JPH0644202U - Bandpass filter structure - Google Patents

Bandpass filter structure

Info

Publication number
JPH0644202U
JPH0644202U JP8458792U JP8458792U JPH0644202U JP H0644202 U JPH0644202 U JP H0644202U JP 8458792 U JP8458792 U JP 8458792U JP 8458792 U JP8458792 U JP 8458792U JP H0644202 U JPH0644202 U JP H0644202U
Authority
JP
Japan
Prior art keywords
bandpass filter
filter
pieces
dielectric substrate
stripline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8458792U
Other languages
Japanese (ja)
Inventor
清二 善最
Original Assignee
東洋通信機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋通信機株式会社 filed Critical 東洋通信機株式会社
Priority to JP8458792U priority Critical patent/JPH0644202U/en
Publication of JPH0644202U publication Critical patent/JPH0644202U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 (修正有) 【目的】共振器の数を増加せしめ多段化せんと構成した
場合であっても、素子の実装面積を極限し、機器の小型
化に対応可能なバンドパスフィルタの構造を提供するこ
とを目的とする。 【構成】誘電体基板の一の主表面に導体パターンを形成
したストリップライン型バンドパスフィルタを数片のフ
ィルタ片4,5,6に分割し、これらを重ね合わせて立
体的に組み立て、フィルタ片4,5,6の端部でアース
板および導体パターン同志をそれぞれ電気的に接続して
構成したものである。
(57) [Summary] (Correction) [Purpose] Even if the number of resonators is increased and configured as a multistage resonator, the mounting area of the element is limited and the bandpass can be made smaller. The purpose is to provide the structure of the filter. [Structure] A strip line type band pass filter having a conductor pattern formed on one main surface of a dielectric substrate is divided into several pieces of filter pieces 4, 5 and 6, and these pieces are superposed and three-dimensionally assembled to form a filter piece. The ground plate and the conductor patterns are electrically connected to each other at the ends of 4, 5, and 6.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

マイクロ波伝送装置のバンドパスフィルタ、殊に携帯用機器等の小型化に伴う フィルタ形状の小型化に関する。 The present invention relates to a bandpass filter of a microwave transmission device, and more particularly to downsizing of a filter shape accompanying miniaturization of a portable device or the like.

【0002】[0002]

【従来の技術】[Prior art]

近年の電子機器等の小型化に伴い、マイクロ波伝送装置の分野に於いても小型 化への要求が高まり、バンドパスフィルタとして従来の導波管の共振を利用する ものから、誘電体基板上に導体パターンを形成したストリップライン共振器を用 いたものが主流となりつつある。 With the recent miniaturization of electronic devices and the like, the demand for miniaturization has increased in the field of microwave transmission equipment as well, and the conventional waveguide resonance is used as a bandpass filter on a dielectric substrate. The use of stripline resonators with conductor patterns formed on the inside is becoming the mainstream.

【0003】 例えば、図4(a)に示す如く、誘電体基板1の一の主表面にアース板2を付 着し、前記基板1の他の主表面に導電パターン3を付着した両端開放型半波長共 振器が互いに並列結合するよう形成された、ストリップライン型バンドパスフィ ルタが広く用いられている。更に、同図(b)に示す如く、前述の導電パターン 3を、前記誘電体基板1と一方の主表面にアース板2′を付着した誘電体基板1 ′との間に挟むように構成した、ストリップライン型バンドパスフィルタもしば しば用いられる。For example, as shown in FIG. 4 (a), a ground plate 2 is attached to one main surface of a dielectric substrate 1 and a conductive pattern 3 is attached to the other main surface of the substrate 1 to open both ends. Stripline bandpass filters are widely used in which half-wave resonators are connected in parallel. Further, as shown in FIG. 3B, the above-mentioned conductive pattern 3 is arranged so as to be sandwiched between the dielectric substrate 1 and the dielectric substrate 1 ′ having a ground plate 2 ′ attached to one main surface. Stripline bandpass filters are also often used.

【0004】 しかしながら、上述した如き構成のストリップライン型バンドパスフィルタに 於いては、前記共振器の数を増加せしめ多段化せんとすると、フィルタ素子の外 形形状が長くなるため、装置へ組み込む際に素子が占有する面積が増大し、装置 の小型化に対応できないという欠点があった。However, in the stripline bandpass filter having the above-mentioned configuration, if the number of the resonators is increased to form a multistage structure, the external shape of the filter element becomes long, and therefore, when the filter element is incorporated in the device. In addition, the area occupied by the element increases, and there is a drawback that the device cannot be downsized.

