JPH0632627A - Method for processing glass substrate and production of flat display - Google Patents

Abstract

PURPOSE:To form a through-hole in a glass substrate by cutting a circular groove in a state where a thin-wall part is left on one main surface of the glass substrate and then breaking the thin-wall part. CONSTITUTION:A cylindrical drill 5 rotating at a high speed in the circumferential direction is brought into contact with a chip attaching position of a glass substrate 8 for cathode panel from the face on the opposite side of an electrode forming face to continue to cut the contact face and a circular groove 6 is cut in a state where several 10 to 100mum thickness is left on the electrode-forming face side of the glass substrate without passing through the glass substrate 8 in the glass substrate 8. Various kinds of processing are carried out on the left smooth face of the glass substrate 8 in order to form the electrode and a cathode panel is prepared. Then, the thin-wall part is sucked with a vacuum suction device so as to encircle the thin-wall part from the electrode forming face of the glass substrate 8 and the glass thin-wall part is broken by suction force and passed through a chip tube-attaching hole and a part encircled by the groove 6 and broken pieces of the glass thin-wall part are sucked. Then, a chip tube is attached to the chip tube attaching hole to provide a flat display free from the possibility of pollution and breakage of the element.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a hole in a glass substrate, and more particularly to a manufacturing method for forming a hole for attaching a chip tube of a flat display.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a flat display, it is necessary to provide a hole for vacuum suction in a glass substrate in addition to various processing for forming an electrode. It is mainly adopted that either a predetermined processing is performed on a substrate provided with a hole or a through hole is provided after a predetermined processing is performed on a substrate surface.

However, in manufacturing a flat display, if holes are formed in a glass substrate before various steps for forming electrodes, various steps for forming electrodes such as resist spin coating, film formation and etching are performed. The hole becomes an obstacle. Further, if the holes are formed after the above-mentioned steps for forming the electrodes are completed, there is a possibility that the completed element may be contaminated and destroyed by dust generated during the hole forming process.

Therefore, as shown in the cross-sectional view of FIG. 6, a hole 106 is formed up to a middle portion in the thickness direction of the glass substrate 108, and various processes for forming the above electrode are performed on the surface left as a smooth surface. Alternatively, a method of breaking the portion left as a thin wall to form a through hole is also conceivable. However, if the entire glass substrate part that is removed as a through hole is thinned,
There is a problem that the thin-walled portion of the glass may be damaged by the action of a vacuum chuck, thermal shock, etc. during the vacuum panel manufacturing process.

[0005]

The present invention has been proposed in view of such circumstances. As described above, it is an object of the present invention to provide a processing method for forming a hole in a glass substrate that does not hinder other steps, and further, to process a chip tube mounting hole. It is an object of the present invention to provide a method for manufacturing a flat display in which the steps do not damage the glass substrate itself or hinder other steps.

[0006]

In order to achieve the above-mentioned object, the present invention cuts an annular groove from a main surface of a glass substrate while leaving a thin portion on the glass substrate, and thereafter cutting the thin portion. It is characterized in that the glass substrate is broken to provide a through hole. Further, the flat display manufacturing method according to the second invention of the present application is such that an annular groove is cut from the surface of the glass substrate opposite to the electrode formation surface at the chip tube mounting position, leaving a thin portion in the glass substrate, After performing a predetermined step for forming an electrode on the glass substrate, subsequently, the thin-walled portion is destroyed and removed by vacuum suction from the electrode forming surface side to provide a chip tube mounting hole. Is.

By applying the present invention, a groove is cut leaving a thin portion from the one main surface of the glass substrate, the surface opposite to this is processed as a smooth surface, and the thin portion is broken. When the through hole is provided, the process for forming the hole does not limit the processing on the opposite surface. For example, when manufacturing a flat display, if you cut the annular groove leaving a thin portion on the glass substrate,
One surface of the glass substrate exists as a smooth surface, and various steps such as resist spin coating, film formation, and etching for electrode formation can be performed on this smooth surface. And
After the step for forming the electrode is completed, the thin portion is broken by vacuum suction from the electrode forming surface side. Dust such as glass fragments accompanying the destruction is sucked into the suction device and removed, so that the hole for attaching the chip tube penetrates through the glass substrate without contaminating or destroying the completed element on the substrate surface.

