JP2009158827A - Electronic apparatus cabinet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus cabinet which is easy to separate constituting components upon recycling, while having sufficient thermal resistance. <P>SOLUTION: In the electronic apparatus cabinet equipped with a predetermined first component, a second component different from the first component and an adhesive resin which bonds the first component to the second component mutually, microcapsules 140, in which organic solvent is sealed in a shell 141 formed of organic material as a vaporization agent 142 evaporating and expanding at a temperature rise, and further, the shell 141 is covered by a covering body 143, which causes the expansion of the vaporization agent 142 toward the high-temperature side, are dispersed inside the adhesive resin. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device casing in an electronic device such as a personal computer or a mobile phone.

  In the field of electronic devices such as personal computers and mobile phones, as an example of a technology that can easily obtain a lightweight, rigid and highly complex electronic device housing, conventionally, a plurality of component parts are combined by bonding to form an electronic device. A technique for obtaining a device casing is known (for example, see Patent Document 1). In particular, among electronic device casings obtained by such a technique, an electronic device casing in which a lightweight metal part having high rigidity and a resin part that can easily realize a complicated shape are combined by bonding It is attracting attention because of its excellent portability and decorativeness.

  Incidentally, in recent years, from the viewpoint of environmental considerations, there is a strong demand for recycling in the field of electronic devices (see, for example, Patent Document 2). In such recycling, it is necessary to sort by material type, and when recycling an electronic device casing composed of metal parts and resin parts as described above, these 2 It is necessary to separate the types of components from each other.

Therefore, in order to facilitate separation of the component parts when recycling such an electronic device casing, an adhesive resin mixed with a foaming agent that foams when heat is applied is used to bond the component parts together. Techniques have been proposed (see, for example, Patent Documents 3 to 5). According to this technology, the electronic device casing is heated at the time of recycling to foam the foaming agent in the adhesive resin and weaken the adhesive strength of the adhesive resin, thereby easily separating the components. Will be able to. However, the degree of foaming of such a foaming agent is not sufficient to weaken the adhesive force, and it may be difficult to separate the electronic device casing during recycling. In view of this, a technique has been proposed in which an adhesive resin in which thermally expandable microcapsules that are significantly expanded when heat is applied is used to bond component parts in an electronic device casing (for example, Patent Documents 6 to 6). 8). This heat-expandable microcapsule is an organic material sealed in an organic material shell, and has the property of expanding significantly due to softening of the organic material and vaporization of the organic solvent caused by heating. . According to the technique of using the adhesive resin in which the microcapsules are dispersed, the adhesive force of the adhesive resin can be weakened to a degree sufficient for separating the components due to the significant expansion of the microcapsules that occurs during heating.
Japanese Patent No. 3762313 JP-A-7-307536 Japanese Patent Laid-Open No. 7-7275 JP-A-10-119169 JP-A-6-334337 Japanese Patent No. 3914448 JP 2000-351974 A Japanese Patent No. 3650546

  Here, depending on the type of electronic device in which the electronic device casing is used, high heat resistance may be required for the electronic device casing. However, in the technique of using an adhesive resin in which the microcapsules are dispersed, it is difficult to increase the temperature at which the microcapsules expand due to the selection of the organic material and the organic solvent. There is a risk that sufficient heat resistance may not be obtained.

  In view of the above circumstances, an object of the present invention is to provide an electronic device casing that has sufficient heat resistance and that allows easy separation of components during recycling.

The basic form of the electronic device casing that achieves the above object is as follows:
A predetermined first part;
A second part different from the first part;
An adhesive resin that bonds the first component and the second component together;
In the adhesive resin, an organic solvent that expands due to a temperature rise is enclosed in a shell formed of an organic material, and the shell is further coated with a coating that shifts the expansion of the organic solvent to a high temperature side. It is characterized in that capsules are dispersed.

  According to this basic form, the shell is covered with the covering body in the microcapsules dispersed in the adhesive resin. As a result, the expansion of the microcapsule is suppressed until the covering cannot withstand the internal pressure generated by the softening of the organic material and the vaporization of the organic solvent. Will be. On the other hand, at the time of recycling, the microcapsules can be surely expanded by heating until an internal pressure exceeding the proof stress of the covering is generated. That is, according to this basic form, sufficient heat resistance and sufficient ease of separation of components during recycling can be obtained.

