JPH0636469B2 - Method for manufacturing copper-clad laminated wiring board - Google Patents
Method for manufacturing copper-clad laminated wiring boardInfo
- Publication number
- JPH0636469B2 JPH0636469B2 JP63178454A JP17845488A JPH0636469B2 JP H0636469 B2 JPH0636469 B2 JP H0636469B2 JP 63178454 A JP63178454 A JP 63178454A JP 17845488 A JP17845488 A JP 17845488A JP H0636469 B2 JPH0636469 B2 JP H0636469B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet material
- pattern
- metal sheet
- adhesive
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 「産業上の利用分野」 本発明は、各種の絶縁基板上の厚肉の銅または銅合金か
らなる配線パターンを形成した銅張積層配線板の製造方
法に関する。TECHNICAL FIELD The present invention relates to a method for manufacturing a copper-clad laminated wiring board on which a wiring pattern made of thick copper or copper alloy is formed on various insulating substrates.
「従来の技術」 この種の銅張積層配線板は、表面に絶縁層を形成したア
ルミ等の金属板やセラミックス製等の絶縁基板上に、厚
さ数１０μｍ程の銅箔配線パターンを形成したもので、
前記絶縁基板により高い放熱性，耐熱性，寸法安定性が
得られることから、大電力用や高密度実装用のプリント
配線板として市場を広げつつある。"Prior Art" In this type of copper-clad laminated wiring board, a copper foil wiring pattern having a thickness of several tens of μm is formed on a metal plate such as aluminum having an insulating layer formed on the surface or an insulating substrate made of ceramics or the like. Things
Since the insulating substrate provides high heat dissipation, heat resistance, and dimensional stability, the market is expanding as a printed wiring board for high power and high density mounting.
そして最近では、パワートランジスタ、電源回路、大出
力アンプ等のさらに大電力を制御する用途に合わせて、
従来は薄かった配線パターンの銅箔を１mm程度にまで厚
くした配線板への需要が生じ始めている。And recently, in accordance with the use to control higher power such as power transistors, power supply circuits, and large output amplifiers,
Demand for wiring boards in which copper foil with a wiring pattern that was thin in the past was thickened to about 1 mm has begun to occur.
「発明が解決しようとする課題」 そこで本発明者らは、上記のように配線パターンの厚い
銅張積層配線板を製造するため、絶縁基板上に厚肉の銅
板を接着固定し、この銅板上に配線パターンに対応する
マスキングを施してエッチングする方法を試みた。[Problems to be Solved by the Invention] Therefore, in order to manufacture a copper-clad laminated wiring board having a thick wiring pattern as described above, the present inventors adhere a thick copper plate to an insulating substrate and fix it on the copper plate. We tried the method of etching by masking the wiring pattern.
ところが、このように厚肉な銅板をエッチングする方法
では、多大な手間と時間を要して生産性が極めて悪く、
採算に合わないうえ、エッチング液の回り込みによって
配線パターンの境界近傍が侵食され、配線パターンの信
頼性を低下する欠点があった。However, in such a method for etching a thick copper plate, a great deal of labor and time is required, and productivity is extremely poor,
In addition to being unprofitable, there is a drawback that the vicinity of the boundary of the wiring pattern is eroded by the sneaking of the etching solution, and the reliability of the wiring pattern is reduced.
またこれとは別に、銅板を配線パターンの形状に打ち抜
き加工し、この打抜板を絶縁基板に貼付する方法も試み
たが、この方法では配線パターンが多数の断片に分割さ
れてしまうために、これらパターン片を正確に位置決め
して基板に接着するのが困難で、実現性に乏しかった。Separately from this, I also tried a method of punching a copper plate into the shape of a wiring pattern and pasting this punched plate to an insulating substrate, but in this method the wiring pattern is divided into many fragments, It was difficult to accurately position and bond these pattern pieces to the substrate, which was not feasible.