【0005】[0005]

【考案の目的】[The purpose of the device]

本考案は上述した如き従来のストリップライン型バンドパスフィルタの欠点を 除去するためになされたものであって、共振器の数を増加せしめ多段化せんと構 成した場合であっても、素子の実装面積を極限し、機器の小型化に対応可能なバ ンドパスフィルタの構造を提供することを目的とする。 The present invention was made in order to eliminate the drawbacks of the conventional stripline bandpass filter as described above, and even when the number of resonators is increased and the multistage structure is adopted, the element It is an object of the present invention to provide a bandpass filter structure that can be mounted in a miniaturized device by limiting the mounting area.

【0006】[0006]

【考案の概要】[Outline of the device]

誘電体基板の一の主表面に導体パターンを形成したストリップライン型バンド パスフィルタを数片に分割し、これらを重ね合わせて立体的に組み立て、前記パ ターンを互いに電気的に接続して構成したものである。 A stripline type bandpass filter with a conductor pattern formed on one main surface of a dielectric substrate was divided into several pieces, and these were superposed and three-dimensionally assembled, and the patterns were electrically connected to each other. It is a thing.

【0007】[0007]

【実施例】【Example】

以下本考案を実施例を示す図面に基づいて詳細に説明する。 図1(a)、(b)はそれぞれ本考案に係るストリップライン型バンドパスフ ィルタの一実施例の構成を示す外観斜視図及びA−A断面図であって、図中4乃 至6は従来のストリップライン型バンドパスフィルタを所定の長さに分割したフ ィルタ片であり、互いにほぼ平行となるよう配置する。而して、各フィルタ片の 端部にてアース板及び導電パターン同志をそれぞれ接続した上で全体をモールド 材7にてモールドしたものである。 このように構成したことによって、高さ方向の寸法が増大するものの、装置内 のプリント基板等にこれを実装するときの実装面積がこの例の場合約1/3と小 型となり、プリント基板の小面積化、更には装置の小型化を実現することが可能 となる。 Hereinafter, the present invention will be described in detail with reference to the drawings illustrating an embodiment. 1 (a) and 1 (b) are respectively an external perspective view and an AA cross-sectional view showing the configuration of an embodiment of a stripline bandpass filter according to the present invention, in which 4 through 6 are conventional ones. It is a filter piece obtained by dividing a stripline bandpass filter into a predetermined length, and is arranged so as to be substantially parallel to each other. Thus, the ground plate and the conductive patterns are connected to each other at the end of each filter piece, and the whole is molded with the molding material 7. With this configuration, the size in the height direction increases, but the mounting area for mounting it on a printed circuit board in the device is as small as about 1/3 in this example, and the size of the printed circuit board is reduced. It is possible to reduce the area and further downsize the device.

【0008】 又、図2(a)は本考案に係るバンドパスフィルタの第2の実施例を示す斜視 図であって、8は同図(b)に示す如きフレキシブル基板にフィルタの構成に必 要な導電パターンを配した導電パターンシートであって、同図(c)の分解正面 図の如く、該導電パターンシート8を他の主表面にアース板を付着した誘電体基 板9と10、11と12、13と14にてそれぞれ狭持するよう構成したもので ある。 これにより、導体パターンのみを別途量産することが可能となり、組立工数の 低減も含めコストダウンが実現できる。FIG. 2 (a) is a perspective view showing a second embodiment of the bandpass filter according to the present invention, and 8 is necessary for the filter construction on the flexible substrate as shown in FIG. 2 (b). A conductive pattern sheet having necessary conductive patterns arranged thereon, and as shown in the exploded front view of FIG. 7C, the conductive pattern sheet 8 is a dielectric substrate 9 and 10 having a ground plate attached to the other main surface thereof. 11 and 12, and 13 and 14 are configured to hold each other. As a result, only the conductor pattern can be separately mass-produced, and the cost can be reduced including the reduction of the number of assembly steps.

