＬＥＤの他の一つは、透明又は半透明の基板
と、この基板の上面の所定位置に配設された第一の発光
色のＬＥＤチップと、上記基板の下面の上記所定位置に
対応する位置に配設された第二の発光色のＬＥＤチップ
と、上記基板の上面で上記第一の発光色のＬＥＤチップ
を覆うように透明樹脂により成形された樹脂モールド部
と、上記基板の下面で第二の発光色のＬＥＤチップから
の光を上方に向かって反射するように設けられた反射面
とを含んでいることを特徴としている。To achieve the above object, one of surface-mounting type multicolor light emitting chip LEDs according to the present invention is a substrate having a substantially annular through hole and a portion surrounded by the through hole. LED of the first emission color arranged on the upper surface of the
Molded with transparent resin so as to cover the chip, the LED chip of the second emission color disposed on the lower surface of the portion surrounded by the through hole, and the LED chip of the first emission color on the upper surface of the substrate. And a reflection surface provided so as to reflect upward light from the LED chip of the second emission color on the lower surface of the substrate. Further, another one of the surface mounting type multicolor light emitting chip LEDs according to the present invention is a transparent or semitransparent substrate, and an LED chip of a first light emitting color disposed at a predetermined position on the upper surface of the substrate, Molded with a transparent resin so as to cover the LED chip of the second emission color arranged at the position corresponding to the predetermined position on the lower surface of the substrate and the LED chip of the first emission color on the upper surface of the substrate. And a reflection surface provided so as to reflect light from the LED chip of the second emission color upward on the lower surface of the substrate.
【０００７】[0007]
【作用】上記構成によれば、第一の発光色のＬＥＤチッ
プ及び第二の発光色のＬＥＤチップが、それぞれ基板の
上下両面にて略同軸的に配設されていることから、第一
の発光色のＬＥＤチップからの光は、直接に樹脂モール
ド部から上方に向かって出射すると共に、第二の発光色
のＬＥＤチップからの光は、反射面にて反射された後、
略環状の貫通孔を通って、または基板が透明または半透
明の場合は基板を透過してこの基板の上方へ進み、さら
に樹脂モールド部から上方に向かって出射することにな
る。従って、第一の発光色のＬＥＤチップ及び第二の発
光色のＬＥＤチップは、互いに光軸が略一致しているの
で、同時発光による混色発光の際に、均一に混色が行な
われ得ることになり、色ムラが生ずるようなことはな
い。According to the above construction, the LED chip of the first emission color and the LED chip of the second emission color are arranged substantially coaxially on the upper and lower surfaces of the substrate, respectively. The light from the LED chip of the emission color is directly emitted upward from the resin mold portion, and the light from the LED chip of the second emission color is reflected by the reflecting surface,
The light passes through the substantially annular through-hole or, if the substrate is transparent or semi-transparent, passes through the substrate and advances to the upper side of the substrate, and then is emitted upward from the resin mold portion. Therefore, since the optical axes of the LED chip of the first emission color and the LED chip of the second emission color are substantially coincident with each other, it is possible to uniformly mix the colors in the color mixture emission by the simultaneous emission. Therefore, color unevenness does not occur.
【０００８】また、第一の発光色のＬＥＤチップとし
て、第二の発光色のＬＥＤチップよりも発光輝度が低い
ＬＥＤチップが使用されている場合には、第二の発光色
のＬＥＤチップが反射面により反射され、貫通孔を介し
て基板上方に達する光のみが混色に利用されるので、双
方の発光輝度が平均化され得ることになる。When an LED chip having a lower emission brightness than the LED chip of the second emission color is used as the LED chip of the first emission color, the LED chip of the second emission color is reflected. Since only the light reflected by the surface and reaching the upper side of the substrate through the through hole is used for color mixing, the light emission brightness of both can be averaged.