「課題を解決するための手段」 本発明は上記課題を解決するためになされたもので、銅
または銅合金製の薄板から、配線パターンを構成する複
数のパターン線部およびこれらパターン線部を相互に固
定するための架橋部からなる一体形状のパターン板を成
形し、このパターン板の片面に金属シート材を、一定温
度以上に加熱されると貼付力が低下する熱剥離型の接着
剤または粘着材を介して貼付するとともに、前記各架橋
部を機械加工等により除去した後、絶縁基板上に前記パ
ターン板側を熱硬化型接着剤、蝋付けまたは拡散接合に
より貼付し、さらに前記一定温度以上に加熱することに
より前記熱剥離型の接着剤または粘着材の貼付力を低下
させて前記金属シート材を除去することを特徴としてい
る。"Means for Solving the Problems" The present invention has been made to solve the above problems, and a plurality of pattern line portions constituting a wiring pattern and these pattern line portions are mutually formed from a thin plate made of copper or a copper alloy. A pattern board of integral shape consisting of a cross-linking part for fixing to is molded, and a metal sheet material on one side of this pattern board, a heat-peelable adhesive or adhesive whose sticking force decreases when heated above a certain temperature. While pasting through the material, after removing each cross-linking portion by machining, etc., the patterned board side is pasted on the insulating substrate with a thermosetting adhesive, brazing or diffusion bonding, further above the certain temperature It is characterized in that the metal sheet material is removed by lowering the sticking force of the heat-peelable adhesive or pressure-sensitive adhesive by heating the metal sheet material.
「作 用」 この方法によれば、互いにつながりのないパターン線部
を架橋部により相互に仮固定した形状のパターン板を一
体成形し、このパターン板を金属シート材に貼付したう
え架橋部を機械加工等で除去し、パターン線部を金属シ
ート材で保持したまま絶縁基板に接着固定するため、各
パターン線部の配置に誤差が生じることがない。さらに
金属シート材は熱膨張率が小さく高い抗張力を有するた
め、加熱工程等を経ても熱膨張等によるパターン線部の
位置精度低下が生じにくい。[Working] According to this method, a pattern plate having a shape in which pattern line parts that are not connected to each other are temporarily fixed to each other by a bridge part is integrally molded, the pattern plate is attached to a metal sheet material, and then the bridge part is machined. Since the pattern line portions are removed by processing and the pattern line portions are bonded and fixed to the insulating substrate while being held by the metal sheet material, no error occurs in the arrangement of the pattern line portions. Further, since the metal sheet material has a small coefficient of thermal expansion and a high tensile strength, the positional accuracy of the pattern line portion is unlikely to be deteriorated due to thermal expansion or the like even after a heating process or the like.
また、パターン板は基板の肉厚に拘わらず打抜加工等に
より効率良く生産できるうえ、金属シート材に接着した
後には各架橋部を切削加工、打ち抜き加工等によって容
易に除去できるため、エッチングのように手間と時間の
かかる工程が要らず、量産に適し、製造コスト低減が図
れる。Further, the pattern plate can be efficiently produced by punching or the like regardless of the thickness of the substrate, and after being bonded to the metal sheet material, each cross-linked portion can be easily removed by cutting, punching or the like. Thus, it does not require time-consuming and time-consuming steps, is suitable for mass production, and can reduce manufacturing costs.
さらに、本発明の方法では、加熱により貼付力が低下す
る熱剥離型の接着剤または粘着材でパターン板に金属シ
ート材を貼付する一方、絶縁基板には、熱硬化型接着
剤、蝋付けまたは拡散接合によりパターン板側を貼付
し、加熱により熱剥離型の接着剤または粘着材の貼付力
を低下させて金属シート材を除去するから、パターン板
と絶縁基板との接合に影響を与えることなく金属シート
材のみを選択的かつ容易に除去できる。しかも、金属シ
ート材は耐熱性に優れて加熱時の寸法変化が小さいた
め、加熱前後の金属シート材の寸法変化によるパターン
板の位置狂いが生じない上、、熱伝導性に優れるから、
熱剥離型の接着剤または粘着材の加熱温度分布を均一に
する作用が得られ、金属シート材の剥離状態を安定化し
て、その分、金属シート材の剥離工程の速度および信頼
度を高めることが可能となる。Further, in the method of the present invention, the metal sheet material is attached to the pattern plate with a heat-peelable adhesive or pressure-sensitive adhesive whose adhesive force is reduced by heating, while the insulating substrate is a thermosetting adhesive, brazing or The pattern plate side is pasted by diffusion bonding, and the adhesive force of the heat-peelable adhesive or pressure-sensitive adhesive is reduced by heating to remove the metal sheet material, so that the bonding between the pattern plate and the insulating substrate is not affected. Only the metal sheet material can be selectively and easily removed. Moreover, since the metal sheet material has excellent heat resistance and a small dimensional change during heating, the positional displacement of the pattern plate due to the dimensional change of the metal sheet material before and after heating does not occur, and since the heat conductivity is excellent,
The effect of making the heating temperature distribution of the heat-peelable adhesive or pressure-sensitive adhesive uniform is obtained, the peeling state of the metal sheet material is stabilized, and the speed and reliability of the peeling process of the metal sheet material are correspondingly increased. Is possible.
