JPH06330210A - Copper alloy wire - Google Patents
Copper alloy wireInfo
- Publication number
- JPH06330210A JPH06330210A JP14577393A JP14577393A JPH06330210A JP H06330210 A JPH06330210 A JP H06330210A JP 14577393 A JP14577393 A JP 14577393A JP 14577393 A JP14577393 A JP 14577393A JP H06330210 A JPH06330210 A JP H06330210A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- wire
- alloy wire
- ppm
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は極細銅線として使用され
る銅合金線に関し、特に、抗張力と導電率が高く、且
つ、断線し難く、連続鋳造法により製造可能な銅合金線
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy wire used as an ultrafine copper wire, and more particularly to a copper alloy wire which has high tensile strength and electrical conductivity, is hard to break, and can be manufactured by a continuous casting method.
【０００２】[0002]
【従来の技術】最近、超音波診断用プローブケーブル等
の医療用ケーブルの軽量化，小型化の要求が高まってお
り、ケーブル導体として５０μｍ以下のものが使用され
始めている。ここで、２５μｍ以下の導体を使用するも
のにあっては抗張力を高くする必要があることから、導
体を構成する銅線として銅にＳｎ，Ｍｇ，Ｐ等を含有さ
せた銅合金を使用することが望ましい。2. Description of the Related Art Recently, there has been an increasing demand for weight reduction and size reduction of medical cables such as probe cables for ultrasonic diagnostic use, and cable conductors of 50 .mu.m or less have begun to be used. Here, in the case of using a conductor of 25 μm or less, since it is necessary to increase the tensile strength, use a copper alloy containing copper containing Sn, Mg, P or the like as the copper wire forming the conductor. Is desirable.
【０００３】従来のＳｎ，Ｍｇ，Ｐを主成分とする銅合
金として、例えば、特公昭５７−５８４２３号，特開昭
５２−１０３３１６号，特開昭６１−１１９６３５号，
特開昭６１−１３６６４８号，特開昭６１−２１３３３
２号，特開昭６１−２４２０５２号，特開昭６２−２４
３７２８号，特開昭６３−６５０３８号，特開昭６３−
６５０３９号，特開昭６３−２６２４３５号，特開昭６
３−２４３２３９号，特開昭和６４−４４４５号，特公
昭６２−１５６１９号に示されるものがある。As a conventional copper alloy containing Sn, Mg and P as main components, for example, Japanese Patent Publication No. 57-58423, Japanese Unexamined Patent Publication No. 52-103316, Japanese Unexamined Patent Publication No. 61-119635,
JP-A-61-136648, JP-A-61-213333
2, JP-A-61-242052, JP-A-62-24
3728, JP-A-63-65038, JP-A-63-63
65039, JP-A-63-262435, JP-A-6
3-243239, JP-A 64-4445 and JP-B-62-15619.
【０００４】これらの銅合金は、耐熱性，耐食性，及び
熱放散性の観点から自動車等の熱交換器（ラジエターフ
ィン），給水用銅管，半導体用リードフレーム，コネク
タ等に使用されている。These copper alloys are used for heat exchangers (radiator fins) of automobiles, copper pipes for water supply, lead frames for semiconductors, connectors, etc. from the viewpoint of heat resistance, corrosion resistance, and heat dissipation.
【０００５】一方、上記した特開昭６３−２４３２３９
号，及び特開昭６３−２６２４３５号については、外径
０．３〜０．０１ｍｍの銅線を対象とした銅合金線も示
されている。この銅合金線は、銅に０．０２〜０．５重
量％のＭｇと、このＭｇに対して３５〜１００重量％の
Ｐと、更に、Ｓｎ，Ｉｎ，Ｐｂ等を添加して構成されて
おり、その主なる強化機構は基本的にＨ．Ｊ．Ｆｉｓｈ
ｅｒ，ＤＳ．Ｈａｙａｎｄ Ｗ．Ｌ．Ｆｉｎｌａｙ
（Ｊ．Ｉｎｓｔ．Ｍｅｔ．，９８（１９７０），３６
８）によるＭｇ3 Ｐ2 の形で析出させる強化法や、Ｍ
ｇ，Ｓｎ等の加工硬化による強化法を応用したものであ
る。On the other hand, the above-mentioned JP-A-63-243239.
