JPH06331160A - Assembly for electronic cooling element - Google Patents

Abstract

PURPOSE:To perform a mass production of electronic cooling element assembly continuously at a low cost by alternately fixing different type semiconductors for forming the elements at an equal interval at two stripes of ribbons of electric conductors, and alternately cutting the ribbons at the gap of the semiconductors. CONSTITUTION:Two stripes of ribbons 1, 2 are heated and coated with solder at opposed surfaces. Two types of semiconductors 4, 5 of electronic cooling elements 3 coated with solder are alternately advanced in a shape in which they are interposed between the ribbons 1 and 2 by a conveyor 11 from below at a gap 10 in a predetermined direction, fusion-bonded with solder previously coating the ribbons 1, 2 and the semiconductors 4, 5 while passing between heating rolls 12, and the semiconductors 4, 5 are cooled to be fixed between the ribbons 1 and 2 through cooling rolls 13. Then, high-speed cutters 14, 15 horizontally move in synchronization with passage of the semiconductors 4, 5 through the gap 10 to alternately cut and partly delete the ribbons 1, 2. Thus, an electronic cooling element assembly 17 is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a facility for practically applying the Peltier effect for cooling.

[0002]

2. Description of the Related Art A conventional assembly of electronic cooling elements of this type is divided into several sets or tens or hundreds of two different kinds of semiconductors which produce a Peltier effect when a DC voltage is applied. It was fixed electrically in series connection to a plate of an electric conductor arranged in a substantially rectangular shape, a plate for electrical insulation was arranged outside the plate, and a plate of a heat conductor was attached to the outside.

[0003]

However, in the above-mentioned conventional assembly of electronic cooling elements, since a plurality of sets of two kinds of different kinds of semiconductors are accommodated in a predetermined substantially rectangular space, a large number of them are continuously arranged in a straight line. It was not arranged and had a shape of turning several times or tens of times within the length of a predetermined rectangular side, which was inconvenient for industrial continuous mass production. .

Furthermore, since the outer shape of the assembly of cooling elements is rectangular and planar, the shape of the contact portion of the heat conductor, which is the main purpose of the assembly, is inevitably flat, and the heat exchange with the liquid accompanying the flow is unavoidable. It is not easy to connect with a convenient cylindrical pipe or a fin-shaped heat conductor with high density, which is convenient for convective heat transfer with gas, and if you try to forcibly form a heat conductor, the heat conductor will be large. As a result, the heat transfer resistance to the target fluid also becomes large, so the temperature difference between the two end faces of the assembly of electronic cooling elements becomes large, and the efficiency of the Peltier effect for electrical input was kept low, making it easy to win.

In addition, the DC voltage suitable for applying to one set of semiconductors is extremely low at about 0.1 V in the existing semiconductors, and therefore several thousand sets of semiconductors are connected in series in order to be used at a commercial power supply voltage of 100 to 200 V. They had to be connected, which was not easy with conventional manufacturing methods.

Therefore, the electronic cooling is manufactured by an extremely simple device having no working part as compared with the compression type refrigerator and the like, although the cooling effect can be produced without using the CFC refrigerant or the petrochemical fuel. Because of its high cost and lack of practicality in terms of shape, it could hardly be put to practical use commercially.

[0007]

The present invention has been made to improve this point. As described in the first aspect of the patent, when two kinds of ribbons of electric conductors, such as two copper strips whose ends are long and face parallel to each other, are applied with a DC voltage, a Peltier effect is produced. The semiconductors are prepared alternately, and they are continuously bonded and fixed so as to maintain a gap between them, and then the ribbon of the electric conductor is cut at the gap so that all the semiconductors are electrically connected in series. By doing so, it has become possible to manufacture continuously and extremely efficiently as compared with the conventional one.

Further, as described in claim 2, a film of an electric insulator is provided on the inner surface of the outer tube and the outer surface of the inner tube of the two concentric heat conductor tubes. One or a plurality of electronic cooling element assemblies connected in a chain form are arranged in the gap between the two in parallel or spirally with the axis of the tube to shrink the outer tube diameter or reduce the inner tube diameter. The inner and outer tubes and the assembly of the electronic cooling elements sandwiched by the tubes can be tightly and closely attached to each other more easily than in the case of the conventional flat surface by fixing the assembly of the electronic cooling elements and at the same time a convenient tubular shape for liquid. The heat conductor is formed.