「実施例」 以下、図面を参照して、本発明の一実施例を詳細に説明
する。[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
この方法ではまず、表面にＮｉめっき等の保護膜を形成
した銅または銅合金からなる薄板から、第１図に示すよ
うに、配線パターンを構成する独立した複数のパターン
線部１…、およびこれらパターン線部１…を一体に連結
する架橋部２…とからなるパターン板３を打抜加工等に
より一体成形する。In this method, first, as shown in FIG. 1, from a thin plate made of copper or a copper alloy having a protective film such as Ni plating formed thereon, a plurality of independent pattern line parts 1 ... The pattern plate 3 including the bridge portions 2 that integrally connect the pattern line portions 1 is integrally formed by punching or the like.
前記各架橋部２…の幅や長さは、除去作業を簡略化する
ために全て統一しておくことが望ましく、特に、縦横の
方向性が無い正方形にすると後の除去工程に都合がよ
い。また架橋部２…の形成位置は、できるだけ少数の架
橋部２…によって各パターン線部１…を十分な強度で固
定でき、しかも各架橋部２…ができるだけ同一直線に沿
って並ぶように考慮すべきである。架橋部２…の個数が
多いとその分、架橋部除去作業に時間を要する。また、
直線に沿って並べておくと、架橋部２…の数が同じ場合
にも除去作業の効率を高められる。It is desirable that the widths and lengths of the respective cross-linking portions 2 are all uniform in order to simplify the removing work, and in particular, a square having no vertical or horizontal directionality is convenient for the subsequent removing step. Further, the formation positions of the bridging portions 2 ... Are considered so that the pattern line portions 1 ... Can be fixed with sufficient strength by the fewest number of bridging portions 2 ... And the bridging portions 2 ... Are aligned along the same straight line as much as possible. Should be. If the number of the cross-linking portions 2 is large, the work for removing the cross-linking portions will take time accordingly. Also,
By arranging them along a straight line, the efficiency of the removing operation can be improved even when the number of the bridge portions 2 ... Is the same.
次に、こうして得られたパターン板３…の打ち抜き図の
下面側(数μｍ程度の僅かなバリが生じる)に、第２図の
ように長尺の金属シート材４を接着剤等で貼り付けてい
く。この金属シート材４は後工程で除去(剥離)されるも
ので、その材質としては鉄，アルミニウム，ステンレス
等が比較的安価で適するが、他の金属も使用可能であ
る。また金属シート材４の厚さは、使用する加工機械に
応じて、例えば０．０５〜０．５mm程度とされる。図示
例の金属シート材４の幅方向端縁には位置決め用の送り
孔５…が形成され、これにより作業効率や位置決め精度
の向上、および量産化が図られている。Next, as shown in FIG. 2, a long metal sheet material 4 is attached to the lower surface side (a slight burr of about several μm is formed) of the punched drawing of the pattern plate 3 obtained in this way with an adhesive or the like. To go. This metal sheet material 4 is to be removed (peeled) in a later step, and as the material thereof, iron, aluminum, stainless steel, etc. are relatively inexpensive and suitable, but other metals can also be used. The thickness of the metal sheet material 4 is, for example, about 0.05 to 0.5 mm depending on the processing machine used. Positioning feed holes 5 ... Are formed in the widthwise end edge of the metal sheet material 4 in the illustrated example, whereby the work efficiency and the positioning accuracy are improved, and mass production is achieved.
