JPH06333907A - Cleaning and processing device - Google Patents

Abstract

PURPOSE:To improve the cleaning and processing efficiency of a cleaning and processing device by making the flow of a cleaning and processing liquid uniform in a processing vessel. CONSTITUTION:A straightening means 20 is provided between semiconductor wafers W dipped in a cleaning and processing liquid contained in a processing vessel 15 equipped with a cleaning and processing liquid inlet 17 in its lower section and the inlet 17. The means 20 is constituted of a straightening plate 22 which is set in a horizontal position so as to divide the inside of the vessel 15 into an upper and lower sections and have numerous small holes 21 bored through the plate 22 and spreading plate 24 positioned above the inlet 17. In addition, flow arresting walls 23 are formed downward from the edge section of the plate 22 so as to arrest the flow of the liquid. Therefore, the difference between the flows of the liquid flowing through the holes 21 of the plate 22 can be reduced by arresting part of the liquid flowing toward the gap 19 between the vessel 15 and plate 22 and the occurrence of turbulent flows in the liquid flowing upward in the vessel 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning processing apparatus.

[0002]

2. Description of the Related Art Generally, in a semiconductor manufacturing process, contamination of particles, organic contaminants, metal impurities, etc. adhered to the surface of a semiconductor wafer (hereinafter referred to as a wafer) which is an object to be processed, or natural formation on the surface. A cleaning processing apparatus is used to remove an oxide film and the like. This type of cleaning processing apparatus is used for processing wafers with ammonia, water, hydrofluoric acid, sulfuric acid, hydrochloric acid,
For example, a chemical treatment and a water washing treatment such as a water washing treatment are alternately performed.

Conventional cleaning treatment apparatuses for chemical liquid treatment and cleaning treatment apparatuses for water washing generally have the same structure.
For example, as shown in FIG. 14, a wafer W is immersed in a processing bath a having a cleaning treatment liquid supply port b in the lower portion thereof and a cleaning treatment liquid L (pure water or chemical liquid) contained in the processing bath a. A wafer holder c that holds the wafer as much as possible, and a rectifying means d that is arranged between the wafer W immersed in the cleaning processing liquid L and the supply port b.
And. In this case, the rectifying means d is composed of a quartz rectifying plate f having a large number of small holes e and a diffusion plate g arranged above the supply port b, and the rectifying plate f supplies the supply port b. The cleaning treatment liquid supplied from the above into the treatment tank a is rectified and flowed into the treatment tank a, and the fast flow on the supply port b side is diffused by the diffusion plate g.

[0004]

However, in the conventional cleaning processing apparatus of this type, since the flow straightening plate f is made of quartz, it is placed between the processing tank a and the straightening plate f from the viewpoint of processing accuracy. A gap h (about 1 mm) had to be opened. Therefore, the flow of the cleaning treatment liquid passing through the gap h flows faster than the flow of the cleaning treatment liquid passing through the small holes e of the straightening vanes f to generate turbulent flow, thus making the flow in the treatment tank a non-uniform. Further, due to the diffusion plate g located above the supply port b,
Since the flow of the cleaning processing liquid between the wafers W above the diffusion plate g becomes slower than that between the other wafers W, the flow distribution of the cleaning processing liquid in the processing bath a is non-uniform as shown in FIG. It was. Therefore, there is a problem that the cleaning efficiency of the wafer W is lowered and a large amount of pure water must be used for cleaning up to a predetermined specific resistance value in the final cleaning process with pure water.

The present invention has been made in view of the above circumstances, and provides a cleaning treatment apparatus capable of uniformizing the flow of the cleaning treatment liquid in the treatment tank, improving the efficiency of the cleaning treatment, and improving the resistivity recovery characteristic. It is intended to be provided.

[0006]

In order to achieve the above object, the first cleaning processing apparatus of the present invention has a processing tank having a cleaning processing solution supply port at its lower portion, and is housed in this processing tank. Based on the premise that the cleaning treatment apparatus is provided with the object to be treated which is immersed in the cleaning treatment liquid and the rectifying means arranged between the supply port, the rectifying means is for dividing the treatment tank into upper and lower parts. It is composed of a straightening plate that is arranged horizontally and has a large number of small holes, and a diffusion plate that is located above the supply port.
The present invention is characterized in that a blocking wall for the cleaning treatment liquid is formed so as to hang downward from the edge of the current plate.

