JPH0639464Y2 - 発光ダイオード - Google Patents
発光ダイオードInfo
- Publication number
- JPH0639464Y2 JPH0639464Y2 JP1988063522U JP6352288U JPH0639464Y2 JP H0639464 Y2 JPH0639464 Y2 JP H0639464Y2 JP 1988063522 U JP1988063522 U JP 1988063522U JP 6352288 U JP6352288 U JP 6352288U JP H0639464 Y2 JPH0639464 Y2 JP H0639464Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- recess
- infrared light
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988063522U JPH0639464Y2 (ja) | 1988-05-13 | 1988-05-13 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988063522U JPH0639464Y2 (ja) | 1988-05-13 | 1988-05-13 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01167065U JPH01167065U (US20110009641A1-20110113-C00256.png) | 1989-11-22 |
JPH0639464Y2 true JPH0639464Y2 (ja) | 1994-10-12 |
Family
ID=31289018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988063522U Expired - Lifetime JPH0639464Y2 (ja) | 1988-05-13 | 1988-05-13 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0639464Y2 (US20110009641A1-20110113-C00256.png) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6945672B2 (en) * | 2002-08-30 | 2005-09-20 | Gelcore Llc | LED planar light source and low-profile headlight constructed therewith |
US7425083B2 (en) * | 2005-05-02 | 2008-09-16 | Samsung Electro-Mechanics Co., Ltd. | Light emitting device package |
JP5441316B2 (ja) * | 2007-04-05 | 2014-03-12 | ローム株式会社 | 半導体発光装置 |
JP2013229395A (ja) * | 2012-04-24 | 2013-11-07 | Panasonic Corp | Ledパッケージおよびled発光素子 |
DE102013100121A1 (de) * | 2013-01-08 | 2014-07-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5577874U (US20110009641A1-20110113-C00256.png) * | 1978-11-21 | 1980-05-29 | ||
JPS58220480A (ja) * | 1982-06-16 | 1983-12-22 | Toshiba Corp | 光半導体装置 |
JPS59115669U (ja) * | 1983-01-25 | 1984-08-04 | 三洋電機株式会社 | 発光素子 |
-
1988
- 1988-05-13 JP JP1988063522U patent/JPH0639464Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01167065U (US20110009641A1-20110113-C00256.png) | 1989-11-22 |
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