JPH06331813A - Production of optical parts - Google Patents

Production of optical parts

Info

Publication number
JPH06331813A
JPH06331813A JP12139293A JP12139293A JPH06331813A JP H06331813 A JPH06331813 A JP H06331813A JP 12139293 A JP12139293 A JP 12139293A JP 12139293 A JP12139293 A JP 12139293A JP H06331813 A JPH06331813 A JP H06331813A
Authority
JP
Japan
Prior art keywords
transparent substrate
cutting
diffraction grating
ice
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12139293A
Other languages
Japanese (ja)
Inventor
Shinichiro Gosho
真一郎 御所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP12139293A priority Critical patent/JPH06331813A/en
Publication of JPH06331813A publication Critical patent/JPH06331813A/en
Pending legal-status Critical Current

Links

Landscapes

  • Diffracting Gratings Or Hologram Optical Elements (AREA)

Abstract

PURPOSE:To provide the process for production of optical parts having diffraction gratings in which wax and solvents, such as hydrocarbon halide, are not used and production efficiency is enhanced. CONSTITUTION:The marginal end of a transparent substrate 1 formed with the diffraction gratings consisting of glass, quartz crystal, etc., is fixed by a fixing frame 2 and holding jig 3 which are fixing means. The transparent substrate 1 is put together with the fixing frame 2 into a water tank 4 and the fixing frame 2 is set on a frame rest 5. The water tank 4 is internally filled with pure water. The pure water is frozen by using a refrigerating device to fix the transparent substrate 1 by ice. The frozen water tank 4 is set in a cutting device and the transparent substrate 1 is cut vertically and horizontally by a diamond blade 6 which is a cutting means, by which the diffraction gratings are formed. The ice is thereafter thawed and the diffraction gratings are washed by the pure water, by which the products are obtd.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、CD等の光記録媒体の
信号読取装置に組み込まれる、光学ピックアップ部品の
一部である回折格子(グレイティング)を形成した光学
部品の製造方法に関し、特に、回折格子の形成された透
明基板を切断して回折格子を有する光学部品を製造する
方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an optical component having a diffraction grating (grating), which is a part of an optical pickup component, incorporated into a signal reading device for an optical recording medium such as a CD. The present invention relates to a method for manufacturing an optical component having a diffraction grating by cutting a transparent substrate on which the diffraction grating is formed.

【0002】[0002]

【従来の技術】従来、回折格子を形成した光学部品は次
のような方法で製造されていた。すなわち、例えばφ7
5mmの平板ガラスあるいは水晶等の透明基板を洗浄
し、マスキングした後にパターン露光し、エッチングに
よって回折格子を形成し、これを洗浄した後に品質検査
を行い、最後に保護膜のコーティングを行って回折格子
の形成された基板を完成する。次に、この透明基板を任
意の大きさに切断するために、平盤上にいわゆる捨てガ
ラスと呼ばれるガラス平板を置き、この捨てガラス上に
溶融したワックスを塗布し、この上に回折格子を形成し
た透明基板を載置してワックスの冷却固化により固定す
る。そして、この透明基板の上に、カッターの刃の摩耗
を防ぐためにさらにワックスを塗布する。
2. Description of the Related Art Conventionally, an optical component having a diffraction grating has been manufactured by the following method. That is, for example, φ7
A 5 mm flat glass or a transparent substrate such as a crystal is washed, masked, and then pattern-exposed, etching is performed to form a diffraction grating, and after this is cleaned, quality inspection is performed, and finally a protective film is coated to form the diffraction grating. To complete the formed substrate. Next, in order to cut this transparent substrate into an arbitrary size, a glass plate called so-called discarded glass is placed on a flat plate, molten wax is applied on this discarded glass, and a diffraction grating is formed on this. The transparent substrate is placed and fixed by cooling and solidifying the wax. Then, wax is further applied onto the transparent substrate in order to prevent abrasion of the blade of the cutter.

