JPH06342635A - Image display device - Google Patents

Abstract

PURPOSE:To improve atmospheric pressure-proofness, to prevent deformation breakage of anti atmospheric pressure support member, so as to improve reliability by increasing the arrangement density of the support member in the center part, in vacuum atmosphere between an element substrate and a face plate. CONSTITUTION:An image display device comprises an element substrate 11 of blue plate glass, on which a plurality of electron emission elements each consisting of element electrodes 12, 13 and a thin film 14, are loaded, and a face plate 17, for which a phosphor 16 having a metal back is provided on the surface of a blue plate glass sheet 15. A plurality of columnar anti- atmospheric pressure support members 18 are provided in the vacuum atmosphere between the substrate 11 and the plate 17, and the arrangement density of the member 18 is increased in the center part. By increasing the arrangement density of the anti-atmospheric pressure support member in the center part of the vacuum region and thereby improving the atmospheric pressure resistance, the deformation or loss of the support member due to atmospheric pressure during vacuum discharging process and the like, is prevented, and the reliability is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image display device using an electron-emitting device, and more particularly to an image display device provided with an atmospheric pressure resistant support member between an element substrate and a face plate.

[0002]

2. Description of the Related Art Conventionally, image display devices using electron-emitting devices include those using a Brun tube, and electron beams emitted from electron-emitting devices in a vacuum panel sandwiched between a face plate and a device substrate. There has been proposed a thin image display device that accelerates light, irradiates the phosphor, and causes the phosphor to emit light to display an image.

In an image display device provided with a plurality of electron-emitting devices, in order to keep the inside of the peripheral device constituting the image display device under reduced pressure and to reduce the thickness by reducing the thickness of the face plate and the device substrate. An atmospheric pressure resistant support member is used between the face plate and the element substrate.

As a method of arranging the above atmospheric pressure resistant support member,
For example, Ivor Brodie, "Advanced
tech. : Flat cold-cathod C
RTs ", Information Display
y, 1 , 17 (1989). This is a top view of the image display device, for example, as shown in FIG.
As shown in (a) and (b), as the atmospheric pressure resistant support members 18, square columnar type support members are arranged in a lattice point shape, or columnar type support members are arranged in a staggered manner, that is, with an equal distribution density over the entire surface. It had been.

As an example of a sectional view of an image display device using an element substrate provided with a plurality of electron-emitting devices, the image display device disclosed in Japanese Patent Application Laid-Open No. 2-299136 of the present applicant is disclosed in the above-mentioned four. FIG. 11 shows a prism-shaped support member arranged in a lattice point shape with an equal distribution density. Figure 11
11 is an element substrate made of soda lime glass, 12 and 13 are element electrodes, 14 is a thin film including an electron emitting portion, 17
Is a face plate in which the phosphor 16 having a metal back is provided on the surface of the blue plate glass 15, 18 is a quadrangular prism type atmospheric pressure resistant support member, and 19 is an outer frame. The inside of the image display device of FIG. 11 has a pressure of about 1 × 1 through an exhaust pipe (not shown).
After being evacuated to a vacuum degree of 0 ^-6 torr, the exhaust pipe is closed. This device causes a voltage to be applied to the device electrodes 12 and 13 to cause the electron-emitting device to emit electrons in a beam shape, and the electrons are accelerated by the positive high voltage applied to the phosphor 16 to cause the phosphor 16 to emit light. An image is obtained by colliding and causing this to emit light. Although not shown in the figure, a control electrode such as a grid is appropriately provided to control the trajectory of the electron beam.

Next, the electron-emitting device will be described. Conventionally,
Two types of electron emitters, a thermoelectron source and a cold cathode electron source, are known. The field emission type (hereinafter, F
E type), metal / insulating layer / metal type (hereinafter abbreviated as MIM type), surface conduction electron-emitting device (hereinafter abbreviated as SCE type), and the like.

