JPH06331820A - Formation of black matrix pattern of color - Google Patents

Abstract

PURPOSE:To improve the accuracy of the pattern edges of black matrix patterns of the color filter without using a black pigment dispersed photoresist in the case of formation of the black matrix patterns by a photofabrication system. CONSTITUTION:A light shieldable chromium oxide layer 13 is formed by a vapor deposition method on a glass substrate 1 and a light shieldable nickel plating layer 14 is formed by an electroless plating method on this chromium oxide layer and a photosensitive resin layer 15 on this nickel plating layer; thereafter, the black matrix patterns 2 composed of a first pattern layer 3 consisting of a vapor deposited chromium oxide layer 13 and a second pattern layer 4 consisting of a light shieldable nickel plating layer 14 matched and laminated on this first pattern layer 3 are formed thereon by pattern etching with the resist patterns 6 obtd. by subjecting the layers described above to pattern exposing and development processing to the shapes corresponding to the black matrix patterns.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a black matrix pattern on a glass substrate, and blue, green, and
d. Black matrix pattern formation of a color filter for forming a black matrix pattern on a glass substrate in a color filter of a liquid crystal display device or the like provided with a filter color pattern composed of each colored pattern and a transparent conductive film or the like as appropriate. Regarding the method.

[0002]

2. Description of the Related Art As shown in FIG. 2A, a conventional color filter for a liquid crystal display device or the like has an appropriate shape pattern such as regular parallel lines or a grid on a glass substrate 21 for the color filter. 4B, the black matrix pattern 22 having the light-shielding property (or the light-absorbing property) is provided, and Blue, Green,
A filter color pattern 25 including red color patterns is provided, and a transparent protective film or a transparent conductive film (not shown) is appropriately laminated on the black matrix pattern 22 and the filter color pattern 25.

In the above color filter, it is necessary to arrange the black matrix pattern 22 and the filter color pattern 25 in close contact with each other so that no void is formed in the adjacent portion of the black matrix pattern 22 and the filter color pattern 25. Therefore, the filter color pattern 25 is provided so as to overlap the black matrix pattern 22.

The black matrix pattern 22 is
When forming a pattern on the glass substrate 21, a chromium vapor deposition thin film formed on the glass substrate 21 by a metal vapor deposition method is patterned by a pattern etching method, or
Pattern formation is performed by a photofabrication (photolithography) method using a pigment dispersion photoresist in which black and dark color pigments are dispersed in a photoresist, or pattern formation is performed by a intaglio offset printing method using a printing ink.

In the pattern etching method of the above chromium vapor deposition thin film, the production cost of chromium metal vapor deposition is higher than that of other methods. Therefore, a pattern is formed by photofabrication (photolithography) method using a pigment dispersion photoresist. Is being formed.

[0006]

When the black matrix pattern 22 is formed by a photofabrication (photolithography) method using a pigment-dispersed photoresist, the pattern exposure light beam in the photofabrication is a pigment. Before reaching the surface of the glass substrate 21 through the dispersed photoresist film, the amount of light that is absorbed by the black pigment of the pigment dispersed photoresist film and actually reaches the surface of the glass substrate is 1/1.
It is only 000 to 1/10000.

Therefore, it is necessary to take a long exposure time for the pattern exposure, but due to the lengthening of the exposure time, halation occurs on the surface of the glass substrate 21 due to the exposure light beam, and the pattern edge portion of the black matrix pattern 22 is formed. Tended to cause a decrease in accuracy.

In the pattern formation, it is possible to reduce the optical density by making the film thickness of the pigment-dispersed photoresist as thin as possible in order to avoid the lengthening of the exposure time. In order to obtain the optical density of the formed black matrix pattern 22, it is necessary to increase the film thickness of the pigment-dispersed photoresist as much as possible. Therefore, control of the coating film thickness of the pigment-dispersed photoresist on the glass substrate 21 is performed. Was difficult.

According to the present invention, when a black matrix pattern is formed by a photofabrication (photolithographic method) method, a black pigment-dispersed photoresist is not used so that the pattern exposure time is not lengthened. Therefore, it is intended to improve the accuracy of the pattern edge portion of the black matrix pattern without considering the film thickness setting of the pigment-dispersed photoresist.

