JPH0637076A - Polishing method for semiconductor - Google Patents
Polishing method for semiconductorInfo
- Publication number
- JPH0637076A JPH0637076A JP18824092A JP18824092A JPH0637076A JP H0637076 A JPH0637076 A JP H0637076A JP 18824092 A JP18824092 A JP 18824092A JP 18824092 A JP18824092 A JP 18824092A JP H0637076 A JPH0637076 A JP H0637076A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- plate
- jig
- rotary
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体ウェハをダイ
シングしたあとの小片状の半導体基板の側面研磨する半
導体研磨装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor polishing apparatus for side surface polishing a semiconductor wafer in the form of small pieces after dicing a semiconductor wafer.
【０００２】[0002]
【従来の技術】図５に従来の半導体研磨装置の斜視図
と、図６に図５のＢ−Ｂ’線に沿った断面図を示す。従
来、図５の半導体研磨装置１は、本体上部には円柱型水
受け皿１０、注水口２、治具固定棒４があり、また内部
には図６に示すように駆動制御器１１、回転モータ１
２、円柱型水受け皿１０の中心には回転モータ１２の軸
３が突起している。前面部には表示部５、駆動制御ボタ
ン６、回転数制御ボタン８、注水制御ボタン９から形成
されている。円柱型水受け皿１０は、斜度をつけて水を
外部に排出するようになっている。治具固定棒４は本体
の一部から伸びた長方体で、側面に鋸山を形成する。表
示部５は液晶ディスプレイで回転数を表示、回転数制御
ボタン８で回転数を可変させ、回転数を駆動制御器１１
へ送る。駆動制御ボタン６で回転モータ１２を駆動制御
し、軸３を回転させる。注水制御ボタン９で、注水口２
の開閉を行い、水は研磨時治具固定棒４付近に注水され
る。2. Description of the Related Art FIG. 5 is a perspective view of a conventional semiconductor polishing apparatus, and FIG. 6 is a sectional view taken along line BB 'of FIG. Conventionally, the semiconductor polishing apparatus 1 of FIG. 5 has a cylindrical water tray 10, a water injection port 2, and a jig fixing rod 4 on the upper part of the main body, and inside thereof, as shown in FIG. 6, a drive controller 11, a rotary motor. 1
2. The shaft 3 of the rotary motor 12 projects at the center of the cylindrical water tray 10. On the front surface, a display unit 5, a drive control button 6, a rotation speed control button 8, and a water injection control button 9 are formed. The columnar water tray 10 is designed to discharge water with an inclination. The jig fixing rod 4 is a rectangular parallelepiped extending from a part of the main body, and has saw teeth on its side surface. The display unit 5 displays the number of rotations on the liquid crystal display, the number of rotations is changed by the number-of-rotations control button 8, and the number of rotations is controlled by the drive controller 11.
Send to. The drive control button 6 drives and controls the rotary motor 12 to rotate the shaft 3. Water injection control button 9, water injection port 2
Is opened and closed, and water is poured near the jig fixing rod 4 during polishing.
【０００３】図７は半導体材料を固定する治具の斜視図
で、加熱可能な重みのある金属性材料を使用する。形状
は長方体で、一側面の中央部に楔形溝を形成。図８の回
転研磨板１５は、円板型で全面にやすり目が存在する。
やすり目は、荒い目から細かい目がある。また、石英等
で形成されるガラス状の研磨板がある。半導体研磨板１
５は、円柱型水受け皿１０中心に突起している回転モー
タ１２の軸３に、やすり目がある面を上にし固定させ
る。FIG. 7 is a perspective view of a jig for fixing a semiconductor material, which uses a heatable and weightable metallic material. The shape is a rectangular parallelepiped, with a wedge-shaped groove formed in the center of one side. The rotary polishing plate 15 shown in FIG. 8 is a disc type and has a file on the entire surface.
The file eyes have coarse to fine eyes. Further, there is a glass-like polishing plate formed of quartz or the like. Semiconductor polishing plate 1
5 is fixed to the shaft 3 of the rotary motor 12 projecting at the center of the cylindrical water receiving tray 10 with the surface having the rasps facing upward.