The second cleaning processing apparatus of the present invention,
Similar to the first cleaning processing apparatus, a processing tank having a cleaning processing solution supply port at a lower portion thereof, an object to be processed immersed in the cleaning processing solution housed in the processing tank, and the supply port. Assuming a cleaning processing apparatus having a rectifying means arranged between the rectifying means, the rectifying means is horizontally arranged to vertically divide the processing tank, and a rectifying plate having a large number of small holes formed therein,
And a diffusion plate located above the supply port to form a blocking wall for the cleaning treatment liquid that hangs downward from the peripheral edge of the diffusion plate, and a diffusion hole for the cleaning treatment liquid is formed in the diffusion plate. It is characterized by being installed.

The third cleaning processing apparatus of the present invention is
Similar to the above first and second cleaning processing apparatuses, a processing tank having a cleaning processing solution supply port at a lower portion thereof, an object to be processed immersed in the cleaning processing solution housed in the processing tank, and the above-mentioned supply. Assuming a cleaning processing apparatus including a rectifying means arranged between the mouth and the mouth, the rectifying means is horizontally arranged to divide the processing tank into upper and lower parts, and a large number of small holes are formed in the rectifying means. And a diffusion plate located above the supply port to form a blocking wall for the cleaning treatment liquid that hangs downward from the edge of the rectifying plate, and extends downward from the peripheral edge of the diffusion plate. The present invention is characterized in that it forms a baffle wall for the cleaning treatment liquid that hangs down and forms a circulation hole for the cleaning treatment liquid in the diffusion plate.

[0009]

According to the cleaning processing apparatus of the present invention configured as described above, the rectifying means is horizontally arranged to divide the processing tank into upper and lower parts, and a rectifying plate having a large number of small holes formed therein.
It is composed of a diffusion plate located above the supply port, and forms a baffle wall for the cleaning treatment liquid that hangs downward from the edge of the straightening plate, so that it flows toward the gap between the processing tank and the straightening plate. Since a part of the cleaning treatment liquid is blocked by the baffle wall, the flow of the cleaning treatment liquid through the gap becomes slow, and the difference with the flow of the cleaning treatment liquid flowing through the small holes of the straightening vane can be reduced. It is possible to prevent turbulence from occurring in the cleaning treatment liquid rising in the treatment tank.

Further, by forming a blocking wall for the cleaning treatment liquid which hangs downward from the peripheral edge of the diffusion plate and forming a flow hole for the cleaning treatment liquid in the diffusion plate, the inside of the treatment tank is supplied from the supply port. Part of the cleaning treatment liquid introduced into the above is taken in below the diffusion plate by the baffle wall, and the taken cleaning treatment liquid flows upward from the flow hole of the diffusion plate. Therefore, the flow of the cleaning treatment liquid between the objects to be treated above the diffusion plate and the flow between the other objects to be treated can be made uniform, and the efficiency of the cleaning treatment can be improved.

Further, a baffle wall for the cleaning treatment liquid that hangs downward from the edge of the straightening plate is formed, and a baffle wall for the cleaning treatment liquid that hangs downward from the peripheral edge of the diffusion plate is formed. By forming a through hole for the cleaning treatment liquid in the diffusion plate, a part of the cleaning treatment liquid introduced from the supply port into the treatment tank is taken in below the diffusion plate by the baffle wall to distribute the diffusion plate. Flows upward from the hole. On the other hand, a part of the cleaning treatment liquid flowing toward the gap between the treatment tank and the straightening vane is blocked by the baffle wall, the flow of the cleaning treatment liquid passing through the gap is delayed, and the cleaning treatment liquid flowing through the small holes of the straightening vane. The difference with the flow of can be reduced. Therefore, it is possible to prevent the turbulent flow of the cleaning treatment liquid and further ensure the uniformization of the flow of the cleaning treatment liquid into the processing tank.

[0012]

Embodiments of the present invention will be described in detail below with reference to the drawings. Here, a case where the cleaning processing apparatus of the present invention is applied to a semiconductor wafer cleaning processing apparatus will be described.

