JPH06334449A - Multi-layered board for high frequency amplifier circuit - Google Patents

Abstract

PURPOSE:To obtain a board possible for miniaturization while having excellent input output isolation by providing three or more ground layers among four or more dielectric layers and using a strip line between ground layers for an input side circuit and using a strip line between different ground layers for an output side circuit. CONSTITUTION:Ground layers 3-5 are formed among dielectric layers 6-11. Strip lines 1, 2 are respectively separated by the ground layers 3, 4 and connected to electrodes 14, 15 of a semiconductor element 16 through via-holes 12, 13. When the line 1 is used for an input side of a high frequency amplifier circuit and the line 2 is used for an output side, the oscillation due to direct propagation of the signal between the input side circuit and the output side circuit hardly takes place. Furthermore, it is not required to increase the distance between the lines 1 and 2 and miniaturization is attained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer substrate which constitutes a high frequency amplifier circuit which requires isolation between input and output.

[0002]

2. Description of the Related Art Conventionally, a multilayer substrate constituting a high frequency amplifier circuit has been constructed by laminating a dielectric layer and a ground layer in a multilayer structure. For example, FIG. 5 shows the configuration of a conventional high frequency amplifier circuit. The figure is shown. Further, FIG. 6 shows a configuration diagram of a conventional antenna switch circuit. 5 and 6, 22 and 23 are strip lines (one is an input side, the other is an output side), 24 and 25 are ground layers, 26, 27,
28 and 29 are dielectric layers, 30 and 31 are via holes, 32 and 33 are electrodes, and 34 is a mounted semiconductor element. Further, the via holes 30 and 31 connect the electrodes 32 and 33 on the upper surface of the multilayer substrate to the strip lines 22 and 23, and at the portion intersecting with the ground layer 24, the via holes 30 and 31 should not come into contact with the pattern forming the ground. ing. For the sake of explanation, electronic components mounted on the high frequency amplifier circuit such as a chip capacitor or a passive component such as a chip resistor and on the antenna switch circuit are omitted in the figure. The operations of the conventional high-frequency amplifier circuit (FIG. 5) and the antenna switch circuit (FIG. 6) configured as described above will be described below.

In a conventional high frequency amplifier circuit, as shown in FIG. 5, strip lines 22 and 23 are used for an input side circuit and an output side circuit, respectively. One of the striplines 22 is connected to the semiconductor element 34 mounted on the electrode 32 on the upper surface of the multilayer substrate by the via hole 30. The other strip line 23 is connected to a semiconductor element 34 mounted on an electrode 33 on the upper surface of the multilayer substrate by a via hole 31 to form a high frequency amplifier circuit.
If the strip lines 22 and 23 are provided in the same layer in the multilayer substrate as described above, a signal directly propagates between the strip lines 22 and 23, and good isolation between input and output cannot be obtained, and the input terminal The signal coming from the strip line
The signal propagates to not only the semiconductor element 34 but also the other strip line 23 through 22 and the signal passing through the strip line 23 also propagates not only to the output terminal but also to the strip line 22. There was a possibility that it would oscillate because it reciprocates between. Therefore, in order to obtain a good isolation between the input and the output, the strip lines 22 and 23 are arranged as large as possible to avoid direct propagation of signals from each other.

Further, in the conventional antenna switch circuit, strip lines 22 and 23 are used for the input side circuit and the output side circuit, respectively, as shown in FIG. The electrode 32
And the other stripline 23 was connected to the semiconductor element 34 mounted on the electrode 32 on the upper surface of the multilayer substrate by the via hole 31 to form an antenna switch circuit. The antenna switch circuit, which functions as a switch, is a circuit that amplifies and outputs the input signal when it is in the ON state, and does not output the input signal when it is in the OFF state.
Good isolation between outputs in the F state is required. That is, the isolation between the input and the output in the OFF state needs to be sufficiently large. However, if the strip line is provided in the same layer of the multilayer substrate, a signal propagates between the strip lines, and good isolation between input and output cannot be obtained. Therefore, in order to obtain good isolation, the strip lines 22 and 23 are arranged as large as possible to avoid direct signal propagation.