JP-A-63-262435 and JP-A-63-262435 also show a copper alloy wire for a copper wire having an outer diameter of 0.3 to 0.01 mm. This copper alloy wire is formed by adding 0.02 to 0.5% by weight of Mg to copper, 35 to 100% by weight of P to this Mg, and further adding Sn, In, Pb or the like. And its main strengthening mechanism is basically H.264. J. Fish
er, DS. Hayand W. L. Finlay
(J. Inst. Met., 98 (1970), 36.
8) The strengthening method of precipitating in the form of Mg 3 P 2 according to 8) or M
This is an application of a strengthening method by work hardening such as g and Sn.
【０００６】[0006]
【発明が解決しようとする課題】しかし、従来のＳｎ−
Ｍｇ−Ｐ系の銅合金線によると、Ｐの添加によって銅線
の機械的強度を高めているものの導体の導電率を大幅に
低下させており、高強度と高導電率の２つの特性を同時
に満足することができないという不都合がある。上記銅
合金線を極細線とする場合に問題となるのは伸線時の断
線や、ケーブルにするための撚線時の断線である。この
ため、極細銅合金線の要件として高張力を有し、尚且つ
断線しないことが必要であり、これら３特性を備えた銅
合金線が望まれている。一方、これらの銅合金線におい
ても、経済性の点から連続鋳造法により製造可能な組成
となっていることが望まれている。However, the conventional Sn-
According to the Mg-P-based copper alloy wire, although the mechanical strength of the copper wire is increased by the addition of P, the conductivity of the conductor is significantly reduced, and two characteristics of high strength and high conductivity are simultaneously achieved. There is an inconvenience that we cannot be satisfied. When the above copper alloy wire is made into an ultrafine wire, a problem is a wire break at the time of wire drawing or a wire break at the time of twisting to make a cable. Therefore, it is necessary for the ultrafine copper alloy wire to have a high tensile strength and not to be broken, and a copper alloy wire having these three characteristics is desired. On the other hand, these copper alloy wires are also desired to have a composition that can be manufactured by the continuous casting method from the viewpoint of economy.
【０００７】従って、本発明の目的は抗張力と導電性が
高く、且つ、断線し難く、連続鋳造法により容易に製造
可能な銅合金線を提供することである。Therefore, an object of the present invention is to provide a copper alloy wire which has high tensile strength and conductivity, is hard to break, and can be easily manufactured by a continuous casting method.
【０００８】[0008]
【課題を解決するための手段】本発明は上記問題点に鑑
み、抗張力と導電性を高くし、且つ、断線し難くするた
め、Ｐを２〜４０ｐｐｍ含有した酸素含有量５０ｐｐｍ
以下のＣｕに、ＳｎとＭｇをＳｎ／Ｍｇの重量比にして
２±０．２の重量比で、且つ、Ｓｎが１００〜４００ｐ
ｐｍとなるように含有させた銅合金線を提供するもので
ある。In view of the above problems, the present invention has an oxygen content of 50 ppm containing P in an amount of 2 to 40 ppm in order to increase tensile strength and conductivity, and to prevent breakage.
In Cu below, Sn and Mg are in a weight ratio of Sn / Mg of 2 ± 0.2 and Sn is 100 to 400 p.
It is intended to provide a copper alloy wire contained so as to have pm.
