JPH06335942A - Nozzle part structure of hot runner type injection mold - Google Patents
Nozzle part structure of hot runner type injection moldInfo
- Publication number
- JPH06335942A JPH06335942A JP5146707A JP14670793A JPH06335942A JP H06335942 A JPH06335942 A JP H06335942A JP 5146707 A JP5146707 A JP 5146707A JP 14670793 A JP14670793 A JP 14670793A JP H06335942 A JPH06335942 A JP H06335942A
- Authority
- JP
- Japan
- Prior art keywords
- bush
- nozzle
- hot runner
- sprue
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この考案はホツトランナ−タイプ
の射出成形金型において、樹脂詰まりを軽減すべき提案
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a proposal for reducing resin clogging in a hot-runner type injection molding die.
【0002】[0002]
【従来の技術】従来のこの種射出成形金型のノズル部の
構造は、図2に示すように、ホツトランナ−ノズルブツ
シユaと、スプル−ブツシユbとの間は、密着して構成
されていた。なおこの図において、cはバンドヒ−タを
示し、前記ホツトランナ−ノズルブツシユaはホツトラ
ンナ−ブロツクに連なり、スプル−ブツシユbは成形品
側に位置する。2. Description of the Related Art As shown in FIG. 2, the structure of the nozzle portion of a conventional injection molding die has a structure in which a hot runner-nozzle bush a and a sprue-bush bush b are in close contact with each other. In this figure, c indicates a band heater, the hot runner-nozzle bush a is connected to the hot runner block, and the sprue bush b is located on the molded product side.
【0003】[0003]
【発明が解決しようとする課題】上述のような構成から
なる場合、ナイロンガラス入り等の高温な樹脂を成形す
る際に、バンドヒ−タcにより溶融した樹脂は、ホツト
ランナ−ノズルブツシユaの先端が、スプル−ブツシユ
bに密着しているために、熱を奪われ固化してしまい詰
まりを生じていた。又、バンドヒ−タ−cの温度を上げ
すぎると溶融した樹脂がスプル−ブツシユb側に垂れて
しまい、詰まりを生じていた。この発明はこのような不
都合な事態が発生するのを阻止することを解決すること
が課題である。In the case of the above-mentioned structure, the resin melted by the band heater c when molding a high temperature resin such as nylon glass is such that the tip of the hot runner-nozzle bush a is Because it was in close contact with the sprue-bush b, it was deprived of heat and solidified, resulting in clogging. Further, if the temperature of the band heater c is raised too much, the molten resin drips to the side of the sprue-bush b and causes clogging. It is an object of the present invention to solve the problem of preventing such an inconvenient situation from occurring.
【0004】[0004]
【課題を解決するための手段】すなわちこの発明は、ホ
ツトランナ−ノズルブツシユとスプル−ブツシユとの間
に、断熱リングを介設して微小の隙間を設けると共に、
その実施に当つて更に前記ホツトランナ−ノズルブツシ
ユの先端のノズルピ−スを熱伝導性のよいBe−Cu合
金をもつて形成することを提案するものである。That is, according to the present invention, a heat insulating ring is provided between the hot runner-nozzle bush and the sprue-brush to provide a minute gap, and
In implementing this, it is further proposed to form the nozzle piece at the tip of the hot runner-nozzle bush with a Be-Cu alloy having good thermal conductivity.