【0003】上記の上面及び下面をワックスで固めた透
明基板を、複数のダイヤモンド刃を有する円盤型のマル
チカッターによって、任意のピッチで縦方向及び横方向
に切断する。こうして作成された回折格子は、次にワッ
クスを除去するために竹製のピンセットを使用して洗浄
容器に入れ、フロン等の有機溶剤で洗浄して製品とす
る。
The transparent substrate, the upper and lower surfaces of which are hardened with wax, is cut in a vertical direction and a horizontal direction at arbitrary pitches by a disc type multi-cutter having a plurality of diamond blades. The diffraction grating thus produced is then put into a washing container using bamboo tweezers to remove wax and washed with an organic solvent such as Freon to obtain a product.

【0004】[0004]

【発明が解決しようとする課題】上述の従来技術ではワ
ックスを使用していたため、このワックスの溶融及びカ
ッティング時に発生する蒸気によって作業環境が悪化し
ていた。また、ワックスを洗浄するためにフロン等のハ
ロゲン化炭化水素からなる溶剤を使用していたため、大
気中のオゾン層を破壊する等、地球環境にも悪影響を与
えていた。さらに、ワックス除去のために切断された回
折格子を洗浄装置に移す場合には、ピンセットを用いる
等人手に頼っていたため生産効率が悪かった。
Since the above-mentioned prior art uses wax, the working environment is deteriorated by the steam generated during melting and cutting of the wax. Further, since a solvent composed of a halogenated hydrocarbon such as CFC is used to wash the wax, it has a bad influence on the global environment such as destroying the ozone layer in the atmosphere. Further, when the diffraction grating cut to remove the wax is transferred to the cleaning device, the production efficiency was poor because it relied on manual labor such as using tweezers.

【0005】本発明は上記課題を解決するためになされ
たものであり、その目的は、ワックスもハロゲン化炭化
水素等の溶剤も使用せず、また、生産効率をも高めるこ
とのできる回折格子を有する光学部品の製造方法を提供
しようとするものである。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a diffraction grating which does not use a wax or a solvent such as a halogenated hydrocarbon and can improve the production efficiency. An object of the present invention is to provide a method of manufacturing an optical component having the same.

【0006】[0006]

【課題を解決するための手段及び作用】上記課題を解決
するため本発明は、回折格子の形成された透明基板の縁
端部を固定手段によって固定し、この固定した透明基板
を水に浸漬し、これを冷却して結氷させ、結氷状態のま
ま透明基板をカッティング手段によって切断するように
した。
According to the present invention, in order to solve the above problems, the edge portion of a transparent substrate on which a diffraction grating is formed is fixed by fixing means, and the fixed transparent substrate is immersed in water. Then, this was cooled to freeze the ice, and the transparent substrate was cut by the cutting means while keeping the ice.

【0007】[0007]

【実施例】以下に本発明の実施例を図に基づいて説明す
る。図1は本発明に基づく光学部品製造方法の一例を示
す工程図である。同図(a)に水槽内にセットした透明
基板を断面図によって示した。同図において、ガラス、
水晶等からなる回折格子を形成した透明基板1の縁端部
を、固定手段である固定枠2及び保持治具3によって固
定する。そして、この透明基板1を固定枠2ごと水槽4
内に入れ、固定枠2を枠受け5に掛ける。次に水槽4内
を純水で満たし、この純水を冷凍装置を用いて凍らせて
透明基板1を氷で固定する。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a process chart showing an example of a method for manufacturing an optical component according to the present invention. The transparent substrate set in the water tank is shown in a sectional view of FIG. In the figure, glass,
An edge portion of the transparent substrate 1 on which a diffraction grating made of crystal or the like is formed is fixed by a fixing frame 2 and a holding jig 3 which are fixing means. Then, the transparent substrate 1 and the fixed frame 2 together with the water tank 4
Put it inside and hang the fixed frame 2 on the frame receiver 5. Next, the water tank 4 is filled with pure water, and this pure water is frozen using a freezing device to fix the transparent substrate 1 with ice.

【0008】図1(b)は水槽内にセットした透明基板
の平面図である。同図に示すように保持治具3は水中で
透明基板1を固定しているが、この保持治具3の数は複
数であってもよい。純水を結氷させた後に水槽4を切断
装置へセットする。
FIG. 1 (b) is a plan view of the transparent substrate set in the water tank. As shown in the figure, the holding jig 3 fixes the transparent substrate 1 in water, but the number of the holding jigs 3 may be plural. After the pure water is frozen, the water tank 4 is set in the cutting device.

