JPH0644205U - Non-reciprocal circuit element - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a non-reciprocal circuit device capable of preventing connection failure due to misalignment of matching capacitors and ferrites and preventing short circuit due to contact with a ground plate to improve quality reliability. . A ferrite 3 is brought into contact with the intersecting portions of a plurality of central conductors 9a to 9c arranged so as to intersect each other in an electrically insulated state, and one end of each of the central conductors 9a to 9c is used as a matching capacitor C1 to C3. The circulator 1 (non-reciprocal circuit device) by connecting the other end to the ground plate 14
In this case, the insulating substrate 6 is used as the ground plate 14. Further, the first ground electrode 7 in which the other end portions of the central conductors 9a to 9c are connected to one main surface of the insulating substrate 6.
a to 7c are patterned, and a second ground electrode 7d is patterned on the other main surface.
The a through 7c and the second ground electrode 7d are connected by the through hole electrode 8 or the side surface electrode 15. Further, the insulating substrate 6 is provided with positioning holes 6a and 6b into which the matching capacitors C1 to C3 and the ferrite 3 are inserted.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to non-reciprocal circuit devices such as circulators and isolators, in particular, it can prevent connection failure due to misalignment of matching capacitors and ferrite, and can prevent short circuit due to contact with the ground plate to improve reliability of quality. It is related to the structure that was able to improve.

[0002]

[Prior art]

 Generally, circulators and isolators used in the VHF, UHF, and SHF bands have a function of passing signals only in the transmission direction and blocking transmission in the reverse direction. For example, mobile phones, car phones, etc. Is an indispensable component for mobile communication equipment. As such a circulator, there is one having a structure shown in FIGS. 5 and 6, for example. In this circulator 30, a ferrite 32 is arranged on a lower case 31a, a laminated center electrode substrate 33 is arranged on the ferrite 32, and a terminal block 34 is arranged on the electrode substrate 33. An upper case 31b is attached to the lower case 31a to form a magnetic closed circuit, and a permanent magnet 35 attached to the inner wall surface of the upper case 31b is used to apply a DC magnetic field to the ferrite 32. . Further, one electrode of the chip capacitors C1 to C3 having a single plate shape is connected to the lower case 31a, and the other electrode is connected to one end portion 36a of each central conductor 36 of the central electrode substrate 33. There is.

Further, in the circulator 30, when the other end 36b of each center conductor 36 is connected to the ground, conventionally, an earth plate 37 is connected to the bottom wall of the lower case 31a by a half-pad connection. The other end 36b of each center conductor 36 is soldered and connected to the ground plate 37. The ground plate 37 is made of a copper plate or a brass plate, and has an opening hole 37a into which the chip capacitors C1 to C3 and the ferrite 32 are inserted. The opening hole 37a is formed in the mold. It is formed by punching out with, or by an etching method. The ground plate 37 is formed to have substantially the same thickness as the chip capacitors C1 to C3 and the ferrite 32. Further, in order to avoid contact with the capacitors C1 to C3 and the ferrite 32, the opening hole 37a is made as large as possible. Is forming.

[0004]

[Problems to be solved by the device]

 However, in the conventional ground plate 37, the chip capacitors C1 to C3 and the ferrite 32 arranged in the opening 37a of the ground plate 37 are apt to be displaced in the assembly process and the like, which may cause a connection failure, resulting in reliability of quality. There is a problem that is low. Here, when the opening hole 37a is set to a size into which the capacitors C1 to C3 and the ferrite 32 are inserted, the elements C1 to C3 and 32 are close to the ground plate 37. There is a problem in that the protrusion of 38 easily causes a short circuit, resulting in a malfunction.

The present invention has been made in order to solve the above-mentioned conventional problems. It is possible to eliminate a connection failure due to the displacement of the chip capacitor and the ferrite, and to prevent a short circuit due to contact with the ground plate. It is an object of the present invention to provide a non-reciprocal circuit device that can improve the reliability of the device.

[0006]

[Means for Solving the Problems]

 Therefore, in the present invention, ferrite is arranged in a plurality of center conductors arranged so as to intersect in an electrically insulated state, one end of each center conductor is connected to a matching capacitor, and the other end is connected to a ground plate. In a connected nonreciprocal circuit device, the ground plate is composed of an insulating substrate, and a first ground electrode, to which the other end of each of the central conductors is connected, is patterned on one main surface of the insulating substrate. At the same time, a pattern is formed on the other main surface of the first ground electrode and the second ground electrode connected through the through-hole electrode or the side surface electrode, and the matching capacitor and ferrite are inserted into the insulating substrate. It is characterized by the formation of positioning holes.