[0008]

Since the annular groove is cut while leaving a thinner portion than one surface of the glass substrate, the surface on the opposite side is left as a smooth surface. Therefore, it is possible to perform fine processing that can be performed only on a smooth surface. Since the groove is provided in an annular shape, the area of the thin portion is small, distortion is unlikely to occur on the surface of the glass substrate, and disturbance of the temperature distribution of the glass substrate can be minimized.

Further, the thin portion of the glass substrate can be easily broken to form a hole. Particularly, when the thin glass portion is broken by the pressure of vacuum suction, dust generated when the hole penetrates is sucked by the suction device. Therefore, dust does not adhere to the substrate or damage the substrate.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the FED
The present invention is applied to a method of processing a chip tube mounting hole of a flat display for (field emission display).

The FED flat display, as shown in FIG. 2, is a cathode panel 1 which emits electrons, a front panel 4 which is a phosphor screen, and a vacuum drawing for creating a vacuum between the panels 1 and 4. And a tip tube 3 which is provided in the cathode panel 1 and has a tip tube mounting hole 2
It is configured to be installed at the position. An enlarged view of the cathode panel 1 and the front panel 4 is shown in FIGS.

As shown in FIG. 4, a control line 9 is provided on a glass substrate 8 for a cathode panel, a conical cathode 10 is further provided on the control line 9, and an opening 14 is provided around the cathode 10. Insulator 11 is formed. Also,
On this insulator 11, there is a gate electrode 12 whose end is formed in the vicinity of the tip of the conical cathode 10, and the cathode panel 1 is formed as described above.
The cathodes 10 are arranged in a matrix as shown in FIG. On the other hand, the front panel 4 facing the cathode panel 1
Is a glass substrate 16 coated with fluorescent stripes 15.

In the FED flat display having such a structure, when a voltage is applied between the control line 9 and the gate electrode 12, a potential is supplied from the control line 9 to the cathode 10, and an electron is emitted from the tip with high electrolytic strength. Is released. The emitted electrons pass through the opening 14 and enter the fluorescent stripe 15 of the front panel 4 as indicated by an arrow in the figure, causing the fluorescent dots to emit light.

A method of manufacturing a flat display for FED will be described below, focusing on a method of forming the mounting hole 2 of the chip tube 3 for vacuuming in the cathode panel 1.

As shown in FIG. 1, a cylindrical drill 5 is brought into contact with the tip tube mounting position of the glass substrate 8 for the cathode panel from the surface opposite to the electrode forming surface. The drill 5 rotates at high speed in the circumferential direction, and cuts an annular groove 6 in the glass substrate 8 in order to continue cutting the contact surface of the glass substrate 8. The groove 6 does not penetrate the glass substrate 8, and a thickness of several tens to 100 μm is left on the electrode formation surface side of the glass substrate 8.

Then, on the surface of the glass substrate 8 which remains as a smooth surface, various processes for forming the above-mentioned electrodes (formation of control lines 9 and insulators 11, formation of a cathode material by electron beam evaporation, etc., The cathode panel 1 is prepared by applying an electronic grade resist by a spin coating method, etching, etc.).

After that, as shown in FIG. 3, a vacuum suction machine is formed so as to surround the electrode (not shown) forming surface of the glass substrate 8 so as to surround the thinned portion due to the provision of the annular groove 6. The suction port 7 is applied to suck. The thin portion of the glass is broken by this suction force and the tip tube mounting hole 2
Penetrates. The fragments surrounded by the groove 6 and the broken glass thin-walled parts are sucked by the vacuum suction device.

If necessary, simultaneously with vacuum suction, the portion surrounded by the groove 6 is lightly hit from the surface of the glass substrate 8 opposite to the electrode forming surface (the surface provided with the groove 6) to assist the destruction. You can do it.