【０００９】上記Ｐを２〜４０ｐｐｍにする理由は、４
０ｐｐｍ以上にすると、導電率が３ＩＡＣＳ％以上低下
し、２ｐｐｍ以下にすると、鋳造材中に欠陥が認めら
れ、断線し易くなるためである。The reason why P is 2 to 40 ppm is 4
This is because if it is 0 ppm or more, the conductivity is lowered by 3 IACS% or more, and if it is 2 ppm or less, defects are recognized in the cast material and the wire is easily broken.
【００１０】上記Ｓｎを１００〜４００ｐｐｍにする理
由は、Ｓｎ／Ｍｇの重量比が２±０．２において１００
ｐｐｍより小さいと強度が不十分となり、また、４００
ｐｐｍより大きいと導電率が低下するためである。すな
わち、強度に及ぼす元素の影響は、Ｍｇよりも原子半径
の大きいＳｎの方が大きいと考えられるので、本発明に
おいては強度に重点をおいてＳｎを主元素とした。ここ
で、Ｓｎを主元素としてＣｕに添加した場合、導電率の
面から約４００ｐｐｍが限界なので、Ｓｎの一部をＭｇ
におきかえた。このとき、Ｍｇの添加量が少ないと強度
へ及ぼす効果が少なく、一方、Ｍｇの添加量が多すぎる
と、鋳造、特に連続鋳造により荒引線を製造する際に荒
引線の表面傷が多くなり、荒引線の製造が困難となるの
で、Ｓｎの約１／２にしたものである。なお、約１／２
という値は実験により求めたものである。The reason for setting the above Sn to 100 to 400 ppm is 100 when the Sn / Mg weight ratio is 2 ± 0.2.
If it is less than ppm, the strength is insufficient, and it is 400
This is because if the content is higher than ppm, the conductivity will decrease. That is, since it is considered that Sn having a larger atomic radius has a larger influence on the strength than Sn, in the present invention, Sn is the main element with emphasis on strength. Here, when Sn is added to Cu as a main element, since about 400 ppm is the limit from the viewpoint of conductivity, a part of Sn is Mg.
Replaced by At this time, if the addition amount of Mg is small, the effect on the strength is small. On the other hand, if the addition amount of Mg is too large, there are many surface scratches on the rough wire when casting, particularly when manufacturing the rough wire by continuous casting. Since it is difficult to manufacture the rough wire, it is about 1/2 of Sn. About 1/2
The value is obtained by experiment.
【００１１】[0011]
【実施例】以下、本発明の銅合金線について詳細に説明
する。EXAMPLES The copper alloy wire of the present invention will be described in detail below.
【００１２】[0012]
【表１】 Ｓｎ，Ｍｇ，及びＰを表１に示す配合で原料である無酸
素銅（ＯＦＣ）に添加し、これを真空中（１０-4ｔｏｒ
ｒ）にて約１Ｋｇに溶解した後、Ａｒ雰囲気中で外径８
ｍｍの銅線を鋳造すると共に、外径８ｍｍから外径０．
００２５４ｍｍに伸線してサンプル１から５までの本発
明品の銅合金線を製造した。ここで、使用した母合金組
成は、それぞれ９９．９％Ｓｎ，６０％Ｍｇ−Ｃｕ，１
５％Ｐ−Ｃｕである。[Table 1] Sn, Mg, and P were added to the raw material oxygen-free copper (OFC) in the composition shown in Table 1, and this was added in a vacuum (10 −4 torr).
r), dissolved in about 1 kg, then outside diameter 8 in Ar atmosphere
mm copper wire is cast, and an outer diameter of 8 mm to an outer diameter of 0.
Wires were drawn to 00254 mm to produce the copper alloy wires of Samples 1 to 5 of the present invention. Here, the mother alloy compositions used were 99.9% Sn, 60% Mg-Cu, 1 respectively.
It is 5% P-Cu.