[0007]

According to the nonreciprocal circuit device of the present invention, the ground electrodes are formed on both main surfaces of the insulating substrate, and both electrodes are connected by the through-hole electrode and the side electrode. Since the positioning hole for inserting the matching capacitor and ferrite is formed in the board, the capacitor and the ferrite can be positioned reliably while ensuring the electrical characteristics of the ground plate, and the connection failure due to the positional deviation can be prevented. It can be prevented. Further, since it is composed of the above-mentioned insulator substrate, short-circuiting does not occur, for example, even if solder is squeezed out, malfunctions can be prevented, and reliability of quality can be improved.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. 1 to 3 are views for explaining a non-reciprocal circuit device according to an embodiment of the present invention. In this embodiment, a case where the present invention is applied to a lumped constant type circulator will be described as an example. In the figure, reference numeral 1 is a circulator of this embodiment, in which a disk-shaped ferrite 3 is arranged on a lower case 2a made of a magnetic metal, and a center electrode substrate 4 is arranged on the ferrite 3. Then, an upper case 2b also made of a magnetic metal is attached to the lower case 2a to form a magnetic closed circuit, and a permanent magnet 5 is attached to the inner wall surface of the upper case 2b. Thus, a direct current magnetic field is applied to the ferrite 3.

The central electrode substrate 4 has first and second central conductors 9a and 9b formed on the upper surface and the lower surface of the substrate 4, respectively, and a third central conductor 9c formed inside the electrode substrate 4. It is a laminated type. The respective central conductors 9a to 9c are arranged in an electrically insulated state and are arranged in an intersecting manner at an angle of 120 degrees with each other, and the above-mentioned ferrite 3 is in contact with this intersecting portion.

Further, both ends of each of the central conductors 9a to 9c are led out to the upper surface and the lower surface of the electrode substrate 4 through the through-hole electrodes 10, and the port electrodes 11a to 11f are provided at the lead-out portions on both surfaces. Has been formed. The port electrodes 11a to 11f extend to the outer edge of the electrode substrate 4, and the port electrodes 11a to 11f facing each other with the substrate 4 interposed therebetween are connected by the through-hole electrode 10.

A terminal block 12 is disposed above the center electrode substrate 4, and the terminal block 12 has an earth terminal 17 and an input / output terminal made of a metal plate on the left and right legs 13 b of the resin member 13, respectively. The terminal 18 is arranged. The terminal block 12 is formed by inserting the terminals 17 and 18 into a resin member 13. An insertion hole 13a is formed in the center of the main body of the resin member 13, and the permanent magnet 5 is inserted into the insertion hole 13a.

The inner ends (not shown) of the terminals 17 and 18 are exposed on the inner lower surfaces of the left and right leg portions 13 b of the resin member 13, and the inner ends of the terminals 17 and 18 are the center electrode substrate 4 respectively. It is connected to each port electrode 11a-11f on the upper surface. Here, the input / output terminal 18 is connected to the input / output port electrodes 11a, 11c, 11e, and the ground terminal 17 is connected to the remaining ground port electrodes 11b, 11d, 11f. The outer ends of the terminals 17 and 18 are disposed on the side surfaces of the leg portion 13b, and the leg portion 13b is exposed to the outside from the opening 16 of the lower case 2a.

On the bottom wall of the lower case 2a, a ground plate 14 which is a feature of this embodiment is arranged. The ground plate 14 is composed of an insulator substrate 6 made of, for example, glass epoxy resin. A circular positioning hole 6a is formed in the center of the insulating substrate 6, and the ferrite 3 is inserted and arranged in the positioning hole 6a. In addition, rectangular positioning holes 6b are formed in the periphery of the positioning holes 6a of the insulating substrate 6 at an angle of 120 degrees, and each of the positioning holes 6b has a single plate chip capacitor C1. C3 is inserted and arranged. The insulator substrate 6 is set to have substantially the same thickness as the capacitors C1 to C3 and the ferrite 3.

First earth electrodes 7 a to 7 c are patterned between the positioning holes 6 b on the upper surface of the insulator substrate 6, and the earth electrodes 7 a to 7 c extend to the outer edge of the substrate 6. A second ground electrode 7d is formed on the entire lower surface of the insulating substrate 6, and the first and second ground electrodes 7a to 7d are formed by a screen printing method or an etching method. is there. Further, each of the first ground electrodes 7a to 7c and the second ground electrode 7d are connected via a through hole electrode 8 formed on the substrate 6, and among the first ground electrodes 7a to 7c. The end is connected to the second ground electrode 7d via the side surface electrode 15 formed on the inner peripheral surface of the positioning hole 6a.

One electrode of each of the chip capacitors C1 to C3 is connected to the lower case 2a by a solder 19 (see FIG. 2), and the other electrode is connected to each of the input / output port electrodes 11a on the lower surface of the center electrode substrate 4, Solder 19 is connected to 11c and 11e. The first ground electrodes 7a to 7c are connected to the ground port electrodes 11b, 11d and 11f on the lower surface of the center electrode substrate 4 by solder 19, and the second ground electrode 7d is soldered to the lower case 2a. Connected by.

