JPS63177497A - Molded product with printed circuit and manufacture of the same - Google Patents
Molded product with printed circuit and manufacture of the sameInfo
- Publication number
- JPS63177497A JPS63177497A JP775787A JP775787A JPS63177497A JP S63177497 A JPS63177497 A JP S63177497A JP 775787 A JP775787 A JP 775787A JP 775787 A JP775787 A JP 775787A JP S63177497 A JPS63177497 A JP S63177497A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- base film
- composite sheet
- molded product
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000002131 composite material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007666 vacuum forming Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 13
- -1 polypropylene Polymers 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 5
- 239000004814 polyurethane Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 229920000877 Melamine resin Polymers 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000007646 gravure printing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
発明の目的 purpose of invention
本発明は、印刷回路を有する成形品の改良に関し、その
製造方法も包含する。
［従来の技術］
合成樹脂の成形品の表面に、電気または電子回路（以下
、単に「回路」という）を形成したい場合がある。
この目的を達するひとつの手段として、基材フィルム上
に導電性インキを用いて回路を印刷した転写シートを用
い、成形品にローを転写する方法がある。 成形品の表
面に回路が露出していることは好ましくないので、基材
シート上に剥離層を設けておき、これで保護することも
試みたが、耐湿性は十分といえない。 そこで、基材フ
ィルムを剥離しないでそのまま成形品の表面に残してお
くことが考えられる。
その場合は、成形品への転写に代えて、射出絵付成形の
手法を利用することが得策である。 しかし、いずれの
手法によるにしても、基材フィルムを表面にもつ成形品
は、回路の保護はすぐれているが、回路にリードをつけ
ることが容易でなかった。The present invention relates to an improvement in a molded article having a printed circuit, and also includes a method for manufacturing the same. [Prior Art] There are cases where it is desired to form an electric or electronic circuit (hereinafter simply referred to as a "circuit") on the surface of a synthetic resin molded product. One way to achieve this goal is to use a transfer sheet in which a circuit is printed using conductive ink on a base film, and then transfer the raw material to the molded product. Since it is undesirable for the circuit to be exposed on the surface of the molded product, an attempt was made to protect the circuit by providing a release layer on the base sheet, but the moisture resistance was not sufficient. Therefore, it is conceivable to leave the base film as it is on the surface of the molded product without peeling it off. In that case, it is advisable to use an injection molding method instead of transferring to a molded product. However, no matter which method is used, molded products having a base film on the surface provide excellent protection of the circuit, but it is not easy to attach leads to the circuit.
本発明の目的は、基材フィルムによる印刷回路の保護を
したうえで、リードをつけやすいような、印刷回路を有
する成形品を提供することにある。
上記の印刷回路を有する成形品の製造方法もまた、本発
明の目的に含まれる。
発明の構成An object of the present invention is to provide a molded product having a printed circuit that can be easily attached with leads while protecting the printed circuit with a base film. A method of manufacturing a molded article having a printed circuit as described above is also included within the scope of the present invention. Composition of the invention
本発明の印刷回路を有する成形品は、第４図に示すよう
に、プラスチック成形品４の上に、基材フィルム１１上
