JPH0642117U - Hard material processing equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a means capable of efficiently processing hard materials such as ceramics, carbon materials and composite materials thereof into specified dimensions. [Structure] A stationary machine base and a movable machine base are provided, and a positioning mechanism capable of adjusting the distance between both machine bases according to the width of a workpiece is provided, and both machine bases have a pair of left and right band saws or disc saws. When the work material is placed on the upper surface of the machine base and moved forward by a separate feeding device, both sides of the work material are simultaneously cut by the band saw or the disk saw. Further, downstream of the band saw type cutting machine or the disc saw type cutting machine, a polishing device having a pair of left and right rotary polishing wheels on the upper surface of a machine stand having the same positioning mechanism as described above is connected. [Effect] Since both sides of the hard material can be cut at the same time, the cutting efficiency is high. Can easily handle workpieces with different dimensions. Cutting and polishing can be done online. The processing cost is low.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an apparatus for processing hard materials such as ceramics, carbon materials, and composite materials thereof that are difficult to process.

[0002]

[Prior art]

 Machining of hard materials that are difficult to process, such as ceramics, carbon materials and composite materials thereof, is generally performed by cutting. For example, when processing a rectangular material of a certain size to a specified width or thickness, use a cutting machine to cut the material on one or both sides to finish to the specified dimensions. There are two methods of cutting: fixing the material and moving the cutting machine to cut it, or fixing the cutting machine and moving the material to cut, and cut both sides to the specified size. When finishing, it is difficult to cut both sides simultaneously, so one-side cutting is used.

[0003]

[Problems to be solved by the device]

 However, the method of finishing hard materials such as ceramics, carbon materials and their composite materials to the specified dimensions by cutting requires a cutting blade made of high-performance cemented carbide, and has a short life and cost It is expensive, and because the material is hard, the feed rate of the work material or the cutting machine is limited, and the depth of cut cannot be large, so multiple cuts must be made and the machining time is extremely long. It takes. Further, as described above, it is difficult to cut both sides of the material simultaneously in the cutting process, and the efficiency is poor because one side is cut at a time. In addition, if surface precision of the machined surface is required, it was necessary to polish offline after cutting.

The present invention solves the above-mentioned problems of conventional machining, and can cut hard materials such as ceramics, carbon materials and composite materials thereof with a high efficiency and a high precision into specified dimensions, and The aim is to provide a processing device that can polish the cut surface online.

[0005]

[Means for Solving the Problems]

 This invention not only can cut both sides of a work piece at the same time, but also has a positioning mechanism that can easily handle materials with different widths or thickness dimensions with a single unit. Since it has the function of polishing at the same time, its gist is the fixed machine table with the material placing table on the top, and the concave and convex fitting slidably with the material placing table so that it can move in parallel to the material cutting direction at a right angle. There is a structure in which the movable machine base to be fitted is placed on the base relatively, and the movable cylinders are horizontally moved by the positioning cylinders arranged at the bottom of both machine stands. A band saw or disc saw is provided, and a pair of left and right guide rollers are arranged on the upper and lower sides of the fixed machine base and the movable machine base on the inlet side and the output side of the band saw or disc saw, respectively. Machining, characterized in that a mechanism for cutting both sides of the material with the band saw or disc saw while advancing the material to be processed placed between the stationary machine table and the movable machine table In addition to the band saw or the disc saw, the polishing device having a pair of left and right rotary polishing grindstones and having the same positioning mechanism as the above is connected to the downstream of the processing device. It is a processing device characterized by shitako.

[0006]

[Action]

 The band saw is a method of cutting an object by rotating an endless band (blade) with a motor, and the disk saw is a method of rotating a circular blade by a motor to cut an object. It has the feature of being able to take a large amount of one cut. As the blade, a band or disk with a diamond grindstone is used in consideration of cutting efficiency and life because the work material is hard. The band saw and disc saw are paired to the left and right respectively so that both sides of the workpiece can be cut simultaneously.

When cutting the work material, the movable machine base is moved in parallel with the material feed direction at a right angle by the positioning cylinders arranged under the fixed machine stand and the movable machine stand, and fixed on the material placing table. The space between the machine base and the movable machine base is set to the width of the processed material. As a means for advancing the workpiece, for example, a pressing device such as a cylinder can be used. The workpiece that slides on the material table is cut simultaneously on both sides by a band saw or disc saw installed in the center of the machine table. The work material is sandwiched between the movable machine base and the stationary machine base and slides, and both sides are supported by the front and rear guide rollers, so that it is accurately cut to the specified size. The feed rate of the work material can be arbitrarily adjusted by the pressing device.