【０００９】[0009]
【実施例】以下、図面に示した実施例に基づいて、この
発明を詳細に説明する。図１はこの発明によるチップＬ
ＥＤの第一実施例を示している。図２及び図３はそれぞ
れ本実施例の平面図及び底面図である。このチップＬＥ
Ｄ１０は、ガラスエポキシ等から成る不透明な基板１１
と、この基板１１の上面の所定位置に配設され且つダイ
ボンディング等により固定されると共に、その上面がこ
の基板１１の表面の隣接した領域に備えられたボンディ
ングパッド等との間にボンディングワイヤＷにより接続
された第一の発光色のＬＥＤチップ１２とを有してい
る。さらに、このチップＬＥＤ１０は、基板１１の下面
の上記所定位置に対応する位置に配設され且つダイボン
ディング等により固定されると共に、その上面が基板１
１の下面の隣接した領域に備えられたボンディングパッ
ド等との間にボンディングワイヤにより接続された第二
の発光色のＬＥＤチップ１３を有している。そして、基
板１１の上面で上記ＬＥＤチップ１２を覆うように透明
樹脂により成形された樹脂モールド部１４が、また、基
板１１の下面で上記ＬＥＤチップ１３を覆うように透明
樹脂により成形された樹脂モールド部１５が、それぞれ
成形されており、この樹脂モールド部１５の内面は反射
面として作用するようになっている。また、基板１１の
両側には、それぞれこの基板１１上に形成された導電パ
ターン等により構成された取出し電極としてのアノード
１６及びカソード１７が設けられている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the embodiments shown in the drawings. FIG. 1 shows a chip L according to the present invention.
The 1st example of ED is shown. 2 and 3 are a plan view and a bottom view of this embodiment, respectively. This chip LE
D10 is an opaque substrate 11 made of glass epoxy or the like.
And a bonding wire W between the upper surface of the substrate 11 and a bonding pad or the like provided at a predetermined position on the upper surface of the substrate 11 and fixed by die bonding or the like, and the upper surface thereof is provided in a region adjacent to the surface of the substrate 11. And the LED chip 12 of the first emission color connected by. Further, the chip LED 10 is arranged at a position corresponding to the above-mentioned predetermined position on the lower surface of the substrate 11 and fixed by die bonding or the like, and the upper surface thereof is the substrate 1.
The LED chip 13 of the second emission color is connected to the bonding pad or the like provided in the adjacent area of the lower surface of No. 1 by a bonding wire. Then, a resin mold portion 14 formed of a transparent resin on the upper surface of the substrate 11 so as to cover the LED chip 12, and a resin mold formed of a transparent resin so as to cover the LED chip 13 on the lower surface of the substrate 11. The parts 15 are respectively molded, and the inner surface of the resin mold part 15 functions as a reflecting surface. Further, on both sides of the substrate 11, there are provided an anode 16 and a cathode 17 as extraction electrodes, each of which is composed of a conductive pattern or the like formed on the substrate 11.
【００１０】ここで、上記基板１１は、第一の基板層１
１ａとこの第一の基板層１１ａの下側に重ねて貼り合わ
された第二の基板層１１ｂとから成る二層構造として構
成されている。上記第一の基板層１１ａは、中央の周囲
に貫通孔１８を有しており、また第二の基板層１１ｂは
図面にて左右に分割され、中央に凹陥部１９を画成する
ようになっている。こうして、第一の基板層１１ａ及び
第二の基板層１１ｂを貼り合わせたとき、基板１１の下
面の中央付近に画成される凹陥部１９は、第二の基板層
１１ｂの厚さに等しい深さを有することになる。従っ
て、基板１１の第一の基板層１１ａの下面に実装された
第二の発光色のＬＥＤチップ１３及び樹脂モールド部１
５がこの凹陥部１９内に収容されることができる。Here, the substrate 11 is the first substrate layer 1
It is configured as a two-layer structure composed of 1a and a second substrate layer 11b which is laminated and bonded to the lower side of the first substrate layer 11a. The first substrate layer 11a has a through hole 18 around the center, and the second substrate layer 11b is divided into right and left in the drawing to define a recessed portion 19 in the center. ing. Thus, when the first substrate layer 11a and the second substrate layer 11b are bonded together, the recessed portion 19 defined near the center of the lower surface of the substrate 11 has a depth equal to the thickness of the second substrate layer 11b. Will have Therefore, the LED chip 13 of the second emission color mounted on the lower surface of the first substrate layer 11a of the substrate 11 and the resin mold portion 1
5 can be accommodated in this recess 19.
【００１１】尚、第一の基板層１１ａと第二の基板層１
１ｂは、例えばこれらの間に接着剤を塗布しておき、加
熱しながらローラで圧接せしめることにより、貼り合わ
されるようになっている。The first substrate layer 11a and the second substrate layer 1
For example, 1b is adhered by applying an adhesive agent between them and pressing them with a roller while heating.
