JPH06342972A - Pressing apparatus for soldered part - Google Patents

Abstract

PURPOSE:To reduce a pressing force from a roller to a board side and to simplify a lower support for supporting the board by pressing a soldered part formed on a circuit pattern of the board.at each one or two by the roller. CONSTITUTION:A pressing force to be operated from a roller 36 to a board 1 is sufficient with that for smoothing one or two soldered parts 3. Accordingly, an excess lower supporting force is not required for a lower support 11, the parts 3 are smoothed by a simple lower part 11a to prevent leads from dropping. Even if an array of circuit patterns 2 is altered, it can be easily coped with only by altering a relatively moving amount of the roller 36 to the board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a pressing device for a solder portion, which enables a solder portion to be pressed by a roller so as to be smooth.

[0002]

2. Description of the Related Art A chip having leads such as QFP and SOP has a circuit pattern 2 on a substrate 1 as shown in FIG.
The lead 4 is landed on the solder portion 3 formed on the mounting part 3 to be mounted.

The solder portion 3 is formed by a solder precoating method such as a solder leveler method or a plating method. The upper surface of the solder portion 3 has a curved surface with a large curvature as shown in the drawing. In the example shown in FIG. 6, when the lead 4 is displaced from the ideal position (chain line) by half the width W of the lead 4 (solid line), the lead 4 slips off from the solder portion 3 as shown by the broken line. In this way, when the chip 5 is mounted with the solder portion 3 having the curved surface shape, the leads 4
When it lands, it slides down and the lead 4 of the chip is soldered to the solder part 3
There was a problem that it was difficult to mount on top.

Therefore, the present applicant has previously proposed a technique for smoothing the solder portion 3 (Japanese Patent Laid-Open No. 4-241500). FIG. 7 is a front view showing the main part thereof. Figure 7
In the figure, A is a pusher that presses a large number of solder portions 3 together to make it smooth, B is a rod of a cylinder (not shown) that applies a pressing force to the pusher A, and C is a bottom for receiving the substrate 1. It is a base block as a receiving part.

[0005]

Here, the normal solder portion 3 is used.
Are provided in an extremely large number such as several tens to several hundreds, and in such a configuration, the pressing force applied to the pressing element A is the sum of the pressing forces required for smoothing the solder portions 3. It will be extremely large. Therefore, the substrate 1
Since the lower support portion that supports the substrate 1 from the opposite side of the presser A must support the substrate 1 in a flat manner against the extremely large pressing force, a solid member such as the above-described lower support block C is used. I have no choice but to configure. On the contrary, if the lower receiving portion is composed of a simple member such as a lower receiving pin,
Since the lower receiving portion loses the large pressing force and the board 1 bends, there is a problem that the solder portion 3 cannot be evenly smoothed in the end. In addition, the pressing element A must be prepared according to the array shape of the circuit pattern 2.
When the array shape is changed, there is a problem that the work of replacing the presser A is required and the management of the presser A is troublesome.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a solder portion pressing device which can press and smooth a solder portion with a simple underlaying portion and can easily cope with a change in circuit pattern arrangement. To do.

[0007]

SUMMARY OF THE INVENTION A solder portion pressing device according to the present invention includes a lower receiving portion for receiving a substrate and an X portion for the substrate.
It has a roller that moves relatively in the Y direction and presses one or two solder portions formed on the circuit pattern of the substrate, and pressing means that applies a pressing force to the roller.

[0008]

With the above structure, the pressing force applied from the roller to the substrate is sufficient as long as it can smooth one or two solder portions. Therefore, the lower receiving portion is not required to have an excessive lower receiving force, and the simple lower receiving portion can smooth the solder portion and prevent the leads from falling. Further, even if the arrangement of the circuit pattern is changed, it can be easily dealt with by simply changing the moving amount when the roller is moved relative to the substrate.

[0009]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of a bond coater using a solder pressing device according to an embodiment of the present invention. Figure 1
Inside, 5 is a Y table and 6 is an X table, and a box 7 is fixed to the X table 6. Further, 8 and 9 are a pair of guide rails for positioning the substrate 1 in the XY directions, and 10 is a clamper provided on the guide rail 9 for urging the substrate 1 toward the opposing guide rail 8 side. Therefore, when the Y table 5 and the X table 6 are driven, the box 7 can be moved in the XY directions relative to the substrate 1.

