JPH0645410A - Inner lead bonding head apparatus - Google Patents

Abstract

PURPOSE:To easily and rapidly adjust a parallel property between a pressurizing stage and a bonding head. CONSTITUTION:There are provided a bonding head BH, a hod rod HR for holding the bonding head BH, a spherical bearing CR for elevatably and roakably supporting the head rod HR with respect to the pressurizing stage 16, and rock means RC for allowing or inhibiting the rocking of the bearing CB.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inner lead bonding head device, and more particularly to an inner lead bonding head device capable of easily and quickly adjusting the parallelism between a pressure stage and a bonding head.

[0002]

2. Description of the Related Art An electronic component manufacturing process known as a TAB (tab) method includes a step of forming bumps on a chip, an inner lead bonding step of crimping the chip to an inner lead of a tab tape (film carrier),
After punching out the tab tape, the outer lead bonding step is performed to bond the outer leads to the substrate.

In the inner lead bonding step, a gang bonding head is used so that a plurality of bumps are uniformly crushed and collectively pressed.

It is necessary to adjust the gang bonding head so as to have a high parallelism of about ± 1 μm with respect to the chip or the pressure stage. This is because if the parallelism is reduced, the bumps are not uniformly crushed and the product becomes defective.

The adjustment of the parallelism is performed when the bonding head is worn due to use or the type of tab tape or chip is changed.

FIG. 3 is a sectional view of a conventional inner lead bonding head device. In FIG. 3, ST is a horizontal pressure stage, 51 is a moving table, 52 is a support block supported by the table 51 so as to be swingable in the direction of arrow M2, and HR is slid on the tip of this support block 52. A head rod that is movably mounted. A bonding head BH is detachably attached to the lower part of the head rod HR, and a flange portion HRa of the head rod HR is urged upward by a spring K, whereby the bonding head BH and the rod HR thereof are separated from each other. Has been held. Further, CY is a cylinder and RD is its rod, and this cylinder CY is driven to drive the rod RD.
By projecting in the direction of the arrow M3, the bonding head BH is pressed toward the facing pressure stage ST side. P is a chip, TT is a tab tape, IL
1 and IL2 are inner leads, and BP1 and BP2 are bumps.

[0007]

Here, the pressing surface F2 of the bonding head BH and the receiving surface F of the pressing stage ST.
The parallelism with 1 is adjusted by the operator performing the following work. That is, by rotating the tilt adjusting screw 54 screwed into the support block 52 in the direction of the arrow M1, the tip of the screw 54 is moved to the moving table 51.
Push it against. Further, by gently rotating in the direction of arrow M1, at a position where both sides F1 and F2 are considered to be parallel,
Try bonding. Then, as shown in FIG. 3B, if there is any inconvenience such as uneven bump collapse, the screw 54 is repeatedly adjusted to cancel it.

As described above, in the conventional means, the inclination of the bonding head is adjusted with the screw many times, and the trial is performed.
Since a high parallelism of about ± 1 μm was provided, there was a problem that the adjustment was difficult and the adjustment took a long time.

Therefore, an object of the present invention is to provide an inner lead bonding head device capable of easily and quickly adjusting the parallelism between the pressure stage and the bonding head.

[0010]

SUMMARY OF THE INVENTION The present invention is directed to a bonding head which faces a pressure stage and presses a tab tape and a chip on the pressure stage, a head rod for holding the bonding head, and a head rod. Is provided with a spherical bearing that supports the pressure stage so as to be able to move up and down and swing, and a lock unit that permits or disallows swing of the spherical bearing.

[0011]

According to the above construction, the locking means is first driven to allow the spherical bearing to swing. In this state,
The head rod is lowered and the bonding head is pressed against the pressure stage directly or in parallel via a dummy chip or the like. Then, the locking means is driven to inhibit the swinging of the spherical bearing, and the adjustment is completed.

As described above, it is not necessary to repeat trials and adjustments over and over, and the parallelism can be adjusted easily and quickly.

[0013]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of an inner lead bonder using an inner lead bonding head device according to an embodiment of the present invention, and FIG. 2 is a sectional view of the inner lead bonding head device.

In FIG. 1, TT is a tab tape, and SP is a sprocket for pitch-feeding the tab tape TT. Reference numeral 11 denotes an XY table, which includes an X table 12, a Y table 13, an X motor MX1 and a Y motor (not shown). A base plate 14 is provided on the Y table 13, and a tray 15 as a chip supply unit is placed on the base plate 14. The chip P having the bumps BP formed thereon is transferred to the tray 15. Also Y
On the side of the table 13, chips P from this tray 15
A pressure stage 16 is provided on which is transferred.

Reference numeral 20 denotes a pickup head portion, which includes a bracket 21, a camera 22, and a pickup nozzle 2.
It is configured by mounting 3. A block 24 is mounted on the rear portion of the bracket 21, and the block 24 is mounted on a vertical guide shaft 25. Motor M
When Z1 is driven, the pickup nozzle 23 moves up and down.

