JPH0636595Y2 - 半導体集積回路装置 - Google Patents
半導体集積回路装置Info
- Publication number
- JPH0636595Y2 JPH0636595Y2 JP11134085U JP11134085U JPH0636595Y2 JP H0636595 Y2 JPH0636595 Y2 JP H0636595Y2 JP 11134085 U JP11134085 U JP 11134085U JP 11134085 U JP11134085 U JP 11134085U JP H0636595 Y2 JPH0636595 Y2 JP H0636595Y2
- Authority
- JP
- Japan
- Prior art keywords
- input
- output
- protection
- lsi
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11134085U JPH0636595Y2 (ja) | 1985-07-19 | 1985-07-19 | 半導体集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11134085U JPH0636595Y2 (ja) | 1985-07-19 | 1985-07-19 | 半導体集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6219756U JPS6219756U (US06534493-20030318-C00166.png) | 1987-02-05 |
JPH0636595Y2 true JPH0636595Y2 (ja) | 1994-09-21 |
Family
ID=30991172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11134085U Expired - Lifetime JPH0636595Y2 (ja) | 1985-07-19 | 1985-07-19 | 半導体集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0636595Y2 (US06534493-20030318-C00166.png) |
-
1985
- 1985-07-19 JP JP11134085U patent/JPH0636595Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6219756U (US06534493-20030318-C00166.png) | 1987-02-05 |
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