As shown in FIG. 1, the semiconductor wafer cleaning apparatus is carried by a carry-in section 1 for accommodating a semiconductor wafer W (hereinafter referred to as a wafer) which is an unprocessed object and a wafer carrying apparatus 2. A cleaning processing unit 3 that performs a cleaning process such as a chemical process and a water cleaning process on the wafer W to be cleaned, and a carry-out unit 4 that accommodates the wafer W after cleaning constitute a main part.

The carry-in section 1 includes a waiting section 6 for the carrier C for storing the wafer W, a loader section 5 for taking out the wafer W from the carrier C, aligning the orientation flat, and detecting the single wafer of the wafer W, and the like. The carrier transport arm 7 is provided for transporting the carrier C to the standby unit 6 and transporting the carrier C between the standby unit 6 and the loader unit 5.

A carrier cleaning / drying line 8 for cleaning and drying the empty carrier C after the wafer W is taken out by the wafer transfer device 2 is provided above the cleaning processing unit 3 above. Are arranged along. The carrier cleaning / drying line 8 has a lifting mechanism 9
The empty carrier C is configured to be lifted from the loader unit 5 and supplied via the. A similar lifting mechanism (not shown) is also provided on the unloading unit 4 side, and the carrier C after cleaning and drying is supplied to the unloading unit 4 via this lifting mechanism. A treatment liquid tank / pipe region 10 including a tank and a pipe group (not shown) for containing a treatment liquid such as a chemical liquid is provided on the back side of the cleaning treatment unit 3.

On the other hand, the cleaning processing section 3 includes the wafer transfer device 2, a chuck cleaning / drying processing tank 11 for cleaning and drying the wafer chuck 2a of the wafer transfer device 2, and the chuck cleaning / drying processing tank 11. A first chemical cleaning device 12a, which is sequentially disposed on the downstream side and processes unnecessary substances such as organic contaminants, metal impurities or particles on the surface of the wafer W by cleaning, and two second chemical cleaning devices 12a for cleaning the wafer W after chemical cleaning. 1st and 2nd water washing processing equipment 13a, 13
b, a second chemical cleaning treatment device 12b that performs a chemical treatment different from the first chemical cleaning treatment device 12a, two third and fourth water cleaning treatment devices 13c and 13d, and the wafer chuck 2a. A chuck cleaning / drying treatment tank 11 for drying and a drying treatment tank 14 for vapor-drying the wafer W from which impurities have been removed with, for example, isopropyl alcohol (IPA) are provided. In the first and second chemical liquid cleaning processing devices 12a and 12b and the first to fourth water cleaning processing devices 13a to 13d, the cleaning processing liquid overflows, and in the case of water cleaning processing, the overflow cleaning is performed. Drain the treatment liquid, and in the case of chemical treatment,
It is equipped with a processing tank 15 in which the overflowed cleaning processing liquid is circulated to remove accumulated impurities and to be recycled.

Three wafer transfer devices 2 are arranged so as not to be affected by the chemical cleaning devices 12a and 12b. Each of these wafer transfer devices 2 holds a pair of left and right wafer chucks 2a that collectively hold, for example, 50 wafers W, and the wafer chucks 2a in the horizontal direction (X, Y).
Drive mechanism 2 for moving in the vertical direction) and in the vertical direction (Z direction)
d, and a transport path 2b arranged along the processing tanks 15 to 15.
And is configured to reciprocate along the transport path 2b.

Next, the cleaning processing apparatus of the present invention used in the semiconductor wafer cleaning processing apparatus having the above-described structure will be described in detail with reference to FIGS.

First Embodiment FIG. 2 is a schematic perspective view of a first embodiment of the cleaning apparatus of the present invention, and FIG. 3 is a sectional view thereof.

The cleaning processing apparatus 12a, 12b of the present invention,
13a to 13d (hereinafter represented by 12 and 13), for example, the chemical cleaning processing apparatus 12 includes a rectangular processing tank 15 that stores a cleaning processing liquid such as ammonia water heated to a high temperature,
A wafer holder 16 disposed in the processing tank 15 for vertically holding, for example, 50 wafers W, and a wafer holder 16
A rectifying means 20 is provided slightly below and between the supply port 17 for the cleaning treatment liquid L provided at the bottom of the treatment tank 15.