に導電性インキで形成した印刷回路１４であって回路の
端子部分３において基材フィルム１１と印刷回路１４と
が接着していない複合シート１Ａ（１Ｂ＞を一体化して
なり、回路の端子部分３の基材フィルム１１を剥離して
リードをつけることが可能なものである。
本発明の印刷回路を有する成形品の製造方法は、第１図
および第２図に示すように、基材フィルム１１上に導電
性インキで形成した印刷回路１４を有し、印刷回路の端
子部分において基材フィルムと印刷回路とが接着してい
ない複合シート１Ａ（１Ｂ）を製造し、第４図に示すよ
うに、その複合シートを、基材フィルムが表面に位置す
るように有するプラスチック成形品４を形成したのち、
端子部分３を被覆している前記基材フィルム１１を剥離
してリードがつけられるようにすることからなる。
複合シートを有するプラスチック成形品の形成は、代表
的には第３図に示すように、複合シート１Ａを基材フィ
ルム１１０面が射出成形金型２Ａ。
２Ｂの内面に接するように配置してプラスチックの射出
成形を行なうことにより実施する。
別の態様においては、プラスチック成形品の表面に複合
シートの印刷回路の面を接着する方法として、複合シー
トの印刷回路の面をプラスチック成形品の表面に置いて
加熱加圧することにより実施する。
複合シートの製造は、第１図に示すように、基材フィル
ム１１上の印刷回路１４の端子部分に接触する部分に剥
離層１２を設けたのち導電性インキで印刷回路１４を形
成することにより行なうのが、代表的である。 別法と
しては、第２図に示すように、導電性インキが付着しな
い基材フィルム１１上の印刷回路１４の端子部分を除い
てインキ付着のためのプライマー層１３を設けたのち導
電性インキで印刷回路１４を形成することにより行なっ
てもよい。
複合シートと成形品の接着性を高めたい場合は、接着剤
層を使用するとよい。
成形品の形状が三次元形状である場合は、複合シートを
適宜の方法、たとえば真空成形、圧空成形、真空圧空成
形、マツチドダイモールド成形により予備成形して使用
するとよい。 真空および（または）圧空成形の金型と
して、射出成形の金型を利用すれば、設備が簡略となる
。
基材フィルムの材料は、ポリ塩化ビニル、ポリアミド、
ポリ塩化ビニリデン、ポリプロピレン、ポリウレタン、
ポリカーボネート、ポリスチレン、ポリサル７オン、ボ
リアリレート、ポリエーテルサルホン、ポリエステルな
どのプラスチックのフィルムの単体または積層体がよい
。 これらの基材フィルムに導電性インキが付着するか
否かは、インキのビヒクル成分との組み合わせいかんに
より異なる。
剥離層の材料は、ポリ塩化ビニル、アクリル、ポリアミ
ド、ニトロセルロース、ポリウレタン、ポリ酢酸ビニル
などの熱可塑性樹脂、またはメラミン、フェノール、ポ
リウレタンなどの熱硬化性樹脂がよい。 剥離層を形成
するには、ロールコート法、グラビア印刷法、シルクス
クリーン印刷法その他の任意の方法を使用すればよい。
インキ付着のためのプライマー層の材料は、アクリル、
ポリエステル、ポリウレタンなどの熱可塑性樹脂、メラ
ミン、フェノールなどの熱硬化性樹脂およびクロロプレ
ンゴムなどがよい。 プライマー層を形成するには、ロ
ールコート法、グラビアコート法、シルクスクリーン印
刷法その他の任意の方法によればよい。
印刷回路の形成は、導電性インキをスクリーン印刷、グ
ラビア印刷またはオフセット印刷などの方法で、基材フ
ィルム上に印刷することによって行なう。
導電性のインキは、Ａｕ、Ｐｄ、 Ａｇ、 Ｎｉ 。
Ｃｕなどの金属の粉末またはＣの粉末を、バインダーと
混練して調整する。 バインダーは合成樹脂を主成分と
するものであって、エポキシ、フェノールなどの熱硬化
性樹脂や、ポリオレフィン、ポリウレタン、ポリエステ
ル、ポリアミドなどの熱可塑性樹脂から、適当なものを
えらんで使用する。
プラスチック成形品の材料としては、任意の熱可塑性樹
脂および熱硬化性樹脂が使用できる。
たとえば、ポリスチレン、アクリル、Ａｓ樹脂、ＡＢＳ
樹脂、ポリカーボネート、ポリフェニレンエーテル、ポ
リアミド、ポリエーテルサルホン、ポリエーテルイミド
、ポリエーテルエーテルケトン、ポリメチルペンテン、
ポリブチレンテレフタレート、ポリエチレンテレフタレ
ート、ポリプロピレン、ポリエチレンなどである。
［作 用］
本発明の印刷回路を有する成形品は、基材フィルムが印
刷回路の表面を完全に保護している。
その印刷回路にリードをつけるには、第４図に示すよう
に、端子部分３を被覆している基材フィルム１１を剥離
して、端子部分３に導電性接着剤を使用してリード線を
接着したり、リード用舌片をさし込んだりすればよい。
必要ならば、基材フィルムの端子部分３を被覆してい
る部分を切断除去する。
［実施例１１
厚さ５０μのポリエステルフィルムを基材フィルムとし
、その上にポリウレタン系樹脂を所定の位置にシルクス
クリーン印刷法によりパートコートして、剥離層を形成
した。
八ｇの粉末をポリエステル樹脂を主成分とするバインダ
ーと混練した導電性インキを、上記の剥離層を有するポ
リエステルフィルム上に、シルクスクリーン印刷法によ
り所望の回路のパターンで印刷した。
その上にアクリル樹脂系の接着剤をシルクスクリーン印
刷法で全面コートして、複合シートを得た。
この複合シートを、基材フィルムの面が射出成形金型の
内面に接するように金型内に配置して、樹脂温度２２０
’ＣでＡＢＳ樹脂を射出成形した。
これを金型からとり出し、剥離層上の基材フィルム、す
なわち印刷回路の端子部分を被覆している基材フィルム
を切断除去して端子部分だけを露出させ、その他の部分
は基材フィルムで保護されている印刷回路を有する成形
品を得た。As shown in FIG. 4, the molded product having a printed circuit according to the present invention is a printed circuit 14 formed with conductive ink on a base film 11 on a plastic molded product 4, and terminal portions 3 of the circuit. The composite sheet 1A (1B>) in which the base film 11 and the printed circuit 14 are not bonded is integrated, and leads can be attached by peeling off the base film 11 of the terminal portion 3 of the circuit. As shown in FIGS. 1 and 2, the method for manufacturing a molded product having a printed circuit according to the present invention includes a printed circuit 14 formed with conductive ink on a base film 11, and A composite sheet 1A (1B) in which the base film and the printed circuit are not bonded at the terminal portion is manufactured, and as shown in FIG. 4, the composite sheet is made of plastic having the base film located on the surface. After forming the molded product 4,