As an example of the FE type, W. P. Dyk
e & W. W. Dolan, "Field em
"Ission", Advance in Elect
ron Physics, 8 , 89 (1956) and C.I. A. Spindt, "Physical pr
operations of thin-film pie
ld emission cathodes with
mollybdenum cones ”, J. Ap.
pl. Phys. , 47 , 5248 (1976) and the like are known.

As an example of the MIM type, C.I. A. Me
ad, "The tunnel-emission
ampli? er ", J. Appl. Phy
s. , 32 , 646 (1961) and the like are known.

As an example of the SCE type, M. I. El
inson, Radio Eng. Electro
n Phys. , 10 , 1290 (1965) and the like. The SCE utilizes a phenomenon in which electron emission occurs when a current is passed through a thin film having a small area formed on a substrate in parallel with the film surface.

As the surface conduction electron-emitting device, one using the SnO ₂ thin film by Erinson et al.
Thin film [G. Dittmer: "Thin
Solid Films ", 9, 317 (197)
2)], by In ₂ O ₃ / SnO ₂ thin film [M. H
artwell and C.I. G. Fonsta
d: "IEEE Trans. ED Con
f. , 519, (1975)], carbon thin films [Hiraki Araki et al .: Vacuum, Vol. 26, No. 1, page 22 (1983)] and the like.

As a typical element structure of these surface conduction electron-emitting devices, the above-mentioned M. The Hartwell device configuration is shown in FIG. In the figure, 121 is an insulating substrate. Reference numeral 123 denotes an electron emitting portion forming thin film formed of an H-shaped metal oxide thin film formed by sputtering, and the electron emitting portion 122 is formed by an energization process called forming, which will be described later.
Is formed.

Conventionally, in these surface conduction electron-emitting devices, the electron-emitting portion forming thin film 1 is formed before electron emission.
It was general that the electron-emitting portion 122 was formed in advance by performing an energization process called forming on 23. That is,
The forming means that a voltage is applied to both ends of the electron emitting portion forming thin film 123 to locally destroy, deform or alter the electron emitting portion forming thin film, and the electron emitting portion 122 is brought into an electrically high resistance state. Is to form. In some cases, the electron emitting portion 122 has a crack in a part of the electron emitting portion forming thin film 123, and electrons are emitted from the vicinity of the crack. Hereinafter, the electron emitting portion forming thin film 123 including the electron emitting portion generated by forming is referred to as a thin film including the electron emitting portion.

Further, the above-mentioned Japanese Patent Laid-Open No. 2-2 mentioned above by the present applicant.
FIG. 13 shows the structure of an electron-emitting device technically disclosed in Japanese Patent Publication No. 99136. In the figure, 131 is an insulating substrate, 134 and 135 are device electrodes, 133 is a thin film including an electron emitting portion, and 132 is an electron emitting portion. Of the thin film 133 including the electron emitting portion, the electron emitting portion 132 is made of conductive fine particles having a particle diameter of several tens of liters, and the thin film 133 including the electron emitting portions other than the electron emitting portion 132 is made of a fine particle film. Note that the fine particle film described here is a film in which a plurality of fine particles are aggregated, and its fine structure is not only in a state in which the fine particles are individually dispersed and arranged, but also in a state in which the fine particles are adjacent to each other or overlap each other (islet-like Including) film. In addition to this, the thin film 133 including the electron emitting portion may be a carbon thin film or the like in which conductive fine particles are dispersed.

[0014]

In an image display device provided with a plurality of electron-emitting devices, it is necessary to maintain a vacuum degree of about 1 × 10 ^-6 torr inside the peripheral device constituting the image display device. Therefore, as described above, it is necessary to configure the atmospheric pressure resistant support member between the face plate and the element substrate. As shown in FIGS. 10A and 10B, the conventional atmospheric pressure resistant support member has columnar support members arranged in an equal distribution density such as a lattice point shape or a staggered shape. Therefore, in the image display device in which a plurality of electron-emitting devices are provided on the element substrate, a vacuum atmosphere is created in the face plate and the element substrate where the maximum deflection occurs during the vacuum exhaust step of reducing the atmospheric pressure by the vacuum pump. A large load is applied near the center of the area. Especially when the distribution density of a large-sized image display device or atmospheric pressure resistant support member is low, uneven load is applied to the atmospheric pressure resistant support member, exceeds the allowable stress, and the atmospheric pressure resistant support member is deformed, chipped or destroyed. Occurs and reliability decreases,
In the worst case, the entire image display device may be destroyed.