【0009】図1(c)は氷中で切断された透明基板を
示す断面図である。同図に示すようにカッティング手段
であるダイヤモンド刃6によって透明基板1を縦方向及
び横方向に切断して回折格子を作成する。その後、氷を
溶解して純水で回折格子を洗浄して製品とする。
FIG. 1C is a sectional view showing a transparent substrate cut in ice. As shown in the figure, the transparent substrate 1 is cut in the vertical and horizontal directions by a diamond blade 6 as a cutting means to form a diffraction grating. After that, ice is melted and the diffraction grating is washed with pure water to obtain a product.

【0010】上述の本発明に基づく方法によれば、透明
基板1及び解凍前の回折格子はその両面が氷で覆われて
いるため、外部からの衝撃による破壊や塵埃から保護す
ることができる。また、透明基板1は氷によって完全に
固定されているため切断時にずれることがなく、さらに
ガラス等の切り粉によって回折格子表面を傷つけること
もなく容易に加工することができる。
According to the above-described method of the present invention, since both sides of the transparent substrate 1 and the diffraction grating before thawing are covered with ice, it is possible to protect the transparent substrate 1 from damage and dust due to an external impact. Further, since the transparent substrate 1 is completely fixed by ice, it does not shift at the time of cutting and can be easily processed without damaging the surface of the diffraction grating by chips such as glass.

【0011】また、ダイヤモンド刃6の高速回転時に発
生する摩擦熱によって一部の氷が溶解し、この水が切削
液の役割を果たすため摩擦熱を冷却し、切断時に発生し
やすいチッピングや欠け等を防ぐことができる。さら
に、この方法によればワックスを使用しないため、フロ
ン等の有機溶剤を使用することなく洗浄できるので環境
汚染の心配がない。また、純水を使用すれば塵埃による
影響が少なく、加工後の回折格子や切断装置等にダメー
ジを与えることがない。
Further, a part of ice is melted by the frictional heat generated when the diamond blade 6 rotates at a high speed, and this water serves as a cutting fluid, so that the frictional heat is cooled, and chipping, chipping, etc. which are likely to occur during cutting. Can be prevented. Further, according to this method, since wax is not used, cleaning can be performed without using an organic solvent such as CFC, so that there is no fear of environmental pollution. Further, when pure water is used, the influence of dust is small, and the processed diffraction grating and cutting device are not damaged.

【0012】なお、図1(c)に示すように、冷却した
切削液を注液ノズル7からダイヤモンド刃6の切断部へ
供給しながら前記切断を行うこともできる。この切削液
としては、界面活性剤とエチルアルコール、エチレング
リコール等のアルコール類との混合液が好ましく、例え
ば界面活性剤7に対してアルコール類3の重量割合で混
合する。そしてこの切削液を0℃以下、例えば−5℃で
使用すれば、透明基板1の冷凍状態はなお一層良好に維
持され固定を完全なものにすることができるため切断後
に回折格子が散らばることがない。
As shown in FIG. 1C, the cutting can be performed while supplying the cooled cutting fluid from the liquid injection nozzle 7 to the cutting portion of the diamond blade 6. The cutting liquid is preferably a mixed liquid of a surfactant and an alcohol such as ethyl alcohol or ethylene glycol. For example, the surfactant is mixed with the alcohol 3 in a weight ratio of 3. If this cutting fluid is used at 0 ° C. or lower, for example, −5 ° C., the frozen state of the transparent substrate 1 can be maintained even better and the fixing can be perfected, so that the diffraction grating may be scattered after cutting. Absent.

