JPH0637518A - High frequency module connection structure - Google Patents

Abstract

PURPOSE:To reduce reflection at the connection point between a high frequency module and a mother board and to stably operate an amplifier on the high frequency module with respect to the high frequency module connection structure where a strip line is formed. CONSTITUTION:An earth conductor 3 is formed on one face of a dielectric substrate 5 of the mother board, and an earth conductor 11 and a signal conductor 1 are formed on the other face, and a connection conductor 8 connecting the earth conductor 3 and the earth conductor 11 is formed. The high frequency module where an earth conductor 4 is formed on one face of a dielectric substrate 6 and a signal conductor 2 is formed on one face, the end face, and the other face of the dielectric substrate 6 is arranged on the other face of the mother board, and signal conductors 1 and 2 are connected, and earth conductors 11 and 4 are connected. A window 9 whose width is approximately equal to the thickness of the dielectric substrate 6 is provided between the connection part of signal conductors 1 and 2 and that of earth conductors 11 and 4, and a connection conductor 8 is provided in the vicinity of the end part of the window.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency module connection structure, and more particularly to a high frequency module connection structure formed with a strip line for the quasi-microwave band.

Recently, miniaturization and high frequency have been advanced mainly in mobile communication radio equipment, and high density packaging and high performance of high frequency circuits in the quasi-microwave band to the microwave band have been demanded. Therefore, it is necessary to improve the characteristics of the high frequency module connection structure.

[0003]

2. Description of the Related Art FIG. 5 shows an example of a conventional high-frequency module connection structure. In FIG. 5, 5 and 7 are dielectric substrates of the mother board, the ground conductor 3 is formed on the lower surface thereof, and the ground conductor 11 is formed on the upper surface thereof. Connected by. Further, the signal conductor 1 is formed on the upper surface.

The ground conductor 4 is formed on the lower surface of the dielectric substrate 6 of the high frequency module, and the signal conductor 2 for connecting to the signal conductor 1 of the motherboard is formed on the lower surface, the end portion and the upper surface of the dielectric substrate 6. ing.

As shown in FIG. 5, the high frequency module and the mother board are connected by mounting the high frequency module on the mother board, connecting the signal conductor 1 and the signal conductor 2 and connecting the ground conductor 11 and the ground conductor 4. There is. The ground conductor 4, the ground conductor 11, the signal conductor 1, and the signal conductor 2
The minimum interval between and is.

[0006]

However, in the conventional high frequency module connection structure, when a distributed constant circuit such as a microstrip line is formed on the high frequency module,
TEM (Tra from the motherboard to the high frequency module
nsversal Electro Magnetti
c) There is a problem that the wave excitation becomes discontinuous and the reflection at the connection point increases. Further, when the amplifier is configured on the high frequency module, there is a problem that unstable operation such as oscillation occurs.

The present invention has been made in view of the above points, and provides a high frequency module connection structure in which reflection at a connection point between a high frequency module and a mother board is small and stable operation of an amplifier on the high frequency module can be realized. The purpose is to provide.

[0008]

FIG. 1 shows the principle of the present invention. According to the invention of claim 1, the first ground conductor 3 is formed on one surface of the first dielectric substrate 5, and the second ground conductor 11 and the first signal conductor 1 are formed on the other surface. A mother board on which a connection conductor 8 for connecting the first ground conductor 3 and the second ground conductor 11 is formed is provided, and the third ground conductor 4 is formed on one surface of the second dielectric substrate 6. The second signal conductor 2 is formed on the one surface, the end surface, and the other surface of the second dielectric substrate 6, and the high-frequency module is arranged on the other surface of the mother board. In a high frequency module connection structure in which the conductor 1 and the second signal conductor 2 are connected and the second ground conductor 11 and the third ground conductor 4 are connected, the first signal conductor 1 and the second signal conductor 2 Between the connection part of the second ground conductor 11 and the connection part of the second ground conductor 11 and the third ground conductor 4. The window 9 thickness approximately the same width of the body substrate 6 is provided, the connection conductor 8 a structure provided near the end of the window 9.

In the invention of claim 2, the first ground conductor 3
In the configuration, the portion facing the second ground conductor 11 via the first dielectric substrate 5 is removed.