This consists of peeling off the base film 11 covering the terminal portion 3 so that leads can be attached. Typically, as shown in FIG. 3, a plastic molded article having a composite sheet is formed by using a composite sheet 1A with the base film 110 side in an injection mold 2A. This is carried out by injection molding of plastic by placing it so as to be in contact with the inner surface of 2B. In another embodiment, the printed circuit surface of the composite sheet is bonded to the surface of the plastic molded article by placing the printed circuit surface of the composite sheet on the surface of the plastic molded article and applying heat and pressure. As shown in FIG. 1, the composite sheet is manufactured by providing a release layer 12 on the base film 11 at a portion that contacts the terminal portion of the printed circuit 14, and then forming the printed circuit 14 with conductive ink. It is typical to do so. As an alternative method, as shown in FIG. 2, a primer layer 13 for ink adhesion is provided on the base film 11 to which the conductive ink does not adhere, except for the terminal portions of the printed circuit 14, and then the conductive ink is applied. This may also be done by forming a printed circuit 14. If you want to improve the adhesion between the composite sheet and the molded product, it is recommended to use an adhesive layer. When the shape of the molded product is three-dimensional, the composite sheet may be preformed by an appropriate method, such as vacuum forming, pressure forming, vacuum pressure forming, or mated die molding. If an injection mold is used as the mold for vacuum and/or pressure molding, the equipment will be simplified. The material of the base film is polyvinyl chloride, polyamide,
Polyvinylidene chloride, polypropylene, polyurethane,
A single film or a laminate of plastic films such as polycarbonate, polystyrene, polysal 7one, polyarylate, polyether sulfone, and polyester are preferable. Whether or not the conductive ink adheres to these base films depends on the combination of the ink and the vehicle component. The material for the release layer is preferably a thermoplastic resin such as polyvinyl chloride, acrylic, polyamide, nitrocellulose, polyurethane, or polyvinyl acetate, or a thermosetting resin such as melamine, phenol, or polyurethane. To form the release layer, roll coating, gravure printing, silk screen printing, or any other method may be used. The material of the primer layer for ink adhesion is acrylic,