The pair of left and right rotary grinding wheels of the polishing apparatus is provided so that both the cut surfaces of the workpiece can be simultaneously polished, as in the cutting apparatus. The grinding wheel has a cylindrical shape and is driven by a motor. This polishing device is connected to the downstream of the cutting processing device so that both cutting surfaces of the workpiece can be simultaneously polished online when surface accuracy of the cutting surface is required.

According to the processing apparatus of the present invention, not only can both sides of a workpiece be cut simultaneously, but also workpieces of different sizes can be easily dealt with. Therefore, ceramics, carbon materials and composites of these materials can be used. Hard materials such as materials can be cut into specified dimensions with high efficiency and high accuracy, and the cut surface can be continuously polished online after cutting, making it easy to obtain products with excellent surface properties of the cut surface. be able to.

[0010]

【Example】

 1 is a plan view showing an example of a band saw type processing apparatus according to the present invention, FIG. 2 is a side view of the same as above, FIG. 3 is a plan view showing an example of a disk saw type processing apparatus according to the present invention, and FIG. Same as above, side view of the processing apparatus, FIG. 5 is a plan view showing an example of the polishing apparatus according to the present invention, FIG. 6 is a side view of the above polishing apparatus, 1 is a base, 2 is a fixed machine stand, 3 is a movable machine stand Reference numeral 4 is a band saw, 5 is a disk saw, 6 is a grinding wheel, 7 is a positioning cylinder, 8 and 9 are guide rollers, 10 is a workpiece, and 11 is a material feeding device.

That is, in the band saw type processing apparatus shown in FIGS. 1 and 2, the fixed machine base 2 and the movable machine base 3 are provided on the base 1 relative to each other, and the movable machine base 3 is projectingly provided on the base 1. It is installed on the rail 3-1 in parallel with the concave-convex fitting method so that it can move in parallel to the direction in which the work piece advances. The stationary machine base 2 and the movable machine base 3 are slidably concavo-convex so that the tip end of the material mounting table 2-1 horizontally protruding from the upper part of the stationary machine base 2 can be recessed into a recess 3-2 provided in the movable machine base 3. The structure is such that the work piece 10 is set between the upper step portion 2-2 of the material placing table 2-1 and the upper end surface 3-3 of the movable machine table 3 and the fixed machine table 2 can be attached. A movable cylinder 3 is provided in the lower part of the motive base 3 so that the movable pedestal 3 can be moved in parallel in the left-right direction according to the size of the workpiece.

The band saw 4 is installed in the window holes 2-3, 3-4 formed in the central portions of the stationary machine base 2 and the movable machine base 3, and the structures thereof are fixed machine stand 2 and movable machine stand 3 respectively. An endless band (blade) 4-4 is hung on an upper roll 4-2 rotatably supported by a bearing 4-1 protruding from the upper roll 4-2 and a lower roll 4-3 installed inside both machine bases. A band (blade) 4-4 is rotatably driven by a drive motor 4-5 installed inside via a lower roll 4-3.

On the other hand, in the disk saw type processing apparatus, as shown in FIGS. 3 and 4, a pair of disk saws 5 is installed in the central portion of the stationary machine base 2 and the movable machine base 3, and the structure thereof is the fixed machine base. 2 and a drive motor 5-1 installed on the movable base 3 to rotate the circular blade 5-2.

As shown in FIGS. 5 and 6, the cutting surface polishing apparatus includes a cylindrical grinding wheel 6 at the center of the stationary machine table 2 and the movable machine table 3 at the upper step of the material mounting table 2-1. 2-2 and the upper end surface 3-3 of the movable machine base 3 are installed flush with each other, and the drive motor 6-1 built into each machine base rotates and drives them. It should be noted that a plurality of rotary polishing wheels 6 may be provided as needed to perform two steps of rough polishing and finish polishing.