【０００４】固定させた回転研磨板１５上に、半導体基
板の板面を治具１４の底面より下に少しはみだして治具
１４の端面に固定させたのち、治具１４側面の楔形溝と
治具固定棒４の鋸山部分とを噛み合わせながら置く。回
転研磨板１５を回転モータ１２で回転させ、半導体基板
側面と回転研磨板を治具１４の重量を利用して接触させ
研磨する。After the plate surface of the semiconductor substrate is slightly protruded below the bottom surface of the jig 14 onto the fixed rotary polishing plate 15 and fixed to the end surface of the jig 14, the wedge-shaped groove and the side surface of the jig 14 are fixed. Place it while engaging the sawtooth portion of the tool fixing rod 4. The rotary polishing plate 15 is rotated by the rotary motor 12, and the side surface of the semiconductor substrate and the rotary polishing plate are brought into contact with each other using the weight of the jig 14 to polish.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
ような半導体研磨装置では、研磨板の回転数、やすり目
の種類の各々に応じて、あらかじめ単位あたりの研磨量
を測定しておく必要があった。すなわち、最初に任意の
回転数、時間で研磨し、研磨された距離を光学顕微鏡等
で半導体基板板面を観察し測定する。この距離と回転数
から研磨終了地点までの時間を算出しておく必要があっ
た。また算出を誤り研磨終了地点を過ぎてしまうことが
あった。また、これを防ぐために、研磨時間を小刻みに
区切り、その都度半導体基板の研磨地点を光学顕微鏡等
で確認して、研磨していたので、かなりの時間を費やし
ていた。However, in the semiconductor polishing apparatus as described above, it is necessary to measure the polishing amount per unit in advance in accordance with each of the number of revolutions of the polishing plate and the type of file. It was That is, first, polishing is performed at an arbitrary number of rotations for a certain time, and the polished distance is measured by observing the semiconductor substrate plate surface with an optical microscope or the like. It was necessary to calculate the time from the distance and the rotation speed to the polishing end point. Moreover, the calculation may be incorrect and the polishing end point may be passed. Further, in order to prevent this, the polishing time is divided into small pieces, and the polishing point of the semiconductor substrate is checked each time with an optical microscope or the like to perform polishing, so that a considerable time is spent.
【０００６】そこでこの発明は、研磨終了地点の通過防
止、光学顕微鏡や計測器の不要、研磨時間の短縮を目的
とする。Therefore, the object of the present invention is to prevent the passage of the polishing end point, eliminate the need for an optical microscope and a measuring instrument, and shorten the polishing time.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、本発明はやすり目と透明部が共存する回転研磨板上
に、半導体材料を斜めに（半導体基板板面が回転研磨板
に向くよう）固定した治具を置き、回転研磨板の透明部
が回転することによってできる透明なところを利用し
て、回転研磨板下から半導体基板板面をモニタする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention diagonally arranges a semiconductor material on a rotary polishing plate in which a file and a transparent portion coexist (the semiconductor substrate plate surface faces the rotary polishing plate). As a result, the fixed jig is placed, and the transparent surface of the rotary polishing plate is rotated to monitor the surface of the semiconductor substrate from below the rotary polishing plate.
【０００８】[0008]
【作用】上記のように構成された半導体研磨装置におい
ては、モニタした半導体基板板面の映像を画像処理する
ことにより、半導体基板の座標や存在を認識でき、予め
設定した研磨終了地点の座標に半導体基板側面が到達し
たときに、自動的にモータの駆動を停止できることとな
る。In the semiconductor polishing apparatus configured as described above, the coordinates and presence of the semiconductor substrate can be recognized by image-processing the image of the monitored semiconductor substrate plate surface, and the coordinates of the preset polishing end point can be set. When the side surface of the semiconductor substrate reaches, the driving of the motor can be automatically stopped.