【0013】また、保持治具3としては上記の他に多種
なものを使用することができる。図2(a)は、本発明
に係る透明基板の固定方法の他の例を示す平面図であ
り、図2(b)は固定に用いる他の保持治具の概要図で
ある。同図(a)に示すように、この保持治具3は複数
個使用し、透明基板1の縁端部の数箇所を止めることが
好ましい。また、保持治具3の一例としては同図(b)
に示すように、固定枠2に固着する基部8、透明基板1
を挟むための挟持部9、及び基部8と挟持部9とを接続
する上下動可能なアーム10からなるものを挙げること
ができる。中でも、透明基板1を固定枠2へ固定する際
にはアーム10がロックされ、ロックを外すと挟持部9
が跳ね上がって透明基板1を外すことのできる機構を有
する保持治具3が好ましい。
As the holding jig 3, various kinds other than the above can be used. FIG. 2A is a plan view showing another example of the method of fixing a transparent substrate according to the present invention, and FIG. 2B is a schematic view of another holding jig used for fixing. As shown in FIG. 3A, it is preferable to use a plurality of holding jigs 3 and stop the edge portions of the transparent substrate 1 at several positions. In addition, as an example of the holding jig 3, FIG.
As shown in FIG. 1, the base portion 8 fixed to the fixed frame 2 and the transparent substrate 1
An example is a holding part 9 for holding the holding part, and an up-and-down movable arm 10 connecting the base part 8 and the holding part 9. Above all, the arm 10 is locked when the transparent substrate 1 is fixed to the fixed frame 2, and when the lock is released, the holding portion 9 is held.
It is preferable to use the holding jig 3 having a mechanism that allows the transparent substrate 1 to be detached by jumping up.

【0014】上述の方法によって切断した回折格子の好
ましい回収方法を次に説明する。図3は、本発明に係る
切断した回折格子の沈降・整列方法の一例を示す断面図
である。同図(a)は、切断された回折格子を水槽4か
ら氷ごと取出し、その上方に加熱手段である解凍装置1
1を配置した様子を示している。ただし本例において
は、前記冷凍の前の段階で水槽4中に受け皿12をセッ
トし、その上に固定枠2を配置してこれらを一緒に冷凍
している。そのため本図3(a)には、ダイヤモンド刃
6によるメッシュ状の切り跡に対応して桝目状の仕切板
13が当接するように配置された受け皿12が存在して
いる。
A preferred method for recovering the diffraction grating cut by the above method will be described below. FIG. 3 is a cross-sectional view showing an example of the method of sedimentation / alignment of a cut diffraction grating according to the present invention. In the same figure (a), the cut diffraction grating is taken out from the water tank 4 together with the ice, and the thawing device 1 as a heating means is provided above it.
1 shows a state in which 1 is arranged. However, in this example, the saucer 12 is set in the water tank 4 before the freezing, and the fixed frame 2 is placed on the saucer 12 to freeze them together. Therefore, in FIG. 3A, there is a tray 12 arranged so that the grid-shaped partition plate 13 is brought into contact with the mesh-shaped cut traces of the diamond blade 6.

【0015】上記解凍装置11を用いて氷を溶解するた
めには、同図に示すようにダイヤモンド刃6によるメッ
シュ状の切り跡に解凍装置11の構成部分であるヒータ
付き仕切板14を押込んで加熱する。氷塊が溶けるに従
って解凍装置11は自重で沈み、ヒータ付き仕切板14
の先端は受け皿12の前記桝目状の仕切板13の上面に
当接する。この当接部の拡大図を同図(b)に示す。同
図で明らかなように、ヒータ付き仕切板14が桝目状仕
切板13に嵌合されるように両仕切板を形成してある。
In order to melt the ice using the thawing device 11, as shown in the figure, the partition plate 14 with the heater, which is a constituent part of the thawing device 11, is pushed into the mesh-shaped cut by the diamond blade 6. To heat. As the ice block melts, the thawing device 11 sinks under its own weight, and the partition plate 14 with a heater
The tip of the abutment contacts the upper surface of the grid-shaped partition plate 13 of the tray 12. An enlarged view of this contact portion is shown in FIG. As is apparent from the figure, both partition plates are formed so that the partition plate with a heater 14 can be fitted into the grid-shaped partition plate 13.

【0016】上記のように仕切板13と仕切板14とが
当接させ、次に図3(c)に示すように解凍装置11に
内蔵されている温純水供給パイプ15から温めた純水を
供給して氷を溶解させ、同時に回折格子の洗浄も行う。
すると、仕切板13及び仕切板14は前記のように当接
してガイドの機能を果たすため、受け皿12は、氷の溶
解とともに洗浄されながら沈降する回折格子をそれらの
表裏及び方向が変ることなく整列することができる。
The partition plate 13 and the partition plate 14 are brought into contact with each other as described above, and then warm pure water is supplied from the warm pure water supply pipe 15 built in the defroster 11 as shown in FIG. 3 (c). Then, the ice is melted and the diffraction grating is washed at the same time.
Then, since the partition plate 13 and the partition plate 14 contact each other as described above to perform the function of the guide, the tray 12 aligns the diffraction gratings that sink while being washed with the melting of ice without changing their front and back sides and directions. can do.