[0010]

The present invention provides a glass substrate 1
Black matrix pattern 2 on top, and Blue, Gr
The black matrix pattern 2 includes a first pattern layer 3 formed of a light-shielding chromium oxide vapor-deposition layer, and a first color layer 3 including a filter color pattern 5 including een and Red color patterns and a transparent conductive layer. A color filter constituted by a second pattern layer 4 formed of a light-shielding nickel plating layer which is aligned and laminated on the pattern layer, wherein a light-shielding chromium oxide is deposited on the color filter glass substrate 1 by a vapor deposition method. The vapor-deposited layer 13, the light-shielding nickel-plated layer 14 is provided in this order on the chromium oxide vapor-deposited layer 13 by an electroless plating method, then the photosensitive resin layer 15 is provided on the nickel-plated layer 14, and A resist pattern is formed on the nickel plating layer 14 by exposing the photosensitive resin layer 15 to a shape corresponding to a black matrix pattern and developing the pattern. Is provided, and the chromium oxide vapor deposition layer 13 and the nickel plating layer 14 are pattern-etched using the resist pattern 6 as an etching mask, thereby forming the first pattern layer 3 of the light-shielding chromium oxide vapor deposition layer 13 and the first pattern layer 3. A black matrix of a color filter, characterized in that a black matrix pattern 2 constituted by a second pattern layer 4 of a light-shielding nickel-plated layer 14 which is matched and laminated on the pattern layer 3 is formed on the glass substrate 1. This is a pattern forming method.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for forming a black matrix pattern of a color filter according to the present invention will be described in detail below with reference to one embodiment shown in FIGS.

First, as shown in FIG. 1 (a), a predetermined thickness (for example, vapor deposition film thickness; 300Å to 2000Å or more, optical density; 0.3 to 1) is formed on a glass substrate 1 for a color filter by a vapor deposition method. 0.5 or more) light-shielding chromium oxide layer 1
3 (translucent or opaque film) is formed.

Subsequently, nickel plating is applied on the chromium oxide layer 13 of FIG. 1 (b) by an electroless plating method under an appropriate plating condition (for example, 300 Å to 5000).
Å) to form a light-shielding nickel plating layer 14 (optical density; translucent or opaque film having an optical density of 0.3 to 1.5 or more).

Subsequently, on the light-shielding nickel-plated layer 14 shown in FIG. 1 (b), a light-transmissive (as transparent as possible, a pigment that hinders the light-transmission is not mixed) positive photosensitive photoresist or negative is used. A type photosensitive photoresist is applied over the entire surface and dried to provide a photosensitive resin layer 15 (for example, coating thickness: 0.5 μm to 1 μm) that serves as an etching resist.

As the photosensitive photoresist, for example, an alkali-soluble polymer such as a novolac type phenol resin or a methylmethacrylate-maleic anhydride copolymer, and an alkali dissolution inhibitor such as quinonediazide which increases alkali solubility by light irradiation. Photodecomposition type positive photoresist containing, or photo radical polymerization type polyfunctional acrylic monomer (acrylamide, acrylonitrile, acrylic acid (acrylate), acrylic acid ester, etc.) resin monomer, phenylacetophenone,
A photopolymerization-curable negative photoresist containing a photopolymerization initiator such as benzophenone or dimethylaminobenzoate can be used.

Next, a black matrix pattern 2 of an appropriate shape is formed on the photosensitive resin layer 15 by using a photofabrication method using ultraviolet rays.
In the case of a positive type photosensitive photoresist, the exposed area of the photosensitive resin layer 15 is subjected to a black matrix pattern in the form of a black matrix pattern. In the case of a negative-type photosensitive photoresist, which has been alkali-solubilized (photolyzed) with a resin monomer and a photopolymerization initiator, the exposed region of the photosensitive resin layer 15 is photopolymerized and cured into a black matrix pattern. Let

Next, in the case of a positive type photosensitive photoresist, the exposed area (photolysis area) of the photosensitive resin layer 15
3 is developed and removed with an alkaline solution to form a resist pattern 6 (etching resist pattern) having a shape corresponding to the black matrix pattern 2 as shown in FIG. 3C. In the case of a positive photosensitive photoresist, The unexposed area (uncured area) of the photosensitive resin layer 15 is developed with an alcohol-based or toluene-based organic solvent,
As shown in FIG. 3C, a resist pattern 6 (etching resist pattern) having a shape corresponding to the black matrix pattern 2 is formed.

