JPH06349904A - Probe card - Google Patents

Probe card

Info

Publication number
JPH06349904A
JPH06349904A JP5133625A JP13362593A JPH06349904A JP H06349904 A JPH06349904 A JP H06349904A JP 5133625 A JP5133625 A JP 5133625A JP 13362593 A JP13362593 A JP 13362593A JP H06349904 A JPH06349904 A JP H06349904A
Authority
JP
Japan
Prior art keywords
probe
probe card
needles
sub
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5133625A
Other languages
Japanese (ja)
Inventor
Masao Okanda
政雄 大神田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP5133625A priority Critical patent/JPH06349904A/en
Publication of JPH06349904A publication Critical patent/JPH06349904A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a probe card with which the working manhours for removal of resin with which all probe needles are fixed, readjustment of positioning of all probe needles, refixing of probe needles using resin and the like when the probe needles are replaced in the case where they are worn out or broken, can be reduced and also kinds of probe cards can be decreased. CONSTITUTION:This probe card is composed of a probe card substrate 1 and a plurality of probe card sub-substrates 2 on which a probe 3 is fixed. The removal and refixing of the probe 3 is conducted by the unit of a probe card sub-substrate 2. Accordingly, the number of probes 3 to be adjusted can be reduced. Also, when the number of simultaneous measurements is different, the situation can be coped with only by attaching the sub-substrate of the number of simultaneous measurements to the probe card substrate, and the probe card for the number of simultaneous measurements can be unnecessitated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電気的測定対象が微細
である際に使用されるプローブカードに関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used when an electrical measurement target is minute.

【0002】[0002]

【従来の技術】従来プローブカードは、プローブ針全数
をプローブカード基板に絶縁性の樹脂類で固定してい
た。
2. Description of the Related Art Conventionally, in a probe card, all the probe needles are fixed to a probe card substrate with an insulating resin.

【0003】そのため複数個のプローブ針の内1本のプ
ローブ針が摩耗したり破損して交換する場合でも、複数
個のプローブ針を固定している樹脂を除去しなければな
らないため、プローブ針全数の再位置調整が必要であっ
た。
Therefore, even if one of the plurality of probe needles is worn or damaged and needs to be replaced, the resin fixing the plurality of probe needles must be removed. Repositioning was required.

【0004】[0004]

【発明が解決しようとする課題】かかる従来の方法だ
と、複数個のプローブ針の内1本のプローブ針が摩耗し
たり破損して交換する場合でも、複数個のプローブ針を
固定している樹脂を除去しなければならないため、プロ
ーブ針全数の再位置調整が必要であり、作業が多大であ
った。しかも固定の際は全数のプローブ針を調整可能範
囲内の位置精度で固定する必要があるため、熟練度を要
するものである。
According to such a conventional method, a plurality of probe needles are fixed even if one of the plurality of probe needles is worn or damaged and is replaced. Since the resin has to be removed, it is necessary to readjust the total number of probe needles, which requires a lot of work. Moreover, when fixing, it is necessary to fix all the probe needles with positional accuracy within the adjustable range, which requires skill.

【0005】又同品種であっても、同時測定数が異なる
場合は、全く違うプローブカード基板となってしまい、
多種のプローブカードが必要であった。さらにそれぞれ
の種類のプローブカードには、必ず予備が必要であり、
多量のプローブカードが必要となっていた。
Further, even in the same type, if the number of simultaneous measurements is different, a completely different probe card substrate will result,
Various probe cards were needed. In addition, each type of probe card must have a spare,
A lot of probe cards were needed.

【0006】本発明はかかる従来の課題を解決し、プロ
ーブカードの多種、多量化を防ぐプローブカードを提供
する事を目的とする。
An object of the present invention is to solve the conventional problems and to provide a probe card which prevents various types of probe cards from increasing in number.