[0005]

SUMMARY OF THE INVENTION In the above conventional configuration,
Since the stripline is provided in the same layer, direct signal propagation between the striplines is unavoidable, and the isolation between input and output deteriorates to some extent, which may cause oscillation in the high-frequency amplifier circuit. It had a problem that Further, in the antenna switch circuit, there is a problem that good isolation cannot be obtained between the output in the ON state and the output in the OFF state. Furthermore, in the above-described conventional configuration, in both the high frequency amplifier circuit and the antenna switch circuit, in order to avoid direct propagation of a signal between the strip lines as much as possible, each strip line must be separated as much as possible. However, there is a problem that the original purpose of reducing the size of the circuit board cannot be achieved by using the multilayer board.

The present invention solves the above-mentioned problems of the prior art. A high-frequency amplifier circuit multi-layer substrate which can obtain good isolation between input and output and can sufficiently achieve miniaturization of the circuit by the multi-layer substrate. The purpose is to provide.

[0007]

In order to achieve the above object, a high frequency amplifier circuit multilayer substrate of the present invention is a dielectric body in which high frequency amplifier circuits requiring isolation between input and output are laminated in an arbitrary number of layers. In a high-frequency amplifier circuit multilayer substrate configured by using the multilayer substrate of, at least four or more dielectric layers and three or more ground layers between dielectric layers, and strip lines between the different ground layers, A high-frequency amplifier circuit multilayer substrate, wherein a strip line between one ground layer is used as an input side circuit of a high-frequency amplifier circuit and a strip line between different ground layers is used as an output-side circuit of a high-frequency amplifier circuit.

According to a second aspect of the present invention, there is provided a high frequency amplifier circuit which requires isolation between the input and the output.
In particular, the high frequency amplifier circuit multilayer substrate is characterized in that the antenna switch circuit changes the input impedance of the receiving side viewed from the antenna and changes the signal level input to the receiving section.

[0009]

Therefore, according to the high-frequency amplifier circuit multilayer substrate of the present invention, each stripline has an independent structure separated by the ground layer, and it can be considered that there is no direct signal propagation, which is preferable. The isolation between the input and output can be obtained, and the possibility of oscillation disappears in the high frequency amplifier circuit.

Further, according to the antenna switch circuit of the present invention as defined in claim 2, since each stripline has a structure of an independent multilayer substrate separated by the ground layer, the stripline between the transmitting side and the receiving side is provided. Since we can assume that there is no direct propagation of the signal at
Good isolation between the output when the antenna switch is ON and the output when the antenna switch is OFF can be obtained.

Further, according to the high frequency amplifier circuit multi-layer substrate of the present invention, since the strip lines are provided between the different ground layers, each independent strip line is separated into the upper and lower ground layers in the multi-layer substrate. It is possible to sufficiently realize the original purpose of downsizing the circuit of the high frequency amplifier circuit multilayer substrate and the antenna switch circuit of the multilayer substrate.

[0012]

Embodiment 1 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a mounting cross-sectional view of a high frequency amplifier circuit multilayer substrate according to the first embodiment of the present invention.
In the figure, 1 and 2 are strip lines (one is an input side, the other is an output side), 3, 4, and 5 are ground layers, and 6,
7, 8, 9, 10, 11 are dielectric layers, 12 and 13 are via holes,
Reference numerals 14 and 15 are electrodes, and 16 is a mounted semiconductor element. Further, the via holes 12 and 13 connect the electrodes 14 and 15 on the upper surface of the multilayer substrate to the strip lines 1 and 2, and at the portions intersecting with the ground layers 3 and 4, prevent contact with the pattern forming the ground. ing.

In the high-frequency amplifier circuit multilayer board having the above-mentioned structure, if strip lines 1 and 2 are used for the input side circuit and the output side circuit, the strip line 1 is mounted on the electrode 14 on the upper surface of the multilayer board by the via hole 12. The stripline 2 is connected to the semiconductor element 16 mounted on the electrode 15 on the upper surface of the multilayer substrate by the via hole 13 to realize a high frequency amplifier circuit.