Next, the function and effect of this embodiment will be described. According to the circulator 1 of the present embodiment, the ground plate 14 is formed of the insulating substrate 6, the positioning holes 6a and 6b are formed in the substrate 6, and the first and second surfaces are formed on both surfaces of the insulating substrate 6. Since the ground electrodes 7a to 7d are formed in a pattern and the first ground electrodes 7a to 7c and the second ground electrode 7d are connected by the through-hole electrode 8 and the side electrode 15, the ground plate made of a conventional metal plate is used. While obtaining the grounding characteristics similar to those described above, by inserting the ferrite 3 and the chip capacitors C1 to C3 into the respective positioning holes 6a and 6b of the insulating substrate 6, the positioning can be surely performed, and the connection failure due to the misalignment is caused. Can be prevented.

Further, since the ground electrodes 7a to 7d are formed on the insulating substrate 6, even if the solder 19 is squeezed out, there is no short circuit with the substrate 6, and furthermore, the electrodes on the upper surface of the chip capacitors C1 to C3. Since there is no electrode in contact with each of the ground electrodes 7a to 7c, a short circuit can be avoided from this point as well, and the reliability of the quality can be improved accordingly.

Further, when a conventional ground plate made of a metal plate is used, metal powder or the like of the metal plate may remain in the component, and as a result, a short circuit may occur even after assembly. On the other hand, in this embodiment, since the electrodes are patterned on the insulating substrate, the metal powder does not enter. In addition, the insulating substrate of this embodiment can be formed on the glass epoxy resin by a general method such as screen printing or etching, which can reduce the cost as compared with the conventional copper plate or brass plate. It can contribute to the cost reduction and weight reduction of parts.

Although the circulator has been described as an example in the above embodiment, the present invention can be applied not only to the isolator but also to other high frequency components. Further, in the above-mentioned embodiment, the first ground electrodes 7a to 7c and the second ground electrode 7d of the insulator substrate 6 are connected by both the through-hole electrode 8 and the side surface electrode 15. However, the present invention is not limited to this. You may connect with only one.

FIG. 4 shows an example applied to an isolator. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts. In this lumped constant isolator 20, a pair of terminal chip resistors 21 are arranged on one input / output port electrode 11e of the center electrode substrate 4, and one electrode of each chip resistor 21 is connected to the port electrode 11e. At the same time, the other electrode is connected to each of the earth port electrodes 11d and 11f so that the port electrode 11e is not connected to the external circuit. Also in this isolator 20, the insulator plate 6 is adopted for the ground plate 14, the positioning holes 6a and 6b are formed in the substrate 6, and the first and second main surfaces of the insulator substrate 6 are formed on the both main surfaces. Since the second ground electrodes 7a to 7d are formed, the same effect as in the above embodiment can be obtained.

[0021]

[Effect of device]

 As described above, according to the nonreciprocal circuit device of the present invention, the ground plate is formed of the insulating substrate, the first ground electrode is patterned on one main surface of the substrate, and the first ground electrode is formed on the other main surface. Since the second earth electrode connected to the earth electrode through the through-hole electrode or the side surface electrode is pattern-formed, and the matching capacitor and the positioning hole into which the ferrite is inserted are formed in the insulating substrate, the matching capacitor is formed. It is possible to prevent connection failure due to the displacement of the ferrite and the position of the ferrite, and to prevent short-circuit due to contact with the ground plate, thus improving the reliability of quality.

[Brief description of drawings]

FIG. 1 is an exploded perspective view illustrating a non-reciprocal circuit device according to an embodiment of the present invention.

FIG. 2 is a sectional view of the circulator of the above embodiment.

FIG. 3 is a diagram for explaining the ground plate of the above embodiment.

FIG. 4 is an exploded perspective view showing an isolator according to another example of the above embodiment.

FIG. 5 is an exploded perspective view showing a circulator using a conventional ground plate.

FIG. 6 is a cross-sectional view showing a circulator using a conventional ground plate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circulator (non-reciprocal circuit element) 3 Ferrite 9a-9c Central conductor 6 Insulator substrate 6a, 6b Positioning hole 7a-7c 1st earth electrode 7d 2nd earth electrode 8 Through hole electrode 14 Ground plate 15 Side electrode 20 Isolator (non-) Reversible circuit element)

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Takashi Kawanami, 26--10 Ten Tenjin, Nagaokakyo, Kyoto Prefecture, Murata Manufacturing Co., Ltd. (72) Takashi Hasegawa 2-26-10, Tenjin, Nagaokakyo, Kyoto Stock Company Murata Manufacturing Co., Ltd. (72) Inventor Katsuyuki Taihei 2 26-10 Tenjin Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A ferrite is disposed on a plurality of center conductors arranged so as to intersect in an electrically insulated state, one end of each center conductor is connected to a matching capacitor, and the other end is connected to a ground plate. In the connected non-reciprocal circuit device, the ground plate is composed of an insulating substrate, and a first ground electrode to which the other end of each of the central conductors is connected is patterned on one main surface of the insulating substrate. At the same time, a pattern is formed on the other main surface of the first ground electrode and the second ground electrode connected through the through-hole electrode or the side surface electrode, and the positioning for inserting the matching capacitor and the ferrite into the insulating substrate. A non-reciprocal circuit element having a hole formed therein.