【0007】[0007]

【課題を解決するための手段】本発明は、プローブカー
ドをプローブカード基板本体とプローブ針を固定した複
数のプローブカードサブ基板に分割して構成する手段に
より、プローブ針固定用樹脂の除去及び再固定がプロー
ブカードサブ基板単位でできるため、プローブ針交換時
の再調整対象プローブ針数を少なくでき、固定作業も同
時固定するプローブ針数が少ないため熟練度が低く済
む。また同時測定数が異なる場合には、同時測定数分の
プローブカードサブ基板をプローブカード基板に装着す
るだけで対応でき、1種類のプローブカードで済み、予
備もサブ基板だけ所有すればよいので多量化を防ぐ事が
できる。
According to the present invention, a probe card is divided into a plurality of probe card sub-boards on which a probe card substrate body and a probe needle are fixed. Since the fixing can be done on a probe card sub-board unit basis, the number of probe needles to be readjusted when exchanging probe needles can be reduced, and the fixing work also requires a small number of probe needles to be fixed at the same time, so that the skill level is low. Also, when the number of simultaneous measurements is different, it is sufficient to mount the probe card sub boards for the number of simultaneous measurements on the probe card board, and only one type of probe card is required. It can prevent quantification.

【0008】[0008]

【実施例】図1に本発明の一実施例を示す。FIG. 1 shows an embodiment of the present invention.

【0009】従来のプローブカードだとプローブ針3が
摩耗したり破損して交換する場合、固定用樹脂4の除
去、プローブ針3全数の再位置調整、樹脂類での再固
定、等の多大の作業が必要であった。
In the case of a conventional probe card, when the probe needles 3 are worn or damaged and are to be replaced, the fixing resin 4 is removed, all the probe needles 3 are repositioned, and the resin needles are re-fixed. Work was needed.

【0010】しかもこれら作業は熟練度を要するもので
ある。
Moreover, these operations require skill.

【0011】本発明はかかる従来の課題を解決し、プロ
ーブ針交換時に、作業工数を少なく、熟練性も不要とす
る、プローブカード基板を提供する。
The present invention solves the conventional problems described above, and provides a probe card substrate which requires less man-hours and does not require skill when replacing the probe needle.

【0012】図1に示すように、プローブカード基板1
とプローブカードサブ基板2を複数個用意し、各々のプ
ローブカードサブ基板2は同構造としする。
As shown in FIG. 1, a probe card substrate 1
And a plurality of probe card sub-boards 2 are prepared, and each probe card sub-board 2 has the same structure.

【0013】プローブ針3は、固定用樹脂4によりプロ
ーブカードサブ基板2に固定する。
The probe needle 3 is fixed to the probe card sub-board 2 with a fixing resin 4.

【0014】プローブカードサブ基盤2はネジ等で、プ
ローブカード基板1に取り付ける。
The probe card sub board 2 is attached to the probe card board 1 with screws or the like.

【0015】信号はプローブカード基板1の伝導性のパ
ターンから接触ピン叉は接触面を介しプローブカードサ
ブ基板2の伝導性パターンに伝わり、さらに伝導性パタ
ーンにハンダ付けされたプローブ針3へと伝達される。
The signal is transmitted from the conductive pattern of the probe card substrate 1 to the conductive pattern of the probe card sub-substrate 2 through the contact pin or contact surface, and further to the probe needle 3 soldered to the conductive pattern. To be done.

【0016】図5の従来のプローブカードの場合は、1
本のプローブ針3が故障しても、プローブ針固定用樹脂
4を取り除き故障したプローブ針3を交換し再固定し、
更にプローブ針3の全数を再調整しなければならなかっ
た。
In the case of the conventional probe card shown in FIG.
Even if the probe needle 3 of the book breaks down, the probe needle fixing resin 4 is removed and the broken probe needle 3 is replaced and fixed again,
Furthermore, the total number of probe needles 3 had to be readjusted.

【0017】本発明の図1の実施例によれば、プローブ
針3の先端位置調整は、プローブカードサブ基板2単位
で実施出来るため、プローブ針3が故障しプローブ針固
定用樹脂4を取り除きプローブ針3を交換しプローブ針
3を再調整する場合でも、再調整対象プローブ針3の数
が従来より少ないため調整工数が少なくて済む。
According to the embodiment of FIG. 1 of the present invention, the tip position adjustment of the probe needle 3 can be carried out in units of the probe card sub-board 2, so that the probe needle 3 fails and the probe needle fixing resin 4 is removed. Even when the needles 3 are replaced and the probe needles 3 are readjusted, the number of probe needles 3 to be readjusted is smaller than in the conventional case, and the number of adjustment steps can be reduced.