【０００９】[0009]
【実施例】図１に本発明による半導体研磨装置の斜視図
を、図２に図１のＡ−Ａ’線に沿った断面図を示す。図
１の半導体研磨装置１は、本体上部には円柱型水受け皿
１０、注水口２、治具固定棒４、内部には図２に示すよ
うに駆動制御器１１、回転モータ１２、カメラ１３、円
柱型水受け皿１０中心には回転モータ１２の軸３が突起
し、前面部には図１に示すように表示部５、駆動制御ボ
タン６、研磨位置制御ボタン７、回転数制御ボタン８、
排水制御ボタン９から形成されている。円柱型水受け皿
１０は、斜度をつけ水を外部に排出するようになってい
る。治具固定棒４は、本体の一部から伸びた長方体で、
側面に鋸山を形成する。表示部５はカメラで撮った映像
が映しだされると同時に回転数や研磨位置制御ライン等
も表示する。研磨位置制御ボタン７で研磨位置制御ライ
ンを、また回転数制御ボタン８で回転数を可変させる。
カメラ１３でモニタした半導体基板板面の映像は、駆動
制御器１１に送り画像処理され、半導体基板の座標と存
在を認識する。1 is a perspective view of a semiconductor polishing apparatus according to the present invention, and FIG. 2 is a sectional view taken along the line AA 'in FIG. The semiconductor polishing apparatus 1 of FIG. 1 includes a cylindrical water tray 10, a water injection port 2, a jig fixing rod 4 on the upper part of the main body, a drive controller 11, a rotation motor 12, a camera 13, and an inside as shown in FIG. The shaft 3 of the rotary motor 12 is projected at the center of the cylindrical water tray 10, and the display unit 5, the drive control button 6, the polishing position control button 7, the rotation speed control button 8 are provided on the front surface as shown in FIG.
It is formed from the drainage control button 9. The cylindrical water tray 10 is designed to have a gradient and discharge water to the outside. The jig fixing rod 4 is a rectangular parallelepiped extending from a part of the main body.
Form sawtooth on the side. The display unit 5 displays the image taken by the camera and, at the same time, displays the rotation speed, the polishing position control line, and the like. The polishing position control button 7 changes the polishing position control line, and the rotation speed control button 8 changes the rotation speed.
The image of the semiconductor substrate plate surface monitored by the camera 13 is sent to the drive controller 11 for image processing to recognize the coordinates and presence of the semiconductor substrate.
【００１０】また、回転数、研磨位置制御ラインの座標
は駆動制御器１１へ送られる。駆動制御ボタン６で回転
モータ１２を駆動制御し軸３を回転させる。注水制御ボ
タン９で、注水口２の開閉を行い、水は治具固定棒４付
近に注水される。図３の半導体基板を固定する治具１４
は、加熱可能な重みのある金属性材料を使用する。形状
は長方体で、半導体材料を固定する側面のかどを上面に
対し４０〜８０度の角度で切断し斜度を形成、対抗する
側面の中央部には楔形溝を形成する。The rotation speed and the coordinates of the polishing position control line are sent to the drive controller 11. The drive control button 6 drives and controls the rotary motor 12 to rotate the shaft 3. The water injection control button 9 opens and closes the water injection port 2, and water is injected near the jig fixing rod 4. A jig 14 for fixing the semiconductor substrate of FIG.
Uses a heatable, weighted metallic material. The shape is a rectangular parallelepiped, and the corner of the side surface for fixing the semiconductor material is cut at an angle of 40 to 80 degrees with respect to the upper surface to form a slope, and a wedge-shaped groove is formed in the central portion of the opposing side surface.
【００１１】図４の回転研磨板１５は、円板型で中心か
ら外側へ放射状に３本ガラス部を設け、他はやすり目
を存在させる。やすり目は、荒い目から細かい目のもの
を揃え、またガラス部は石英状の材質を使用し透明に形
成する。回転研磨板１５は、円柱型水受け皿１０中心に
突起している回転モータ１２の軸３に、やすり目がある
面を上にし固定させる。The rotary polishing plate 15 of FIG. 4 is a disc type and is provided with three glass portions radially from the center to the outside.
To exist. As for the files, coarse to fine grains are prepared, and the glass portion is made transparent by using a quartz-like material. The rotary polishing plate 15 is fixed to the shaft 3 of the rotary motor 12 projecting in the center of the cylindrical water tray 10 with the surface having the grain facing upward.