The processing bath 15 is composed of an inner bath 15a for containing a cleaning treatment liquid L in which the wafer W is immersed, and an outer bath 15b for receiving the cleaning treatment liquid L overflowing from the upper end of the inner bath 15a. The circulation pipe 18 is connected to the supply port 17 provided at the bottom of the inner tank 15a and the discharge port 15c provided at the bottom of the outer tank 15b, and the circulation pump P and the filter are connected to the circulation pipe 18. F is interposed so that the overflowed cleaning treatment liquid L can be cleaned and circulated and supplied.

The rectifying means 20 is horizontally arranged so as to divide the processing tank 15 into upper and lower parts, and a large number of cleaning processing liquids L are provided.
A rectangular rectifying plate 22 having a small hole 21 for distribution of
It is composed of a circular diffusion plate 24 arranged above the supply port 17. In this case, the rectifying plate 22 is made of, for example, a chemically resistant plate member such as a plate made of quartz or a fluororesin, and as shown in FIG. A small hole 21 is formed in each of the holes. Specifically, the small holes 2 in the odd rows and in the even rows 2
1 is provided at the same position, and all the small holes 21 are located between the wafers W held by the wafer holder 16. A baffle wall 23 for the cleaning treatment liquid that hangs downward from the edge is provided at the peripheral edge of the baffle plate 22 formed in this manner. A part of the cleaning treatment liquid L flowing toward the gap 19 between the cleaning treatment liquid L and the flow path of the cleaning treatment liquid L passing through the small holes 21 of the straightening plate 22 to reduce the difference. It is configured so that the flow of L can be made uniform.

The diffuser plate 24 is also formed of a chemically resistant plate member such as a quartz plate or a fluororesin plate similarly to the straightening plate 22, and the upper surface of the diffuser plate 24 and the straightening plate 22 are formed. Plural pieces (for example, 4
It is supported below the flow straightening plate 22 by support legs 27 (see FIG. 4). The diffuser plate 24 may be a circular plate itself, but preferably, as shown by an imaginary line in FIG.
It is better to form a through hole for the cleaning treatment liquid L in the diffusion plate 24. The reason is that all of the cleaning treatment liquid L supplied from the supply port 17 is not distributed to the left and right by the diffusion plate 24, but a part thereof is flowed above the diffusion plate 24 so that the cleaning treatment liquid flows into the tank. This is because it can be made uniform.

Cleaning processing apparatus 1 configured as described above
To perform the cleaning process of the wafer W in 2 and 13, first, the wafer W held by the wafer chuck 2a of the wafer transfer device 2 is delivered to the wafer holder 16, and the wafer W is held.
Are disposed in the processing tank 15. Then, the circulation pump P is driven to drive the cleaning treatment liquid L from the cleaning treatment liquid supply source (not shown).
Is supplied from the supply port 17 into the inner tank 15a, the supply port 1
The cleaning treatment liquid L supplied from 7 to the inner tank 15a is the diffusion plate 2
After being diffused to the left and right by 4, the small holes 21 of the straightening plate 22
Is rectified and supplied to the surface of the wafer W. At this time, a part of the cleaning treatment liquid L passing through the gap 19 between the rectifying plate 22 and the inner tank 15a is blocked by the baffle wall 23.
It is possible to suppress the flow velocity of the cleaning treatment liquid L passing through the gap 19 from being excessively higher than the flow velocity of the cleaning treatment liquid L passing through the small holes 21, and to disturb the cleaning treatment liquid L supplied to the wafer surface. Flow can be prevented from occurring.

[Second Embodiment] FIG. 5 is a schematic perspective view of a second embodiment of the cleaning apparatus of the present invention, and FIG. 6 is a sectional view thereof.

The cleaning processing apparatus in the second embodiment is a case in which the flow of the cleaning processing liquid on the supply side is controlled so that the cleaning processing liquid supplied to the wafer surface can be made uniform.
That is, the flow blocking wall 26 of the cleaning treatment liquid L that hangs downward from the peripheral edge of the diffusion plate 24 that constitutes the rectifying means 20 is hung down, and the diffusion plate 24 has the through holes 25 for the cleaning treatment liquid L.
This is the case when In this case, as shown in FIG. 7, the through holes 25 formed in the diffusion plate 24 are small holes 25a formed in a position parallel to the small holes 21 formed in the flow straightening plate 22.
Alternatively, as shown in FIG. 8, it may be formed by a long hole 25b parallel to the small hole 21 formed in the current plate 22. When the through hole 25 is formed by the small hole 25a, the position of the small hole 25a is set to the small hole 2 of the straightening plate 22.
The cleaning treatment liquid L below the diffusion plate 24 can be positively supplied to the surface of the wafer W by adjusting the position of the diffusion plate 24 to the position of 1, and the position of the small hole 25a of the diffusion plate 24 and the rectifying plate 22.
By displacing the position of the small holes 21, the supply amount of the cleaning processing liquid L below the diffusion plate 24 to the surface of the wafer W can be reduced.

