JPH06334377A - Electronic equipment case body - Google Patents

Abstract

PURPOSE:To make an electronic equipment case body provide with the, strength and non- combustibility of a metal outer shell and the functional properties and lightweight properties of a resin layer and moreover, to contrive to separate resin internal mechanism parts from the metal outer shell at the time of disposal of the case body by a method wherein a metal press molded material is formed as the metal outer shell and in a bonding of the resin internal mechanism parts injection molded integrally with the metal outer shell to the metal outer shell, the adhesive synthetic resin layer made to contain a chemical foaming agent is made to interpose between the metal outer shell and the resin internal mechanism parts. CONSTITUTION:A metal outer shell 11 is formed by a method wherein a laminated metal plate formed by providing an adhesive synthetic resin layer 12 on one surface of a metal plate, for example, is put in a press die to perform such a press working that the layer 12 is put on the inner side of the laminated metal plate and is molded into the form of the outer shell of a dish-shaped or box-shaped case body. Then, the obtained metal outer shell 11 is mounted at a prescribed position in an injection mold and a thermoplastic resin is injection molded on the inner surface of the molded material, that is, on the layer 12, whereby internal mechanism parts 13 are molded integrally with the outer shell 11. In the addition blending ratio of a chemical foaming agent to the resin layer 12, it is desirable to add the foaming agent to the resin layer 12 in such a way that 1 to 10wt.% of the foaming agent is contained in the resin layer 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for electronic equipment which is thin, lightweight and easy to dispose of.

[0002]

2. Description of the Related Art Conventionally, for housing electromagnetic equipment, a metal layer is formed by metal plating on the surface of a resin housing made by injection molding of a thermoplastic resin for electromagnetic wave shielding. Some are provided and used.

Particularly as a recent trend, electronic devices are becoming lighter and smaller, and it is required that the thickness of the housing be thin and lightweight, and further higher electromagnetic wave shielding effect is required. At the same time, there is a demand for simple disposal methods after use.

[0004]

However, in the conventional resin housing formed by injection molding of the thermoplastic resin as described above, the wall thickness is increased in order to increase the rigidity, and the housing surface is metal-plated. Therefore, there is a problem that it is very difficult to separate the resin part and the metal part at the time of discarding.

The present invention has been made in order to solve these problems. The metal outer shell and the thermoplastic resin forming the internal mechanism are firmly adhered to each other, and the strength and noncombustibility of the metal are maintained. It is an object of the present invention to provide an electronic device housing that has both the functionality and light weight of a resin and that facilitates the separation of the metal part and the resin part at the time of disposal.

[0006]

Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that a metal press-molded body is used as a metal outer shell, and a resin internal mechanism portion and a metal which are integrally injection-molded are used. By interposing an adhesive synthetic resin layer containing a chemical foaming agent on the joint with the outer shell, it can be used as a housing with excellent characteristics, and at the time of disposal, foam and separate the metal part and the resin part. Therefore, the inventors have found that the above object can be achieved and completed the present invention.

That is, according to the present invention, a resin inner mechanism portion of a thermoplastic resin is injection-molded by interposing an adhesive synthetic resin layer on a metal outer shell formed by metal press molding to form a metal outer shell and a resin inner mechanism portion. The electronic device housing is characterized in that the synthetic resin of the adhesive synthetic resin layer contains a chemical foaming agent.

The present invention will be described in detail below.

FIG. 1 is a vertical cross-sectional view showing an example 16 of an electronic equipment casing of the present invention. In the figure, 11 is a metal outer shell,
Reference numeral 12 is an adhesive synthetic resin layer, and 13 is a resin internal mechanical portion. For the metal outer shell 11, for example, a laminated metal plate in which an adhesive synthetic resin layer 12 is provided on one surface of a metal plate is put into a press die, and press working is performed so that the adhesive synthetic resin layer 12 is on the inside. It is molded into the outer shell of a box-shaped or box-shaped housing. Then, the obtained metal outer shell 11 is mounted at a predetermined position in an injection molding die, and a thermoplastic resin is injection-molded on the inner surface of the molded body, that is, on the synthetic resin layer 12, to thereby form an internal mechanism portion. 13 is molded integrally with the metal shell. 1
Reference numeral 3a is a self-tapping screw boss, 13b is a boss for a through hole, and 13c is a positioning boss.

The metal plate constituting the metal outer shell in the present invention is made of a metal such as iron, aluminum or zinc alloy that can be recycled and is easily processed by pressing or the like, and has a thickness having a desired strength. Plates of 0.5 to 0.7 mm can be used.

As the synthetic resin of the adhesive synthetic resin layer, an ethylene-vinyl acetate copolymer (EV) having excellent adhesiveness with the above-mentioned metal and also good adhesiveness with the thermoplastic resin is used.
A) and ethylene-ethyl acrylate copolymer (EE
Synthetic resins such as A), or terpolymers of these copolymers with polyolefins can be used. Commercially available products such as EVA or EEA include Novatec AP (trade name, manufactured by Mitsubishi Kasei Co., Ltd.), N polymer (trade name, manufactured by Nippon Petrochemical Co., Ltd.), Showflex (trade name, manufactured by Showa Denko KK), Admer (Mitsui). Petrochemical Industry Co., Ltd., trade name), Modic (Mitsubishi Petrochemical Co., Ltd., trade name), Nucrel (Mitsui DuPont Polychemical Co., Ltd., trade name), etc., and these may be used alone or in combination. You can

As a chemical foaming agent to be added and contained in the adhesive synthetic resin layer, azodicarbamide (ADC) is used.
A), azobisisobutyronitrile (AIBN), dinitrosopentamethylenetetramine (DPT), 4,4'-
Oxybisbenzenesulfonyl hydrazide (OBS
H), paratoluenesulfonyl hydrazide (TSH)
Further, barium azodicarboxylate and the like can be mentioned, and these can be used alone or in combination. EVA
Among these, ADCA is preferably used as a substance that decomposes gas is generated at the processing temperature or higher. It is desirable to add the chemical foaming agent so that it is contained in an amount of 1 to 10% by weight based on the adhesive synthetic resin. Addition ratio
If it is less than 1% by weight, the foaming pressure will be insufficient, and if it exceeds 10% by weight, film processing will be hindered, which is not preferable.