【００１２】また、上記貫通孔１８は、図示の場合、基
板層１１ａの中心と同心の円環状に形成されており、半
径方向に延びる４本のウェブにより中央部分が支持され
ているが、円環状に限らず、他の形状、例えば四角形，
三角形等、概略環形状をした切欠であってもよい。Further, in the illustrated case, the through hole 18 is formed in an annular shape concentric with the center of the substrate layer 11a, and the central portion is supported by four webs extending in the radial direction. The shape is not limited to a ring, but other shapes such as a square,
It may be a cutout having a substantially ring shape such as a triangle.
【００１３】さらに、上記樹脂モールド部１５は、その
表面が例えば放物面状に形成されている。これにより、
第二の発光色のＬＥＤチップ１３から出射した光がこの
樹脂モールド部１５の内面で反射して、基板１１の第一
の基板層１１ａに設けられた貫通孔１８を通って基板１
１の上方に効率的に達するようになっている。The surface of the resin mold portion 15 is formed, for example, in a parabolic shape. This allows
The light emitted from the LED chip 13 of the second emission color is reflected on the inner surface of the resin mold portion 15, passes through the through hole 18 provided in the first substrate layer 11a of the substrate 11, and the substrate 1
1 is efficiently reached.
【００１４】この発明による多色発光チップＬＥＤ１０
は、以上のように構成されており、第一の発光色のＬＥ
Ｄチップ１２及び第二の発光色のＬＥＤチップ１３は、
それぞれ基板１１の両面にて中心に配設されており、そ
の光軸は一致している。これにより、基板上面にある第
一の発光色のＬＥＤチップ１２からの光は直接に樹脂モ
ールド部１４から上方へ向かって出射すると共に、基板
下面にある第二の発光色のＬＥＤチップ１３からの光は
樹脂モールド部１５の内面による反射面で反射された
後、基板１１の第一の基板層１１ａの中央の周囲に設け
られた貫通孔１８を通って、該基板１１の上方へ進み、
さらに樹脂モールド部１４から上方に向かって出射する
ことになる。Multicolor LED chip 10 according to the present invention
Is configured as described above, and the LE of the first emission color is
The D chip 12 and the LED chip 13 of the second emission color are
Each of the substrates 11 is centrally arranged on both sides of the substrate 11, and their optical axes coincide with each other. As a result, the light from the LED chip 12 of the first emission color on the upper surface of the substrate is directly emitted upward from the resin mold portion 14, and the light from the LED chip 13 of the second emission color on the lower surface of the substrate is emitted. After the light is reflected by the reflecting surface of the inner surface of the resin mold portion 15, the light passes through the through hole 18 provided around the center of the first substrate layer 11a of the substrate 11 and proceeds above the substrate 11.
Further, the light is emitted upward from the resin mold portion 14.
【００１５】従って、第一の発光色のＬＥＤチップ１２
及び第二の発光色のＬＥＤチップ１３は、互いに光軸が
一致しているので、同時発光による混色発光の際に、均
一に混色が行なわれ得ることになり、色ムラが生ずるよ
うなことはない。Therefore, the LED chip 12 of the first emission color
Since the optical axes of the LED chips 13 of the second and second emission colors are coincident with each other, it is possible to mix colors evenly in the case of mixed color light emission by simultaneous light emission, and color unevenness does not occur. Absent.
【００１６】ここで、第二の発光色のＬＥＤチップ１３
からの光は、樹脂モールド部１４の内面により反射さ
れ、貫通孔１８を通過したものだけが混色発光に利用さ
れ得ることから、第一の発光色のＬＥＤチップ１２とし
て、第二の発光色のＬＥＤチップ１３より発光輝度の低
いＬＥＤチップを使用するようにすれば、各ＬＥＤチッ
プ１２，１３からの基板１１の上方に向かって進む光の
発光輝度が平均化され得ることになる。Here, the LED chip 13 of the second emission color
The light emitted from the LED chip 12 of the first emission color is reflected by the inner surface of the resin mold portion 14 and only the light passing through the through hole 18 can be used for mixed color emission. By using an LED chip whose emission brightness is lower than that of the LED chip 13, the emission brightness of the light traveling upward from the LED chips 12, 13 above the substrate 11 can be averaged.