As described above, by providing the baffle wall 26 on the periphery of the diffusion plate 24, a part of the cleaning treatment liquid L supplied from the supply port 17 into the inner tank 15a is taken in below the diffusion plate 24. Therefore, the cleaning treatment liquid L that has been taken in can be caused to flow upward from the flow hole 25. Therefore, the flow of the cleaning processing liquid L between the wafers W above the diffusion plate 24 and the flow between the other wafers W can be made uniform, and the cleaning processing efficiency can be improved.

The second embodiment is the same as the first embodiment except that the baffle wall 23 is not provided at the edge of the flow straightening plate 22, so the same parts are designated by the same reference numerals. The description is omitted.

Third Embodiment FIG. 9 is a schematic perspective view of a third embodiment of the cleaning apparatus of the present invention, and FIG. 10 is a sectional view thereof.

The cleaning apparatus in the third embodiment is one in which the supply of the cleaning solution can be more surely made uniform. That is, as shown in the first and second embodiments, the blocking wall 23 for the cleaning treatment liquid that hangs downward from the edge of the straightening plate 22 is formed, and the diffusion plate 24 is
Barrier wall 26 for the cleaning treatment liquid hanging downward from the peripheral edge
Is formed, and the diffusion plate 24 is provided with a through hole 25 for the cleaning treatment liquid L. With this configuration, a part of the cleaning treatment liquid L introduced from the supply port 17 into the inner tank 15a is taken in below the diffusion plate 24 by the baffle wall 26 and is passed through the circulation hole 25 of the diffusion plate 24. It flows upwards. On the other hand, a part of the cleaning treatment liquid L flowing toward the gap 19 between the treatment tank 15 and the rectifying plate 22 is blocked by the baffle wall 23, and the flow of the cleaning treatment liquid L through the gap 19 is delayed,
The difference from the flow of the cleaning treatment liquid L flowing through the small holes 21 of the straightening vane 22 can be reduced. Therefore, the uniformization of the flow of the cleaning treatment liquid L into the treatment tank 15 can be further ensured.

Since the other parts of the third embodiment are the same as those of the first and second embodiments, the same parts are designated by the same reference numerals and the description thereof will be omitted.

Fourth Embodiment FIG. 11 is a schematic perspective view of the fourth embodiment of the cleaning processing apparatus of the present invention.

The cleaning apparatus in the fourth embodiment is
This is a case where, in addition to making the supply of the cleaning treatment liquid L uniform, the capacity of the treatment tank 15 is reduced and the amount of the cleaning treatment liquid used can be suppressed. That is, the bottom inclined portions 15d inclined upward are provided on both sides of the bottom of the processing bath 15 (inner bath 15a) in which the flow regulating means 20 having the same structure as in the first to third embodiments is arranged. A straightening plate 22 which constitutes 20 is a horizontal straightening portion 22a corresponding to the center of the bottom of the processing tank 15, and an upward slanting portion provided on both sides of the horizontal straightening portion 22a corresponding to the bottom slanting portion 15d. It is a case where it is configured to have the inclined rectifying section 22b. Therefore, the entire volume of the processing tank 15 can be reduced by the amount of inclination of the processing tank 15 and the current plate 22, and the amount of the chemical liquid used for cleaning the wafer W or the amount of the pure water used for cleaning is used. Can be significantly suppressed.

Although FIG. 11 shows the case where the baffle wall 23 is hung at the longitudinal end of the rectifying plate 22, that is, the edge on the short side, this shows that the cleaning treatment apparatus is the washing treatment apparatus 1 with water.
3 shows a case where it is applied to 3
In the above, if the baffle wall 23 is hung on the long side edge of the straightening vane 22, that is, the side edge of the inclined straightening portion 22b, bubbles are generated when the cleaning treatment liquid is supplied again after the cleaning treatment liquid in the tank is replaced. This is to prevent the cleaning process on the surface of the wafer W from being adversely affected by the bubbles remaining on the side edge portion.