The present invention has been made in view of the problems of the above-mentioned conventional technique, and an object of the present invention is to eliminate the above problems and provide a safe and highly reliable image display device.

[0016]

SUMMARY OF THE INVENTION The present invention, which has been made to achieve the above object, provides an element substrate on which a plurality of electron-emitting devices are mounted, and electrons emitted from the electron-emitting devices which are arranged so as to face the element substrate. An image display device comprising: a face plate on which a phosphor that emits light when irradiated with a beam is mounted; and a plurality of atmospheric pressure resistant supporting members that are individually and independently arranged in a vacuum atmosphere between the element substrate and the face plate. In the distribution density of the atmospheric pressure resistant support member in the in-plane region of the element substrate or face plate in contact with the vacuum atmosphere, the central portion of the in-plane region has a higher distribution density than the central region. Is an image display device.

According to the present invention, the arrangement density of the atmospheric pressure resistant supporting members is increased in the central portion of the region having the vacuum atmosphere,
By improving the atmospheric pressure resistance, it is possible to prevent the atmospheric pressure resistant supporting member from being deformed, chipped or destroyed due to the atmospheric pressure during a vacuum evacuation process or the like, and it is possible to provide a safe and highly reliable image display device.

Preferred embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a sectional view showing an example of the image display device of the present invention using the surface conduction electron-emitting device as shown in FIG. 13 as the electron-emitting device. Note that FIG. 1 is a cross-sectional view taken along a plane perpendicular to each plate, including the central portion of a region of the image display device in a vacuum atmosphere.

In FIG. 1, 11 is an element substrate made of soda lime glass, 12 and 13 are element electrodes, 14 is a thin film including an electron emitting portion, and 17 is a soda lime glass 15 on which a phosphor 16 having a metal back is provided. Face plate, 18
Is a columnar atmospheric pressure resistant support member, and 19 is an outer frame. Figure 1
As shown in, the most characteristic feature of the present invention is to make the arrangement density of the atmospheric pressure resistant support members 18 in the central portion higher than the arrangement density of the portions other than the central portion.

As the atmospheric pressure resistant supporting member 18, an insulating material such as photosensitive glass is used, and it is processed into a cylindrical shape, a prismatic shape, a cross shape or the like by an etching method or a mechanical polishing method. The region where the arrangement density is increased and the distribution density are appropriately set depending on the material and shape of the atmospheric pressure resistant supporting member and the thickness and area of the element substrate and face plate.

As an arrangement example of the atmospheric pressure resistant supporting members, those arranged basically in a lattice point are shown in FIG. 2 (a), and those arranged basically in a staggered manner are shown in FIG. 2 (b). Figure 2
In (a), a columnar atmospheric pressure resistant supporting member is used, and four atmospheric pressure resistant supporting members are further provided in the vicinity of the atmospheric pressure resistant supporting member located at the center of the in-plane region of the element substrate in contact with the vacuum atmosphere. , The distribution density in the central part is higher than that in the parts other than the central part. In this case, the arrangement density in the central portion is 5 times the arrangement density in the central portion and below. In FIG. 2B, a cross-shaped atmospheric pressure resistant support member is used, four atmospheric pressure resistant support members are provided in the vicinity of the center without providing the atmospheric pressure resistant support member at the center, and the distribution of the central portion is distributed. Arrange so that the density is higher than the distribution density other than in the central part. In this case, the arrangement density of the central portion is four times the arrangement density of the portions other than the central portion. In the above two rows, the number of atmospheric pressure resistant supporting members is increased only in the vicinity of the central portion, but as shown in FIGS. 2C and 2D, basically, the atmospheric pressure resistant supporting members are provided in the vicinity of a plurality of central portions of the lattice points. In some cases, the number of support members may be increased.