【００１７】図４は第二実施例を示しており、これはガ
ラスエポキシ等からなる不透明な第一の基板層１１ａの
代わりに、二枚の透明または半透明なガラス板１１ａ′
の表面にＬＥＤチップ１２を実装したものを互いに背面
同志で貼り合わせることにより第一の基板層を形成して
成るものである。この場合、貫通孔を設ける必要がなく
なり、加工が容易であるという利点がある。FIG. 4 shows a second embodiment in which two transparent or semitransparent glass plates 11a 'are used instead of the opaque first substrate layer 11a made of glass epoxy or the like.
The first substrate layer is formed by bonding the LED chips 12 mounted on the surface of the above to each other on the back surfaces. In this case, it is not necessary to provide a through hole, and there is an advantage that processing is easy.
【００１８】[0018]
【発明の効果】以上述べたように、この発明によれば、
第一の発光色のＬＥＤチップ及び第二の発光色のＬＥＤ
チップの光軸が互いに略一致しているので、同時発光に
よる混色発光の際に均一に混色が行なわれ得ることにな
り、色ムラが生ずるようなことはない。さらに、第一の
発光色のＬＥＤチップとして、第二の発光色のＬＥＤチ
ップよりも発光輝度が低いＬＥＤチップが使用されてい
る場合には、第二の発光色のＬＥＤチップが、反射面に
より反射され貫通孔を介して基板上方に達する光のみが
混色に利用されるので、双方の発光輝度が平均化され得
ることになる。かくして、この発明によれば、複数の発
光色のＬＥＤチップの発光中心を略一致させることによ
り、混色発光の際に十分な混色により、色ムラが生ずる
ことなく発光品質が向上され得る極めて優れた多色発光
チップＬＥＤが提供される。As described above, according to the present invention,
First emission color LED chip and second emission color LED
Since the optical axes of the chips are substantially coincident with each other, color mixing can be performed uniformly during simultaneous color emission, and color unevenness does not occur. Furthermore, when an LED chip having lower emission brightness than the LED chip of the second emission color is used as the LED chip of the first emission color, the LED chip of the second emission color is changed by the reflecting surface. Since only the light that is reflected and reaches the upper side of the substrate through the through hole is used for color mixing, it is possible to average the emission brightness of both. Thus, according to the present invention, by substantially matching the emission centers of the LED chips of a plurality of emission colors, it is possible to improve the emission quality without causing color unevenness due to sufficient color mixture during mixed color emission. A multicolor light emitting chip LED is provided.
【図１】この発明による多色発光チップＬＥＤの第一実
施例の概略断面図である。FIG. 1 is a schematic sectional view of a first embodiment of a multicolor light emitting chip LED according to the present invention.
【図２】図１の多色発光チップＬＥＤの概略平面図であ
る。FIG. 2 is a schematic plan view of the multicolor light emitting chip LED of FIG.
【図３】図１の多色発光チップＬＥＤの概略底面図であ
る。3 is a schematic bottom view of the multicolor light emitting chip LED of FIG. 1. FIG.
【図４】この発明による多色発光チップＬＥＤの第二実
施例の要部側面図である。FIG. 4 is a side view of the essential parts of a second embodiment of a multicolor light emitting chip LED according to the present invention.
【図５】従来の多色発光チップＬＥＤの一例を示し、
（Ａ）は概略断面図、（Ｂ）は要部の平面図である。FIG. 5 shows an example of a conventional multicolor light emitting chip LED,
(A) is a schematic sectional view, and (B) is a plan view of a main part.
１０ 多色発光チップＬＥＤ １１ 基板 １１ａ 第一の基板層 １１ｂ 第二の基板層 １２ ＬＥＤチップ １３ ＬＥＤチップ １４ 樹脂モールド部 １５ 樹脂モールド部 １６ 取出し電極（アノード） １７ 取出し電極（カソード） １８ 貫通孔 １９ 凹陥部 10 Multicolor Light-Emitting Chip LED 11 Substrate 11a First Substrate Layer 11b Second Substrate Layer 12 LED Chip 13 LED Chip 14 Resin Molding Part 15 Resin Molding Part 16 Extraction Electrode (Anode) 17 Extraction Electrode (Cathode) 18 Through Hole 19 Recess
Claims (3)
孔に囲まれた部分の上面に配設された第一の発光色のＬ
ＥＤチップと、該貫通孔に囲まれた部分の下面に配設さ
れた第二の発光色のＬＥＤチップと、上記基板の上面で
上記第一の発光色のＬＥＤチップを覆うように透明樹脂
により成形された樹脂モールド部と、上記基板の下面で
上記第二の発光色のＬＥＤチップからの光を上方に向か
って反射するように設けられた反射面とを含んでいるこ
とを特徴とする、表面実装型多色発光チップＬＥＤ。1. A substrate having a substantially annular through hole, and a first emission color L provided on an upper surface of a portion surrounded by the through hole.