The XY table 11 is driven to drive the tray 15
The predetermined chip P stored in the camera is moved right below the camera 22 and observed by the camera 22 to detect the presence or absence of the chip P. Further, the XY table 11 is driven to move the chip P directly below the pickup nozzle 23, the motor MZ1 is driven to move the pickup nozzle 23 up and down, and the chip P is picked up. Next, the XY table 11 is driven to move the pressure stage 16 directly below the chip P attracted to the pickup nozzle 23, and the motor MZ1 is driven to move the pickup nozzle 23 up and down, thereby pressing the chip P. It is mounted on the stage 16.

Reference numeral 31 is a second XY table, which includes an X table 32, a Y table 33, and an X motor MX.
2. Y motor MY2. An inner lead bonding head device 30 is provided on the Y table 33. 38 is a main body case.

Numeral 40 is an adsorption stage. An opening 41 is opened at the center of the suction stage 40. A suction hole (not shown) is formed around the opening 41. With the pitch feed of the tab tape TT stopped, the upper surface of the tab tape TT is adsorbed and fixed in this adsorption hole. Further, in this state, the pressure stage 16 on which the chip P is mounted moves right below the opening 41, and the bump BP formed on the upper surface of the chip P is removed from the tab tape TT.
Press the inner lead IL of.

BL is a first support block extending from the lower portion of the main body box 38 to above the opening portion 41, and has a spherical air bearing CB and a holder H which will be described later.
D, head rod HR, bonding head BH, etc. are installed. Further, 34 is a second support block extending from the upper part of the main body box 38 to above the first support block BL. In this second support block 34, the head rod HR and the rod RD facing downward are provided. As a result, the cylinder CY that presses in and out freely is mounted.

Next, the inner lead bonding head device 30 according to this embodiment will be described in detail with reference to FIG.

First, a concave portion 34 having a spherical surface is formed in the lower portion of the first support block BL, and the concave portion 3 is formed.
A circular hole 35 penetrating above the support block BL is formed in the top portion of No. 4. NZ is a nozzle that opens in the recess 34, and the nozzle NZ injects the compressed air CA supplied from the compressed air supply unit AS toward the inside of the recess 34 in accordance with a command. Reference numeral 16a is a blowout nozzle that is opened upward on the pressure stage 16. The blowout nozzle 16a is provided coaxially with the central axes of the bonding head BH and the head rod HR, and the blowout nozzle 16a is also supplied with the compressed air CA from the compressed air supply unit AS. Then, as will be described later, when the bonding head BH is lowered and this BH is made to follow the pressure stage 16, compressed air CA is jetted from the blowout nozzle 16a toward the lower surface of the bonding head BH as shown by the arrow in FIG. . By doing so, as shown in a partially enlarged view of FIG. 2B, a minute air gap δ can be created between the lower surface of the bonding head BH and the pressure stage 16. As a result, the frictional force generated between the bonding head BH and the pressure stage 16 can be reduced as compared with the case where the bonding head BH is brought into direct contact with the pressure stage 16, and the above-described tracing operation can be performed smoothly. Moreover, since the blowout nozzle 16a is configured to inject the compressed air CA toward the center O of the bonding head BH, the bonding head BH is moved by the pressure stage 1.
6 is less likely to be displaced.

RT is a rotating body having a spherical surface having substantially the same diameter as the spherical surface formed by the concave portion 34, and a holder HD is mounted on the central portion of this rotating body RT by a bolt BT. The bush BS is attached to the inner cylinder of the holder HD by
The head rod HR is supported slidably in the vertical direction. BH is a bonding head detachably attached to the lower part of the head rod HR.

K is a lock spring interposed between the upper portion of the support block 33 and the upper flange portion HDa of the holder HD, and the ring RG is provided above the lock spring K.
Is installed. In addition, AM has a ring RG at the right end in FIG.
, The left end is connected to the rod RD2 of the unlocking cylinder CY2, and the middle is connected by the pivot 36.
It is an arm pivotally attached to the upper part of the support block 33. Then, normally, the rod RD2 of the cylinder CY2 is in a retracted state as shown by the solid line, and the spring force of the lock spring K directed upward is applied to the holder HD via the ring RG and the flange portion HDa, the holder HD, and the head. The rod HR and the bonding head BH are elastically held at the position indicated by the solid line in FIG. These cylinders CY2, arm AM, ring R
From G, lock spring K, etc., spherical bearing CB described later
The lock means RC is formed to allow the rocking of the rock.

K2 is a spring interposed between the upper flange portion HRa of the head rod HR and the flange portion HDa, and the spring K2 causes the head rod HR and the bonding head BH to spring against the holder HD. I have it. BL is a pressed member made of a sphere attached to the center of the top of the head rod HR. Further, the support block 33 is made of a magnetic material such as iron and has a permanent magnet MG.
The magnetic force in the direction of adhering each other always acts between and the support block 33.