In addition, for the above basic form,
“The covering has a third temperature higher than both the first temperature at which the organic material begins to soften and the second temperature at which the organic solvent begins to vaporize until the temperature of the microcapsule exceeds the third temperature. The application form that “withstands the internal pressure of the microcapsule accompanying vaporization of the organic solvent and has a thickness that can be broken by the internal pressure when the temperature of the microcapsule exceeds the third temperature” is preferable.

  According to this preferred application mode, the expansion of the microcapsules can be reliably shifted to the high temperature side.

In addition, for the above basic form,
An application form that “the covering has a thickness of 0.01 μm or more and 10 μm or less” is also suitable.

  This application form is a specific form of the above-mentioned suitable application form, and the expansion of the microcapsules can be reliably shifted to the high temperature side.

In addition, for the above basic form,
An application form that “the shell is formed of a thermoplastic resin containing at least one selected from the group consisting of vinylidene chloride, acrylonitrile, acrylic acid ester, and methacrylic acid ester” is also suitable. It is.

  According to this preferred application mode, the shell can be softened well when the microcapsule is heated.

In addition, for the above basic form,
An application mode in which “the organic solvent is an organic solvent containing any one or more selected from the group consisting of isobutane, pentane, petroleum ether, hexane, octane, isooctane, and butane” is also suitable.

  According to this preferred application mode, when the microcapsule is heated, vaporization can be favorably generated inside the shell.

In addition, for the above basic form,
“The covering body is formed of a material containing any one or more selected from the group consisting of gold, silver, aluminum, copper, nickel, lead, solder, tin, silicon dioxide, zirconium oxide, and aluminum oxide. The application form of “the product has been made” is also suitable.

  According to this preferred application mode, the covering body can be provided with a good proof strength capable of withstanding the internal pressure described above. In addition, the covering can be easily obtained by adhering the substance to the surface of the shell constituting the microcapsule by a method such as plating, vapor deposition, sputtering, printing, dipping, or photocuring. Can be formed.

In addition, for the above basic form,
An application form that “the covering is formed of a thermosetting resin containing one or both of a phenol resin and an epoxy resin” is also suitable.

  Also according to this preferred application mode, it is possible to give the covering body good proof strength that can withstand the internal pressure described above.

In addition, for the above basic form,
An application form that “the adhesive resin is formed by dispersing the microcapsules in a rubber adhesive containing one or both of nitrile rubber and chloroprene rubber” is also suitable.

  According to this preferred application mode, the adhesive resin can be softened by appropriate heating, so that, in combination with the expansion of the microcapsules, it is even easier to separate the components during recycling. Can be obtained.

In addition, for the above basic form,
“The first component is a metal plate-shaped component,
The second component is formed by pouring a molten resin into a mold in which the first component, to which the adhesive resin is applied in an uncured state, is disposed, and then curing the resin, so that the first component has an adhesive property. An application form of “a resin part molded in a state of being bonded with resin” is also suitable.

  According to this preferred application mode, high rigidity can be obtained in the first part, and a complicated shape can be obtained in the second part.

  As described above, according to the basic form of the electronic device casing, it is possible to obtain sufficient heat resistance and sufficient ease of separation of components during recycling.

  Specific embodiments of the electronic device casing described above for the basic form and the application form will be described below with reference to the drawings.

  FIG. 1 is a diagram illustrating a specific embodiment of an electronic device casing.

  FIG. 1 shows an electronic apparatus composed of a plate-like first component 110 and a second component 120 having a complicated shape provided with bosses and ribs for fixing a circuit board (not shown). A housing 100 is shown. In the electronic device casing 100, the two parts 110 and 120 are bonded to each other by an adhesive resin 130 that is applied to the first component 110 in an uncured state when the electronic device casing 100 is manufactured.

  The first part 110 is formed of a magnesium alloy having a light weight and high rigidity, and the second part 120 is formed of a fiber reinforced resin in which glass fiber is dispersed at a rate of 20 percent in polycarbonate (PC) resin. Yes. The first component 110 and the second component 120 correspond to examples of the first component and the second component, respectively, in the basic form described above.

  In addition, the adhesive resin 130 for bonding them together is formed by dispersing microcapsules described later at a rate of 10% in a rubber-based adhesive of nitrile rubber. It corresponds to an example. The adhesive resin in the basic form is not limited to the one in which microcapsules are dispersed in the rubber adhesive of nitrile rubber. For example, the microcapsules are dispersed in the rubber adhesive of chloroprene rubber. The microcapsules may be dispersed in a rubber adhesive made of both nitrile rubber and chloroprene rubber. Further, the adhesive resin in the basic form may be one in which microcapsules are dispersed in a rubber-based adhesive composed of, for example, one of nitrile rubber and chloroprene rubber and other rubbers. Alternatively, microcapsules may be dispersed in a rubber-based adhesive composed of both nitrile rubber and chloroprene rubber and another rubber.