Thereafter, as shown in FIG. 1D, the lower nickel plating layer 14 is appropriately etched with an etching solution using the resist pattern 6 as an etching mask to form a second pattern layer 4.

Thereafter, as shown in FIG. 1E, the chromium oxide layer 13 below the nickel plating layer 14 is appropriately etched with an etching solution using the resist pattern 6 as an etching mask to form a first pattern layer. 3 is formed.

Next, the resist pattern 6 shown in FIG. 1 (e) is stripped with an alkaline solution or an appropriate organic solvent (acetone-based, methyl ethyl ketone-based, etc.) to give a glass substrate 1 as shown in FIG. 1 (f). A black formed by a first pattern layer 3 having a light-shielding chromium oxide layer 13 thereon and a second pattern layer 4 having a light-shielding nickel plating layer 14 laminated on the first pattern layer 3 in an aligned state. The matrix pattern 2 is formed.

The color filter according to the method of the present invention is shown in FIG.
As shown in (g), the areas other than the formation area of the black matrix pattern 2 on the glass substrate 1 after the formation of the black matrix pattern 2 are blue, Gr.
It is also possible to pattern-form the filter color pattern 5 composed of each of the een and Red color patterns, apply the transparent protective film 7 as needed from above, and then apply the transparent conductive film 8.

Blue, Gr are formed on a portion of the glass substrate 1 other than the formation region of the black matrix pattern 2.
When forming the filter color pattern 5 consisting of een and Red color patterns, a method similar to the method for forming a filter color pattern of a conventional color filter, for example, a transparent photosensitive liquid with good dyeability such as gelatin Dyeing method using blue and green, and red dyes, a pigment dispersion photoresist method using the above-mentioned blue, green, and red pigment dispersion photoresists, and blue, green, and red color printing An organic filter color pattern forming method using a printing method such as an intaglio offset printing method using ink, titanium oxide (TiO ₂ , photorefractive index: 2.40), or silicon oxide (SiO ₂ ).
_2. Dielectric films such as photorefractive index: 1.46) are vapor-deposited and laminated in multiple layers.
The black matrix pattern 2 and the filter color pattern 5 are closely adjacent to each other at their edges by an inorganic filter color pattern forming method by a dielectric multilayer film method for forming the n and Red interference color filters (polarization filters), or Filter color pattern 5 is black matrix pattern 2
The filter color pattern 5 is formed so that the edges thereof overlap with each other.

As shown in FIGS. 1 (f) and 1 (g), the color filter obtained by the method of the present invention has a regular parallel line shape on a transparent glass substrate 1 for a color filter.
A black matrix pattern 2 having a light shielding property (or light absorbing property) such as a lattice shape is provided.

As shown in FIG. 1 (f), the glass substrate 1
The black matrix pattern 2 formed above is
A first pattern layer 3 in which a light-shielding chromium oxide layer 13 formed into a predetermined film thickness by vapor deposition (vacuum vapor deposition, sputtering) is pattern-formed by a photoetching method.
And a second pattern layer 4 in which a light-shielding nickel plating layer 14 is laminated on the first pattern layer 3 in an aligned state by electroless plating. In addition, the first
The pattern layer 3 and the second pattern layer 4 are semitransparent or opaque film forming layers, and by stacking the both pattern layers 3 and 4, an opaque light shielding function is provided.

In the color filter according to the method of the present invention, as shown in FIG. 1 (g), a filter color pattern 5 composed of blue, green and red color patterns is provided between the black matrix patterns 2. The black matrix pattern 2 and the filter color pattern 5
A transparent conductive film or the like (for example, a transparent conductive film 8 such as an ITO film having a wiring pattern in which indium is doped with tin, or a transparent conductive film 8 stacked via a transparent protective layer 7) is laminated on the upper side of the .