Further, in FIG. 2A to FIG. 2D, each one point is shown as an independent atmospheric pressure resistant support member, but this one point is one unit composed of a plurality of atmospheric pressure resistant support members. Sometimes there is.

Next, a method of manufacturing the surface conduction electron-emitting device will be described with reference to FIGS.

In FIG. 13, a thin film 1 including an electron emitting portion.
If the specific examples of the materials constituting 33 are given, Pd, R
u, Ag, Au, Ti, In, Cu, Cr, Fe, Z
n, Sn, Ta, W, Pb and other metals, PdO, Sn
_{O 2, In 2 O 3,} PbO, oxides such as Sb ₂ O _3, Hf
Borides of B ₂ , ZrB ₂ , LaB ₆ , CeB ₆ , YB ₄ , GdB _4, etc., TiC, ZrC, HfC, TaC, SiC, W
Carbides such as C, nitrides such as TiN, ZrN and HfN, S
Examples thereof include semiconductors such as i and Ge, carbon, AgMg, and NiCu. Then, the thin film 133 including the electron emitting portion is formed by a vacuum deposition method, a sputtering method, a chemical vapor deposition method, a dispersion coating method, a dipping method, a spinner method, or the like. Various methods can be considered as a method of manufacturing the surface conduction electron-emitting device having the electron-emitting portion 132, and one example thereof will be specifically described in the order of steps with reference to FIG.

After the insulating substrate 131 is thoroughly washed with a detergent, pure water and an organic solvent, element electrodes 134 and 135 are formed on the surface of the insulating substrate 131 by the vacuum deposition technique and the photolithography technique (FIG. 14 ( a)).

The organic metal thin film is formed by applying an organic metal solution on the insulating substrate on which the element electrodes 134 and 135 are formed between the element electrodes 134 and 135 provided on the insulating substrate 131 and leaving the solution. To form. After that, the organic metal thin film is heated and baked, and is patterned by lift-off, etching, etc. to form the electron emission portion forming thin film 133 (FIG. 14B).

Subsequently, an energization treatment called forming is performed at a vacuum degree of a pressure of about 1 × 10 ^-6 torr or less.
When a voltage is applied between the device electrodes 134 and 135 by a power source (not shown), an electron emitting portion 132 having a changed structure is formed at the site of the electron emitting portion forming thin film 133 (FIG. 14).
(C)). The electron emitting portion 132 is a portion whose structure is changed by locally destroying, deforming, or deteriorating the electron emitting portion forming thin film 133 by the energization process. The applicants have observed that the electron emitting portion 132 is made of conductive fine particles. In addition, the surface conduction electron-emitting device in which the conductive fine particles are dispersed in advance can be configured by partially changing the basic manufacturing method of the basic device structure. In addition, in the present specification, a device in which an electron emitting portion is not yet formed at the stage of FIG. 14B will be referred to as an electron emitting device for convenience.

[0029]

The present invention will be described in more detail with reference to the following examples.

In the following embodiments, an image display device using an element substrate provided with a plurality of electron-emitting devices will be described. However, it is necessary to keep the inside of the peripheral device (panel) under reduced pressure and the face plate. It goes without saying that the present invention can be applied to any peripheral device as long as it requires an atmospheric pressure resistant support member between the back plate (element substrate).

Example 1 As a first example, cylindrical atmospheric pressure resistant supporting members are basically arranged in a lattice point shape, and the distribution density of the central portion of the region in contact with the vacuum atmosphere in the element substrate is the center. An image display device arranged so as to have a higher distribution density than other parts will be described. In this embodiment, the central portion of the element substrate, which is in contact with the vacuum atmosphere, coincides with the central portion of the element substrate.