[0010]

According to the invention of claim 1, between the connecting portion of the first signal conductor 1 and the second signal conductor 2 and the connecting portion of the second ground conductor 11 and the third ground conductor 4, The configuration in which the window 9 having the same thickness as that of the second dielectric substrate 6 is provided is the first signal conductor 1
And the continuity of the electric field of the TEM wave at the connection portion of the second signal conductor 2 and the second signal conductor 2 is realized.

According to the second aspect of the invention, the first ground conductor 3 is provided.
The configuration in which the portion facing the second ground conductor 11 via the first dielectric substrate 5 is removed eliminates the current flowing through the second ground conductor 11 by the external magnetic flux.

[0012]

2 is a perspective view of the first embodiment, and FIG. 3 is a sectional view of the high frequency module taken along the center line I--I in FIG. As shown in FIGS. 2 and 3, the ground conductor 3 serving as the first ground conductor is formed on the entire lower surface of the dielectric substrate 5 of the mother board which is the first dielectric substrate. On the upper surface, the ground conductor 11 that is the second ground conductor
And a ground conductor 1 which is a first signal conductor.
Further, a plurality of through holes 18 which are the connection conductors 8 and which connect the ground conductor 3 and the ground conductor 11 are formed.

On the other hand, on the lower surface of the dielectric substrate 6 of the high frequency module which is the second dielectric substrate, the ground conductor 4 which is the third ground conductor is formed on almost the entire surface except the signal conductor. A signal conductor 2, which is a second signal conductor, is formed over the lower surface, the end surface, and the upper surface of the. The dielectric substrate 6 of the high frequency module and the dielectric substrate 5 of the mother board have the same thickness.

To mount the high frequency module on the motherboard, the ground conductor 11 of the motherboard and the ground conductor 4 of the high frequency module, and the signal conductor 1 of the motherboard and the signal conductor 2 of the high frequency module are connected. At this time, as shown in FIG. 3, the end surface of the signal conductor 1 of the motherboard and the end surface of the signal conductor 2 of the high frequency module are aligned with each other. The signal conductor 1 and the signal conductor 2 are connected by soldering with the solder 10.

A window is provided between the signal conductor 2 and the ground conductor 4 of the high frequency module, and a window is also provided between the signal conductor 1 and the ground conductor 11 of the mother board. The window 9 is formed between the end surface of the connection portion of the signal conductor 1 and the signal conductor 2 and the end surface of the connection portion of the ground conductor 11 and the ground conductor 4 in the state of being connected to the ground conductor 11. The width of this window 9 is defined by the dielectric substrate 5 and the dielectric substrate 6.
It is about the same as the thickness of.

The through hole 18 closest to the window 9 is the window 9
Is arranged close to the end of the grounding conductor 11 forming the so that the continuity of the grounding conductor 3 to the through hole 18 to the grounding conductor 11 can be obtained. In addition, other through holes 18
Are provided to improve the characteristics. Further, on the upper surface of the high frequency module, the transistor 13 and the like constitute an amplifier.

For the dielectric substrate 5 and the dielectric substrate 6, for example, glass epoxy substrates having a thickness of 0.8 mm and a dielectric constant of 4.5 are used, and the width of the window 9 is also 0.8 mm.
The diameter of the through hole 18 is, for example, 0.6 mm.
And

In the first embodiment, the signal conductor 1 of the motherboard and the ground conductor 3 form a microstrip line, and the signal conductor 2 of the high frequency module and the ground conductor 4 on the lower surface form a microstrip line. Is forming.

From the microstrip line of the mother board to the microstrip of the high frequency module, TEM
The wave is excited. The electric field of the TEM wave in the mother board and the high frequency module can realize continuity as shown by an arrow in FIG. 2 because of the window 9 and the through hole 18 connecting the ground conductor 3 and the ground conductor 11. Therefore,
The reflection at the connection point between the mother board and the high frequency module can be suppressed, and good reflection characteristics can be obtained.

Further, due to the continuity of the ground conductor 3 to the through hole 18 to the ground conductor 11, the potentials of the ground conductor 11 and the ground conductor 4 with respect to the ground conductor 3 become low. Therefore, when the amplifier is configured on the high frequency module, unstable operation such as oscillation can be prevented, and stable operation up to about 2 GHz can be realized.