FIG. 2 shows an embodiment of the electric circuit of the high frequency amplifier. The strip line 1 is connected to a part of the input of this circuit.
The stripline 2 is used as a part of the output section, and when mounted on a high-frequency amplifier circuit multilayer substrate using the striplines 1 and 2, it becomes as shown in FIG. 1 (in the figure, only a part of the high-frequency amplifier circuit is shown. Exist). However, here, the FFT is used for the semiconductor element 16.

When the strip lines 1 and 2 are thus separated by the ground layers 3 and 4, that is, the structure in which the signal does not directly propagate between the input side circuit and the output side circuit, the conventional structure is confirmed. The oscillation phenomenon due to the direct propagation of the signal between the input side circuit and the output side circuit almost disappeared. Also, stripline 1,
There is no need to increase the distance between the two, and it is possible to reduce the size.

In the above embodiment, the dielectric layers 6,
7,8,9,10,11 may have a structure in which at least four layers are provided, and the ground layer 3 between the dielectric layers 3 and
4 and 5 may have three or more configurations. The strip lines 1 and 2 are separately formed between the different ground layers 3, 4 and 5 for use.

[0017]

Second Embodiment Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a sectional view showing the mounting of the multilayer substrate on the antenna switch circuit according to the second embodiment of the present invention. In the figure, 1 and 2 are strip lines (one is an input side, the other is an output side), 3, 4, and 5.
Is a ground layer, 6, 7, 8, 9, 10, 11 is a dielectric layer, 1
Reference numerals 2 and 13 are via holes, 14 and 15 are electrodes, and 16 is a mounted semiconductor element. Further, the via holes 12 and 13 connect the electrodes 14 and 15 on the upper surface of the multilayer substrate to the strip lines 1 and 2, and at the portions intersecting with the ground layers 3 and 4, prevent contact with the pattern forming the ground. ing.

In the antenna switch circuit multilayer substrate having the above-mentioned structure, if strip lines 1 and 2 are used for the input side circuit and the output side circuit, respectively, the strip line 1 is mounted on the electrode 14 on the upper surface of the multilayer substrate by the via hole 12. Connected to the semiconductor device 16 connected to the strip line 2
Is connected to a semiconductor element 16 mounted on an electrode 15 on the upper surface of the multilayer substrate by a via hole 13 to realize an antenna switch circuit.

As a preferred embodiment of the antenna switch circuit, a simplified block diagram is shown in FIG. 4A. An example of the electric circuit of the antenna switch is shown in FIG. 4B. The antenna switch circuit is a switch circuit that switches a signal from the transmission unit to the antenna and a signal from the antenna to the reception unit, and the ON state and the OFF state of the antenna switch circuit are determined by the control gate illustrated in FIG. 4B. It That is, when no voltage is applied to the control gate, it is turned on, and the received signal from the antenna is input, amplified and output, and the received signal is sent to the receiving unit. Further, when a negative voltage is applied to the control gate, the control gate is turned off, the input reflection coefficient on the receiving side as seen from the transmitting section increases, and the transmitting signal is sent only to the antenna. That is,
An antenna switch circuit is configured to change the input impedance on the receiving side as viewed from the antenna and change the signal level input to the receiving unit for transmission.

However, if the isolation between the input and output of the antenna switch circuit is not good, the input reflection coefficient of the receiving side when viewed from the transmitting side becomes small and the transmitting signal is sent to the receiving section when in the OFF state. Good isolation between input and output is desired. In FIG. 4B, a strip line 1 is used for a part of the input part and a strip line 2 is used for a part of the output part of the antenna switch circuit. When the antenna switch circuit using the strip lines 1 and 2 is mounted on a multilayer substrate, As shown in FIG. 3 (only a part of the antenna switch circuit is shown in the figure). However, here, an FET (dual gate type) is used for the semiconductor element 16.

As described above, when the strip lines 1 and 2 are separated by the ground layers 3 and 4, that is, the structure in which the signal does not directly propagate between the input side circuit and the output side circuit, the conventional structure is obtained. ON which was about 45 dB
The isolation of the output of the state and the output of the OFF state is about
A good isolation of 70 dB was obtained. Further, it is not necessary to set a large distance between the strip lines 1 and 2, and the size can be reduced.