Since the other parts of the fourth embodiment are the same as those of the first to third embodiments, the same parts are designated by the same reference numerals and the description thereof will be omitted.

Above the processing bath 15, a wafer confirmation detection for detecting whether or not the wafer W is securely held when the wafer W is transferred between the wafer holder 16 and the wafer chuck 2a. A device 30 is provided. The wafer confirmation / detection apparatus 30 includes, for example, a light emitting section 31 formed of a light emitting element arranged on one of opposite sides of the processing tank 15.
And a light receiving portion 32 formed of a light receiving element arranged on the opposite side. According to the wafer confirmation / detection apparatus 30 configured as described above, when the wafer W is not reliably held in the holding groove 2c of the wafer chuck 2a or the holding groove 16a of the wafer holder 16 when transferring the wafer W, Since the wafer W floats or is tilted excessively, it is possible to prevent the wafer W from coming off, contact between the wafers, and the like.

An openable lid 33 is attached to the upper opening of the processing bath 15, and the lid 33 is closed to drop the wafer W carried over the processing bath 15 from the wafer W or the wafer chuck 2a. The cleaning treatment liquid, dust and the like are prevented from falling into the treatment tank 15. As shown in FIGS. 12 and 13, the lid 33 is a pair of fixed to open / close arms 35 projecting from two rotary shafts 34 pivotally mounted on both sides of the short side wall 15e of the processing tank 15. For example, polytetrafluoroethylene (PTF
E) made of a lid 36, and the outer tank 1 located outside the lid 36
5b and an inclined fixed lid 33a that covers the upper side. The lid 33 configured as described above is opened and closed by the rotation of each rotary shaft 34 with a time delay by the drive of a drive motor (not shown), and both lids 36 are closed when closed.
The butted portion is inclined in a mountain shape so as to project upward so that the liquid droplets dropped on the lid can flow to the outside of the processing tank 15. Therefore, it is possible to prevent the liquid dropped on the lid 33 from crystallizing and generating particles. In addition, since the lid 36 is positioned vertically when opened, the lid 36 is positioned inside the main frame 40 that houses the processing tank 15,
In the opened state, the lid 33 does not interfere with the transfer of the wafer W. A closing member 37 is attached to the free end portion of one lid body 36 to cover the free end portion of the other lid body 36 so that the gap between the lid bodies 36 and 36 can be closed when closed. Has become. Further, an opening window 38 is provided in an intermediate portion of the lid 36, and a transparent plate 39 made of, for example, quartz is fitted in the opening window 38, and when the lid 33 is closed, the inside of the processing tank 15 is externally supplied. Is configured to be visible. In addition, since liquid droplets are accumulated on the upper surface of the transparent plate 39,
It is preferable to provide a drainage port (not shown) in the lower frame portion of the opening window 38 because the liquid accumulated on the transparent plate 39 can be discharged to the outside from the drainage port.

In addition, in the lower part of the processing tank 15 shown in FIG.
As shown in, a level adjusting mechanism 42 for stably mounting the processing tank 15 on the mounting table 41 of the main frame 40 is attached. This level adjusting mechanism 42 is used in the processing tank 1.
The bottom surface of the mounting leg 43 fixed to the bottom surface of the base plate 5 of FIG. 5 has a hat-shaped mounting plate 44 whose lower surface is surface-finished, an adjust plate 45 having a flat surface, and an adjust plate 45. A positioning block 46 fixed to the main frame 40, a fixing bolt 47 for fixing the adjusting plate 45 on the mounting table 41 of the main frame 40, and an adjusting plate 45 for mounting the adjusting plate 45 on the mounting table 41 of the main frame 40 in a height-adjustable manner. Bolt 4
8 and.