【0009】 更に、図3(a)に示す如くフィルタ片同志の間隙を無くし上下のアース板を 共通化した構成に於いては、導電パターンシート8と同様にフレキシブル基板に アース板を形成したアースパターンシート15を用いて、図中B−B断面図を示 す同図(b)の如く誘電体基板を挟み込みつつ交互に折り重ねて構成したもので あってもよく、更なるコストダウンが可能となる。 以上本考案をストリップライン型バンドパスフィルタを3分割したものを例に 説明したが、本考案はこれのみに限定されるものではなく、図4の如き構成のス トリップライン型バンドパスフィルタに適用したものであってもよく、更に多数 に分割したもので構成してもよい。Further, as shown in FIG. 3A, in the configuration in which the upper and lower ground plates are made common by eliminating the gap between the filter pieces, the ground plate formed on the flexible substrate is the same as the conductive pattern sheet 8. The pattern sheet 15 may be configured by alternately folding the dielectric substrate while sandwiching the dielectric substrate as shown in FIG. 9B showing a cross-sectional view taken along the line BB in the figure, which enables further cost reduction. Becomes The present invention has been described above by taking the stripline type bandpass filter divided into three as an example. However, the present invention is not limited to this and is applied to a stripline type bandpass filter having a configuration as shown in FIG. However, it may be divided into a large number.

【0010】[0010]

【考案の効果】[Effect of device]

本考案は、以上説明した如く構成するものであるから、ストリップライン型バ ンドパスフィルタの段数を増大しても装置等に組み込む際のプリント基板上での 実装面積を増やすことなく、むしろこれを低減せしめ装置等の小型化を実現する と共にフィルタ素子をコストダウンする上で著しい効果を奏する。 Since the present invention is configured as described above, even if the number of stages of the stripline type bandpass filter is increased, the mounting area on the printed circuit board when incorporating it in a device or the like is not increased, but rather this is increased. This has a remarkable effect in reducing the size of the reduction device and reducing the cost of the filter element.

【0011】[0011]

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)、(b)はそれぞれ本考案に係るストリ
ップライン型バンドパスフィルタの一実施例の構成を示
す外観斜視図及びA−A断面図。
1A and 1B are an external perspective view and an AA cross-sectional view showing a configuration of an embodiment of a stripline bandpass filter according to the present invention, respectively.

【図2】(a)は本考案に係るバンドパスフィルタの第
2の実施例を示す斜視図。(b)はこれに用いる導電パ
ターンシートの構成を示す図。(c)は(a)の分解正
面図。
FIG. 2A is a perspective view showing a second embodiment of the bandpass filter according to the present invention. (B) is a figure which shows the structure of the electrically conductive pattern sheet used for this. (C) is an exploded front view of (a).

【図3】(a)は本考案に係るバンドパスフィルタの第
3の実施例を示す断面図。(b)は(a)図中のB−B
断面図。
FIG. 3A is a sectional view showing a third embodiment of the bandpass filter according to the present invention. (B) is BB in (a) figure
Sectional view.

【図4】(a)、(b)はそれぞれ従来のストリップラ
イン型バンドパスフィルタの構成を示す外観斜視図。
4A and 4B are external perspective views showing the configuration of a conventional stripline bandpass filter, respectively.

【符号の説明】[Explanation of symbols]

1、1′、9乃至14・・・誘電体基板 2、2′・・・アース板 3・・・ストリップライン 4、5、6・・・フィルタ片 7・・・モールド材 8・・・導電パターンシート 15・・・アースパターンシート 1, 1 ', 9 to 14 ... Dielectric substrate 2, 2' ... Ground plate 3 ... Strip line 4, 5, 6 ... Filter piece 7 ... Mold material 8 ... Conductivity Pattern sheet 15: Earth pattern sheet

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】誘電体基板の一の主表面に導体パターンを
形成したストリップライン型バンドパスフィルタを数片
に分割し、これらを重ね合わせて立体的に組み立て、前
記パターンを互いに電気的に接続して構成したことを特
徴とするバンドパスフィルタの構造。
1. A stripline bandpass filter having a conductor pattern formed on one main surface of a dielectric substrate is divided into several pieces, and these pieces are superposed and three-dimensionally assembled to electrically connect the patterns to each other. The structure of the bandpass filter, which is characterized in that
JP8458792U 1992-11-13 1992-11-13 Bandpass filter structure Pending JPH0644202U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8458792U JPH0644202U (en) 1992-11-13 1992-11-13 Bandpass filter structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8458792U JPH0644202U (en) 1992-11-13 1992-11-13 Bandpass filter structure

Publications (1)

Publication Number Publication Date
JPH0644202U true JPH0644202U (en) 1994-06-10

Family

ID=13834808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8458792U Pending JPH0644202U (en) 1992-11-13 1992-11-13 Bandpass filter structure

Country Status (1)

Country Link
JP (1) JPH0644202U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015198865A1 (en) * 2014-06-23 2017-04-20 株式会社村田製作所 Resin substrate combination structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015198865A1 (en) * 2014-06-23 2017-04-20 株式会社村田製作所 Resin substrate combination structure

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