In the color filter according to the method of the present invention, the black matrix pattern 2 is used as in the conventional case.
The black matrix pattern 2 and the filter color pattern 5 are arranged so as to be in close contact with each other so that no void is formed in the adjacent portion between the filter color pattern 5 and the filter color pattern 5.
Black matrix pattern 2 and filter color pattern 5
Edges are adjacent to each other, or the filter color pattern 5 is provided on the black matrix pattern 2 such that the edges overlap.

Specific examples of the method for forming the black matrix pattern 2 on the glass substrate 1 in the color filter of the present invention will be shown below.

Example 1 First, a chromium oxide layer (optical density: 0.5 to 1.8) having a film thickness of 1000 Å is formed on a transparent glass substrate by a vacuum vapor deposition method.

Next, the glass substrate 1 having the chromium oxide layer formed thereon is dipped in a nickel electroless plating bath to subject the chromium oxide layer to nickel plating treatment to obtain a nickel plating layer (film thickness: 2000Å, optical). Concentration; 2.3 or more) is formed.

Next, a transparent positive photoresist (PMER, OFPR (manufactured by Tokyo Ohka Kogyo Co., Ltd.)) was formed on the nickel plating layer with a spin coater to a film thickness of 0.5 μm.
A photosensitive resin layer was formed by uniformly applying a film having a thickness of 1.0 μm (for example, a film thickness; 1 μm) and drying.

Next, pattern exposure (mask pattern exposure or beam exposure) with ultraviolet rays (or electron beams) corresponding to the black matrix pattern shape is performed on the photosensitive resin layer to expose the photosensitive resin layer to an alkaline solution (hydroxylation). Development treatment was performed with potassium, sodium hydroxide solution, etc.) to form a resist pattern corresponding to the black matrix pattern shape on the photosensitive resin layer.

Next, using this resist pattern as an etching mask, the lower nickel plating layer is pattern-etched with a nitric acid-based etching solution, and then the chromium oxide layer is pattern-etched with a cerium nitrate-based etching solution.

Next, the resist pattern is stripped with an alkaline solution having a stronger alkali than the alkaline solution used for the development (or an organic solvent such as toluene or methyl ethyl ketone), so that the glass substrate 1 having a light-shielding property is shielded. A black matrix pattern was formed by a first pattern layer made of a chromium oxide layer and a second pattern layer made of a nickel plating layer.

Example 2 First, a chromium oxide layer (optical density: 0.5 to 1.8) having a film thickness of 1000 Å is formed on a transparent glass substrate by a vacuum vapor deposition method.

Next, the glass substrate 1 having the chromium oxide layer formed thereon is dipped in a nickel electroless plating bath to subject the chromium oxide layer to nickel plating to form a nickel plating layer (film thickness: 2000Å, optical). Concentration; 2.3 or more) is formed.

Next, a negative photoresist containing a resin monomer (acrylic resin monomer) and a photopolymerization initiator was formed on the nickel plating layer with a spin coater to a film thickness of 0.
5 μm to 1.0 μm (for example, film thickness; 1 μm) was uniformly applied and dried to form a photosensitive resin layer.

Next, a pattern exposure (mask pattern exposure or beam exposure) treatment with ultraviolet rays (or electron beams) corresponding to the black matrix pattern shape is performed on the photosensitive resin layer to transform the photosensitive resin layer into an alcohol-based organic solvent. Then, development processing was performed to form a resist pattern corresponding to the black matrix pattern shape on the photosensitive resin layer.

Next, using this resist pattern as an etching mask, the lower nickel plating layer is pattern-etched with a nitric acid-based etching solution, and then the chromium oxide layer is pattern-etched with a cerium nitrate-based etching solution.

Next, the resist pattern is stripped with an acetone-based organic solvent to form a first pattern layer of a light-shielding chromium oxide layer and a second pattern layer of a nickel plating layer on the glass substrate 1. A black matrix pattern was formed.