The level adjusting mechanism 4 configured as described above
In order to mount the processing tank 15 using the No. 2, the adjustment plate 45 is first leveled with the adjustment bolt 48. At this time, the through hole 45a provided in the adjusting plate 45 is formed with a diameter larger than the diameter of the fixing bolt 47 so that the fixing bolt 47 can be loosely fitted, and the fixing bolt 47 is fixed to the mounting table 41 via the spacer 49. Therefore, the adjustment plate 41 can be easily adjusted horizontally. Next, the mounting plate 44 mounted on the mounting legs 43 of the processing tank 15 is brought into contact with the positioning block 46 and then fixed. In this case, the fine adjustment in the horizontal direction of the processing tank 15 is performed by moving the adjustment plate 41.
Pure water is put in the processing tank 15, and the adjustment plate 41 is horizontally finely adjusted so as to overflow from four circumferences.

Next, the operation of the semiconductor wafer cleaning processing apparatus incorporating the cleaning processing apparatuses 12 and 13 configured as described above will be described. First, carrier C in units of 25
When the wafers W stored in 1 are supplied to the loading section 1, the carrier transfer arm 7 is driven to transfer the supplied carriers C to the loader section 5 in units of two. Then, the carrier C supplied thereafter is transferred to the standby unit 6 by the carrier transfer arm 7, and the wafer W of the subsequent carrier C is temporarily stored in the standby unit 6.

When the two carriers C are supplied to the loader unit 5, the loader unit 5 is driven to align the orientation flats of the wafers W in the two carriers C in one direction to obtain 50 wafers W. While positioning, the wafer transfer device 2 is driven to move the wafer chuck 2a into the chuck cleaning / drying processing tank 11 to be ready to receive the wafer W. Then, the loader unit 5 is driven to drive the two carriers C.
When the wafers W of each carrier C are brought close to each other while lifting the wafers W from above, the wafer transfer device 2 is driven to hold 50 wafers W by the wafer chuck 2a. The wafer chuck 2a holding the wafer W moves to the first chemical liquid cleaning processing device 12a along the transport path 2b by the drive of the wafer transport device 2 and then lowers the wafer chuck 2a at that position to move the first chemical liquid. Fifty wafers W are delivered to the wafer holder 16 in the processing tank 15 of the cleaning processing apparatus 12a and immersed in the cleaning processing liquid L.

In the first chemical cleaning apparatus 12a, as described above, the cleaning processing liquid L supplied from the supply port 17 into the processing tank 15 is rectified by the rectifying plate 22 and the diffusion plate 24 of the rectifying means 20. At the same time, it is homogenized and supplied to the surface of the wafer W to be used for cleaning the surface of the wafer W.

When the cleaning process of the wafer W in the first chemical cleaning device 12a is completed, the wafer chuck 2a of the wafer transfer device 2 collectively collects the wafer W from the wafer holder 16 by the operation reverse to the above case. After receiving, the wafer is transferred to the wafer holder 16 of the next first water washing / cleaning processing apparatus 13a, the water washing processing is performed by the same operation as described above, and the same water washing processing is performed by the next second water washing / cleaning processing apparatus 13b. To complete the cleaning process. Thereafter, the chemical solution treatment and the water washing treatment are repeatedly performed as necessary, and the wafer W after the washing treatment is performed.
Is discharged to the next process in carrier units via the carry-out section 4.

In the final rinsing / cleaning process of the semiconductor wafer cleaning / processing device that performs the cleaning process as described above, the cleaning processing device of the present invention and the conventional cleaning processing device using the rectifying means were used. As a result, it was possible to significantly reduce the time required to reach a predetermined specific resistance value (for example, 15 MΩ) indicating the completion of final rinse with pure water, to improve the cleaning treatment efficiency and the amount of the cleaning treatment liquid used. Could be reduced.

In the above embodiments, the case where the cleaning processing apparatus of the present invention is applied to a cleaning processing apparatus for semiconductor wafers has been described. However, it can be applied to other cleaning processing apparatuses such as LCD glass substrates and etching apparatuses. Of course.

[0046]

As described above, since the cleaning apparatus of the present invention is constructed as described above, the following effects can be obtained.

1) According to the cleaning processing apparatus of the first aspect, since the diversion wall of the cleaning processing liquid that hangs downward from the edge of the flow straightening plate that constitutes the flow straightening means is formed, the inside of the processing tank is formed. It is possible to prevent turbulence from occurring in the cleaning treatment liquid that rises and improve the cleaning treatment efficiency.