In the above band saw type processing apparatus or disc saw type processing apparatus, when cutting the workpiece 10, the movable cylinder 3 is moved back and forth by the positioning cylinder 7 in accordance with the dimension of the workpiece to perform positioning. Then, the workpiece 10 is set on the material mounting table 2-1. Thereafter, when the material is moved forward at a predetermined speed by the separately provided material feeding device 11, both ends of the work material 10 are simultaneously cut by the band saw 4 or the disk saw 5 into a specified width. As the material feeding device 11, a pressing method using a cylinder or the like can be adopted.

When cutting the workpieces 10 having different sizes, the movable cylinder 3 is moved back and forth to position the movable cylinder 3 for positioning, so that the workpieces 10 can be easily cut.

When the surface accuracy of the cut surface is required, the material to be processed is sent to a polishing device arranged downstream of the processing device, and both the cut surfaces are polished by a cylindrical grinding wheel 6 after cutting. It In the case of a polishing device, the movable machine base 3 is moved back and forth to determine the position according to the dimensions after cutting. The cut pieces are removed in advance when they are applied to a polishing device after cutting.

Example 1 A carbon fiber material with steel fiber (width 48 mm, length 300 mm, thickness 23 mm) was used as a plate material (width 40 mm, length 270 mm, thickness 15 mm) by a band saw type processing apparatus shown in FIGS. 1 and 2. ), And subsequently, when the cut surface is processed by the polishing apparatus shown in FIGS. 5 and 6, the required cutting time and polishing time per plate material are shown in Table 1 in comparison with the conventional cutting process. Shown in.

[0019]

[Table 1]

As is clear from the results shown in Table 1, the cutting apparatus and the polishing time can be greatly reduced by the processing apparatus of the present invention.

[0021]

[Effect of device]

 As mentioned above, this invention has the following effects. Both sides of the material to be processed can be cut at the same time, the amount of cutting can be increased in one cutting process, and the material feeding speed can be increased, resulting in high processing efficiency. It can cut hard materials such as ceramics, carbon materials and their composite materials that are difficult to cut with high efficiency and high accuracy. Can easily handle workpieces with different dimensions. The cutting time can be greatly shortened compared to mechanical cutting. Cutting and polishing can be done online. It is possible to efficiently manufacture a product having a high cut surface accuracy. The life of the blade can be extended and the processing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a band saw type processing apparatus according to the present invention.

FIG. 2 is a side view of the above processing device.

FIG. 3 is a plan view showing an example of a disk saw type processing apparatus according to the present invention.

FIG. 4 is a side view of the above processing device.

FIG. 5 is a plan view showing an example of a polishing apparatus according to the present invention.

FIG. 6 is a side view of the same polishing apparatus.

[Explanation of symbols]

 1 Base 2 Fixed Machine Stand 3 Movable Machine Stand 4 Band Saw 5 Disc Saw 6 Rotating Grinding Wheel 7 Positioning Cylinder 8, 9 Guide Roller 10 Work Material 11 Material Feeding Device

Claims (2)

[Scope of utility model registration request] 1. A stationary machine table having a material mounting table on an upper part,
A movable machine stand that slidably fits with the material stand so that it can move parallel to the material cutting direction at a right angle is installed on the base, and the movable stand is moved by the positioning cylinders located under both machine stands. The fixed machine stand and the movable machine stand are provided with a pair of left and right band saws or disc saws at the center, and a pair of left and right guide rollers are provided on the inlet side and the outlet side of the band saw or the disc saw. It is arranged on the upper surface of the table, and on the material mounting table of the fixed machine table, the material to be machined placed between the stationary machine table and the movable machine table is moved forward while advancing the material to be processed by the band saw or the disk saw. An apparatus for processing hard materials, which has a mechanism for cutting both sides. 2. A stationary machine base having a material mounting base on the upper part,
A movable machine stand that slidably fits with the material stand so that it can move parallel to the material cutting direction at a right angle is installed on the base, and the movable stand is moved by the positioning cylinders located under both machine stands. There is a structure that allows a fixed machine stand and a movable machine stand to be provided with a pair of left and right rotary grinding wheels, and a pair of left and right guide rollers are provided on the entrance side and the exit side of the grinding wheel. Placed on the upper surface, and while advancing the work piece placed between the fixed machine table and the movable machine table on the material table of the fixed machine table, both sides of the material are polished by the polishing grindstone. The hard material processing apparatus according to claim 1, further comprising a polishing device connected to a downstream side of the polishing device.