A method of manufacturing the image display device of this embodiment will be described below in the order of a method of manufacturing an element substrate provided with a plurality of electron-emitting devices, a method of disposing an atmospheric pressure resistant supporting member, and a method of manufacturing an image display device.

A method of manufacturing an element substrate having a plurality of electron-emitting devices will be described. A method of manufacturing an element substrate having a large number of single electron-emitting devices having the structures shown in FIGS. 13 and 14 will be described.
A top view of the element substrate of this embodiment is shown in FIG. 3, and a partially enlarged view of FIG. 3 is shown in FIG. 3 and 4, 11 is soda lime glass, 12 and 13 are the same device electrodes as the device electrodes 134 and 135 of the device shown in FIG. 13, and 14 is a thin film 133 including the electron-emitting portion of the device shown in FIG. It is a thin film including the same electron emitting portion. As shown in FIG. 3 and FIG.
A large number of electron-emitting devices in the stage (b) were formed without gaps between the device electrodes, that is, so that a pair of device electrodes form a set of parallel lines. In FIG. 4, the distance L1 between the device electrodes 12 and 13 on which the electron emission portion forming thin film 14 is formed is 3 μm, and the length L2 of the electron emission portion forming thin film 14 is 400.
μm, width W2 is 300 μm, space S1 is 200 μm, width S2 of a pair of parallel device electrodes is 1 mm, and space S3 between adjacent linear device electrodes is 0.5 mm. In addition, Ni is used for the device electrodes 12 and 13, and the electron emission portion forming thin film 14 is made of organic palladium (manufactured by Okuno Chemical Industries Co., ccp).
-4230) containing solution was applied and then heat-treated at 300 ° C. for 10 minutes to use a fine particle film made of palladium oxide (PdO) fine particles (average particle diameter: 70 Å). Further, an extraction electrode (not shown) for supplying electric power to the device was formed.

Arrangement Method of Atmospheric Pressure Resistant Support Member The atmospheric pressure resistant support member was disposed as follows on the element substrate manufactured as described above. As the atmospheric pressure resistant supporting member, a photosensitive glass processed into a cylindrical shape having a diameter of 0.4 mm and a height of 3 mm by an etching method is used, and as shown in FIGS. 0.5 mm pitch (Fig. 2
In (A) of (a), it is arranged in a lattice shape, and further, in the central portion of the element substrate, it is arranged at four positions of 1.5 mm vertically and horizontally from the center (+ mark in FIG. 5) and fixed on the element substrate. .

Method of Manufacturing Image Display Device Subsequently, an image display device as shown in FIG. 1 was manufactured as follows using the element substrate to which the atmospheric pressure resistant supporting member was fixed as described above. Frit glass is applied to the upper surface and the lower surface of the outer frame 19, and the face plate 17 (which is formed by forming the fluorescent film 16 together with the metal back on the inner surface of the blue glass substrate 15) above the element substrate 3 by 3 mm. It was placed via the frame 19 and was sealed by baking in the atmosphere at 450 ° C. for 60 minutes. Since the fluorescent film 16 is monochrome in this embodiment, it is made of only a fluorescent material.

FIG. 6 is a schematic perspective view of the image display device manufactured as described above. The atmosphere in the image display device shown in FIG. 6 was exhausted by a vacuum pump through an exhaust pipe (not shown). However, even when the vacuum degree of about 1 × 10 ⁻⁶ torr was reached, the atmospheric pressure resistant supporting member was It supported atmospheric pressure without being destroyed.

Subsequently, the following forming process was performed in the image display device shown in FIG. FIG. 7 shows the voltage waveform of the forming process. In FIG. 7, T ₁ and T ₂ are the pulse width and pulse interval of the voltage waveform.
₁ is 1 millisecond, T ₂ is 10 milliseconds, the peak value of the triangular wave (peak voltage during forming) is 5 V, and the element electrode terminal D _R1 outside the container connected to the extraction electrode shown in FIG.
Through D _Rm and D _L1 through D _Lm through the device electrodes 12, 13
The voltage was applied between them and the forming treatment was performed for 60 seconds. In the electron emitting portion thus produced, fine particles containing palladium element as a main component were dispersed and arranged, and the average particle diameter of the fine particles was 30Å.