【0017】本発明の別実施例を以下に説明する。図4
は本発明に基づく光学部品製造方法の他の例を示す概略
断面図である。同図において透明基板1は、固定枠2及
び保持治具3によってその縁端部を固定されている。そ
して、この透明基板1を固定した固定枠2は、平板16
上に立設された枠体17の頭頂部に嵌合されており、全
体として箱体を形成している。一方、この箱体の内側に
は、板材を格子状に組み合わせて複数の桝目を形成した
仕切枠18、及びこの仕切枠18の下方に配置し、桝目
を一致させて仕切枠18と組み合わせた受け皿19が置
かれている。
Another embodiment of the present invention will be described below. Figure 4
FIG. 6 is a schematic cross-sectional view showing another example of the optical component manufacturing method according to the present invention. In the figure, the transparent substrate 1 has its edge fixed by a fixing frame 2 and a holding jig 3. The fixed frame 2 to which the transparent substrate 1 is fixed is a flat plate 16
It is fitted on the top of the frame 17 which is erected on the top, and forms a box body as a whole. On the other hand, inside the box body, a partition frame 18 in which plate materials are combined in a grid pattern to form a plurality of grids, and a saucer which is arranged below the partition frame 18 and has the grids aligned and combined with the partition frame 18 19 is placed.

【0018】図5に、仕切枠及び受け皿の一例を斜視図
によって示す。同図に示すように、仕切枠18の桝目は
受け皿19の桝目に対応するように形成されている。ま
た、仕切枠18と受け皿19とを接続するには、受け皿
19の桝目部分を浮き彫りにして仕切枠18の下端内に
嵌着させたり、受け皿19側あるいは仕切枠18側に凸
部を設け相対する仕切枠18側あるいは受け皿19側に
凹部を設けてこれらを嵌合させる等、どのような方法で
行ってもよい。
FIG. 5 is a perspective view showing an example of the partition frame and the tray. As shown in the figure, the grid of the partition frame 18 is formed so as to correspond to the grid of the tray 19. Further, in order to connect the partition frame 18 and the saucer 19, the grid portion of the saucer 19 is embossed and fitted into the lower end of the partition frame 18, or a convex portion is provided on the saucer 19 side or the partition frame 18 side. Any method may be used, such as providing a concave portion on the side of the partition frame 18 or the side of the tray 19 and fitting them together.

【0019】図4に戻って説明を続ける。前記固定枠
2、平板16及枠体17からなる箱体内に水を一杯に注
ぎ、冷凍して結氷させる。この氷によって透明基板1は
完全に固定される。続いて、この箱体を切断装置へセッ
トする。そして、カッティング中も凍結状態が維持でき
るように注液ノズル7から冷却した切削液を供給しなが
ら、ダイヤモンド刃6によって透明基板1を縦方向及び
横方向に切断する。
Returning to FIG. 4, the description will be continued. A box body composed of the fixed frame 2, the flat plate 16 and the frame body 17 is filled with water, frozen and frozen. The transparent substrate 1 is completely fixed by this ice. Then, this box is set in the cutting device. Then, the transparent substrate 1 is cut in the vertical direction and the horizontal direction by the diamond blade 6 while supplying the cooling cutting liquid from the liquid injection nozzle 7 so that the frozen state can be maintained even during cutting.

【0020】上記切断後に、洗浄液として前記切削液を
温めて使用すれば、氷は溶解し、回折格子は洗浄されな
がら仕切枠18に設けられた桝目内の水中に表裏及び方
向が変ることなく沈降して受け皿19に整列される。
After the cutting, if the cutting fluid is warmed and used as a cleaning fluid, the ice melts and the diffraction grating is washed and settles in the water in the grid provided in the partition frame 18 without changing the front and back and the direction. Then, it is aligned with the saucer 19.