金属シート材４をパターン板３…に貼付するには、エポ
キシ系等の接着剤を接合面に薄く塗布してこれらを重ね
たり、シート材４とパターン板３の間に両面粘着テープ
を挾んで圧迫する方法が採られる。これら接着剤あるい
は粘着テープは、後工程で一定温度まで加熱すると貼付
力が低下して容易に剥離できるもの（熱剥離型と称す
る）でなければならず、例えば２００〜３００℃程度の
加熱によって溶融または剥離するものが適している。な
お、両面粘着テープを用いれば、接着剤を使用する場合
よりも生産ラインが安定化し、量産に好都合である。ま
た粘着テープを用いた場合には、パターン板３に金属シ
ート材４を貼付した後、これらを有機溶剤で洗浄し、パ
ターン板４の開口部で露出した粘着テープの粘着材を除
去しておくとよい。こうすることにより、架橋部２…を
打ち抜き等によって除去する際、架橋部２の周囲の粘着
剤によるカス発生が低減できるうえ、粘着テープの露出
面に金属粉等が付着して悪影響を及ぼすおそれがなくな
る。To attach the metal sheet material 4 to the pattern plate 3 ..., an adhesive such as an epoxy-based adhesive is thinly applied to the joint surface to overlap them, or a double-sided adhesive tape is sandwiched between the sheet material 4 and the pattern plate 3. The method of compression is adopted. These adhesives or pressure-sensitive adhesive tapes must be ones that can be easily peeled off when they are heated to a certain temperature in a subsequent step and easily peeled off (referred to as heat-peelable type). Alternatively, those that are peeled off are suitable. It should be noted that the use of the double-sided adhesive tape stabilizes the production line and is convenient for mass production as compared with the case of using the adhesive. When an adhesive tape is used, after the metal sheet material 4 is attached to the pattern plate 3, these are washed with an organic solvent to remove the adhesive material of the adhesive tape exposed at the opening of the pattern plate 4. Good. By doing so, when removing the cross-linking portion 2 by punching or the like, it is possible to reduce the generation of scraps due to the adhesive around the cross-linking portion 2, and it is possible that metal powder or the like adheres to the exposed surface of the adhesive tape and adversely affects it. Disappears.
次に、パターン板３を貼付した金属シート材４をＮＣ制
御される研削盤や打ち抜き装置等にセットし、金属シー
ト材４を下側にして、パターン板３の架橋部２…のみを
研削または打ち抜き加工により除去する。その際、金属
シート材４に図示Ｐ…のように穴をあけても構わない。
また架橋部２…はひとつづつ除去してもよいし、全てを
同時に除去してもよい。Next, the metal sheet material 4 to which the pattern plate 3 is attached is set on a NC controlled grinder or punching device, and the metal sheet material 4 is placed on the lower side, and only the cross-linking portions 2 of the pattern plate 3 are ground or Remove by punching. At that time, holes may be formed in the metal sheet material 4 as shown by P.
Further, the bridging portions 2 ... May be removed one by one, or all of them may be removed at the same time.
次に、金属シート材４を上にして、パターン板３側を絶
縁基板６上に接着する。第３図はその工程の一例を示
し、コンベヤ等で順次整列状態で送られる基板６…上
に、押圧ローラ７により位置決めしつつ金属シート材４
を順次接合していく。Next, with the metal sheet material 4 facing upward, the pattern plate 3 side is bonded onto the insulating substrate 6. FIG. 3 shows an example of the process, in which the metal sheet material 4 is positioned on the substrates 6 ...
Will be joined in sequence.
絶縁基板６としては、次のようなものが使用可能であ
る。The following may be used as the insulating substrate 6.
アルミ，鉄板，ケイ素鋼板，銅板，銅インバー板等の
金属板８の表面に絶縁層９を形成した基板。絶縁層９と
しては、ポリイミド等の高耐熱性を有する合成樹脂が好
適であり、その厚さは放熱性および絶縁性を考慮して数
１０μｍ〜数１００μｍとされる。この種の絶縁基板と
パターン板の接合には、エポキシ系等の熱硬化型接着剤
が適し、通常４００℃程度に加熱して硬化させる。A substrate in which an insulating layer 9 is formed on the surface of a metal plate 8 such as an aluminum plate, an iron plate, a silicon steel plate, a copper plate, or a copper invar plate. As the insulating layer 9, a synthetic resin having high heat resistance such as polyimide is suitable, and the thickness thereof is set to several tens μm to several hundreds μm in consideration of heat dissipation and insulating properties. A thermosetting adhesive such as an epoxy adhesive is suitable for joining the insulating substrate and the pattern plate of this type, and is usually heated to about 400 ° C. to be cured.