When the tip tube mounting hole 2 is provided in the cathode panel 1 as described above, the tip tube 3 is mounted,
It is assembled to face the front panel 4 to form a flat display for FED.

Although the present invention is very effective as a method for processing the chip tube mounting hole of the flat display for FED described above, the present invention is not limited to this, and the panel hole of a flat panel display such as a VFD (fluorescent display tube) is used. Can be used as a processing method. Furthermore, the technique can be applied to devices that require a vacuum such as vacuum microchips.

Further, the present invention can be widely used as a perforating method when it is desired to utilize one surface as a flat surface, and the step of penetrating a hole for injecting or sucking a substance such as gas or liquid is performed by injecting the substance. Alternatively, it may be used as a perforation method that can be performed simultaneously with the suction step. That is, when you want to provide a hole for injecting or sucking a substance such as gas or liquid,
If the annular groove is cut in advance while leaving the thin portion on the substrate, the thin portion is destroyed by the pressure of injection or suction, and the injection or suction can be started from that moment.

By the way, in the present invention, the tool for cutting the groove is not limited to the annular tool. For example, the same processing is possible even if the ring is divided into four. The shape of the groove is not limited to the annular shape. For example, a polygonal shape such as a hexagon may be used. It is also possible to arrange annular grooves in a line to form an oval shape. Any shape may be used as long as the thin portion of the glass is processed.

The breaking method is not limited to vacuum suction.
The pressure at the time of injecting the substance may be used as described above, and if the suction or injection pressure is insufficient, it may be given a shock such as a blow. It is also possible to use a burner to burn out the thin portion or a tool to break it. Furthermore, the object to be punched is not limited to glass, but can be applied to ceramics, metals, and the like.

[0024]

As shown in the above examples, when the glass substrate is left thin and the groove is cut, one side remains as a completely smooth surface, and the glass substrate surface is not easily distorted to disturb the temperature distribution. Since it is also minimized, it is possible to perform fine processing such as various steps for forming electrodes on a glass substrate, which are greatly affected by the surface condition of the substrate.

Further, when the thin glass portion is broken by the vacuum suction pressure, dust generated when the hole penetrates is sucked by the suction device, so that the dust contaminates or destroys the completed element on the glass substrate. There is no need to worry. As described above, it is possible to provide a method for manufacturing a flat display in which the hole forming step does not damage the glass substrate itself or hinder other steps.

[Brief description of drawings]

FIG. 1 is a perspective sectional view of a glass substrate and a drill in which a groove is provided by applying the present invention.

FIG. 2 is a schematic perspective view showing main components of a flat display.

FIG. 3 is a schematic diagram showing how a thin portion is broken by vacuum suction.

FIG. 4 is an enlarged sectional view schematically showing the structures of a cathode panel and a front panel in a flat display.

FIG. 5 is an enlarged perspective view schematically showing structures of a cathode panel and a front panel in a flat display.

FIG. 6 is a perspective sectional view of a substrate in which a groove is provided by leaving a thin portion by a conventional method.

[Explanation of Codes] 1 ... Cathode panel 2 ... Tip tube mounting hole 3 ... Tip tube 4 ... Front panel 5 ... Drill 6 ... Groove 7 ... Vacuum suction device suction port 8 ... Glass substrate for cathode panel 9 ... Control line 10 ... Cathode 11 ... Insulator 12 ... Gate electrode 14 ... Opening 15 ... Fluorescent stripe 16 ... Front panel Glass substrate

Claims (2)

[Claims] 1. A through hole is provided in the glass substrate by cutting an annular groove from the main surface of the glass substrate, leaving a thin portion in the glass substrate, and then breaking the thin portion. Glass substrate processing method. 2. A ring-shaped groove is cut from the surface of the glass substrate opposite to the electrode formation surface at the chip tube mounting position, leaving a thin portion in the glass substrate, and a predetermined electrode for forming an electrode is formed on the glass substrate. After performing the step (1), subsequently, the thin-walled portion is destroyed and removed by vacuum suction from the electrode formation surface side to provide a chip tube mounting hole, and a method for manufacturing a flat display.