[0040]

In the method of forming a black matrix of the present invention, the light-shielding chromium oxide layer 13 formed by the vapor deposition method and the nickel plating layer 4 formed by the electroless plating method are formed on the same resist pattern 6 (same mask pattern). The same pattern is formed by using the same etching solution, and the first pattern layer 3 formed by the chromium oxide layer 13 and
A second pattern layer 4 formed of a light-shielding nickel-plated layer 14 which is aligned and laminated on the first pattern layer 3.
It is possible to easily form the black matrix pattern 2 having a two-layered structure by the relatively simple process.

Further, on the glass substrate 1, the first pattern layer 3 formed of the light-shielding chromium oxide layer 13 and the light-shielding nickel plating layer 14 laminated on the first pattern layer 3 in alignment with each other. The black matrix pattern 2 having a two-layer structure with the second pattern layer 4 formed by
A sufficient light-shielding property with an optical density of 2.0 or more is obtained by the sum of the film thicknesses of the pattern layer 3 and the second pattern layer 4.

In the method for forming the black matrix of the color filter of the present invention, since the black pigment dispersion type photoresist is not used for forming the pattern of the black matrix 2, the exposure time in the photofabrication of the black pigment dispersion type photoresist is long. It is not necessary to adjust the coating film thickness in order to solve the problem, and good black matrix pattern formation accuracy can be obtained.

[0043]

According to the method for forming a black matrix of a color filter of the present invention, when a black matrix pattern is formed by a photofabrication method, a vapor deposition method and an electroless plating method are used in combination. Since it does not require pattern exposure of the black pigment dispersion type photoresist as in the past, there is no concern about halation on the glass substrate surface due to the lengthening of the exposure time, and the pattern edge portion of the black matrix pattern There is an effect that the accuracy can be improved.

[Brief description of drawings]

1 (a) to 1 (g) are side sectional views for explaining steps in one embodiment of the method of the present invention.

2A is a side sectional view illustrating a black matrix pattern in a conventional color filter, and FIG. 2B is a side sectional view illustrating a black matrix pattern and a filter color pattern in a conventional color filter.

[Explanation of symbols]

1 ... Glass substrate 2 ... Black matrix pattern 3
... 1st pattern layer 4 ... 2nd pattern layer 5 ... Filter color pattern 6 ... Resist pattern 7 ... Transparent protective layer 8 ... Transparent conductive film 13 ... Chromium oxide layer 14 ... Nickel plating layer 15 ...
Photosensitive resin layer 21 ... Glass substrate 22 ... Black matrix pattern 23 ... First pattern layer 24 ... Second pattern layer 25 ... Filter color pattern

Claims (1)

[Claims] 1. A black matrix pattern 2 on a glass substrate 1, a filter color pattern 5 composed of blue, green and red coloring patterns, a transparent conductive layer and the like, and the black matrix pattern 2 has a light shielding property. First pattern layer 3 formed of chromium oxide vapor deposition layer
And a second pattern layer 4 formed of a light-shielding nickel-plated layer, which is aligned and laminated on the first pattern layer, in a color filter glass substrate 1 by an evaporation method. A light-shielding chromium oxide vapor deposition layer 13, a light-shielding nickel plating layer 14 is provided on the chromium oxide vapor deposition layer 13 in this order by an electroless plating method, and then a photosensitive resin layer 15 is provided on the nickel plating layer 14. After the formation, the photosensitive resin layer 15 is pattern-exposed into a shape corresponding to a black matrix pattern and developed to form a resist pattern 6 on the nickel plating layer 14, and the chromium oxide is used as an etching mask. By pattern-etching the vapor-deposited layer 13 and the nickel-plated layer 14, a light-shielding chromium oxide vapor-deposited layer 13 is formed. A pattern layer 3, light-shielding property of the nickel plating layer which is aligned laminated on the first pattern layer 3 14
A method for forming a black matrix pattern of a color filter, characterized in that the black matrix pattern 2 constituted by the second pattern layer 4 according to 1. is formed on the glass substrate 1.