Further, if fins are provided on the outer circumference of the outer tube, it is possible to easily form a lightweight heat conductor having a high density for gas, a low heat passage resistance, and a large heat transfer area. it can.

Further, as described in claim 3, if one end of a heat pipe is filled in place of the inner pipe or the inner pipe is closely inserted, heat is transferred directly without using fluid. Since it can be applied, it can be applied to areas where fluid leakage is not desired.

Further, as described in the fourth claim, 2
If a film of an electrical insulator is provided on the surfaces of the heat conductors placed in parallel and facing each other, and one or a plurality of the electronic cooling elements are arranged side by side and fixed by pressure, the heat conduction can be improved. A very convenient long rod-shaped heat conductor and a large-sized heat conductor can be freely and easily formed.

Further, as described in claim 5, the indoor air of the building is circulated through the heat transfer portion of the heat conductor of the outer tube provided with the fins by using a blower or air guide, and For the inner pipe, a heat medium such as water is connected to a cold heat source such as a cooling tower or a hot heat source such as a boiler by using a pump or piping so as to circulate and circulate, and the inner surface of the outer pipe and the outer surface of the inner pipe are connected. A film of an electrical insulator is provided, and one or more aggregates of the electronic cooling elements are arranged in this gap and arranged in parallel or spirally with respect to the axis, and the inner tube diameter is expanded by a method such as expansion. If they are fixed and a DC voltage is applied to produce the Peltier effect, the building can be cooled and heated without using CFC refrigerant or petrochemical fuel.

As described above, since an assembly of electronic cooling elements can be easily manufactured in an endless manner, thousands of semiconductors can be easily electrically connected in series, and a double coil can be formed in a spiral shape. Since it can be easily stored in a short size by storing it in a gap between tubes, it can be conveniently used by simply converting it to DC with the commercial power supply voltage unchanged.

Also, the electronic cooling element is a thin film of an electric insulator 1
The heat transfer resistance is extremely small because it is close to the heat transfer body that is in direct contact with the fluid to which heat is to be transferred almost only through the thermal resistance of one sheet, and therefore the temperature difference between both ends of the electronic cooling element can be kept small. As a result, the efficiency of the Peltier effect with respect to the electric input is increased, and the performance that can be practically used can be obtained.

[0015]

According to the present invention, two kinds of semiconductors of different kinds that produce a Peltier effect when a DC voltage is applied between the surfaces of the ribbons of electric conductors such as two endless copper-made electric conductors for the assembly of electronic cooling elements are provided. A structure in which all semiconductors are electrically connected in series by alternately arranging, joining, and fixing so as to maintain a gap, and then cutting ribbons of electric conductors alternately at the gap. Therefore, for example, the ribbon is continuously fed from a bobbin of two rolls on which a ribbon of an electric conductor having a length of several thousand meters is spread, and two ribbons are arranged so that their facing surfaces are parallel to each other. Two
By sandwiching different kinds of semiconductors of a certain size alternately so as to keep a constant interval, at the same time automatic solder joining is performed, and in the subsequent process the ribbon is automatically cut alternately at the gap between the semiconductors. ， High-speed automatic continuous production in large quantities is possible.

The assembly of the electronic cooling elements thus formed in a chain and endless manner is formed by connecting two concentric heat conductors having different diameters with each other to the inner surface of the outer tube and the inner tube of the outer tube. Because a thin and strong electric insulator film is attached to the outer surface, and one or more tubes are inserted in the gap between the two tubes in parallel with the axis of the tube or spirally wound around the inner tube. After that, the assembly of electronic cooling elements can be tightly fixed between the outer tube and the inner tube by a simple method such as expanding the inner tube from the inside with a tube expander. In this way, the tube between the assembly of electronic cooling elements and the back side of the heat transfer surface for cooling or heating is tightly bonded with a very small heat passage resistance with only a thin electric insulator film interposed. The transmission is in very good condition.

Further, since the periphery of the assembly of the electronic cooling elements is surrounded by the cylindrical heat transfer tube both inside and outside, it is resistant to pressure inside and outside, and serves as a flow path for the fluid of the heat medium, especially for heat transfer with the liquid. Are suitable.

Further, if fins are provided on the outer circumference of the outer tube, the outside has a shape suitable for heat transfer with gas, and the size and pitch of the fins can be determined irrespective of the assembly of the electronic cooling elements inside. It becomes an optimal heat conductor. If one end of a cylindrical heat pipe with the same diameter as this is used instead of the inner pipe, or if one end of the same cylindrical heat pipe is tightly inserted into the inner surface of the inner pipe, it will be directly cooled to the outside without passing through liquid. Alternatively, heat energy for heating can be transferred.