【0021】[0021]

【発明の効果】以上に説明したように本発明の方法によ
れば、回折格子の形成された透明基板の縁端部を固定手
段によって固定し、この固定した透明基板を水に浸漬
し、これを冷却して結氷させ、結氷状態のまま透明基板
をカッティング手段によって切断するため、従来のよう
に透明基板をワックスで固定する必要がない。
As described above, according to the method of the present invention, the edge portion of the transparent substrate on which the diffraction grating is formed is fixed by the fixing means, and the fixed transparent substrate is immersed in water. Since the transparent substrate is cooled by the cutting means while it is frozen and the frozen substrate is cut in the frozen state, it is not necessary to fix the transparent substrate with wax as in the conventional case.

【0022】従って、ワックスの溶融及びカッティング
時に発生する蒸気によって作業環境が悪化することがな
い。さらに、ワックスを使用しないため切断された回折
格子の洗浄も容易であり、フロン等のハロゲン化炭化水
素からなる溶剤を使用する必要がない。
Therefore, the working environment is not deteriorated by the vapor generated during the melting and cutting of the wax. Furthermore, since the wax is not used, the cut diffraction grating can be easily washed, and it is not necessary to use a solvent composed of a halogenated hydrocarbon such as CFC.

【0023】また、前記カッティング手段による切断
を、冷却した切削液を切断部へ供給しながら行えば、透
明基板の冷凍状態はなお一層良好に維持され固定を完全
なものにすることができるため切断後に回折格子が散ら
ばることがない。
If the cutting is carried out while supplying the cooled cutting fluid to the cutting portion, the frozen state of the transparent substrate can be maintained even better and the fixing can be completed completely. The diffraction grating will not be scattered later.

【0024】また、前記カッティング手段によって切断
した透明基板を、次に加熱手段によって前記氷を溶解
し、下方に配置した桝目状の受け皿へ沈降させて整列さ
せれば、従来のように竹製のピンセットで挟む等の手間
がなくなるため生産性を向上することができる。
If the transparent substrate cut by the cutting means is then melted by the heating means, the ice is melted, and the transparent substrate is settled down and aligned in a grid-shaped saucer arranged below. The productivity can be improved because there is no need to pinch it with tweezers.

【0025】さらに、桝目状の受け皿を格子状の仕切枠
と組み合わせて使用すれば、回折格子を桝目状の受け皿
へ沈降させる際に、表裏及び方向が変ることなく整列さ
せることができる。
Furthermore, if the grid-shaped tray is used in combination with the grid-shaped partition frame, when the diffraction grating is settled on the grid-shaped tray, it is possible to align the front and back and the direction without changing.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に基づく光学部品製造方法の一例を示す
工程図
FIG. 1 is a process chart showing an example of an optical component manufacturing method according to the present invention.

【図2】本発明に係る透明基板の固定方法の他の例を示
す平面図(a)及び固定に用いる他の保持治具の概要図
(b)
FIG. 2 is a plan view (a) showing another example of a transparent substrate fixing method according to the present invention and a schematic view (b) of another holding jig used for fixing.

【図3】本発明に係る切断した回折格子の沈降・整列方
法の一例を示す断面図
FIG. 3 is a cross-sectional view showing an example of a method of sedimentation / alignment of a cut diffraction grating according to the present invention.

【図4】本発明に基づく光学部品製造方法の他の例を示
す概略断面図
FIG. 4 is a schematic sectional view showing another example of a method for manufacturing an optical component according to the present invention.

【図5】本発明に係る仕切枠及び受け皿の一例を示す斜
視図
FIG. 5 is a perspective view showing an example of a partition frame and a tray according to the present invention.