  Here, in the present embodiment, the electronic device casing 100 is formed by pouring a molten resin into a mold in which the metal component is disposed, and curing the resin, thereby integrating the metal component and the resin component. It is made by so-called insert molding to obtain a finished product. This insert molding is a method for easily obtaining a product in which a lightweight and highly rigid metal part and a resin part having a complicated shape are integrated, and generally requires light weight and high rigidity. At the same time, it is used as a method for easily obtaining an electronic device casing that is often complicated in shape.

  FIG. 2 is a diagram schematically showing an insert molding procedure for obtaining the electronic device casing shown in FIG. 1.

  First, the first component 110 is prepared, and an uncured adhesive resin 130 is applied to a portion of the surface of the first component 110 that is combined with the second component 120 (step S101).

  Next, in step S102, a mold 200 composed of a mold part 210 and a pedestal part 220 is prepared. The mold portion 210 is provided with a recess 211 having a shape corresponding to the second part 120 and a passage 212 having a spout for a molten resin material and guiding the resin material to the recess 211. . The pedestal portion 220 is a table on which the first component 110 is placed. In step S <b> 102, first, the first component 110 is placed at a predetermined position on the pedestal portion 220 with the application surface of the adhesive resin 130 facing away from the pedestal portion 220. The mold part 210 is attached to the pedestal part 220 so as to cover the depression 211 described above. Here, the adhesive resin 130 applied to the first component 110 may be in an uncured state at the time when the first component 110 is placed on the pedestal portion 220 or is already cured at that time. It may be.

  In step S <b> 102, following the placement of the first part 110 in the mold 200, the molten fiber reinforced resin is poured into the spout of the resin material in the passage 212 by the injection molding machine 300. If the adhesive resin 130 is in a cured state when the first component 110 is placed on the pedestal portion 220, the adhesive resin 130 is melted by the heat of the fiber-reinforced resin in the molten state. Then, the adhesiveness will be restored.

  In step S102, a resin material is poured into the mold 200, and the resin material is cured over a predetermined time. As a result, the second component 211 is formed in the mold 200 in a state of being bonded to the first component 110 with the adhesive resin 130 described above. After that, when the mold 200 is removed, the electronic device casing 100 is obtained in which the first component 110 that is lightweight and has high rigidity and the second component having a complicated shape are integrated (step S103). ).

  By the way, it is assumed that the electronic device casing 100 is recycled. In general, in recycling, it is necessary to separate each material type, and metal parts and resin parts need to be separated from each other during recycling. Therefore, in this embodiment, the microcapsules described below are provided in the adhesive resin 130 so that the first component 110 that is a metal component and the second component 120 that is a resin component can be easily separated from each other during the recycling. Is distributed.

  FIG. 3 is a cross-sectional view showing one of the microcapsules dispersed in the adhesive resin shown in FIGS. 1 and 2.

  The microcapsule 140 shown in FIG. 3 is a sphere in which butane, which is an organic solvent that vaporizes and expands as the temperature rises, is enclosed as a vaporizing agent 142 inside a shell 141 made of acrylonitrile, which is a thermoplastic organic material. Further, the shell 141 is covered with a covering body 143 which is a nickel thin film having a thickness of 0.01 μm. Here, in this embodiment, the sphere excluding the covering body 143 in the microcapsule 140 has a particle size of about 10 μm, and the shell 141 made of acrylonitrile is softened by heating and butane as the vaporizing agent 142 is vaporized. Then, it has thermal expansibility that the volume expands to about 5 to 250 times. The covering 143 is formed by depositing nickel by vapor deposition on the surface of a sphere having a thermal expansion of about 10 μm in particle diameter. The microcapsule 140 corresponds to an example of the microcapsule in the basic form described above, the shell 141 corresponds to an example of the shell in the basic form, and the vaporizer 142 corresponds to an example of the organic solvent in the basic form. The covering body 143 corresponds to an example of the covering body in its basic form.

