JPH0632368B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0632368B2 JPH0632368B2 JP61148786A JP14878686A JPH0632368B2 JP H0632368 B2 JPH0632368 B2 JP H0632368B2 JP 61148786 A JP61148786 A JP 61148786A JP 14878686 A JP14878686 A JP 14878686A JP H0632368 B2 JPH0632368 B2 JP H0632368B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- sealing member
- hole portion
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は表面実装用両面プリント配線板等のプリント配
線板に関する。The present invention relates to a printed wiring board such as a double-sided printed wiring board for surface mounting.
［従来の技術］ 従来、両面プリント配線板における導通は例えば第２図
に示す如く絶縁基板１に貫通したスルーホール２に、両
面の回路３，４を導通する導体５をメッキにより形成し
たスルーホール部６を介して構成されている。[Prior Art] Conventionally, the conduction in a double-sided printed wiring board is, for example, as shown in FIG. 2, a through hole 2 penetrating an insulating substrate 1 and a conductor 5 for conducting circuits 3 and 4 on both sides formed by plating. It is configured via the section 6.
尚、図中７は両面の回路３，４に施されたソルダーレジ
ストを示すものである。Reference numeral 7 in the figure shows a solder resist applied to the circuits 3 and 4 on both sides.
又、従来の第１図のプリント配線板におけるスルーホー
ル部６は、当該プリント配線板に対する電子部品の実装
工程において半田付けの際の加熱工程を経る等、加熱雰
囲気にさらされるとともにこうして形成されたプリント
配線板の取扱い、その他の運搬，管理にあるいはプリン
ト配線板自体が所要の機器に装着された状態においての
種々の環境雰囲気中にさらされることにより前記スルー
ホール部６が酸化したり、あるいは、プリント配線板自
体がスルーホール部６の存在によって耐水，耐湿性や強
度が損なわれる欠点を有するものであった。Further, the through hole portion 6 in the conventional printed wiring board of FIG. 1 is formed in this manner while being exposed to a heating atmosphere, such as through a heating step during soldering in a mounting step of electronic components on the printed wiring board. The through-hole portion 6 is oxidized when the printed wiring board is handled, transported or managed for other purposes or exposed to various environmental atmospheres when the printed wiring board itself is mounted on a required device, or The printed wiring board itself has a drawback that water resistance, moisture resistance and strength are impaired due to the presence of the through holes 6.
因って、従来のプリント配線板における欠点を除去する
ためにスルーホール部の導体が保護コーティング材に埋
まるように形成した厚膜回路基板が特開昭６１−１２１
４９１号公報所載の発明により公開されている。Therefore, in order to eliminate the defects in the conventional printed wiring board, a thick film circuit board in which the conductor in the through hole portion is buried in the protective coating material is disclosed in Japanese Patent Laid-Open No. 61-121.
It is disclosed by the invention described in Japanese Patent Publication No. 491.
［発明が解決しようとする問題点］ しかるに、前記発明における保護コーティング材はスル
ーホール部の絶縁性及びマイグレーション等の信頼性を
向上することを目的とするもので、エポキシ樹脂あるい
はガラス系材料を保護コーティング材として使用するも
ので、プリント配線板の電子部品の実装工程においての
半田付けの際の加熱工程に対する耐熱性をも考慮された
ものではなく、前記欠点は依然として存在するものであ
った。[Problems to be Solved by the Invention] However, the protective coating material in the invention is intended to improve reliability such as insulation and migration of the through hole portion, and protects the epoxy resin or the glass-based material. It is used as a coating material, and the heat resistance to the heating process at the time of soldering in the mounting process of electronic parts of a printed wiring board is not considered, and the above-mentioned drawbacks still exist.
従って、本発明はかかる欠点の除去を目的として開発さ
れたものでスルーホール部の酸化を防止し、熱ストレス
に強く、かつ耐水，耐湿性並びに耐久性に富み信頼性に
優れたプリント配線板の提供を目的とするものである。Therefore, the present invention was developed for the purpose of eliminating such defects, and prevents the oxidation of the through holes, resists thermal stress, and is excellent in water resistance, moisture resistance, durability, and reliability of a printed wiring board. It is intended to be provided.
［問題点を解決するための手段］ 本発明プリント配線板は、絶縁基板１に貫通したスルー
ホール２に両面の回路３，４を導通する導体５をメッキ
により形成したスルーホール部６に封止部材１０を充填
することにより形成したプリント配線板１１において、 前記封止部材１０を、合成樹脂にカーボンあるいは銀を
含有し、耐熱，耐候性並びに電導性を有するペーストを
充填することにより形成したことを特徴とするものであ
る。[Means for Solving Problems] In the printed wiring board of the present invention, the through hole 2 penetrating the insulating substrate 1 is sealed with the through hole portion 6 formed by plating the conductor 5 for conducting the circuits 3 and 4 on both sides. In printed wiring board 11 formed by filling member 10, sealing member 10 is formed by filling a paste containing carbon or silver in a synthetic resin and having heat resistance, weather resistance and conductivity. It is characterized by.