Thermoplastic resins such as polyester and polyurethane, thermosetting resins such as melamine and phenol, and chloroprene rubber are preferable. The primer layer may be formed by a roll coating method, a gravure coating method, a silk screen printing method, or any other arbitrary method. The printed circuit is formed by printing conductive ink on the base film using a method such as screen printing, gravure printing, or offset printing. The conductive ink is made of Au, Pd, Ag, and Ni. A powder of a metal such as Cu or a powder of C is mixed and adjusted with a binder. The binder is mainly composed of a synthetic resin, and an appropriate one is selected from thermosetting resins such as epoxy and phenol, and thermoplastic resins such as polyolefin, polyurethane, polyester, and polyamide. Any thermoplastic resin or thermosetting resin can be used as the material for the plastic molded article. For example, polystyrene, acrylic, As resin, ABS
Resin, polycarbonate, polyphenylene ether, polyamide, polyether sulfone, polyether imide, polyether ether ketone, polymethyl pentene,
These include polybutylene terephthalate, polyethylene terephthalate, polypropylene, and polyethylene. [Function] In the molded product having a printed circuit according to the present invention, the base film completely protects the surface of the printed circuit. To attach leads to the printed circuit, as shown in FIG. 4, peel off the base film 11 covering the terminal portion 3 and attach the lead wire to the terminal portion 3 using conductive adhesive. You can glue it or insert a lead tongue. If necessary, the portion of the base film covering the terminal portion 3 is cut and removed. [Example 11] A polyester film having a thickness of 50 μm was used as a base film, and a polyurethane resin was part-coated at predetermined positions on the base film by a silk screen printing method to form a release layer. A conductive ink prepared by kneading 8 g of powder with a binder containing polyester resin as a main component was printed in a desired circuit pattern on the polyester film having the release layer by silk screen printing. The entire surface was coated with an acrylic resin adhesive using a silk screen printing method to obtain a composite sheet. This composite sheet is placed in a mold so that the surface of the base film is in contact with the inner surface of the injection mold, and the resin temperature is 220.
ABS resin was injection molded with 'C. This is taken out of the mold, and the base film on the release layer, that is, the base film that covers the terminals of the printed circuit, is cut and removed to expose only the terminals, and the other parts are covered with the base film. A molded article with a protected printed circuit was obtained.
【実施例２】
厚さ１００μのポリカーボネートフィルム上にメラミン
樹脂をグラビア印刷法により全面コートして、導電性イ
ンキの付着しない基材フィルムとした。
この基材フィルム上に、ポリウレタン系樹脂を所定の位
置にシルクスクリーン印刷法によりパートコートして、
導電性インキ付着のためのプライマー層を与えた。
その上に、実施例１と同様にして、回路を所望のパター
ンで印刷した後、実施例１と同様にして接着剤を全面コ
ートして複合シートを得た。
この複合シートを温度１７０℃の熱盤で加熱し、真空圧
空成形により予備成形した後、予備成形体の基材フィル
ムの面が射出成形金型の内面に接するように配置して、
実施例１と同様にＡＢＳ樹脂の射出成形をした。 以下
実施例１と同様にして、端子部分だけ露出し、その他の
部分は基材フィルムで保護されている印刷回路を有する
成形品を得た。
発明の効果
本発明の印刷回路を有する成形品は、基材フィルムが印
刷回路の表面を完全に被覆しているから保護は十分であ
り、しかもリードをつけることは容易でおる。 この成
形品は、本発明の製造方法によって、容易に得られる。[Example 2] A 100 μm thick polycarbonate film was entirely coated with melamine resin by gravure printing to obtain a base film to which conductive ink does not adhere. On this base film, a polyurethane resin is partially coated at predetermined positions using a silk screen printing method.