The ED chip, the LED chip of the second emission color arranged on the lower surface of the portion surrounded by the through hole, and the transparent resin so as to cover the LED chip of the first emission color on the upper surface of the substrate. Characterized in that it includes a molded resin mold portion, and a reflection surface provided on the lower surface of the substrate so as to reflect light from the LED chip of the second emission color upward. Surface-mount type multicolor LED chip.
の所定位置に配設された第一の発光色のＬＥＤチップ
と、該基板の下面の上記所定位置に対応する位置に配設
された第二の発光色のＬＥＤチップと、上記基板の上面
で上記第一の発光色のＬＥＤチップを覆うように透明樹
脂により成形された樹脂モールド部と、上記基板の下面
で上記第二の発光色のＬＥＤチップからの光を上方に向
かって反射するように設けられた反射面とを含んでいる
ことを特徴とする、表面実装型多色発光チップＬＥＤ。2. A transparent or semi-transparent substrate, an LED chip of a first emission color arranged at a predetermined position on the upper surface of the substrate, and a position corresponding to the predetermined position on the lower surface of the substrate. The LED chip of the second emission color, a resin mold part formed of a transparent resin so as to cover the LED chip of the first emission color on the upper surface of the substrate, and the second resin on the lower surface of the substrate. A surface-mounted multicolor light emitting chip LED, comprising: a reflection surface provided so as to reflect light emitted from the LED chip of an emission color upward.
二の発光色のＬＥＤチップよりも発光輝度が低いＬＥＤ
チップが使用されていることを特徴とする、請求項１に
記載の多色発光チップＬＥＤ。3. An LED chip which emits light of a first emission color and whose emission brightness is lower than that of an LED chip which emits a second emission color.
The multicolor light emitting chip LED according to claim 1, characterized in that a chip is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4216639A JP2717906B2 (en) | 1992-07-23 | 1992-07-23 | Multicolor LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4216639A JP2717906B2 (en) | 1992-07-23 | 1992-07-23 | Multicolor LED chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0645659A true JPH0645659A (en) | 1994-02-18 |
| JP2717906B2 JP2717906B2 (en) | 1998-02-25 |
Family
ID=16691597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4216639A Expired - Lifetime JP2717906B2 (en) | 1992-07-23 | 1992-07-23 | Multicolor LED chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2717906B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0734077A1 (en) * | 1995-03-23 | 1996-09-25 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
| JPH10107326A (en) * | 1996-09-30 | 1998-04-24 | Sharp Corp | Side-face light-emitting type led lamp |
| JPH11163412A (en) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led illuminator |
| JP2008205462A (en) * | 2007-02-12 | 2008-09-04 | Cree Inc | Method of forming packaged semiconductor light-emitting device having front contact by compression molding |
| JP2013004560A (en) * | 2011-06-13 | 2013-01-07 | Citizen Electronics Co Ltd | Led illumination unit |
-
1992
- 1992-07-23 JP JP4216639A patent/JP2717906B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0734077A1 (en) * | 1995-03-23 | 1996-09-25 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
| JPH10107326A (en) * | 1996-09-30 | 1998-04-24 | Sharp Corp | Side-face light-emitting type led lamp |
| JPH11163412A (en) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led illuminator |
| JP2008205462A (en) * | 2007-02-12 | 2008-09-04 | Cree Inc | Method of forming packaged semiconductor light-emitting device having front contact by compression molding |
| US8669573B2 (en) | 2007-02-12 | 2014-03-11 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements |
| US8822245B2 (en) | 2007-02-12 | 2014-09-02 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements and methods of forming the same |
| US9061450B2 (en) | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
| JP2013004560A (en) * | 2011-06-13 | 2013-01-07 | Citizen Electronics Co Ltd | Led illumination unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2717906B2 (en) | 1998-02-25 |
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