【００１２】固定させた回転研磨板１５上に、半導体基
板を治具１４の斜度のある側面側に、底面より下に少し
はみだして治具１４の端面に固定させたのち、対抗する
側面に形成されている楔形溝と治具固定棒４の鋸山部分
とを噛み合わせながら置く。回転研磨板１５を、回転モ
ータ１２で回転させる。カメラ１３は、回転研磨板１５
のガラス部１６が回転することにより形成される透明な
ところを利用して、回転研磨板下から斜めに傾けられた
半導体基板板面をモニタする。あらかじめ設定した研磨
位置制御ラインの座標に半導体基板の側面が達したこと
を認識して、自動的にモータの駆動を停止させる。On the fixed rotary polishing plate 15, the semiconductor substrate is fixed to the end surface of the jig 14 on the side surface with a slope of the jig 14, slightly protruding below the bottom surface, and fixed on the end surface of the jig 14. The formed wedge-shaped groove and the saw-toothed portion of the jig fixing rod 4 are placed while being engaged with each other. The rotary polishing plate 15 is rotated by the rotary motor 12. The camera 13 has a rotary polishing plate 15
By utilizing the transparent part formed by rotating the glass portion 16 of the above, the surface of the semiconductor substrate which is obliquely inclined from below the rotary polishing plate is monitored. Upon recognizing that the side surface of the semiconductor substrate has reached the preset coordinates of the polishing position control line, the driving of the motor is automatically stopped.
【００１３】[0013]
【発明の効果】この発明は、以上説明したように、面内
にやすり目と透明部が共存する回転研磨板上に、半導体
基板を斜めに（半導体基板板面が回転研磨板面に向くよ
う）固定した治具を置き、回転研磨板の透明部が回転す
ることによってできる透明なところを利用して、回転研
磨板下から半導体基板板面をモニタし、予め設定した研
磨終了地点に半導体基板板面が到達したときに、自動的
にモータの駆動を止めるという構成としたので、光学顕
微鏡や計測器を用いて研磨時間を算出することなく、研
磨終了地点まで自動的に到達することができ、研磨終了
地点通過をも防止できる。また、研磨時間の短縮と工数
の軽減につながる。As described above, according to the present invention, the semiconductor substrate is obliquely placed on the rotary polishing plate in which the file and the transparent portion coexist in the plane (the semiconductor substrate plate surface faces the rotary polishing plate surface). ) Place a fixed jig and use the transparent part that is created by rotating the transparent part of the rotary polishing plate, monitor the surface of the semiconductor substrate from below the rotary polishing plate, and place the semiconductor substrate at the preset polishing end point. When the plate surface arrives, the motor drive is automatically stopped, so the polishing end point can be automatically reached without calculating the polishing time using an optical microscope or measuring instrument. It is also possible to prevent passage through the polishing end point. In addition, the polishing time is shortened and the number of steps is reduced.
【図１】本発明の半導体研磨装置の斜視図である。FIG. 1 is a perspective view of a semiconductor polishing apparatus of the present invention.
【図２】図１の半導体研磨装置のＡ−Ａ’線に沿った断
面図である。FIG. 2 is a sectional view taken along the line AA ′ of the semiconductor polishing apparatus of FIG.
【図３】本発明の半導体基板を固定する治具の斜視図で
ある。FIG. 3 is a perspective view of a jig for fixing the semiconductor substrate of the present invention.
【図４】本発明の回転研磨板を示した治具の斜視図であ
る。FIG. 4 is a perspective view of a jig showing a rotary polishing plate of the present invention.
【図５】従来の半導体研磨装置を示した斜視図である。FIG. 5 is a perspective view showing a conventional semiconductor polishing apparatus.
【図６】図５の半導体研磨装置のＢ−Ｂ’線に沿った断
面図である。6 is a cross-sectional view taken along the line BB ′ of the semiconductor polishing apparatus of FIG.
【図７】従来の半導体基板を固定する治具の斜視図であ
る。FIG. 7 is a perspective view of a conventional jig for fixing a semiconductor substrate.
【図８】従来の回転研磨板を示した斜視図である。FIG. 8 is a perspective view showing a conventional rotary polishing plate.