【符号の説明】[Explanation of symbols]

1…透明基板、2…固定枠(固定手段)、3…保持治具
(固定手段)、4…水槽、5…枠受け、6…ダイヤモン
ド刃(カッティング手段)、7…注液ノズル、11…解
凍装置(加熱手段)、12,19…受け皿、13,14
…仕切板、15…パイプ、16…平板、17…枠体、1
8…仕切枠。
DESCRIPTION OF SYMBOLS 1 ... Transparent substrate, 2 ... Fixed frame (fixing means), 3 ... Holding jig (fixing means), 4 ... Water tank, 5 ... Frame receiver, 6 ... Diamond blade (cutting means), 7 ... Liquid injection nozzle, 11 ... Defrosting device (heating means), 12, 19 ... saucer, 13, 14
... Partition plate, 15 ... Pipe, 16 ... Flat plate, 17 ... Frame body, 1
8 ... Partition frame.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 回折格子の形成された透明基板を縦横に
切断して回折格子を有する光学部品を製造する方法にお
いて、前記回折格子の形成された透明基板の縁端部を固
定手段によって固定し、この固定した透明基板を水に浸
漬し、これを冷却して結氷させ、結氷状態のまま透明基
板をカッティング手段によって切断することを特徴とす
る光学部品の製造方法。
1. A method of manufacturing an optical component having a diffraction grating by vertically and horizontally cutting a transparent substrate having a diffraction grating formed thereon, wherein an edge portion of the transparent substrate having the diffraction grating is fixed by a fixing means. A method for manufacturing an optical component, which comprises immersing the fixed transparent substrate in water, cooling it to freeze it, and cutting the transparent substrate in a frozen state by cutting means.
【請求項2】 前記カッティング手段によって切断した
透明基板を、次に加熱手段によって前記氷を溶解し、下
方に配置した桝目状の受け皿へ沈降させて整列させるこ
とを特徴とする請求項1に記載の光学部品の製造方法。
2. The transparent substrate cut by the cutting means is then melted by the heating means to allow the ice to melt and settle on a grid-shaped saucer arranged below to be aligned. Of manufacturing optical components of.
JP12139293A 1993-05-24 1993-05-24 Production of optical parts Pending JPH06331813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12139293A JPH06331813A (en) 1993-05-24 1993-05-24 Production of optical parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12139293A JPH06331813A (en) 1993-05-24 1993-05-24 Production of optical parts

Publications (1)

Publication Number Publication Date
JPH06331813A true JPH06331813A (en) 1994-12-02

Family

ID=14810064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12139293A Pending JPH06331813A (en) 1993-05-24 1993-05-24 Production of optical parts

Country Status (1)

Country Link
JP (1) JPH06331813A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7498237B2 (en) 2006-06-06 2009-03-03 Fujitsu Limited Method of manufacturing devices, positioning method, dicing method and dicing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7498237B2 (en) 2006-06-06 2009-03-03 Fujitsu Limited Method of manufacturing devices, positioning method, dicing method and dicing apparatus

Similar Documents

Publication Publication Date Title
US6541730B2 (en) Method and apparatus for cutting a non-metal substrate by using a laser beam
US6257224B1 (en) Process for working a preform made of an oxide single crystal, and a process for producing functional devices
US7790578B2 (en) Dicing method using volatile protective agent
US5981361A (en) Fabrication process of a semiconductor device including a dicing process of a semiconductor wafer
KR100606955B1 (en) A laser cutting apparatus and a method of cutting a glass substrate thereby
US5972234A (en) Debris-free wafer marking method
JPH06331813A (en) Production of optical parts
JP2000323441A (en) Method for cutting optical wave guide circuit chip formed on ceramic substrate
CN113714649A (en) Method for manufacturing wafer
JPH09323300A (en) Substrate dividing method
JP2003146678A (en) Cutting method and cutting apparatus for brittle material
WO2008079098A1 (en) Method and apparatus for supporting a workpiece to be cut
JP3797703B2 (en) Laser processing method for glass substrate
JP3054281B2 (en) Method for manufacturing optical waveguide substrate
JPS62252945A (en) Attachment and detachment of temporaty fixing means of material to be machined
JPH0452614B2 (en)
JP2005347675A (en) Method for manufacturing element having fine structure
JP2003171132A (en) Conveyance method for fragile material and cutting/ conveyance device
JPH0682739A (en) Glass base plate cutting device
JPH0645297A (en) Manufacture of semiconductor substrate
GB2336032A (en) Wafer collecting method and system
JP2001274135A (en) Cleaning method
JPH06124933A (en) Removement of fine grains attached to surface of solid
JPH09183047A (en) Sample polishing method
JP2000021825A (en) Semiconductor jig