  The shell in the basic form described above is not limited to the acrylonitrile shell 141, but is one thermoplastic resin selected from the group consisting of vinylidene chloride, acrylic acid ester, methacrylic acid ester, and the above acrylonitrile. It may be formed, or may be formed of two or more thermoplastic resins selected from the group. Furthermore, the shell in the basic form may be formed of one thermoplastic resin selected from the above group and another thermoplastic resin other than the thermoplastic resin belonging to the group, Alternatively, it may be formed of two or more thermoplastic resins selected from the group and another thermoplastic resin.

  Further, the organic solvent in the basic form described above is not limited to butane as the vaporizing agent 142, but is selected from the group consisting of isobutane, pentane, petroleum ether, hexane, octane, isooctane, and the above butane. One organic solvent may be used, or two or more organic solvents selected from the group may be mixed. Further, the organic solvent in the basic form may be a mixture of one organic solvent selected from the above group and another organic solvent other than the organic solvent belonging to the group, or Two or more organic solvents selected from the group may be mixed with another organic solvent.

  The covering in the basic form described above is not limited to a nickel thin film formed by a vapor deposition method. The covering in the basic form was formed of one substance selected from the group consisting of gold, silver, aluminum, copper, lead, solder, tin, silicon dioxide, zirconium oxide, aluminum oxide, and nickel described above. Or may be formed of two or more substances selected from the group. Furthermore, the covering in the basic form may be formed of one substance selected from the above group and another substance other than the substance belonging to the group, or It may be formed of two or more substances selected from the inside and another substance. In addition, the covering in the basic form is formed using one of the materials selected from the group consisting of a plating method, a sputtering method, a printing method, a dipping method, a photocuring method, and the above-described vapor deposition method. It may be formed by a method.

  Furthermore, the covering body in the basic form described above is not limited to the covering body formed of the above-described substance, and the covering body in the basic form may be formed of the following thermosetting resin. good. That is, the cover in the basic form may be formed of one thermosetting resin of phenol resin and epoxy resin, or formed of both thermosetting resin of phenol resin and epoxy resin. It may be what was done. Furthermore, the covering in the basic form may be formed of one thermosetting resin of a phenol resin and an epoxy resin and another thermosetting resin other than these thermosetting resins, Or what was formed with the thermosetting resin of both a phenol resin and an epoxy resin, and another thermosetting resin may be sufficient.

  When the temperature of the microcapsule 140 shown in FIG. 3 exceeds both the temperature at which the shell 141 made of acrylonitrile starts to soften and the temperature at which butane as the vaporizing agent 142 starts to vaporize, the internal pressure due to the vaporization of butane is increased in the microcapsule 140. Occurs. However, in this embodiment, the expansion of the microcapsule 140 is suppressed by the nickel covering body 143 that covers the shell 141. When the temperature of the microcapsule 140 further rises and the covering body 143 cannot withstand the internal pressure of the microcapsule 140, the covering body 143 breaks and the microcapsule 140 starts to expand. As described above, in this embodiment, the expansion of the microcapsule 140 is shifted to the high temperature side by the nickel covering body 143 as compared with the microcapsules not covered with such a covering body.

  Here, in this embodiment, the thickness of the covering 143 is 0.01 μm as described above. The thickness of the covering in the basic form described above is not limited to this value, but the thickness of the covering is preferably 0.01 μm or more and 10 μm or less. The reason is that if the thickness of the covering body 143 is less than 0.01 μm, the covering body 143 breaks immediately when an internal pressure is generated in the microcapsule 140, so that the temperature at which the microcapsule 140 starts to expand can be sufficiently changed. This is because if the thickness of the covering body 143 exceeds 10 μm, the covering body 143 is too strong and the expansion of the microcapsule 140 becomes difficult.

  In the present embodiment, the microcapsules 140 having such a covering body 143 are dispersed in the adhesive resin 130. 1 is heated until the temperature of the microcapsule 140 in the adhesive resin 130 exceeds the temperature at which the covering body 143 cannot withstand the internal pressure, during the recycling described above. The microcapsules 140 dispersed in the adhesive resin 130 expand. In addition, since the rubber adhesive forming the adhesive resin 130 is softened by this heating, the softening of the rubber adhesive and the expansion of the microcapsules 140 combine to greatly increase the adhesive strength of the adhesive resin 130. The first part 110 and the second part 120 can be easily separated from each other. Furthermore, in this embodiment, as described above, the expansion of the microcapsule 140 is shifted to the high temperature side by the covering body 143. This means that the adhesive strength of the adhesive resin 130 is maintained up to the transitioned high temperature.

  FIG. 4 is a graph showing the temperature change of the volume expansion coefficient when the adhesive resin in which the microcapsules covered with the covering are dispersed is heated after curing.