【0018】又同時に固定するプローブ針3の数が少な
いため熟練度も少なくて済む。
Further, since the number of probe needles 3 to be fixed at the same time is small, the skill level is low.

【0019】さらに同時測定個数が異なる場合は、1個
同時測定時にはIC1用プローブカードサブ基板10の
1組のプローブカードサブ基板2を取り付けるだけでよ
く、2個同時測定時にはIC1用プローブカードサブ基
板10とIC2用プローブカードサブ基板11の2組の
プローブカードサブ基板2を取り付け、更に4個同時測
定時には、IC1用プローブカードサブ基板10とIC
2用プローブカードサブ基板11とIC3用プローブカ
ードサブ基板12とIC4用プローブカードサブ基板1
3の4組のプローブカードサブ基板2を取り付ければよ
く、プローブカードは1種類で済む。
Further, when the number of simultaneous measurement is different, it is only necessary to attach one set of probe card sub-boards 2 of the probe card sub-board 10 for IC1 for simultaneous measurement of one, and for simultaneous measurement of two, the probe card sub-board for IC1. 10 and the probe card sub-board 11 for IC2, two sets of probe card sub-boards 2 are attached, and when measuring four more simultaneously, the probe card sub-board 10 for IC1 and the IC
2 probe card sub-board 11 and IC3 probe card sub-board 12 and IC4 probe card sub-board 1
It suffices to attach four sets of probe card sub-boards 2 to 3, and only one type of probe card is required.

【0020】図2の実施例は、プローブカードサブ基板
2の高さ方向の位置調整を10μm〜50μm程度の厚
みの垂直方向調整用薄板5をプローブカード基盤1とプ
ローブカードサブ基盤2の間にはさむことで調整可能と
したものである。
In the embodiment of FIG. 2, a vertical adjustment thin plate 5 having a thickness of about 10 μm to 50 μm for adjusting the position of the probe card sub-board 2 in the height direction is provided between the probe card base 1 and the probe card sub-base 2. It can be adjusted by scissors.

【0021】本垂直方向調整用薄板5を、プローブカー
ド基板1とプローブカードサブ基板2の間に、何枚はさ
むかで垂直方向の調整が可能となる。
The vertical adjustment thin plate 5 can be adjusted in the vertical direction depending on how many sheets are sandwiched between the probe card substrate 1 and the probe card sub-substrate 2.

【0022】図3の実施例は、プローブ針先端水平方向
の位置調整を、水平方向調整機構8により実施したもの
である。
In the embodiment shown in FIG. 3, the horizontal adjustment mechanism 8 is used to adjust the position of the tip of the probe needle in the horizontal direction.

【0023】図3の位置調整方法は、プローブカードサ
ブ基板固定用ネジ6を緩め、プローブカードサブ基板2
が水平方向に動作可能な状態にし、水平方向調整用ネジ
7を回転することにより、水平方向調整機構8の高さ位
置を変え、プローブカードサブ基板2を外側に押しつけ
ながらプローブカードサブ基板固定用ネジ6を締め付け
ることで水平方向の位置調整が可能となる。
In the position adjusting method of FIG. 3, the probe card sub-board 2 is loosened by fixing the probe card sub-board fixing screw 6.
For horizontal fixing and changing the height position of the horizontal adjustment mechanism 8 by rotating the horizontal adjustment screw 7 for fixing the probe card sub-board while pressing the probe card sub-board 2 to the outside. By tightening the screw 6, it is possible to adjust the position in the horizontal direction.

【0024】更に水平方向の位置調整を不用とした実施
例を図5に示す。
FIG. 5 shows an embodiment in which horizontal position adjustment is unnecessary.