【0005】[0005]
【作用】上記構成からなるこの発明のホツトランナ−タ
イプの射出成形金型におけるノズル部構造において、ホ
ツトランナ−ノズルブツシユとスプル−ブツシユとの間
にリング状の断熱層を介設することにより、ホツトラン
ナ−ノズルブツシユが、スプル−ブツシユに熱を奪われ
ることを防止すると共に、微小な隙間を設けたことによ
り、溶融した樹脂はこの隙間で半溶融状態となり、スプ
ル−ブツシユにまで到達することがない。なお、この隙
間は、0.5mm以下だとスプル−ブツシユに樹脂が垂
れてしまい、大きすぎると成形時に固化した樹脂を突き
破れないため、0.5〜1mmが適当である。In the nozzle structure of the hot-runner-type injection molding die of the present invention having the above-mentioned structure, the hot-runner-nozzle bushing is formed by providing a ring-shaped heat insulating layer between the hot-runner nozzle bushing and the sprue-bushing. However, by preventing the heat from being taken by the sprue-bush, and by providing a minute gap, the molten resin becomes a semi-molten state in this gap and does not reach the sprue-bush. If the gap is 0.5 mm or less, the resin hangs down on the sprue-bush, and if it is too large, the resin solidified during molding cannot be pierced, so 0.5 to 1 mm is appropriate.
【0006】またホツトランナ−ノズルブツシユの先端
のノズルピ−スを、熱伝導性のよいBe−Cu合金で形
成することにより微小な隙間の樹脂を半溶融状態での保
持を容易にし、成形時には前記半溶融状態の樹脂層を突
き破ることは容易となる。Further, by forming the nozzle piece at the tip of the hot runner-nozzle bush with a Be-Cu alloy having good thermal conductivity, it becomes easy to hold the resin in the minute gap in a semi-molten state, and the semi-molten resin is formed at the time of molding. It is easy to break through the resin layer in the state.
【0007】[0007]
【実施例】図1において、1はホツトランナ−ブロツク
(図示せず)側のホツトランナ−ノズルブツシユであ
り、その先端にはノズルピ−ス2が構成されており、こ
のノズルピ−ス2は熱伝導性のよいBe−Cu合金をも
つて形成する。DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 is a hot runner-nozzle bush on the side of a hot runner block (not shown), and a nozzle piece 2 is formed at the tip thereof. It is formed with a good Be-Cu alloy.
【0008】前記ホツトランナ−ノズルブツシユ1に相
対するスプル−ブツシユ3は図にあらわれない成形品側
に連なるものである。The sprue-bush 3 which faces the hot runner-nozzle bush 1 is connected to the molded product side not shown in the figure.
【0009】この発明においては、前記ホツトランナ−
ノズルブツシユ1とスプル−ブツシユ3との間に、ホツ
トランナ−ブツシユとスプル−ブツシユの熱伝導を最小
限にすることと、リング状の断熱層4を介設することに
より、前記ホツトランナ−ノズルブツシユ(実際上はノ
ズルピ−ス2)とスプル−ブツシユ3との間に微小な隙
間gを設けるものであつて、この隙間gは実用上は0.
5〜1mm程度が適当である。なお図に5はバンドヒ−
タを示す。In the present invention, the hot-liner is
Between the nozzle bush 1 and the sprue-bushbone 3, the heat conduction of the hot runner bush and the sprue bush is minimized, and the ring-shaped heat insulating layer 4 is interposed, whereby the hot runner-nozzle bush (actually Provides a minute gap g between the nozzle piece 2) and the sprue-bush 3, and this gap g is practically 0.
About 5 to 1 mm is suitable. In the figure, 5 is a band
Data.
【0010】上述の構成からなるこの発明のノズル部構
造によれば、ホツトランナ−ノズルブツシユとスプル−
ブツシユの密着面が小さいために、バンドヒ−タ−の熱
が奪われることが少なく、樹脂の詰まりを生じるおそれ
がない。また、バンドヒ−タ5により溶融した樹脂は、
前記隙間gで半溶融状態となり、スプル−ブツシユ2に
は到達しないので、樹脂の詰まりを生じるおそれがな
い。According to the nozzle portion structure of the present invention having the above-mentioned structure, the hot runner-nozzle bush and sprue-
Since the contact surface of the bush is small, the heat of the band heater is not taken away so that the resin is not clogged. Further, the resin melted by the band heater 5 is
In the gap g, a semi-molten state is reached and the sprue-bush 2 is not reached, so there is no risk of resin clogging.