When gas is the object of heat transfer on both sides, a planar one similar to the conventional one is suitable. However, if one or a plurality of the electronic cooling elements are arranged side by side, ， Easy to mold from long straight to large square.

A thin film of an electrical insulator is attached to the inner surface of the outer tube having fins on the outer periphery and the outer surface of the inner tube, and one or more assembly of the electronic cooling elements are arranged in this gap in parallel with the axis of the tube. The air inside the building where this is installed is circulated by connecting a blower or air guide to the outer fin of the electronic cooling unit, which is fixed by methods such as spirally sandwiching and expanding the diameter of the inner pipe. In addition, a heat medium such as water is circulated in the inner pipe by connecting a pump or piping to a heat source such as an outdoor cooling tower or a boiler, and circulating the heat medium. If water is circulated to the air and heat sources and a positive DC voltage is applied to the assembly of the electronic cooling elements, heat is transferred from the outer tube side to the inner tube side by the Peltier effect, and as a result, the air is cooled, The water will be heated, The heat is positively transferred from the air to the water by the action of the electronic cooling unit and is discarded into the atmosphere from the cooling tower, and the room is cooled. Conversely, switching to a negative DC voltage also reverses the Peltier effect. , The heat moves from the inner pipe side to the outer pipe side, and as a result, the air is heated and the water is cooled. The thermal energy of water is positively transferred to the air by the action of the electronic cooling unit, and the water temperature is It falls and the room is heated. The decrease in water temperature is compensated by operating a heat source such as a boiler connected by piping.

As described above, since the air circulated from the assembly of the electronic cooling elements is brought into contact with the cooling water or the heat source water in an extremely good condition in terms of heat conduction, the temperature of the cooling side and the heating side of the electronic cooling element is increased. Becomes closer to the air temperature or the water temperature, resulting in a smaller temperature difference between both ends of the electronic cooling element than in the conventional one, and the efficiency of the Peltier effect for electric input is improved.
The heating can be put to practical use.

The DC voltage applied to one set of semiconductors forming the electronic cooling element is about 0.1 volt practically, so that it is necessary to use it with a commercial power source of 100 volt.
To use 00 sets at 200 volts, it is necessary to electrically connect 2000 sets of semiconductor devices in series. However, the assembly of the electronic cooling devices manufactured by the manufacturing method can be linearly and easily Since these semiconductor elements are manufactured in a state of being connected in series, a single assembly can easily handle a commercial power supply voltage. Further, in the case of arranging in the spiral shape, the length can be freely adjusted by adjusting the angle.

[0023]

EXAMPLES Examples of the present invention will be described below. Figure 1
1 and 2 are ribbons having a width of 2 mm and a thickness of 0.1 mm of copper electric conductors for electrically connecting two different semiconductors 4 and 5 of the electronic cooling element 3 alternately, as shown in FIG. In the early stage of manufacturing, two ribbons 1 and 2
Is wound endlessly on two bobbins 6 and 7 of several thousand meters, from which it is continuously unwound for production. The two ribbons 1 and 2 are first heated by solder rolls 8 and 9 and the surfaces facing each other are coated with solder. Two kinds of semiconductors 4 and 5 of different types, which are finished to the exact same dimensions of width 2 mm, thickness 2 mm and length 2.5 mm, and whose end faces are also coated with solder, are alternately arranged in a constant direction and a gap 10. And the conveyor 11 from below to synchronize with the flow velocity of the ribbons 1 and 2 and the two ribbons 1 and 2
It is advanced in the form of being sandwiched between the heating and bonding rolls 12 and is heated when passing between the heating and bonding rolls 12. Then, after passing through the cooling roll 13, the semiconductors 4 and 5 are cooled and fixed between the two ribbons 1 and 2. The high speed cutters 14 and 15 in the next step move in the horizontal direction in synchronization with the passage of the gap 10 between the semiconductors 4 and 5 to alternately cut, partially cut and remove the ribbon 1 and the ribbon 2. 16 is a guide for preventing abnormalities in the shape of the product due to the stress of the high speed cutter 14, 17 is a completed product, that is, an assembly of electronic cooling elements according to the present invention, 18 is an automatic winding for winding the product 17 in an endless manner. A take-up machine 19 indicates a bobbin wound up with the finished product.

FIG. 2 shows in detail a part of a chained endless product of the completed electronic cooling element assembly 17.