【００１３】一方、比較品としてＳｎを５２ｐｐｍ添加
したものをサンプル６，Ｐを１００ｐｐｍ添加したもの
をサンプル７，Ｐを含有しないものをサンプル８，添加
物を含くまない酸素含有量３００ｐｐｍの銅線をサンプ
ル９とした。On the other hand, as comparative products, 52 ppm of Sn was added as sample 6, P of 100 ppm was added as sample 7, P was not contained in sample 8, and copper wire containing no additive of 300 ppm in oxygen content. Was designated as Sample 9.
【００１４】次に、本発明品のサンプル１から５の銅合
金線と、比較品の６から９の銅合金線（銅線を含む）に
対して、引張強さ，導電率，曲げ回数といった特性試験
を行った。このうち、曲げ回数試験は、銅合金線の７本
撚り線を絶縁被覆した後、曲げ半径２．５Ｒ，荷重５０
ｇにて９０ｄｅｇ曲げ（繰り返し曲）を行い、その回数
を測定した。Next, with respect to the copper alloy wires of Samples 1 to 5 of the present invention product and the copper alloy wires of Comparative Product 6 to 9 (including copper wire), the tensile strength, the electrical conductivity, the number of bending, etc. A characteristic test was conducted. Of these, in the bending number test, after 7 wires of copper alloy wire were insulation-coated, the bending radius was 2.5R and the load was 50R.
90 deg bending (repeating bending) was performed at g, and the number of times was measured.
【００１５】表１から判るように、上記したバッチ式の
鋳造方式によって製造されたサンプル１から９の銅合金
線は、Ｐの含有の有無にかからわず表面品質（表面傷の
有無）が良好になっていることが判る。一方、Ｐの含有
量を増やすことによって導電率は低下し、Ｐを１００ｐ
ｐｍ含有したサンプル７の銅合金線は、７０ｋｇ／ｍｍ
2 以上の引張強さを有しているものの導電率が８８．５
ＩＡＣＳ％と大幅に低下しており、本発明品の用途とし
て適さないものになっている。As can be seen from Table 1, the copper alloy wires of Samples 1 to 9 produced by the above-mentioned batch type casting method have a surface quality (whether there is a surface flaw) regardless of whether P is contained or not. You can see that it is getting better. On the other hand, the conductivity decreases as the P content increases, and
The copper alloy wire of sample 7 containing pm is 70 kg / mm
Despite having a tensile strength of 2 or more, the conductivity is 88.5.
It is significantly reduced to IACS%, which makes it unsuitable for use as the product of the present invention.
【００１６】また、Ｓｎの含有量が５２ｐｐｍのサンプ
ル６の銅合金線は、引張強さ，曲げ回数共にサンプル９
の銅線に近い特性になっており、機械的強度が低くなっ
ていることを示している。これに対し、Ｓｎを少なくと
も１００ｐｐｍ以上含有したサンプル１から５の本発明
品の銅合金線は、引張強さ，曲げ回数共に高い特性を備
えている。なお、Ｐを含有させないでＳｎを３００ｐｐ
ｍおよびＭｇを１５１ｐｐｍ含有させた銅合金線も、引
張強さ，曲げ回数については何れも高い特性を備えてい
る。Further, the copper alloy wire of sample 6 having a Sn content of 52 ppm has a tensile strength and a bending frequency of sample 9
The characteristics are close to those of the copper wire, indicating that the mechanical strength is low. On the other hand, the copper alloy wires of samples 1 to 5 of the present invention containing at least 100 ppm or more of Sn have high tensile strength and high bending frequency. It should be noted that Sn is 300 pp without containing P.
The copper alloy wire containing 151 ppm of m and Mg also has high properties in terms of tensile strength and bending frequency.