2) According to the cleaning processing apparatus of the second aspect, a blocking wall for the cleaning processing liquid that hangs downward from the peripheral edge of the diffusion plate forming the rectifying means is formed, and the diffusion plate is cleaned. Since the through hole for the processing liquid is formed, the flow of the cleaning processing liquid between the objects to be processed above the diffusion plate and the flow between the other objects to be processed can be made uniform, and the cleaning efficiency can be improved. Can be planned.

3) According to the cleaning processing apparatus of the third aspect, the flow-stopping wall for the cleaning processing liquid that hangs downward from the edge of the flow straightening plate is formed, and hangs downward from the peripheral edge of the diffusion plate. Since the flow-through hole for the cleaning treatment liquid is formed in the diffusion plate, the turbulent flow of the cleaning treatment liquid can be prevented and the cleaning treatment liquid can be introduced into the treatment tank. It is possible to further ensure the homogenization of the flow.

[Brief description of drawings]

FIG. 1 is a perspective view showing a semiconductor wafer cleaning processing apparatus to which the cleaning processing apparatus of the present invention is applied.

FIG. 2 is a schematic perspective view showing a first embodiment of the cleaning processing apparatus of the present invention.

FIG. 3 is a sectional view of the first embodiment of the present invention.

FIG. 4 is a perspective view showing an attachment mode of a current plate and a diffusion plate in the first embodiment.

FIG. 5 is a schematic perspective view showing a second embodiment of the present invention.

FIG. 6 is a sectional view of a second embodiment of the present invention.

FIG. 7 is a perspective view showing a diffusion plate according to a second embodiment.

FIG. 8 is a perspective view showing another diffusion plate in the second embodiment.

FIG. 9 is a schematic perspective view showing a third embodiment of the present invention.

FIG. 10 is a sectional view of a third embodiment of the present invention.

FIG. 11 is a schematic perspective view showing a fourth embodiment of the present invention.

FIG. 12 is a perspective view showing a lid and attachment legs attached to the processing tank in the present invention.

FIG. 13 is a side view showing the opened / closed state of the lid in the present invention.

FIG. 14 is a cross-sectional view showing a conventional cleaning processing apparatus.

[Explanation of symbols]

 15 treatment tank 17 supply port 19 gap 20 straightening means 21 small hole 22 straightening plate 23 baffle wall 24 diffusion plate 25 flow hole 26 baffle wall W semiconductor wafer (object to be treated) L cleaning treatment liquid

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yasuhiro Nagano 1375 Nishishinmachi, Tosu City, Saga Prefecture 41 41 Tokyo Electron Saga Co., Ltd.

Claims (3)

[Claims] 1. A treatment tank having a supply port for a cleaning treatment liquid at a lower portion thereof, and an object to be treated immersed in the cleaning treatment liquid contained in the treatment bath and the supply port. In a cleaning apparatus including a rectifying means, the rectifying means is arranged horizontally to divide the processing tank into upper and lower parts, and a rectifying plate having a large number of small holes is formed above the supply port. And a diffusing plate that forms a blocking wall for the cleaning treatment liquid that hangs downward from the edge of the rectifying plate. 2. A treatment tank having a cleaning treatment liquid supply port at its lower portion, and an object to be treated immersed in the cleaning treatment liquid contained in the treatment tank and the supply port. In a cleaning apparatus including a rectifying means, the rectifying means is arranged horizontally to divide the processing tank into upper and lower parts, and a rectifying plate having a large number of small holes is formed above the supply port. And a diffusion plate which forms a blocking wall for the cleaning treatment liquid that hangs downward from the periphery of the diffusion plate, and a diffusion hole for the cleaning treatment liquid is formed in the diffusion plate. Cleaning processing equipment. 3. A treatment tank having a cleaning treatment liquid supply port at a lower portion thereof, and a treatment object immersed in the cleaning treatment liquid contained in the treatment tank and the supply port. In a cleaning apparatus including a rectifying means, the rectifying means is arranged horizontally to divide the processing tank into upper and lower parts, and a rectifying plate having a large number of small holes is formed above the supply port. And a diffusion plate that forms a blocking wall for the cleaning solution that hangs downward from the edge of the rectifying plate, and prevents the cleaning solution that hangs downward from the periphery of the diffusion plate. A cleaning processing apparatus, characterized in that a wall is formed and a diffusion hole for a cleaning processing liquid is formed in a diffusion plate.