Finally, at a degree of vacuum of about 1 × 10 ^-6 torr, an unillustrated exhaust pipe is heated by a gas burner to weld and seal the envelope, and the degree of vacuum after sealing is adjusted. A getter deposition process was performed to maintain. This is a process of forming a getter vapor deposition film at a predetermined position (not shown) in the image display device by a heating method such as resistance heating or high frequency heating. The getter usually has Ba or the like as a main component, and maintains the internal vacuum degree by the adsorption action of the deposited film.

In the image display device of this embodiment manufactured as described above, between the device electrodes 12 and 13 through the device electrode terminals D _R1 to D _Rm and D _L1 to D _Lm outside the container shown in FIG. When a voltage is applied, electrons are emitted in a beam shape, and this electron beam is accelerated by the positive high voltage applied to the phosphor 16 via the metal back 20 through the high voltage terminal Hv and collides with the phosphor 16 and An image was obtained by emitting light.

Although the electron beam orbit control electrodes such as the grid are not used in this embodiment, the effect of the present invention is not changed even if the grid or the like is configured.

In this embodiment, the surface conduction electron-emitting device was used as the electron source.
An M-type electron source or the like can also be used.

Comparative Example 1 In order to examine the effect of Example 1, in Example 1, the distribution density of the atmospheric pressure resistant supporting members in the central portion of the element substrate was not increased (at four points of 1.5 mm above and below and to the left and right from the center). The atmospheric pressure resistant support member is arranged in a lattice pattern at a pitch of 4.5 mm on the entire surface (without providing the atmospheric pressure resistant support member), and otherwise the atmosphere in the image display device manufactured in exactly the same manner as in Example 1 is set. When exhausted with a vacuum pump through the exhaust pipe, even if exhausted gradually, the atmospheric pressure resistant support member in the central part of the element substrate was deformed or chipped, and some of them were destroyed. .

Example 2 As a second example, cross-shaped atmospheric pressure resistant supporting members are basically arranged in a zigzag manner, and the distribution density of the central portion of the element substrate is higher than the distribution density other than the central portion. The image display device arranged in such a manner will be described. In this embodiment, the central portion of the element substrate, which is in contact with the vacuum atmosphere, coincides with the central portion of the element substrate.

Also in this embodiment, an element substrate having a large number of electron-emitting devices is used as shown in FIG. 3 similar to the first embodiment. An atmospheric pressure resistant support member was arranged on the element substrate shown in FIG. 3 as follows. As the atmospheric pressure resistant supporting member, a photosensitive glass is etched by an etching method to have a long side A of 2 mm, a short side B of 0.5 mm, a height C of 3 mm, and a thickness D of 0.2 mm, as shown in FIG. As shown in FIG. 2 (b) and FIG. 9, using a cross-shaped product, the zigzag pattern (see FIG.
(B = 9 mm in (b)), and further in the central part of the element substrate,
Except for the center (+ mark in Fig. 9), 3m vertically and horizontally from the center
It was arranged at four positions of m and fixed on the element substrate.

Subsequently, when an image display apparatus was manufactured in the same manner as in Example 1, even when a vacuum degree of about 1 × 10 ⁻⁶ torr was reached, the atmospheric pressure resistant supporting member was kept at atmospheric pressure without being destroyed. Supported.

[0046] In the image display apparatus of this embodiment manufactured as described above, the device electrodes 12 through to D _Rm and D _L1 to no element electrode terminals D _R1 outside container shown in FIG. 6 D _Lm,
When a voltage is applied between 13, the electrons are emitted in a beam shape, and the electron beam is accelerated by the positive high voltage applied to the phosphor 16 through the metal back 20 through the high voltage terminal Hv and collides with the phosphor 16. An image was obtained by causing this to emit light.