The adhesive synthetic resin layer has a total thickness of 30 to 100 μm.
It is desirable to set the thickness to. In order to form this on one side of the metal plate, it is preferable to adopt a method of, for example, performing extrusion lamination or pasting a film processed into a hot press or a hot roll.

The thermoplastic resin to be injection molded is not particularly limited, but polyethylene, polypropylene and the like can be used.

[0015]

Since the housing manufactured in this manner has the metal outer shell, it has a large mechanical strength and can be made thin and lightweight. In addition, since an adhesive synthetic resin layer is provided inside such a metal outer shell, and a thermoplastic resin is injection-molded thereon to form an internal mechanism portion, the metal outer shell and the internal mechanism formed by injection molding are formed. The adhesive strength with the parts is extremely high, and the design appearance is not impaired like the adhered ones.

Further, when the housing is disposed of, by heating it to a temperature not lower than the decomposition temperature of the chemical foaming agent, a gas (nitrogen gas, carbon monoxide gas, carbon dioxide) is generated between the metal plate and the thermoplastic resin. (Gas etc.) is generated, and it is easy to dispose the metal part and the resin part by separating them.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

2 (a)-(b) and FIGS. 3 (c)-(d).
FIG. 8A) is a cross-sectional view for explaining one manufacturing example of the electronic device casing of the present invention.

First, as shown in FIG. 2 (a), the thickness is 0.5
5% by weight of ADCA's Vinyl Hall AC # 3M (manufactured by Eiwa Chemical Co., Ltd.) is added to Novatic AP270L (manufactured by Mitsubishi Kasei Corp.), which is EVA with a thickness of 50 μm, on one side of an aluminum plate 1 of mm. , This with extruder thickness
Overlay EVA film 2 in the form of 100 μm film,
This is hot pressed at a temperature of 130 ° C. to be joined to form a laminated plate 3. Then, as shown in FIG. 2 (b), the obtained laminated plate 3 is put into a press die 4 and press-formed so that the EVA film 2 side faces inward, and after forming into a predetermined rectangular dish shape, As shown in FIG. 3 (c), peripheral unnecessary portions are trimmed to form the metal outer shell 11. Then, as shown in FIG. 3 (d), the metal outer shell 11 is inserted into an injection molding die 5 having a cavity having the same shape as the internal mechanism to be formed, and then heated and fluidized in the cylinder. Molded polyethylene 6 through sprue 7 and mold 5
It is filled in the cavity of and solidified. As shown in Table 1, the housing thus obtained is thinner, lighter, and extremely strong as compared with the conventional resin housing of the comparative example, which is formed of ABS resin alone.

[0020]

[Table 1]

The case obtained in such an embodiment is used as a case of an electronic device such as a semiconductor device in combination with the case on the other side formed by a similar method.

That is, as shown in FIG. 4, the component-mounting circuit boards (electronic devices) having the circuit components 15 mounted on both surfaces of the circuit board 14 are arranged in the center, and the upper and lower sides thereof are obtained in the examples. Covering the casings 16 and 17, the circuit board 1
4 is fixed to the boss 13a of the internal mechanism of the housing by screwing.

[0023]

As is apparent from the above description and Table 1, the electronic equipment housing of the present invention is thin and lightweight and has high strength because the metal outer shell and the internal mechanism portion are firmly bonded.
In addition, in the disposal process, the metal portion and the resin portion can be easily separated by heating above the decomposition temperature of the chemical foaming agent.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view illustrating an embodiment of an electronic device housing of the present invention.

2 (a) and 2 (b) are cross-sectional views for explaining a manufacturing process of the electronic device casing of FIG.

3 (c) to 3 (d) are sectional views for explaining the manufacturing process subsequent to FIG. 2 (b).

FIG. 4 is a cross-sectional view showing an electronic device in which a component mounting circuit board is housed and fixed in the housing obtained in the example.

[Explanation of symbols]

 1 Aluminum Plate 2 Adhesive Synthetic Resin (EVA Film) 3 Laminate Plate 4 Press Mold 5 Injection Mold 6 Thermoplastic Resin (Polyethylene) 7 Spray 11 Metal Outer Shell 12 Adhesive Synthetic Resin Layer 13 Internal Mechanism Parts 13a to 13c Boss 14 Circuit board 15 Mounted component 16, 17 Electronic device housing

Claims (1)

[Claims] 1. A resin inner mechanism part of a thermoplastic resin is injection-molded by interposing an adhesive synthetic resin layer on a metal press-molded metal outer shell to integrate the metal outer shell and the resin inner mechanism part. An electronic equipment housing, wherein the synthetic resin of the adhesive synthetic resin layer contains a chemical foaming agent.