  In the graph G of FIG. 4, similarly to the adhesive resin 130 in the present embodiment, 10 first microcapsules in which a sphere having a particle diameter of about 10 μm is covered with a coating made of nickel and having a thickness of 0.01 μm. For a rubber-based adhesive mainly composed of nitrile rubber dispersed in a percentage ratio, the temperature change of the volume expansion coefficient when heated after curing is shown by the first line L1 connecting white circles. Yes.

  Also, in this graph G, a rubber-based adhesive in which second microcapsules having a coating having a thickness of 0.5 μm made of an epoxy resin, which is an example of the thermosetting resin, are dispersed at a rate of 10 percent. The temperature change of the volume expansion coefficient when heated after curing is shown by the second line L2 connecting the white triangles. In the example of FIG. 4, the shell and vaporizer of the second microcapsule are the same as those of the first microcapsule.

  Further, for comparison with the above two examples, the graph G shows a microparticle having a particle diameter of about 10 μm composed of the same shell and vaporizer as the shell 141 and vaporizer 142 included in the microcapsule 140 in this embodiment. For a rubber-based adhesive in which mere microcapsules without capsules are dispersed at a rate of 10 percent, the temperature change of the volume expansion coefficient when heated after curing is indicated by the third line L3 connecting the black rhombus marks. It is shown.

  As can be seen from the graph G in FIG. 4, in the rubber adhesive in which the mere microcapsules without coating are dispersed, the increase in the volume expansion coefficient indicated by the third line L3 exceeds 25% at about 150 ° C., and the adhesive strength is increased. Remarkably reduced.

  On the other hand, in the rubber adhesive in which the first microcapsules corresponding to this embodiment are dispersed, the increase in the volume expansion coefficient indicated by the first line L1 is less than 5% at about 150 ° C. Maintains strength. Further, in the rubber adhesive in which the second microcapsules are dispersed, the increase in the volume expansion coefficient indicated by the second line L2 is about 10% at about 150 ° C., and the rubber in which the first microcapsules are dispersed. Although it is slightly lower than the adhesives, it still maintains sufficient adhesive strength. The increase in the volume expansion coefficient of the rubber-based adhesive in which these microcapsules are dispersed exceeds 20%, and the separation of the object to be bonded becomes easy after reaching about 160 ° C. From this, it can be seen that the heat resistance of the rubber adhesive in which the microcapsules are dispersed is higher by about 10 ° C. than the heat resistance of the rubber adhesive in which the mere microcapsules without coating are dispersed.

  In the electronic device casing 100 of this embodiment described with reference to FIGS. 1 to 3, the adhesive resin 130 has a high heat resistance equivalent to the rubber adhesive in which the first microcapsules in the example of FIG. 4 are dispersed. As a result, the electronic device casing 100 itself also has high heat resistance. At the time of recycling, the electronic device casing 100 is heated at a temperature exceeding the heat resistance of the adhesive resin 130 to reduce the adhesive strength of the adhesive resin 130, so that the first metal part 110 and the resin The second parts 120 can be easily separated from each other. Thus, in the electronic device casing 100 of the present embodiment, sufficient heat resistance and sufficient ease of separation of component parts during recycling are realized.

  In the above description, the magnesium alloy first part 110 is illustrated as an example of the first part in the basic form described above. However, the first part in the basic form is not limited to this, and the first part is not limited thereto. The part 1 may be, for example, a part formed of a metal other than a magnesium alloy such as an aluminum alloy, a nickel alloy, or a zinc alloy, or a plate formed by impregnating a cloth knitted with carbon fiber with a resin. It may be a part formed of a substance other than metal, such as a fiber reinforced resin.

  In the above description, the plate-like first component 110 is illustrated as an example of the first component in the basic form described above. However, the first component in the basic form is not limited to this, and the first part is not limited thereto. The part may be a part having a complicated shape other than a plate shape, for example, made by a molding method such as die casting or thixomolding.

  In the above, as an example of the second part in the basic form described above, the second part 120 formed of fiber reinforced resin in which glass fiber is dispersed in polycarbonate (PC) resin is illustrated. The second part is not limited to this, and the second part may be made of, for example, a fiber reinforced resin in which carbon fiber is dispersed in polycarbonate (PC) resin. It may be formed of a fiber reinforced resin in which carbon fibers are dispersed in a polyamide (PA) resin.

  Hereinafter, the following additional notes will be disclosed with respect to various forms including the basic form and the application form described above.