Provided a primer layer for conductive ink deposition. Thereon, a circuit was printed in a desired pattern in the same manner as in Example 1, and then the entire surface was coated with an adhesive in the same manner as in Example 1 to obtain a composite sheet. This composite sheet is heated on a hot platen at a temperature of 170°C and preformed by vacuum-pressure forming, and then placed so that the surface of the base film of the preform is in contact with the inner surface of an injection mold.
Injection molding of ABS resin was carried out in the same manner as in Example 1. Thereafter, in the same manner as in Example 1, a molded product having a printed circuit in which only the terminal portions were exposed and the other portions were protected by the base film was obtained. Effects of the Invention The molded product having a printed circuit according to the present invention has sufficient protection because the base film completely covers the surface of the printed circuit, and it is easy to attach leads. This molded article can be easily obtained by the manufacturing method of the present invention.
第１図および第２図は、いずれも本発明の製造方法に使
用する複合シートの基本的な構成を示す、模式的な断面
図である。
第３図は、第１図に示す複合シートを、予備成形して射
出成形金型内に置いたところを示す。
第４図は、第３図に示すようにして製造した、印刷回路
を有する成形品の断面図である。
１Ａ、１Ｂ・・・複合シート
１１・・・基材フィルム
１２・・・剥離層
１３・・・プライマー層
１４・・・印刷回路
２Ａ、２Ｂ・・・射出成形金型
３・・・端子部分
４・・・プラスチック成形品
特許出願人 大日本印刷株式会社
代理人 弁理士 須 賀 総 夫
第３ｒｌｌＩFIG. 1 and FIG. 2 are both schematic cross-sectional views showing the basic structure of a composite sheet used in the manufacturing method of the present invention. FIG. 3 shows the composite sheet shown in FIG. 1 preformed and placed in an injection mold. FIG. 4 is a sectional view of a molded article having a printed circuit manufactured as shown in FIG. 3. 1A, 1B...Composite sheet 11...Base film 12...Peeling layer 13...Primer layer 14...Printed circuit 2A, 2B...Injection mold 3...Terminal portion 4 ...Plastic molded product patent applicant Dainippon Printing Co., Ltd. Agent Patent attorney Souo Suga 3rd rllI
Claims (7)
電性インキで形成した印刷回路であって回路の端子部分
において基材フィルムと印刷回路とが接着していない複
合シートを一体化してなり、回路の端子部分の基材フィ
ルムを剥離してリードをつけることが可能な印刷回路を
有する成形品。(1) A composite sheet is integrated onto a plastic molded product, which is a printed circuit formed with conductive ink on a base film, and the base film and printed circuit are not bonded at the terminals of the circuit. , a molded product with a printed circuit that can be attached to leads by peeling off the base film of the terminal portion of the circuit.
路を有し、回路の端子部分において基材フィルムと印刷
回路とが接着していない複合シートを製造し、その複合
シートを、基材フィルムが表面に位置するように有する
プラスチック成形品を形成したのち、端子部分を被覆し
ている前記基材フィルムを剥離してリードがつけられる
ようにすることからなる印刷回路を有する成形品の製造
方法。(2) Manufacture a composite sheet that has a printed circuit formed with conductive ink on a base film, in which the base film and the printed circuit are not bonded at the terminal portions of the circuit, and transfer the composite sheet to the base film. Manufacturing a molded product having a printed circuit by forming a plastic molded product having the film on the surface and then peeling off the base film covering the terminal portion so that leads can be attached. Method.
、複合シートの基材フィルムの面が射出成形金型の内面
に接するように配置してプラスチックを射出成形するこ
とにより行なう特許請求の範囲第２項に記載の製造方法
。(3) A plastic molded product having a composite sheet is formed by injection molding the plastic with the base film surface of the composite sheet in contact with the inner surface of an injection mold. The manufacturing method described in section.