【００１７】以上の結果から判るように、上記したバッ
チ式の鋳造方式による製造ではＰを含有させなくても表
面傷の発生を防いで断線を防ぐことができる。つまり、
表面傷も耐断線も何れも良好である。また、Ｓｎの含有
量を１００から４００ｐｐｍにすると、導電率をそれ程
低下させずに引張強さと曲げ回数を向上させることがで
きる。従って、抗張力と導電性が高く、且つ、断線し難
いといった特性を提供することができる。As can be seen from the above results, in the production by the above-mentioned batch type casting method, the occurrence of surface scratches can be prevented and the disconnection can be prevented even if P is not contained. That is,
Both surface scratches and breakage resistance are good. Further, when the Sn content is 100 to 400 ppm, the tensile strength and the number of times of bending can be improved without reducing the conductivity so much. Therefore, it is possible to provide the characteristics that the tensile strength and the conductivity are high and the wire is hard to break.
【００１８】表２には、以上の銅合金線を経済的に量産
化するためにＳＣＲ連続鋳造にて製造した銅合金線の配
合，及び特性が示されている。ここで、母合金は上記方
式のものと同一のものを使用し、表面傷は外径８ｍｍの
段階で観察した。Table 2 shows the composition and characteristics of the copper alloy wire produced by SCR continuous casting in order to economically mass-produce the above copper alloy wire. Here, the same mother alloy as that used in the above system was used, and surface scratches were observed at a stage of an outer diameter of 8 mm.
【００１９】[0019]
【表２】 表２から判るように、Ｐを２〜４０ｐｐｍを含有したサ
ンプル１０（本発明品）は表面傷の発生がなく、外径
０．０２５４ｍｍまで伸線する際、断線することがなか
った。これに対し、Ｐを含有していないサンプル１４の
比較品は、表面傷の発生があり、伸線時に断線が多かっ
た。なお、Ｐの含有量の多いサンプル１３の比較品は、
導電率が低い。Ｐを含む合金の表面傷，耐断線性の特性
の良い理由として、Ｐを添加することによってキャスト
バー中の欠陥を低減しているものと考えられる。すなわ
ち、連続鋳造ではその低酸素化工程において、Ｏ2 が少
なくなるとＨ2 が発生してブローホールを生じ易くなる
と考えられるが、Ｐの存在はこのＨ2 ガスの発生を抑制
する効果を奏するものと推定される。[Table 2] As can be seen from Table 2, Sample 10 (invention product) containing 2 to 40 ppm of P did not cause surface scratches and did not break when drawn to an outer diameter of 0.0254 mm. On the other hand, the comparative product of the sample 14 not containing P had surface scratches and had many wire breaks during wire drawing. In addition, the comparative product of Sample 13 having a large P content is
Low conductivity. It is considered that the addition of P reduces defects in the cast bar as a reason for the good surface scratch resistance and disconnection resistance of the alloy containing P. That is, in continuous casting, it is considered that H 2 is generated and blowholes are easily generated when O 2 is reduced in the oxygen reduction step, but the presence of P has an effect of suppressing the generation of H 2 gas. It is estimated to be.
【００２０】[0020]
【発明の効果】以上説明したように、本発明の銅合金線
によると、Ｐを２〜４０ｐｐｍ含有した酸素含有量５０
ｐｐｍ以下のＣｕに、ＳｎとＭｇをＳｎ／Ｍｇの重量比
にして２±０．２の重量比で、且つ、Ｓｎが１００〜４
００ｐｐｍとなるように含有させたため、抗張力と導電
性を高くし、且つ、断線し難く、また連続鋳造法により
容易に製造できるようにすることができる。従って、本
発明の用途に適した銅合金線を低コストで供給すること
ができる。As described above, according to the copper alloy wire of the present invention, the oxygen content containing P of 2 to 40 ppm is 50.