Ａｌ2Ｏ3・ＳｉＯ2等のセラミックス板。この場合に
は、酸素を２００〜５００ppm含有する銅板（タフピッ
チ銅）を用いたパターン板３を成形し、このパターン板
３をＡｌ2Ｏ3・ＳｉＯ2基板に位置決めして載せたあ
と、水素雰囲気中で約９００℃に加熱すると、タフピッ
チ銅の中の酸素原子が基板側に拡散して境界面にＣｕＯ
が生じ、ガラス反応によりパターン板３が強固に拡散接
合される利点がある。また、銀ロウや熱硬化型接着剤を
用いて接合することも当然可能である。Ceramic plate such as Al 2 O 3 · SiO 2 . In this case, the pattern plate 3 using a copper plate (tough pitch copper) containing 200 to 500 ppm of oxygen is formed, and the pattern plate 3 is positioned and placed on the Al 2 O 3 .SiO 2 substrate, and then the hydrogen atmosphere is used. When heated to about 900 ° C in the atmosphere, oxygen atoms in tough pitch copper diffuse to the substrate side and CuO
And the pattern reaction is strongly diffusion-bonded by the glass reaction. Also, it is naturally possible to join them by using a silver wax or a thermosetting adhesive.
ガラスエポキシ被覆板等の従来から使用されている材
質。接合方法はと同様である。Conventional materials such as glass epoxy coated plates. The joining method is similar to.
なお、絶縁基板６の厚さは、所望の放熱性および強度を
考慮して通常数mm程度に決定される。The thickness of the insulating substrate 6 is usually set to about several mm in consideration of desired heat dissipation and strength.
なお、前記接合時に加熱する場合には、金属シート材４
を貼付している接着剤あるいは粘着テープが溶けるの
で、接合がある程度進行した時点で金属シート材４をパ
ターン板３から剥離する。また、接合時に加熱しない場
合にはシート材４の貼付けに使用した接着剤(粘着剤)に
応じて加熱等の処理を施し、金属シート材４を剥離す
る。When heating at the time of joining, the metal sheet material 4
Since the adhesive or pressure-sensitive adhesive tape that has been adhered to is melted, the metal sheet material 4 is peeled off from the pattern plate 3 when the joining has progressed to some extent. If the sheet material 4 is not heated at the time of joining, the metal sheet material 4 is peeled off by heating or the like depending on the adhesive (adhesive) used for attaching the sheet material 4.
その後、金属シート材４を剥離したパターン板３の表面
から残留接着剤や粘着剤を完全に除去し、さらに必要に
応じて洗浄やフラックスの塗布を行ない、第４図および
第５図に示す銅張積層配線板を得る。After that, the residual adhesive and the pressure-sensitive adhesive are completely removed from the surface of the pattern plate 3 from which the metal sheet material 4 has been peeled off, and further cleaning and flux application are performed as necessary, and the copper shown in FIGS. Obtain a laminated wiring board.
上記工程からなる銅張積層配線板の製造方法によれば、
互いに独立したパターン線部１…の間に予め架橋部２…
を掛け渡したパターン板３を一体成形し、このパターン
板３を金属シート材４に貼付したうえ架橋部２…を除去
し、各パターン線部１…を金属シート材４で固定したま
ま絶縁基板６に接着するので、絶縁基板６上でのパター
ン線部１…の配置誤差が生じることがない。また、金属
シート材４は熱膨張率が小さく、抗張力が大きいため、
加熱時に伸びや反りが生じにくく、これらに起因するパ
ターン線部１…の位置精度の低下も防ぐことができる。
したがって、パターン精度が高く、信頼性の高い銅張積
層配線板が製造できるとともに、金属シート材４に貼付
するからパターン板３…の搬送・位置決め等の取り扱い
が容易で、生産ラインの簡略化および効率化が図れる。According to the method for manufacturing a copper clad laminated wiring board comprising the above steps,
Between the pattern line portions 1 ...