Reference numeral 11 denotes a support table provided below the guide rails 8 and 9. The support table 11 has a plurality of pins 11a standing upright as a lower receiving portion for receiving the substrate 1 under these pins. The upper end of 11a is in contact with the back surface of the substrate 1. Then, when a vertically downward pressing force is applied to the substrate 1, the substrate 1 will in principle move to these pins 11a.
Received by only.

On the front surface of the box 7, three brackets 12, 13, 14 are supported so as to be able to move up and down. These brackets 12, 13, 14 are Z motors 15,
By driving 16 and 17 independently, they are raised and lowered independently. A bracket 19 at the left back of FIG. 1 holds a syringe 19 containing a bond, and 20 is a nozzle of the syringe 19. In addition, a syringe 21 in which flux is stored is held in the central bracket 13.
22 is a nozzle of this syringe 21.

Next, with reference to FIG. 2, which is a sectional view taken along the line A--A of FIG. 23 is a vertical guide rod provided on the front surface of the box 7, 24, 2
A slider 5 is provided on the back of the bracket 14 and slidably engages with the guide rod 23. These guide rods 2
The bracket 14 is supported on the box 7 so as to be able to move up and down by the sliders 24 and 25. In addition, an opening S is opened at the front of the box 7, and the bracket 1
The nut portion 26 provided at the back of the box 4 passes through the opening S and reaches the internal space T of the box 7. on the other hand,
A vertical feed screw 29 rotatably supported by bearings 27 and 28 is provided in the internal space T. The feed screw 29 is axially attached to the output shaft of the Z motor 17, and the nut portion 26 is also provided. It is screwed to. Therefore, Z
When the motor 17 is operated, the bracket 14 can be moved up and down.

Reference numeral 30 denotes a θ motor provided downward on the upper portion of the bracket 14, and a vertical output shaft (pressing means) 31 is rotatably supported by a bearing 14a and a lower end portion of the output shaft 31. Is axially attached to the upper part of the cylindrical body 32. The lower portion of the tubular body 32 is rotatably supported by the bearing 33 on the lower portion of the bracket 14. Further, the spline 3 is provided below the inner tubular portion of the tubular body 32.
4, a rod 35 is non-rotatably inserted into the spline 34, and a roller 36 as a roller for pressing the solder portions 3 one by one is rotatably supported in a vertical plane below the rod 35. Has been done. Therefore,
The roller 36 always rotates integrally with the output shaft 31 in the θ direction. Further, 37 is a spring mounted above the inner tubular portion of the tubular body 32, and biases the rod 35 downward. Therefore, when the θ motor 30 is operated, the direction of the roller 36 can be arbitrarily changed. Further, when the Z motor 17 is operated to move the feed screw 26 up and down, the roller 36 in a state where no drag acts on the roller 36 from the substrate 1 side.
The height of the lower end of the peripheral surface 36a (height without load) can be adjusted. By the way, as shown in FIG.
In the state of being pressed against the roller 36, the roller 36 is positioned a short distance t above the unloaded height, but at this time, the spring 37 contracts from the unloaded height by the small distance t. It will be. Then, this shrinkage amount t
The pressing force f proportional to is applied to the solder portion 3, the substrate 1, and the pin 11a as the lower receiving portion. Here, this pressing force f is a relatively small pressing force (for example, several tens kgff) because the roller 36 contacts the solder portion 3 in a point contact state.
Even in the following), sufficient pressure acts on the solder portion 3 and the solder portion 3 having the curved surface shape is sufficiently crushed and can be smoothed. Since such a small pressing force f is applied, the lower receiving portion for lowering the board 1 also receives the pin 11 as illustrated.
Like a, it can be a simple structure. The pressing force f can be adjusted by changing the height of the bracket 14 by the Z motor 17.

Although the peripheral surface 36a of the roller 36 is flat in the illustrated example, it may be changed for convenience such as a knurled surface.

Next, each step of the bond coating apparatus according to this embodiment will be described with reference to FIG. First, FIG. 3 (a)
As shown in, the board 1 on which the curved solder portion 3 is formed is positioned by the guide rails 8 and 9.
Next, the θ motor 30 is operated to adjust the direction of the roller 36, the Z motor 17 is operated, and the height of the feed screw 26 is adjusted so that the roller 36 exerts a predetermined pressing force f. Operate the table 5 and the X table 6 to move the roller 3
6 is moved in the direction of arrow N, and the solder portions 3 are crushed one by one and smoothed.