１ 半導体研磨装置 ２ 注水口 ３ 回転モータ軸 ４ 治具固定棒 ５ 表示部 ６ 駆動制御ボタン ７ 研磨位置制御ボタン ８ 回転数制御ボタン ９ 注水制御ボタン １０ 円柱型水受け皿 １１ 駆動制御器 １２ 回転モータ １３ カメラ １４ 治具 １６ 回転研磨板（透明部） 1 Semiconductor Polishing Device 2 Water Injection Port 3 Rotary Motor Shaft 4 Jig Fixing Rod 5 Display 6 Drive Control Button 7 Polishing Position Control Button 8 Rotation Speed Control Button 9 Water Injection Control Button 10 Cylindrical Water Dish 11 Drive Controller 12 Rotation Motor 13 Camera 14 Jig 16 Rotating polishing plate (transparent part)
Claims (2)
に取りつけられた回転研磨板に押さえつけて所定量研磨
する半導体研磨方法において、前記半導体基板の板面形
状をモニタし、あらかじめ設定した前記所定量を研磨し
たら前記モータの駆動を自動的に停止させることを特徴
とする半導体研磨方法。1. A semiconductor polishing method in which a side surface of a small-sized semiconductor substrate is pressed against a rotary polishing plate mounted on a shaft of a motor to polish a predetermined amount, and the plate surface shape of the semiconductor substrate is monitored and preset. A method of polishing a semiconductor, wherein the driving of the motor is automatically stopped after polishing the predetermined amount.
に斜めに対抗させて前記側面が押さえつけられ、前記回
転研磨板は少なくとも一部に透明部を有しており、前記
半導体基板の板面形状を前記回転研磨板下からモニタす
ることを特徴とする請求項１記載の半導体研磨方法。2. The plate surface of the semiconductor substrate is diagonally opposed to the rotary polishing plate to press the side surface, and the rotary polishing plate has a transparent portion at least in a part thereof. 2. The semiconductor polishing method according to claim 1, wherein the surface shape is monitored from below the rotary polishing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18824092A JPH0637076A (en) | 1992-07-15 | 1992-07-15 | Polishing method for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18824092A JPH0637076A (en) | 1992-07-15 | 1992-07-15 | Polishing method for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0637076A true JPH0637076A (en) | 1994-02-10 |
Family
ID=16220248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18824092A Pending JPH0637076A (en) | 1992-07-15 | 1992-07-15 | Polishing method for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0637076A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6719818B1 (en) | 1995-03-28 | 2004-04-13 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US6860791B2 (en) | 1995-03-28 | 2005-03-01 | Applied Materials, Inc. | Polishing pad for in-situ endpoint detection |
| US6875078B2 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US6994607B2 (en) | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
| US7011565B2 (en) | 1995-03-28 | 2006-03-14 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US7264536B2 (en) | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
| US7731566B2 (en) | 1995-03-28 | 2010-06-08 | Applied Materials, Inc. | Substrate polishing metrology using interference signals |
-
1992
- 1992-07-15 JP JP18824092A patent/JPH0637076A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7118450B2 (en) | 1995-03-28 | 2006-10-10 | Applied Materials, Inc. | Polishing pad with window and method of fabricating a window in a polishing pad |
| US7255629B2 (en) | 1995-03-28 | 2007-08-14 | Applied Materials, Inc. | Polishing assembly with a window |
| US6875078B2 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US8092274B2 (en) | 1995-03-28 | 2012-01-10 | Applied Materials, Inc. | Substrate polishing metrology using interference signals |
| US7011565B2 (en) | 1995-03-28 | 2006-03-14 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US6860791B2 (en) | 1995-03-28 | 2005-03-01 | Applied Materials, Inc. | Polishing pad for in-situ endpoint detection |
| US6719818B1 (en) | 1995-03-28 | 2004-04-13 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US7775852B2 (en) | 1995-03-28 | 2010-08-17 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| US7731566B2 (en) | 1995-03-28 | 2010-06-08 | Applied Materials, Inc. | Substrate polishing metrology using interference signals |
| US7198544B2 (en) | 2001-12-28 | 2007-04-03 | Applied Materials, Inc. | Polishing pad with window |
| US6994607B2 (en) | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
| US7264536B2 (en) | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
| US7547243B2 (en) | 2003-09-23 | 2009-06-16 | Applied Materials, Inc. | Method of making and apparatus having polishing pad with window |
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