【0011】また前記ノズルピ−ス2を熱伝導性のよい
Be−Cu合金で形成することにより、隙間の樹脂を半
溶融状態とし、仮に固化しても成形時に樹脂層を突き破
り易いという工夫を施されているのである。Further, by forming the nozzle piece 2 from a Be-Cu alloy having good thermal conductivity, the resin in the gap is brought into a semi-molten state, and even if it is solidified, it is easy to break through the resin layer during molding. It has been done.
【0012】[0012]
【発明の効果】上述したようにこの発明によれば、前記
隙間の存在により、溶融した樹脂がこの隙間で半溶融状
態とし、したがつて、溶融した樹脂がスプル−ブツシユ
側に垂れて、以後の成形作業に障害となるような詰まり
を生ずるおそれをなくすると共に、前記ノズルピ−スが
熱伝導性のよいBe−Cu合金で形成されることによ
り、成形時に前記隙間で固化した樹脂層を突き破り易い
という効果も得られる。As described above, according to the present invention, the presence of the gap causes the molten resin to be in a semi-molten state in this gap, and accordingly, the molten resin drips toward the sprue-bushtail side. The nozzle piece is formed of a Be-Cu alloy having good thermal conductivity so as to break through the resin layer solidified in the gap at the time of molding, while eliminating the possibility of causing clogging that hinders the molding work. The effect of being easy is also obtained.
【図1】この発明の一実施例の要部断面図である。FIG. 1 is a sectional view of an essential part of an embodiment of the present invention.
【図2】従来例の要部断面図である。FIG. 2 is a sectional view of a main part of a conventional example.
【符号の説明】 1 ホツトランナ−ノズルブツシユ 2 ノズルピ−ス 3 スプル−ブツシユ 4 断熱リング 5 バンドヒ−タ g 隙間[Explanation of symbols] 1 Hot runner-nozzle bush 2 Nozzle piece 3 Sprue-bush 4 Heat insulating ring 5 Band heater g Gap
Claims (2)
−ブツシユとの間に、断熱リングを介設して微小の隙間
を設けたことを特徴とするホツトランナ−タイプの射出
成形金型におけるノズル部構造。1. A nozzle part structure in a hot runner type injection molding die, wherein a minute gap is provided between a hot runner nozzle bush and a sprue bush by providing a heat insulating ring.
端のノズルピ−スを熱伝導性のよいBe−Cu合金をも
つて形成したことを特徴とする請求項1記載のホツトラ
ンナ−タイプの射出成形金型におけるノズル部構造。2. A nozzle in a hot-runner-type injection molding die according to claim 1, wherein the nozzle piece at the tip of said hot-runner-nozzle bush is formed of a Be-Cu alloy having good thermal conductivity. Part structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5146707A JP3041811B2 (en) | 1993-05-27 | 1993-05-27 | Nozzle structure in hot runner type injection mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5146707A JP3041811B2 (en) | 1993-05-27 | 1993-05-27 | Nozzle structure in hot runner type injection mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06335942A true JPH06335942A (en) | 1994-12-06 |
JP3041811B2 JP3041811B2 (en) | 2000-05-15 |
Family
ID=15413731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5146707A Expired - Fee Related JP3041811B2 (en) | 1993-05-27 | 1993-05-27 | Nozzle structure in hot runner type injection mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3041811B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5552719A (en) * | 1993-12-24 | 1996-09-03 | Nec Corporation | Output buffer circuit having gate voltage control circuit of gate current controlling transistor connected to output transistor |
-
1993
- 1993-05-27 JP JP5146707A patent/JP3041811B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5552719A (en) * | 1993-12-24 | 1996-09-03 | Nec Corporation | Output buffer circuit having gate voltage control circuit of gate current controlling transistor connected to output transistor |
Also Published As
Publication number | Publication date |
---|---|
JP3041811B2 (en) | 2000-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090310 Year of fee payment: 9 |
|
LAPS | Cancellation because of no payment of annual fees |