In Cu of less than or equal to ppm, Sn / Mg is in a weight ratio of Sn / Mg of 2 ± 0.2, and Sn is 100 to 4
Since the content is set to be 00 ppm, it is possible to increase the tensile strength and the conductivity, prevent the wire from breaking easily, and facilitate the production by the continuous casting method. Therefore, the copper alloy wire suitable for the use of the present invention can be supplied at low cost.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 根本 孝 茨城県日立市日高町５丁目１番１号 日立 電線株式会社パワーシステム研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Nemoto 5-1-1 Hidaka-cho, Hitachi-shi, Ibaraki Hitachi Cable Co., Ltd. Power Systems Laboratory
Claims (1)
５０ｐｐｍ以下のＣｕに、ＳｎとＭｇをＳｎ／Ｍｇの重
量比にして２±０．２の重量比で、且つ、Ｓｎが１００
〜４００ｐｐｍとなるように含有させたことを特徴とす
る銅合金線。1. Cu containing 2 to 40 ppm of P and having an oxygen content of 50 ppm or less, Sn and Mg in a weight ratio of Sn / Mg of 2 ± 0.2, and Sn of 100.
A copper alloy wire, which is contained so as to be 400 ppm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14577393A JPH06330210A (en) | 1993-05-25 | 1993-05-25 | Copper alloy wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14577393A JPH06330210A (en) | 1993-05-25 | 1993-05-25 | Copper alloy wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06330210A true JPH06330210A (en) | 1994-11-29 |
Family
ID=15392837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14577393A Pending JPH06330210A (en) | 1993-05-25 | 1993-05-25 | Copper alloy wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06330210A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022224940A1 (en) * | 2021-04-19 | 2022-10-27 | 株式会社 Kmct | Corrosion-resistant copper alloy, copper alloy pipe and heat exchanger |
-
1993
- 1993-05-25 JP JP14577393A patent/JPH06330210A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022224940A1 (en) * | 2021-04-19 | 2022-10-27 | 株式会社 Kmct | Corrosion-resistant copper alloy, copper alloy pipe and heat exchanger |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1973120B1 (en) | Electrical wire conductor for wiring, electrical wire for wiring, and their production methods | |
| US20080196923A1 (en) | Aluminum conducting wire | |
| JP2001148206A (en) | Material for ultra thin copper alloy wire and its method of manufacturing | |
| JP2008038207A (en) | Electroconductive material of aluminum alloy for wiring, and wiring material using the same | |
| JP2661462B2 (en) | Straight line excellent in repeated bending property: Cu alloy ultrafine wire of 0.1 mm or less | |
| JP2010280969A (en) | Copper-clad aluminum alloy wire | |
| JP6080336B2 (en) | Electric wire / cable | |
| KR102544287B1 (en) | Aluminum alloy wire, aluminum alloy twisted wire, coated electrical wire, and electrical wire with terminal | |
| JPH04230905A (en) | Copper-clad aluminum composite wire and manufacture thereof | |
| JP3324228B2 (en) | Copper wire for ultrafine wire and method of manufacturing the same | |
| JP2005174554A (en) | Aluminum conductive wire | |
| JP3279374B2 (en) | Copper alloy wire and method of manufacturing the same | |
| JP2010205549A (en) | Method of manufacturing wire conductor, and wire conductor | |
| JPH06330210A (en) | Copper alloy wire | |
| JP2002363668A (en) | Conductor for bending resistant cable and production method therefor | |
| JPH08277447A (en) | Production of conductive aluminum alloy wire | |
| JPH06240388A (en) | Copper alloy wire and its production | |
| JPH0689621A (en) | Manufacture of high conductivity and high strength stranded wire | |
| JPH0120018B2 (en) | ||
| JP2008066108A (en) | Copper conductor for audio/video signal | |
| JP2002302727A (en) | Electroconductive, heat-resistant aluminum alloy wire and production method therefor | |
| JPH11213761A (en) | Composite conductor and its manufacture | |
| JP3275506B2 (en) | Automotive wire and method of manufacturing the same | |
| JP2001181811A (en) | Method of manufacturing chromium-zirconium-type copper alloy wire | |
| JP2000073153A (en) | Copper alloy wire and its production |