、プラスチック成形品の表面に複合シートの印刷回路の
面を置いて加熱加圧することにより行なう特許請求の範
囲第２項に記載の製造方法。(4) The manufacturing method according to claim 2, wherein the plastic molded article having the composite sheet is formed by placing the printed circuit side of the composite sheet on the surface of the plastic molded article and applying heat and pressure.
の端子部分に接触する部分に剥離層を設けたのち導電性
インキで印刷回路を形成することによつて行なう特許請
求の範囲第２項に記載の製造方法。(5) The composite sheet is manufactured by forming a printed circuit with conductive ink after providing a release layer on the base film at the portion that contacts the terminal portion of the printed circuit. The manufacturing method described in section.
基材フィルム上の印刷回路の端子部分を除いてインキ付
着のためのプライマー層を設けたのち導電性インキで印
刷回路を形成することによって行なう特許請求の範囲第
２項記載の製造方法。(6) The composite sheet is manufactured by forming a printed circuit with conductive ink after providing a primer layer for ink adhesion except for the terminal parts of the printed circuit on the base film to which conductive ink does not adhere. The manufacturing method according to claim 2, which is carried out.
およびマッチドダイモールド成形からえらんだ方法によ
り予備成形して使用する特許請求の範囲第２項に記載の
製造方法。(7) The manufacturing method according to claim 2, wherein the composite sheet is preformed by a method selected from vacuum forming, pressure forming, vacuum pressure forming, and matched die molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP775787A JPS63177497A (en) | 1987-01-16 | 1987-01-16 | Molded product with printed circuit and manufacture of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP775787A JPS63177497A (en) | 1987-01-16 | 1987-01-16 | Molded product with printed circuit and manufacture of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63177497A true JPS63177497A (en) | 1988-07-21 |
Family
ID=11674567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP775787A Pending JPS63177497A (en) | 1987-01-16 | 1987-01-16 | Molded product with printed circuit and manufacture of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177497A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02500629A (en) * | 1987-08-24 | 1990-03-01 | アエロスパティアル・ソシエテ・ナシヨナル・アンダストリエル | Method for creating collections of conductive patterns on insulating surfaces of complex morphology |
| JPH05213330A (en) * | 1991-09-09 | 1993-08-24 | Samsung Electronics Co Ltd | Drink storing container and manufacture thereof |
| US7889195B2 (en) | 1998-07-17 | 2011-02-15 | Sensable Technologies, Inc. | Systems and methods for sculpting virtual objects in a haptic virtual reality environment |
| US7990374B2 (en) | 2004-06-29 | 2011-08-02 | Sensable Technologies, Inc. | Apparatus and methods for haptic rendering using data in a graphics pipeline |
| WO2016059927A1 (en) * | 2014-10-16 | 2016-04-21 | 日本写真印刷株式会社 | Molded article, electrical component sheet, and method for manufacturing molded article and electrical product |
-
1987
- 1987-01-16 JP JP775787A patent/JPS63177497A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02500629A (en) * | 1987-08-24 | 1990-03-01 | アエロスパティアル・ソシエテ・ナシヨナル・アンダストリエル | Method for creating collections of conductive patterns on insulating surfaces of complex morphology |
| JPH05213330A (en) * | 1991-09-09 | 1993-08-24 | Samsung Electronics Co Ltd | Drink storing container and manufacture thereof |
| US7889195B2 (en) | 1998-07-17 | 2011-02-15 | Sensable Technologies, Inc. | Systems and methods for sculpting virtual objects in a haptic virtual reality environment |
| US7990374B2 (en) | 2004-06-29 | 2011-08-02 | Sensable Technologies, Inc. | Apparatus and methods for haptic rendering using data in a graphics pipeline |
| WO2016059927A1 (en) * | 2014-10-16 | 2016-04-21 | 日本写真印刷株式会社 | Molded article, electrical component sheet, and method for manufacturing molded article and electrical product |
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