The pattern board 3 which has been bridged over is integrally molded, the pattern board 3 is attached to the metal sheet material 4, the cross-linking portions 2 are removed, and the pattern line portions 1 are fixed by the metal sheet material 4 and the insulating substrate Since it is adhered to the wiring 6, the pattern line portions 1 on the insulating substrate 6 do not have a placement error. Further, since the metal sheet material 4 has a small coefficient of thermal expansion and a large tensile strength,
Elongation and warpage are less likely to occur during heating, and the reduction in the positional accuracy of the pattern line portions 1 ...
Therefore, a highly reliable copper-clad laminated wiring board with high pattern accuracy can be manufactured, and since it is attached to the metal sheet material 4, it is easy to carry the pattern board 3 ... Efficiency can be improved.
しかも、金属シート材４は熱伝導性に優れるから、熱剥
離型の接着剤または粘着材の加熱時温度分布を均一にす
る作用が得られ、金属シート材４の剥離状態を安定化し
て、その分、金属シート材４の剥離工程の速度および信
頼度を高めることが可能である。Moreover, since the metal sheet material 4 is excellent in thermal conductivity, the effect of making the temperature distribution of the heat-peelable adhesive or pressure-sensitive adhesive uniform during heating can be obtained, and the peeled state of the metal sheet material 4 can be stabilized. Therefore, it is possible to increase the speed and reliability of the peeling process of the metal sheet material 4.
また、パターン板３は、その肉厚に関係なく打抜加工等
により効率良く製造できるうえ、各架橋部２…は前記の
ような切削や打ち抜き加工等によって容易に除去できる
ため、エッチングのような手間と時間のかかる作業が無
く、量産が可能で、その分製造コスト低減が図れる。さ
らに、架橋部２…を除去した後も絶縁基板６に接合され
るまで金属シート材４で保持されているため、パターン
板３の打抜加工時に生じた僅かなバリを確実に絶縁基板
６とは反対側に向けて接合でき、このバリで絶縁基板６
の絶縁層９を傷つけるおそれがないという利点も有す
る。Further, the pattern plate 3 can be efficiently manufactured by punching or the like regardless of its wall thickness, and the respective bridge portions 2 ... Can be easily removed by the above-mentioned cutting or punching, so that the patterning plate 3 can be easily etched. Mass production is possible without labor and time-consuming work, and the manufacturing cost can be reduced accordingly. Further, even after the bridging portions 2 are removed, the metal sheet material 4 holds the insulating substrate 6 until it is joined to the insulating substrate 6. Therefore, even a slight burr generated during the punching process of the pattern plate 3 can be securely connected to the insulating substrate 6. Can be bonded to the other side, and this burr can be used to insulate the insulating substrate 6
There is also an advantage that there is no fear of damaging the insulating layer 9 of.
さらに金属シート材４を用いることにより、架橋部２…
を打ち抜き加工する場合にも、他の材質のシート材を用
いた場合に比してバリやカスの発生が少なく、これらの
付着による打ち抜き装置の故障等が生じにくいうえ、加
熱時に絶縁基板６の絶縁層９の材質と反応するおそれも
ない。Further, by using the metal sheet material 4, the bridge portion 2 ...
Even when punching is performed, burrs and debris are less generated as compared with the case of using a sheet material of another material, and the punching device is less likely to malfunction due to the adhesion of these, and the insulating substrate 6 is not heated. There is no possibility of reacting with the material of the insulating layer 9.
なお、上記実施例では長尺の金属シート材４を用いてい
たが、その代わりに１枚または複数枚のパターン板３に
対応する寸法の金属板を用いてもよい。その場合には、
剥離した金属シート材４の再利用が容易である。Although the long metal sheet material 4 is used in the above embodiment, a metal plate having a size corresponding to one or a plurality of pattern plates 3 may be used instead. In that case,
It is easy to reuse the peeled metal sheet material 4.
また上記実施例では、絶縁基板６の片面のみにパターン
板３を固定していたが、絶縁基板６の両面にそれぞれ異
なるパターン板を固定する構成としてもよいし、絶縁基
板６の裏面に金属製等の放熱板を接合してもよい。さら
に架橋部２…の除去方法としては、レーザー光線や、エ
ッチング等の手段も使用可能である。Further, in the above embodiment, the pattern plate 3 is fixed to only one surface of the insulating substrate 6, but different pattern plates may be fixed to both surfaces of the insulating substrate 6, or the back surface of the insulating substrate 6 may be made of metal. You may join the heat sink etc. Further, as a method of removing the cross-linking portions 2, ..., Means such as laser beam and etching can also be used.