(Appendix 1)
A predetermined first part;
A second part different from the first part;
An adhesive resin that bonds the first component and the second component to each other;
In the adhesive resin, an organic solvent that expands due to a rise in temperature is enclosed in a shell formed of an organic material, and the shell is further coated with a coating that shifts the expansion of the organic solvent to a high temperature side. An electronic device casing, wherein capsules are dispersed.

(Appendix 2)
The covering is organic until the temperature of the microcapsule exceeds a third temperature that is higher than both the first temperature at which the organic material begins to soften and the second temperature at which the organic solvent begins to vaporize. 2. The electronic device casing according to appendix 1, wherein the casing of the electronic device has a thickness that can withstand the internal pressure of the microcapsule accompanying the vaporization of the solvent and that can be divided by the internal pressure when the temperature of the microcapsule exceeds the third temperature. .

(Appendix 3)
The electronic device casing according to appendix 1 or 2, wherein the covering has a thickness of 0.01 µm or more and 10 µm or less.

(Appendix 4)
The shell is formed of a thermoplastic resin containing any one or more selected from the group consisting of vinylidene chloride, acrylonitrile, acrylic acid ester, and methacrylic acid ester. 4. The electronic device housing according to any one of 3 to 3.

(Appendix 5)
Addendum 1 to 4, wherein the organic solvent is an organic solvent containing any one or more selected from the group consisting of isobutane, pentane, petroleum ether, hexane, octane, isooctane, and butane. The electronic device housing according to any one of the above.

(Appendix 6)
The covering is formed of a material including any one or more selected from the group consisting of gold, silver, aluminum, copper, nickel, lead, solder, tin, silicon dioxide, zirconium oxide, and aluminum oxide. 6. The electronic device casing according to any one of supplementary notes 1 to 5, wherein the electronic device casing is a thing.

(Appendix 7)
The electronic device casing according to any one of appendices 1 to 5, wherein the covering is formed of a thermosetting resin including one or both of a phenol resin and an epoxy resin.

(Appendix 8)
8. The adhesive resin according to any one of appendices 1 to 7, wherein the microcapsules are dispersed in a rubber adhesive containing one or both of nitrile rubber and chloroprene rubber. Electronics housing.

(Appendix 9)
The first component is a metal plate-shaped component,
The second component is formed by pouring a molten resin into a mold in which the first component coated with the adhesive resin in an uncured state is placed, and curing the resin. 9. The electronic device casing according to any one of appendices 1 to 8, wherein the electronic device casing is a resin part molded in a state of being bonded with a resin.

It is a figure which shows specific embodiment of an electronic device housing | casing. It is a figure which shows typically the procedure of insert molding for obtaining the electronic device housing | casing shown in FIG. It is sectional drawing which shows one of the microcapsules disperse | distributed to adhesive resin shown in FIG.1 and FIG.2. It is a graph which shows the temperature change of the volume expansion coefficient when it heats after hardening about adhesive resin with which the microcapsule covered with the coating body disperse | distributed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Electronic device housing | casing 110 1st part 120 2nd part 130 Adhesive resin 140 Microcapsule 141 Shell 142 Vaporizing agent 143 Covering body 200 Mold 210 Mold part 211 Depression 212 Passage 220 Base part 300 Injection molding machine

Claims (5)

A predetermined first part;
A second part different from the first part;
An adhesive resin that bonds the first component and the second component to each other;
In the adhesive resin, an organic solvent that expands due to a rise in temperature is enclosed in a shell formed of an organic material, and the shell is further coated with a coating that shifts the expansion of the organic solvent to a high temperature side. An electronic device casing, wherein capsules are dispersed.   The shell is formed of a thermoplastic resin including any one or more selected from the group consisting of vinylidene chloride, acrylonitrile, acrylic acid ester, and methacrylic acid ester. The electronic device housing according to 1.   The organic solvent is an organic solvent containing any one or more selected from the group consisting of isobutane, pentane, petroleum ether, hexane, octane, isooctane, and butane. The electronic device casing described in 1.   The covering is formed of a material including any one or more selected from the group consisting of gold, silver, aluminum, copper, nickel, lead, solder, tin, silicon dioxide, zirconium oxide, and aluminum oxide. The electronic device housing according to claim 1, wherein the electronic device housing is one of the above.   The electronic device casing according to any one of claims 1 to 3, wherein the covering is formed of a thermosetting resin including one or both of a phenol resin and an epoxy resin. .

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