JPH06334099A - J-bent lead structure for package ic - Google Patents

Abstract

PURPOSE:To prevent simple deformation of J-bent lead even if the lead is effected by a lateral external force by fixing an end of the lead to a recess formed in a bottom of a package IC with adhesive. CONSTITUTION:A J-bent lead of a package IC protrudes from a package 1, and an end 2a of the J-bent lead 2 is rigidly fixed into a recess 1a provided in a bottom of the package 1 with adhesive 3. Thus, the lead 2 becomes a both end supporting structure, and even if it is effected by an external force, it is not simply deformed. Incidentally, hardness to bend at the time of applying the same external force of the structure of the lead 2 is improved by about four times as large as that of a cantilever structure. Thus, even if the external force is applied, the deformation of the lead such as bent, float of the lead can be prevented, and hence a lead scanner, a step of correcting, etc., are eliminated, and a discarding loss is reduced to be decreased in a cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a J bend lead structure, and more particularly to a J bend lead structure which is resistant to lead bending.

[0002]

2. Description of the Related Art FIG. 3 is a partially cutaway side view showing a J bend lead structure of a conventional package IC. Figure 4 is J
It is a top view of the package IC seen from the bend lead side. In the figure, 1 is a package, 2 is a J bend lead, and this J bend lead 2 is a cantilever support structure protruding from the side surface of this package 1.

In the package IC having this structure, the tip 2a of the J-bend lead 2 is inserted into the recess 1a provided in the bottom of the package 1, and is formed freely.

[0004]

However, in the package IC having the above structure, the J bend lead is fixed on one side and free on one side, so that the external force in the lateral direction is applied to the J bend lead during the manufacturing process or the use process at the customer. However, when the above is added, there is a problem in that lead deformation such as lead bending and lead floating easily occurs, and a technically satisfactory product cannot be obtained.

The present invention eliminates the problem that the J bend lead is easily deformed by an external force in the lateral direction and a technically satisfactory result cannot be obtained. It is an object of the present invention to provide an excellent packaged IC that does not easily lead deformation even when receiving an external force.

[0006]

A J-bend lead structure for a package IC according to the present invention is such that the tip of the J-bend lead is fixed to a recess provided in the bottom of the package IC by an adhesive.

[0007]

The present invention can prevent the lead from being deformed even when an external force is applied to the J bend lead.

[0008]

1 is a partially cutaway side view showing a J bend lead structure of a package IC according to the present invention, and FIG. 2 is a plan view of the package IC seen from the J bend lead side.
In the figure, 3 is an adhesive filled in the recess 1 a of the package 1.

The J-bend lead of the package IC having this structure projects from the package 1, and the tip 2a of the J-bend lead 2 is firmly fixed by the adhesive 3 in the recess 1a provided in the bottom of the package 1. It For this reason, the J bend lead 2 has a structure of supporting both ends, and therefore is not easily deformed even if an external force is applied.

[0012] In the J-bend lead 2 both-ends supporting structure, compared to the cantilever supporting structure, the bending resistance when the same external force is applied is about four times as large as the "bending strength calculation formula" in the design manual. And will be dramatically improved.

Further, in the above description, the package having the J bend lead is simply described, but the package is not limited to this, and S
Of course, the same can be applied to the OJ and QFJ packages.

[0012]

As described above in detail, according to the J bend lead structure of the package IC according to the present invention, J
Since the bent lead has a structure of supporting both ends, it is possible to prevent the lead from being deformed, such as bending of the lead and floating of the lead, even if an external force is applied. Therefore, there is an effect that the steps such as the lead scanner and the lead correction are not necessary, and the cost can be reduced, and further, the disposal loss can be reduced and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a partially cutaway side view showing a structure of a J bend lead of a package IC according to the present invention.

FIG. 2 is a package I seen from the J bend lead side of FIG.
It is a top view of C.

FIG. 3 is a partially cutaway side view showing the structure of a J bend lead of a conventional package IC.

FIG. 4 is a package I seen from the J bend lead side of FIG.
It is a top view of C.

[Explanation of symbols]

 3 adhesive

Claims (1)

[Claims] 1. A package IC having a J-bend lead structure, wherein the tip of the J-bend lead is fixed to a recess provided at the bottom of the package IC with an adhesive agent.