FIG. 3 shows that the inner surface of a copper outer tube 20 having a diameter of 30 mm and a thickness of 1.5 mm and the outer surface of a copper inner tube having a diameter of 20 mm and a thickness of 1 mm each have an electric insulation of 0.15 mm. A body membrane 22 is applied, and an average thickness of 3.2 mm formed between the outer tube 20 and the inner tube 21 has a finished thickness of 2.7.
The assembly 17 of the electronic cooling elements having a millimeter diameter is spirally wound along the outer circumference of the inner tube 21 to be housed, and the electronic cooling element is passed through a tube expander having a diameter of 1 mm expanded from the inside of the inner tube 21. An embodiment of a double-tube type electronic cooling element assembly 24 in which the assembly 17 is tightly fixed between the inner surface of the outer tube 20 and the outer surface of the outer tube 21 is shown. In this embodiment, the thermoelectric cooling element assembly 1 is used.
Two 7 are used in parallel, but of course one may be used. However, if multiple lines are connected and stored in parallel, the risk of disconnection can be reduced. In the figure, 25 indicates a lead wire for connecting a DC power supply.

FIG. 4 is similar to the above embodiment, except that 24 thermoelectric cooling element assemblies 17 are housed in parallel with the axis of the tube and can be electrically connected in parallel to be used at a low voltage. An example of the double-tube electronic cooling element assembly 26 having high reliability against disconnection will be described.

In the embodiment shown in FIGS. 3 and 4, a heat medium such as water is passed through the inside of the inner tube 21, and the outer tube is immersed in a water tank or the like having a certain flow velocity, or exposed to an air stream to apply water. It is suitable for heat transfer methods such as cooling using latent heat of vaporization.

FIG. 5 further shows the outer circumference of the outer tube of the above embodiment.
A triple-tube type electron of a shape covered with a conduit 27 having a diameter of 45 mm and having a shape suitable for heat transfer outside the outer tube 20 as well as inside the inner tube 21 for passing through a heat medium such as water. An example of the cooling element assembly 28 is shown.

FIG. 6 shows an outer tube 20 of the embodiment shown in FIG. 3 in which aluminum fins 29 having a thickness of 0.3 mm and an outer dimension of 50 mm are arranged at a 3 mm pitch and press-fitted. Regarding the 20 side, an example of a double-tube electronic cooling element assembly 30 with a single fin for the purpose of heat transfer with gas including air will be shown.

FIG. 7 shows a plurality of the double-tube type electronic cooling element assemblies 24 of the embodiment shown in FIG. 3 which are combined to form a hole having a thickness of 0.3 mm in which a hole corresponding to the outer diameter of the outer tube is opened at a pitch of 60 mm. An aluminum fin 31 having a width of 50 mm and a width of 50 mm is inserted and attached at a pitch of 3 mm, and is an assembly type finless double tube type electronic cooling element assembly suitable for heat transfer of a larger scale than the embodiment shown in FIG. An example of body 32 is shown. The plurality of inner pipes 21 are combined by a U-shaped bend 33 in a cooling water passage 34 of one system.

FIG. 8 is a general fin-tube heat exchanger which is adjacent to the double-tube type electronic cooling element assembly 32 with collective fins shown in FIG. 35, and the flow passage inlet 37 and the flow passage outlet 38 of the tube 36 of the fin-tube heat exchanger 35 are connected to the inner pipe 21 of the double-tube type electronic cooling element assembly 32 with the collective fin and the U-shaped bend. A branch pipe joint 41 is provided at the outlet 40 as well as the inlet 39 of the flow path 34 gathered by
In addition, an inlet 44 and an outlet 4 of one circulation type or one-pass type cooling water system 43 are provided by connecting the three-way switching valve 42.
When the cooling water temperature and flow rate of the cooling water system 43 are sufficient to cool the gas requiring the desired cooling using only the fin tube heat exchanger 35, the three-way switching valve 42
To the fin tube heat exchanger 35 side to allow the cooling water to flow through the fin tube heat exchanger 35 to cool the target gas, and the cooling water temperature and the flow rate of the cooling water system 43 are set to the fin tube heat exchanger 35. If it is not sufficient to cool the target gas by using only the three-way switching valve 42, the inner tube 21 of the collective finned electronic cooling element assembly 32 is connected to the U-shaped bend 33.
Switching operation is performed to the side of the cooling water system 34 summarized by the above, the cooling water is circulated in the inner pipe 21 of the collective finned electronic cooling element assembly 32, and a direct current voltage is applied to the electronic cooling element in the positive direction. When the cooling capacity of the cooling water is sufficient, the electronic cooling element is used as necessary by cooling the gas by the fins 31 to radiate the heat generated by the cooling and cooling to the cooling water. An embodiment of a double-tube electronic cooling element assembly 46 with a fin-type tube heat exchanger and a collective-type fin, which can effectively utilize this, will be shown.