【0025】図4において、高精度位置決めガイドピン
9を、高精度に造り込み取り付けるだけで、水平方向の
位置調整を不要としたものである。
In FIG. 4, the high-accuracy positioning guide pin 9 is simply built in and mounted with high accuracy, and position adjustment in the horizontal direction is unnecessary.

【0026】[0026]

【発明の効果】本発明によれば、プローブ針3の交換作
業、調整作業が短縮可能となり、更に熟練度も不要とな
る。又プローブカードの種類も低減できる。
According to the present invention, the replacement work and the adjustment work of the probe needle 3 can be shortened, and the skill level becomes unnecessary. Also, the type of probe card can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の斜視図。FIG. 1 is a perspective view of the present invention.

【図2】本発明のA−A’断面図。FIG. 2 is a sectional view taken along the line A-A ′ of the present invention.

【図3】水平方向の位置調整機構を有した本発明の断面
図。
FIG. 3 is a sectional view of the present invention having a horizontal position adjusting mechanism.

【図4】水平方向の位置決めを、高精度の位置決めガイ
ドピンにより行った本発明の断面図。
FIG. 4 is a cross-sectional view of the present invention in which horizontal positioning is performed by a highly accurate positioning guide pin.

【図5】従来の斜視図。FIG. 5 is a conventional perspective view.

【符号の説明】[Explanation of symbols]

1 プローブカード基板 2 プローブカードサブ基板 3 プローブ針 4 プローブ針固定用樹脂 5 垂直方向調整用薄板 6 プローブカードサブ基板固定用ネジ 7 水平方向調整用ネジ 8 水平方向調整機構 9 高精度位置決めガイドピン 10 IC1用プローブカードサブ基板 11 IC2用プローブカードサブ基板 12 IC3用プローブカードサブ基板 13 IC4用プローブカードサブ基板 1 probe card board 2 probe card sub board 3 probe needle 4 probe needle fixing resin 5 vertical adjustment thin plate 6 probe card sub board fixing screw 7 horizontal adjustment screw 8 horizontal adjustment mechanism 9 high-precision positioning guide pin 10 Probe card sub-board for IC1 11 Probe card sub-board for IC2 12 Probe card sub-board for IC3 13 Probe card sub-board for IC4

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】電気的測定対象が微細である際に使用され
る、プローブカード基板とプローブ針により構成されて
いるプローブカードに於て、プローブ針を樹脂等で固定
する複数個のプローブカードサブ基板と、それを取り付
けるプローブカード基板により構成する事を特徴とする
プローブカード。
1. A probe card comprising a probe card substrate and probe needles, which is used when an electrical measurement target is minute, and includes a plurality of probe card subs for fixing the probe needles with resin or the like. A probe card comprising a substrate and a probe card substrate to which the substrate is attached.
JP5133625A 1993-06-03 1993-06-03 Probe card Pending JPH06349904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5133625A JPH06349904A (en) 1993-06-03 1993-06-03 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5133625A JPH06349904A (en) 1993-06-03 1993-06-03 Probe card

Publications (1)

Publication Number Publication Date
JPH06349904A true JPH06349904A (en) 1994-12-22

Family

ID=15109198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5133625A Pending JPH06349904A (en) 1993-06-03 1993-06-03 Probe card

Country Status (1)

Country Link
JP (1) JPH06349904A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222839A (en) * 2001-01-29 2002-08-09 Advantest Corp Probe card
JP2004336062A (en) * 1995-05-26 2004-11-25 Formfactor Inc Contact carrier (tile) for stationing spring contact to larger substrate
US8366477B2 (en) 2007-12-13 2013-02-05 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus and contacts used therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004336062A (en) * 1995-05-26 2004-11-25 Formfactor Inc Contact carrier (tile) for stationing spring contact to larger substrate
JP2008203273A (en) * 1995-05-26 2008-09-04 Formfactor Inc Contact carrier (tile) for populating larger substrates with spring contact
JP2002222839A (en) * 2001-01-29 2002-08-09 Advantest Corp Probe card
US8366477B2 (en) 2007-12-13 2013-02-05 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus and contacts used therefor

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