Next, as shown in FIG. 3 (c), while operating the Y table 5 and the X table 6, the flux 40 is discharged from the nozzle 22 of the syringe 21 and applied to the solder portion 3 etc. Promotes oxide film removal. Next, as shown in FIG. 3D, the chip P is mounted by a transfer head or the like not shown so that the leads 4 of the chip P are mounted on the solder portions 3.

FIG. 4 is a front view showing the smoothed solder portion 3 and the like. Assuming that the width of the upper surface of the smoothed solder portion 3 is A, the deviation amount of the lead 4 is the ideal position (chain line). ), Within the distance (W + A) / 2, it does not slide down as indicated by the arrow. By the way, comparing with the example of FIG.
This means that the deviation allowable value of the lead 4 is expanded by half the width A, so that the fall accident of the lead 4 can be effectively prevented.

FIG. 5A shows a roller 3 according to the second embodiment.
5 is a perspective view showing 5 and the like. FIG. In the second embodiment, the solder portions 3 are pressed two by two to be smoothed. Here, as shown in the figure, the circuit pattern 2 and the solder portion 3 for the QFP are formed in four rows and facing each other, but the roller 36 of the second embodiment has a wide width. The circuit patterns 3 are formed, and the opposing circuit patterns 3 are crushed two by two at the end portions of the peripheral surface. In addition, 35a is a rod 3
5 is a gate-shaped arm fixed to the lower end of the roller 3,
6 is pivotally supported on the lower part of the arm 35a.

Then, as shown in FIG. 5B, the solder portion 3 is divided into two rows facing each other, and in the first pressing work, the roller 36 is moved in the direction of the arrow N1 to move the solder row A1. The roller 3 in the second pressing work.
6 is moved in the direction of arrow N2 to smooth the solder row A2. In the second embodiment, as compared with the first embodiment, the soldering portion 3 is pressed twice in a single pressing operation, and the pressing force f is doubled. Even if it is raised, it can be sufficiently dealt with by the pin 11a as the lower receiving portion. Further, as compared with the first embodiment, the movement process of the roller 35 is half, so that the takt time can be shortened.

Further, the present invention is not limited to the illustrated example, and the solder pressing device of the present invention may be used in an electronic component mounting device or the like, and as the chip P, QFP,
In addition to the SOP, it may be one produced by punching out a film carrier by the TAB method.

[0022]

EFFECTS OF THE INVENTION The solder portion pressing device of the present invention includes a lower receiving portion for receiving a substrate, and a solder portion formed on a circuit pattern of the substrate that moves relative to the substrate in XY directions. Since the roller for pressing the rollers one by one and the pressing means for applying the pressing force to the rollers are provided, the pressing force acting on the substrate side from the rollers can be reduced, and as a result, the under-receiving portion for receiving the substrate can be formed. It can be easily configured.

[Brief description of drawings]

FIG. 1 is a perspective view of a bond applicator using a solder pressing device according to an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view of a solder portion pressing device according to an embodiment of the present invention.

FIG. 3 (a) is an operation explanatory view of a bond coating device using a solder pressing device according to an embodiment of the present invention. (B) Bonds using a solder pressing device according to an embodiment of the present invention. (C) Operation explanatory view of a bond application apparatus using a solder pressing device according to an embodiment of the present invention. (D) A solder pressing device according to an embodiment of the present invention is used. Illustration of the operation of the conventional bond applicator

FIG. 4 is a front view of a smoothed solder portion by a solder portion pressing device according to an embodiment of the present invention.

5A is a perspective view of a roller according to a second embodiment of the present invention. FIG. 5B is a plan view of a roller according to a second embodiment of the present invention.

FIG. 6 is a front view of a conventional solder portion before smoothing.

FIG. 7 is a front view of a main part of conventional means.

[Explanation of symbols]

 1 substrate 2 circuit pattern 3 soldering part 11a under receiving part 36 roller

Claims (1)

[Claims] 1. A lower receiving portion for lowering a substrate, and a roller that moves relative to the substrate in XY directions and presses one or two solder portions formed on a circuit pattern of the substrate. A pressing unit for applying a pressing force to the roller, and a pressing unit for the solder portion.