FIG. 9 shows one or a plurality of double-tube type electronic cooling element assemblies 32 with collective fins shown in FIG. 7 or a fin-tube heat exchanger combined type double-tube system with fins shown in FIG. One or a plurality of electronic cooling element aggregates 46 or a mixture of these, and one cooling water system pipe 4
7 to connect to the cooling water circulation pump 48 and the cooling tower 49, and to the boiler 50 when heating is required.
7 in which water in the inside is circulated, and air in a room 52 of a building 51 in which the water is circulated is formed by using a duct 53, the double-tube electronic cooling element assembly 32 with fins and fin-tube heat exchanger. A cooling and heating device 55 which is configured to circulate and circulate through the fins 31 of the double-tube type electronic cooling element assembly 46 with a side-by-side assembly type fin by using a blower 54 so that cooling or heating can be performed as necessary. The example of is shown.

[0033]

According to the present invention, since the electronic cooling element assembly 17 is constructed and manufactured as shown in the embodiment of FIG. 1, continuous endless products can be industrially produced at a high speed at a low cost. Due to the high cost, it has become possible to put into practical use electronic cooling that has not been put to practical use.

Further, according to the present invention, since the endless thermoelectric cooling element assembly 17 is continuously constructed as described above, it is easily compacted by being sandwiched between the concentric double tubes as shown in FIG. A double tube type electronic cooling element assembly 24 having a light conductor having high heat transfer performance and a double tube type electronic cooling element assembly 26 having high reliability against disconnection shown in the embodiment of FIG. 4 are provided. We will be able to provide the equipment, which will not only allow the installation of low-cost equipment, but also
The temperature difference between the fluid to be cooled or heated and the both ends of the electronic cooling element is reduced, which improves the cooling efficiency of the electronic cooling and greatly improves the practicality in terms of operating cost.

Further, in the present invention, the heat transfer of cooling / heating from liquid to liquid by electronic cooling can be carried out easily and compactly and with high operating efficiency by the triple tube type electronic cooling element assembly shown in FIG. Is now possible.

Further, in the present invention, as shown in the embodiments of FIGS. 6, 7 and 8, the double tube type electronic cooling element assembly 24 is provided with fins to form a single fin type double tube type electronic cooling element assembly. By providing the body 30, the double-tube electronic cooling element assembly 32 with a collective fin, and the fin-tube double-tube electronic cooling element assembly 46 with a fin-tube heat exchanger, it is possible to provide by electronic cooling. Heat transfer from gas to liquid or from liquid to gas can now be performed easily, compactly, and with high operating efficiency.

Further, in the present invention, as shown in the embodiment of FIG. 9, a cooling pipe, a boiler, a pump, a blower pipe, a duct, etc. are provided side by side to form the double tube type electronic cooling element assembly 32 with fins and the fin tube. Since the cooling / heating equipment 55 is constituted by the double-tube type electronic cooling element assembly 46 with a collective fin with a heat exchanger, cooling / heating by electronic cooling can be carried out at a practical cost and with high operating efficiency. It was

As described above, according to the present invention, the electronic refrigeration, which could not be practically used for the conventional industrial purpose, can be practically improved in terms of cost, thermal engineering, and operation cost. With regard to cooling and heating equipment as cooling equipment and building equipment, it can greatly contribute to the solution of CFCs that have become a problem in recent years to protect the global environment.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a manufacturing process for manufacturing an electronic cooling element assembly according to the present invention.

FIG. 2 is an external view of an electronic cooling element assembly manufactured according to the present invention.

FIG. 3 is an external view of a double-tube electronic cooling element assembly according to the present invention.

FIG. 4 is an external view of a double-tube thermoelectric cooler assembly having high reliability against disconnection according to the present invention.

FIG. 5 is an external view of a triple tube type electronic cooling element assembly according to the present invention.

FIG. 6 is an external view of a double-tube electronic cooling element assembly with a single fin according to the present invention.

FIG. 7 is an external view of a double-tube electronic cooling element assembly with a fin assembly according to the present invention.