As a result, the high-frequency circuit in the quasi-microwave band can be made higher in density and higher in performance, and the miniaturization and higher performance of the wireless device for mobile communication can be realized.

FIG. 4 shows a sectional view of the second embodiment of the present invention. 4, the same components as those in FIG. 3 are designated by the same reference numerals, and the description thereof will be omitted as appropriate. As shown in FIG. 4, the second
In the embodiment, the portion of the ground conductor 3 of the mother board facing the ground conductor 11 via the dielectric substrate 5 is removed.

The through hole 18 for connecting the ground conductor 3 and the ground conductor 11 has an end of the window 9 between the connection portion of the signal conductor 1 and the signal conductor 2 and the connection portion of the ground conductor 4 and the ground conductor 11. It is located near the section. Thereby, continuity of the ground conductor 3, the through hole 18, and the ground conductor 11 is obtained. Also in the second embodiment, the thicknesses of the dielectric boards 5 and 7 of the mother board and the dielectric board 6 of the high frequency module are the same, and the width of the window 9 is the dielectric board 5 of the mother board.
And the thickness of the dielectric substrate 6 of the high frequency module.

When the ground conductor 3 is present in a portion facing the ground conductor 11 through the dielectric substrate 5, when the external magnetic flux passes through the dielectric substrate 5, the ground conductor 11 is affected by the interlinking magnetic flux. Electric current flows and noise is generated.

On the other hand, in the second embodiment, the current flowing through the ground conductor 11 can be eliminated by the external magnetic flux passing through the dielectric substrate 5. Therefore, it is possible to suppress noise due to external magnetic flux, which is a problem when a high gain amplifier or a low noise amplifier is formed on the high frequency module.

In the second embodiment as well, as in the first embodiment, the window 9 is provided to suppress reflection at the connection point between the mother board and the high frequency module, and the stable operation of the amplifier on the high frequency module. Can be realized.

[0027]

As described above, according to the invention of claim 1,
Since the continuity of the electric field of the TEM wave can be realized, the reflection at the connection point between the high frequency module and the motherboard can be reduced,
In addition, it has features such that stable operation of the amplifier on the high frequency module can be realized.

According to the second aspect of the present invention, since the current flowing through the second ground conductor is eliminated by the external magnetic flux, noise due to the external magnetic flux can be suppressed.

[Brief description of drawings]

FIG. 1 is a principle diagram of the present invention.

FIG. 2 is a perspective view of the first embodiment of the present invention.

FIG. 3 is a cross-sectional view taken along the line I-I in FIG.

FIG. 4 is a sectional view of a second embodiment of the present invention.

FIG. 5 is an explanatory diagram of a conventional example.

[Explanation of symbols]

 1 1st signal conductor 2 2nd signal conductor 3 1st grounding conductor 4 3rd grounding conductor 5 1st dielectric board 6 2nd dielectric board 8 Connection conductor 9 Window 10 Solder 11 2nd grounding Conductor 12 Soldering pattern 13 Transistor 18 Through hole

Claims (2)

[Claims] 1. A first ground conductor (3) is formed on one surface of a first dielectric substrate (5), and a second ground conductor (11) and a first signal conductor ((1) are formed on the other surface. 1) is provided, and a mother board is provided on which a connection conductor (8) for connecting the first ground conductor (3) and the second ground conductor (11) is formed,
A third ground conductor (4) is formed on one surface of the second dielectric substrate (6) and extends over the one surface, the end surface and the other surface of the second dielectric substrate (6). Second signal conductor (2)
The high frequency module having the above-mentioned structure is arranged on the other surface of the mother board, the first signal conductor (1) and the second signal conductor (2) are connected to each other, and the second ground conductor ( 11) In the high frequency module connection structure in which the third ground conductor (4) is connected, the first signal conductor (1) and the second signal conductor (2) are provided.
Connection part, the second ground conductor (11) and the third
A window (9) having a width similar to the thickness of the second dielectric substrate (6) is provided between the connection conductor (4) and the connection portion of the ground conductor (4). ) The high-frequency module connection structure characterized in that it is provided near the end of (1). 2. The first ground conductor (3) is the first ground conductor (3).
Through the dielectric substrate (5) of the second ground conductor (1
The high-frequency module connection structure according to claim 1, wherein a portion facing 1) is removed.