「発明の効果」 以上説明したように、本発明に係わる銅張積層配線板の
製造方法によれば、パターン線部を架橋部で連結したパ
ターン板を一体成形し、これを金属シート材に貼付した
うえ架橋部を機械的に除去し、個々のパターン線部を金
属シート材に固定したまま絶縁基板に接着するので、パ
ターン線部の配置誤差が生じることがない。また金属シ
ート材は熱膨張率が小さく抗張力が大きいため、加熱時
にも伸びや反りが生じにくく、これらに起因するパター
ン線部の位置精度低下も防げる。したがってパターン精
度が高く、信頼性の高い銅張積層配線板が製造できると
ともに、金属シート材に貼付するからパターン板の取り
扱いが容易で、生産ラインの簡略化および効率化が図れ
る。また、パターン板はその肉厚に関係なく打抜加工等
により効率良く製造できるうえ、各架橋部は機械加工等
により容易に除去できるため、低コストで量産が可能で
ある。さらに金属シート材を用いることにより、架橋部
を打ち抜き加工する場合にも他の材質のシート材を用い
た場合に比してバリやカスの発生が少なく、これらの付
着による加工装置の故障が生じにくいという利点も有す
る。"Effects of the Invention" As described above, according to the method for manufacturing a copper-clad laminated wiring board according to the present invention, a pattern board in which pattern line portions are connected by cross-linking portions is integrally formed and is attached to a metal sheet material. In addition, since the bridge portion is mechanically removed and the individual pattern line portions are fixed to the metal sheet material and bonded to the insulating substrate, the pattern line portion placement error does not occur. Further, since the metal sheet material has a small coefficient of thermal expansion and a large tensile strength, elongation and warpage are unlikely to occur even during heating, and it is possible to prevent a decrease in the positional accuracy of the pattern line portion due to these factors. Therefore, a copper clad laminated wiring board with high pattern accuracy and high reliability can be manufactured, and since the copper clad laminated board is attached to a metal sheet material, the pattern board can be handled easily, and the production line can be simplified and made more efficient. Further, since the pattern plate can be efficiently manufactured by punching or the like regardless of its wall thickness, and each cross-linked portion can be easily removed by machining or the like, mass production is possible at low cost. Furthermore, by using a metal sheet material, burrs and debris are less likely to occur when punching the cross-linking part than when using a sheet material of another material, and the processing device malfunctions due to the adhesion of these materials. It also has the advantage of being difficult.
さらに、本発明の方法では、加熱により貼付力が低下す
る熱剥離型の接着剤または粘着材でパターン板に金属シ
ート材を貼付する一方、絶縁基板には、熱硬化型接着
剤、鑞付けまたは拡散接合によりパターン板側を貼付
し、加熱により熱剥離型の接着剤または粘着材の貼付力
を低下させて金属シート材を除去するから、パターン板
と絶縁基板との接合に影響を与えることなく金属シート
材のみを選択的かつ容易に除去できる。しかも、金属シ
ート材は耐熱性に優れて加熱時の寸法変化が小さいた
め、加熱前後の金属シート材の寸法変化によるパターン
板の位置狂いが生じない上、熱伝導性に優れるから、熱
剥離型の接着剤または粘着材の加熱温度分布を均一にす
る作用が得られ、金属シート材の剥離状態を安定化し、
その分、金属シート材の剥離工程の速度および信頼度を
高めることが可能である。Furthermore, in the method of the present invention, the metal sheet material is attached to the pattern plate with a heat-peelable adhesive or pressure-sensitive adhesive whose adhesive force is reduced by heating, while the insulating substrate is a thermosetting adhesive, brazed or The pattern plate side is pasted by diffusion bonding, and the adhesive force of the heat-peelable adhesive or pressure-sensitive adhesive is reduced by heating to remove the metal sheet material, so that the bonding between the pattern plate and the insulating substrate is not affected. Only the metal sheet material can be selectively and easily removed. Moreover, since the metal sheet material has excellent heat resistance and a small dimensional change during heating, the pattern plate will not be misaligned due to the dimensional change of the metal sheet material before and after heating, and the thermal conductivity is excellent, so that the heat peelable type The effect of making the heating temperature distribution of the adhesive or pressure sensitive adhesive of is uniform is obtained, stabilizing the peeling state of the metal sheet material,
Accordingly, the speed and reliability of the peeling process of the metal sheet material can be increased.