Comparative Example 2 In order to examine the effect of Example 2, in Example 2, the distribution density of the atmospheric pressure resistant supporting member in the central portion of the element substrate is not increased (the resistance is increased at 4 points of 3 mm vertically and horizontally from the center). The atmosphere inside the image display device manufactured in exactly the same manner as in Example 2 except that the atmospheric pressure supporting member is not provided) is exhausted by a vacuum pump through an exhaust pipe.
The atmospheric pressure resistant supporting member in the central portion of the element substrate was deformed or chipped, and some of them were destroyed.

[0048]

As described above, according to the present invention, since the atmospheric pressure resistance can be improved by increasing the distribution density of the atmospheric pressure resistant supporting members in the central portion of the region to be the vacuum atmosphere, the vacuum exhaust can be performed. It is possible to provide a safe and highly reliable image display device, which has an effect of preventing the atmospheric pressure resistant support member from being broken by atmospheric pressure during a process or the like.

In the present invention, the image display device using the element substrate provided with a plurality of electron-emitting devices has been described. However, an outer peripheral device in which the inside of which the atmospheric pressure resistant supporting member is required to be formed is depressurized ( It goes without saying that it can be applied to any kind of panel).

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of an image display device that best represents the features of the present invention.

FIG. 2 is a diagram showing an arrangement example of an atmospheric pressure resistant support member according to the present invention.

FIG. 3 is a top view of an element substrate according to an example of the present invention.

FIG. 4 is a partially enlarged view of FIG.

FIG. 5 is a diagram showing an arrangement of atmospheric pressure resistant support members on an element substrate in Example 1.

FIG. 6 is a schematic perspective view of an image display device according to an embodiment of the present invention.

FIG. 7 is a diagram showing a voltage pulse waveform at the time of forming processing.

FIG. 8 is a perspective view of an atmospheric pressure resistant support member according to a second embodiment.

FIG. 9 is a diagram showing an arrangement of atmospheric pressure resistant support members on an element substrate in Example 2;

FIG. 10 is a layout view of a conventional atmospheric pressure resistant support member.

FIG. 11 is a schematic sectional view of a conventional image display device.

FIG. 12 is a schematic configuration diagram of a surface conduction electron-emitting device.

FIG. 13 is a schematic configuration diagram of a surface conduction electron-emitting device.

FIG. 14 is a schematic cross-sectional view showing an example of a method for manufacturing the element of FIG.

[Explanation of symbols]

11 Element Substrate 12, 13 Element Electrode 14 Electron Emission Portion Forming Thin Film (Thin Film Including Electron Emission Portion) 15 Glass Substrate 16 Phosphor 17 Face Plate 18 Atmospheric Pressure Supporting Member 19 Outer Frame 20 Metal Back 121 Insulating Substrate 122 Electron Emitting part 123 Electron emitting part forming thin film (thin film including electron emitting part) 131 Insulating substrate 132 Electron emitting part 133 Electron emitting part forming thin film (thin film including electron emitting part) 134, 135 Element electrodes

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Kumiko Kaneko 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Yasuko Tomita 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Incorporated (72) Inventor Yoshiyuki Nagata 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (2)

[Claims] 1. An element substrate on which a plurality of electron-emitting devices are mounted, a face plate which is arranged to face the element substrate and which mounts a phosphor that emits light when irradiated with an electron beam emitted from the electron-emitting device, and the element substrate. An image display device comprising a plurality of atmospheric pressure resistant supporting members which are individually and independently arranged in a vacuum atmosphere between the face plates, wherein the in-plane area of the element substrate or the face plate in contact with the vacuum atmosphere is provided. In the distribution density of the atmospheric pressure resistant support member, an image display device is characterized in that a central portion of the in-plane region has a higher distribution density than that of a portion other than the central portion. 2. The image display device according to claim 1, wherein a surface conduction electron-emitting device is used as the electron-emitting device.