In the multi-layer substrate of the antenna switch circuit of the second embodiment, the dielectric layers 6, 7, 8, 9, 10,
It is sufficient for 11 to have a structure in which at least four layers are provided, and the ground layers 3, 4, and 5 between the dielectric layers may have three or more positions. The strip lines 1 and 2 are separately formed between the different ground layers 3, 4 and 5 for use. In the first and second embodiments, the strip line 1 is provided in the input side circuit.
Although the strip line 2 is used for the output side circuit, the strip line 2 is used for the input side circuit by reversing the input side and the output side.
Alternatively, the strip line 1 may be used for the output side circuit.

[0023]

As described above, according to the invention of claim 1 of the present invention, a high frequency amplifier circuit requiring isolation between input and output is constructed by using a dielectric multilayer substrate in which an arbitrary number of layers are laminated. In the high-frequency amplifier circuit multi-layer substrate, at least four or more dielectric layers and three or more ground layers are provided between the dielectric layers, and strip lines are provided between the different ground layers. Is used as an input side circuit of a high frequency amplifier circuit, and a strip line between different ground layers is used as an output side circuit of the high frequency amplifier circuit, so that the input side circuit and the output side circuit are connected to the ground layer. Separation by and providing on separate layers, good isolation between input and output can be obtained, and the multilayer board can be miniaturized. Those that can achieve excellent high-frequency amplifier circuit multilayer board.

According to a second aspect of the present invention, there is provided a high-frequency amplifier circuit which requires isolation between the input and the output, in particular, a signal level input to the receiving section by changing the input impedance of the receiving side viewed from the antenna. Since it is a high-frequency amplifier circuit multilayer substrate characterized by being an antenna switch circuit that changes the, the input side circuit and the output side circuit are separated by a ground layer, by providing a separate layer,
An excellent high-frequency amplifier circuit multi-layer substrate that can miniaturize the antenna switch circuit is realized because good isolation between the output in the ON state and the output in the OFF state can be obtained and it is not necessary to take a large stripline distance. It is possible.

[Brief description of drawings]

FIG. 1 is a mounting cross-sectional view of a high-frequency amplifier circuit multilayer substrate according to a first embodiment of the present invention,

FIG. 2 is an electric circuit diagram of the high-frequency amplifier according to the first embodiment,

FIG. 3 is a mounting cross-sectional view of an antenna switch circuit multilayer board according to a second embodiment of the present invention,

FIG. 4 is a simplified block diagram of an antenna switch circuit according to a second embodiment,

FIG. 5 is an electric circuit diagram of an antenna switch according to a second embodiment,

FIG. 6 is a configuration diagram of a conventional high-frequency amplifier circuit multilayer substrate,

FIG. 7 is a configuration diagram of a conventional antenna switch circuit multilayer substrate,

[Explanation of symbols]

 1,2. Strip line 3,4,5. Ground layer 6, 7, 8, 9, 10, 11. Dielectric layer 12,13. Beer hole 14,15. Electrode 16. Semiconductor device 17. Antenna 18. Antenna switch circuit 19. Receiver 20. Transmission band bus filter 21. Transmitter 22,23. Strip line 24,25. Ground layer 26,27,28,29. Dielectric layer 30,31. Beer holes 32, 33. Electrode 34. Semiconductor element

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuo Eda 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A high frequency amplifier circuit multi-layer substrate comprising a dielectric multi-layer substrate in which an arbitrary number of layers are laminated, the high frequency amplifier circuit requiring isolation between input and output, and at least four or more dielectric layers. 3 between layers and dielectric layer
It has more than one ground layer and has strip lines between different ground layers. The strip line between one ground layer is the input side circuit of the high frequency amplifier circuit and the strip line between different ground layers is the output of the high frequency amplifier circuit. A high-frequency amplifier circuit multilayer substrate, which is used for a side circuit. 2. A high-frequency amplifier circuit that requires isolation between the input and output, and in particular, an antenna switch circuit that changes the input impedance of the receiving side as viewed from the antenna and changes the signal level input to the receiving section. The high frequency amplifier circuit multilayer substrate according to claim 1, wherein