FIG. 8 is an external view of a double-tube electronic cooling element assembly with a fin-tube heat exchanger and a collective fin according to the present invention.

FIG. 9 is a system diagram of a cooling and heating apparatus using the double-tube electronic cooling element assembly with collective fins and the double-tube electronic cooling element assembly with combined fin-tube heat exchanger according to the present invention. is there.

[Explanation of symbols]

1. Electric conductor ribbon 2. Electrical conductor ribbon 3. Electronic cooling element 4. 4. One of the two types of semiconductors of different kinds that constitute the electronic cooling element. Others of two kinds of different kinds of semiconductors constituting the electronic cooling element 16. Ribbon feeding bobbin 7. Ribbon feeding bobbin 8. Solder roll 9. Solder roll 10. Gap between semiconductors 11. Conveyor 12. Heat bonding roll 13. Cooling roll 14. High speed cutter 15. High speed cutter 16. Guide 17. Completed electronic cooling element assembly 18. Automatic winder 19. Finished product bobbin 20.2 Outer tube of double tube type electronic cooling element assembly 21.2 Inner tube of double tube type electronic cooling element assembly 22. Film of electrical insulator 23.2 Gap portion of double tube 24.2 Double tube type electronic cooling element assembly 25. Lead wire for connecting DC power supply 26. Double tube type electronic cooling element assembly with high reliability against disconnection 27. Conduit 28.3 Double tube type electronic cooling element assembly 29. Aluminum fin 30. Double tube type electronic cooling element assembly with a single fin 31. Aluminum fin 32. Double tube type electronic cooling element assembly with collective fin 33. U-shaped bend 34. Flow path in which inner pipe is gathered by U-shaped bend 35. Fin tube heat exchanger 36. Fin tube heat exchanger tube 37. Tube flow path inlet of fin tube heat exchanger 38. Fin tube heat exchanger tube flow path outlet 39. Inlet of the flow path in which the inner pipe is grouped by a U-shaped bend 40. 41. Outlet of the flow path in which the inner pipe is put together by a U-shaped bend 41. Branch pipe joint 42.3 3-way switching valve 43. Circulating or transient cooling water system 44. Circulating or transient cooling water system inlet 45. Circulation or transient cooling water system outlet 46. Combined fin type double tube type electronic cooling element assembly with fin tube heat exchanger 47. Cooling water system piping 48. Cooling water circulation pump 49. Cooling tower 50. Boiler 51. Building 52. Indoor 53. Duct 54. Blower 55. Air-conditioning system using electronic cooling element assembly

Claims (5)

[Claims] 1. Two kinds of semiconductors of different kinds which produce a Peltier effect when a DC voltage is applied between two ribbons of electric conductors which endlessly face each other and face each other in parallel are alternately arranged with a gap, After joining, the two ribbons are alternately cut in the gap portion, and all the semiconductors are electrically joined in series. An assembly of endless thermoelectric cooling elements. 2. An electrically insulating film is provided on the inner surface of two outer heat-conducting tubes of different concentric circles having different diameters and the outer surface of the inner heat-conducting tube, and a gap between the two tubes is provided. Of the electronic cooling element of the first paragraph, one or more tubes are arranged substantially parallel to the axis of the tube or fixed by arranging the tube outside and contracting the tube outside or expanding the tube inside. Aggregation. 3. An electrically insulating film is provided on one end of a cylindrical heat pipe and on the inner surface of a heat conductor tube placed concentrically with a diameter larger than that and on the outer surface of the heat pipe, and in this gap. The assembly of the electronic cooling elements according to the first aspect, wherein one or more tubes are arranged and fixed in parallel or spirally to the axis of the tube by a method of sandwiching and contracting the outer tube. 4. A first electrically insulating film is provided on opposite surfaces of two heat conductors placed in parallel, and one or a plurality of films are arranged and sandwiched between the two sheets by pressure bonding. An assembly of electronic cooling elements of the item. 5. A heat conductor tube having two concentric outer fins having different diameters attached to the fins so as to circulate and circulate the air inside the building. A film of electrical insulator is provided on the outer surface of the inner tube of the heat conductor that allows the heat medium to circulate and flow between the cooling heat source and the heating heat source, or both, and the outer tube is contracted by sandwiching it in this gap, 1 by expanding the inner pipe
An assembly of electronic cooling elements according to the first item, wherein a plurality or a plurality of tubes are arranged and fixed substantially parallel to the axis of the tube or in a spiral shape.