The recess 34, the rotating body RT, and the nozzle N
A spherical air bearing CB is formed from Z, the magnet MG, and the like. This spherical air bearing CB is capable of moving the head rod HR up and down with respect to the pressure stage 16 and is indicated by an arrow Nθ.
It is supported so that it can swing in any direction. Moreover, FIG.
As shown by the arrow in (a), the center of the lower surface (pressing surface) of the bonding head BH is designed to coincide with the center position of the recess 34 and the rotating body RT, and the head rod HR and the bonding are formed in the direction of the arrow Nθ. Even if the head BH is swung, the center of the bonding head BH is not displaced. Therefore, the bonding head BH can be extremely easily
Can be adjusted.

The inner lead bonding apparatus according to this embodiment is constructed as described above, and the procedure of tilt adjustment (adjustment of the parallelism between the bonding head and the pressure stage) by this apparatus will be described below.

First, when it is necessary to replace the bonding head BH such as when the bonding head BH is worn or the type of the chip P is changed, the head rod HR mounted with the new bonding head BH is attached to the spherical air bearing CB. Attach to.

Next, the compressed air supply section AS is driven to inject the compressed air CA from the nozzle NZ toward the rotating body RT.
Further, the cylinder CY2 is driven so that the rod RD2 is projected and the lock spring K is contracted so that the spring force of the lock spring K does not reach the flange portion HDa. That is, the locked state of the locking means RC is released. In addition, the fluid force of the compressed air CA balances the magnetic force of the permanent magnet MG to balance the rotor RT, that is, the bonding head BH.
Is made swingable in the direction of arrow Nθ. Further, the compressed air CA is blown upward (from the bonding head BH side) from the blow nozzle 16a.

While maintaining this state, the cylinder CY
(See FIG. 1) is driven to cause the rod RD to project, and the pressing force of the cylinder CY is exerted on the head rod HR via the pressed element BL. Then, the bonding head BH is lowered and brought close to the pressure stage 16. At this time, the pressing force by the cylinder CY is much smaller than the load during actual bonding, or the bonding head BH may be lowered by the weight of the head rod HR and the bonding head BH. Although not shown, of course, a dummy chip may be placed on the pressure stage 16 and brought into contact with the dummy chip.

Here, as shown in FIG. 2B, the axial direction V.V. A direction orthogonal to L. When the pressure stage 16 has an angle θ1 (broken line position) or an angle θ2 (chain line position) relative to L, the rotating body RT
Swings following this inclination, and the bonding head BH
It is possible to make the lower surface (pressing surface) and the pressing stage 16 parallel to each other. Here, a minute air gap δ is formed between the pressure stage 16 and the bonding head BH by the compressed air CA blown from the blow nozzle 16a.
The bonding head BH smoothly follows the pressure stage 16 with almost no friction between the both 16 and BH. Moreover, since the center O of the lower surface of the bonding head BH is not displaced during the adjustment as described above, the parallelism can be adjusted extremely easily and quickly.

While keeping this state, the rod RD2 of the cylinder CY2 is retracted, the spring force of the lock spring K is exerted on the flange portion HDa, and the inclination of the bonding head BH is fixed. At the same time, the supply of the compressed air CA from the compressed air supply unit AS is stopped, and the rotor RT and the support block 33 are bonded by the magnetic force of the permanent magnet MG. Then, the inner lead bonding step is performed.

[0033]

According to the present invention, a bonding head that faces a pressure stage and press-bonds a tab tape and a chip on the pressure stage, a head rod that holds the bonding head, and the head rod are pressed against each other. It has a spherical bearing that supports the stage so as to be able to move up and down and swing, and a locking means that permits or disallows the swing of the spherical bearing. Therefore, it is possible to easily and quickly adjust the bonding head parallel to the pressure stage or chip without repeating trials and adjustments, and to suppress loss time when the bonding head needs replacement. You can

[Brief description of drawings]

FIG. 1 is a perspective view of a bonder using an inner lead bonding head device according to an embodiment of the present invention.

2A is a sectional view of an inner lead bonding head device according to an embodiment of the present invention. FIG. 2B is a partially enlarged sectional view of the vicinity of an inner lead bonding head according to an embodiment of the present invention.

FIG. 3A is a cross-sectional view of an inner lead bonding head device of a conventional means. FIG. 3B is a partially enlarged cross-sectional view of the vicinity of an inner lead bonding head of a conventional means.

[Explanation of symbols]

 16 Pressure Stage TT Tab Tape P Chip BH Bonding Head CB Spherical Bearing RC Lock Means

Claims (1)

[Claims] 1. A bonding head that faces a pressure stage and presses a tab tape and a chip on the pressure stage, a head rod that holds the bonding head, and the head rod with respect to the pressure stage. An inner lead bonding head device, comprising: a spherical bearing that is vertically movable and swingably supported; and a locking unit that allows swinging of the spherical bearing.