第１図ないし第５図は、いずれも本発明に係わる銅張積
層配線板の製造方法の一実施例を説明するためのもの
で、第１図はパターン板の一形状例を示す平面図、第２
図はパターン板を金属シート材に貼付し架橋部を除去し
た状態を示す平面図、第３図はパターン板を基板に接着
する工程を示す側面図、第４図は得られた銅張積層配線
板の断面拡大図、第５図は同配線板の平面図である。 １……パターン線部、２……架橋部、３……パターン
板、４……金属シート材、５……送り孔、６……絶縁基
板、８……金属板、９……絶縁層、Ｐ……架橋部除去箇
所。1 to 5 are all for explaining one embodiment of a method for manufacturing a copper clad laminated wiring board according to the present invention, and FIG. 1 is a plan view showing one example of the shape of a pattern board, Second
The figure is a plan view showing a state in which the pattern plate is attached to the metal sheet material and the bridging portion is removed, FIG. 3 is a side view showing the step of adhering the pattern plate to the substrate, and FIG. 4 is the obtained copper clad laminated wiring. FIG. 5 is an enlarged cross-sectional view of the board, and FIG. 5 is a plan view of the wiring board. 1 ... pattern line part, 2 ... bridge part, 3 ... pattern plate, 4 ... metal sheet material, 5 ... feed hole, 6 ... insulating substrate, 8 ... metal plate, 9 ... insulating layer, P: Bridge removal point.
Claims (1)
ンを構成する複数のパターン線部およびこれらパターン
線部を相互に固定するための架橋部からなる一体形状の
パターン板を成形し、このパターン板の片面に金属シー
ト材を、一定温度以上に加熱されると貼付力が低下する
熱剥離型の接着剤または粘着材を介して貼付するととも
に、前記各架橋部を機械加工等により除去した後、絶縁
基板上に前記パターン板側を熱硬化型接着剤、鑞付けま
たは拡散接合により貼付し、さらに前記一定温度以上に
加熱することにより前記熱剥離型の接着剤または粘着材
の貼付力を低下させて前記金属シート材を除去すること
を特徴とする銅張積層配線板の製造方法。1. A monolithic pattern plate comprising a plurality of pattern line portions constituting a wiring pattern and a bridge portion for mutually fixing the pattern line portions is formed from a thin plate made of copper or a copper alloy, A metal sheet material was attached to one surface of the pattern plate via a heat-peelable adhesive or pressure-sensitive adhesive whose attachment force decreases when heated to a certain temperature or higher, and the cross-linked portions were removed by machining or the like. After that, the pattern plate side on the insulating substrate is attached by a thermosetting adhesive, brazing or diffusion bonding, and further the adhesive force of the heat-peelable adhesive or pressure-sensitive adhesive is applied by heating to a certain temperature or higher. A method for manufacturing a copper-clad laminated wiring board, which comprises lowering the metal sheet material to remove the metal sheet material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63178454A JPH0636469B2 (en) | 1988-07-18 | 1988-07-18 | Method for manufacturing copper-clad laminated wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63178454A JPH0636469B2 (en) | 1988-07-18 | 1988-07-18 | Method for manufacturing copper-clad laminated wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0228393A JPH0228393A (en) | 1990-01-30 |
| JPH0636469B2 true JPH0636469B2 (en) | 1994-05-11 |
Family
ID=16048800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63178454A Expired - Lifetime JPH0636469B2 (en) | 1988-07-18 | 1988-07-18 | Method for manufacturing copper-clad laminated wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636469B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10128597A (en) * | 1996-10-28 | 1998-05-19 | Aida Eng Ltd | Slide drive device for press using link |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61110489A (en) * | 1984-11-02 | 1986-05-28 | 株式会社日立製作所 | Manufacture of conductor punched wiring board |
-
1988
- 1988-07-18 JP JP63178454A patent/JPH0636469B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0228393A (en) | 1990-01-30 |
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