［作用］ 本発明プリント配線板は導通用スルーホール部に充填し
た封止部材によりスルーホール部の耐酸化作用を付与す
るとともに各スルーホール部の存在によるプリント配線
板自体の熱劣化，耐水，耐湿性等の耐候性および強度の
劣化を阻止する作用を有する。[Operation] In the printed wiring board of the present invention, the sealing member filled in the conduction through hole imparts oxidation resistance to the through hole portion, and heat resistance, water resistance, and moisture resistance of the printed wiring board itself due to the presence of each through hole portion. It has an effect of preventing deterioration of weather resistance such as properties and strength.
［実施例］ 以下本発明プリント配線板の一実施例を図面とともに説
明する。[Embodiment] An embodiment of the printed wiring board of the present invention will be described below with reference to the drawings.
第１図は本発明プリント配線板の実施例を示す要部の断
面図である。FIG. 1 is a sectional view of a main part showing an embodiment of a printed wiring board according to the present invention.
しかして、同図において、１０はスルーホール部６に充
填した封止部材で、かかる封止部材としは、エポキシ樹
脂等の熱硬化型の合成樹脂材料あるいはアクリエポキシ
樹脂等の光硬化型の合成樹脂材料から成るものである。In the figure, 10 is a sealing member filled in the through-hole portion 6, and as the sealing member, a thermosetting synthetic resin material such as epoxy resin or a photocuring synthetic material such as acrylic resin is used. It is made of a resin material.
以下には、前記封止部材１０に使用するペーストの組成
例を示す。Below, the composition example of the paste used for the said sealing member 10 is shown.
ペーストの組成例 （１） 銀 ４０〜７０ ｗｔ％ バインダー（エポキシ系樹脂） １０〜２０ ｗｔ％ 溶剤（ブチルカルビドル系） ２０〜４０ ｗｔ％ ペーストの組成例 （２） カーボン ２０〜５０ ｗｔ％ バインダー（フェノール系樹脂）２０〜３０ ｗｔ％ 溶剤（ブチルセロルルブ系） ３０〜５０ ｗｔ％ しかして、これらの組成から成る銀ペーストあるいはカ
ーボンペーストをスクリーン印刷方法等の手段によりプ
リント配線板１１の各導通用スルーホール部６中に充填
した後、これを硬化することにより形成する。Composition example of paste (1) Silver 40 to 70 wt% Binder (epoxy resin) 10 to 20 wt% Solvent (butyl carbidol system) 20 to 40 wt% Composition example of paste (2) Carbon 20 to 50 wt% Binder (Phenolic resin) 20 to 30 wt% Solvent (Butylcerollube) 30 to 50 wt% Then, the silver paste or carbon paste having these compositions is passed through each of the printed wiring board 11 by means such as a screen printing method. It is formed by filling the hole portion 6 and then hardening it.
特に、前記合成樹脂材料から成るペースト中にはカーボ
ンあるいは銀の金属あるいは非金属性材料を含有して封
止部材１０に耐熱性および耐候性を付与して成る。In particular, the paste made of the synthetic resin material contains a metal such as carbon or silver or a non-metal material to impart heat resistance and weather resistance to the sealing member 10.
また、図中、第２図示の構成と同一構成部分については
同一番号を付して、その説明を省略することにする。Further, in the figure, the same components as those of the second configuration are designated by the same reference numerals, and the description thereof will be omitted.
［発明の効果］ 本発明プリント配線板によれば、導通用スルーホール部
に耐熱，耐候性等の材料を充填して封止部材を形成する
ことにより、プリント配線板に対する電子部材等の実装
工程における導通用スルーホール部の酸化を防止するこ
とができるとともに製品としてのプリント配線板の取り
扱い，管理，保管および使用に際する耐水，耐湿性等の
耐候性並びに耐久性を向上し得るもので信頼性に優れた
プリント配線板を提供することができる。[Effects of the Invention] According to the printed wiring board of the present invention, a step of mounting an electronic member or the like on a printed wiring board is performed by filling a material for heat resistance, weather resistance and the like in the through hole for conduction to form a sealing member. Is reliable because it can prevent oxidation of the conductive through-holes and improve the weather resistance such as water resistance and moisture resistance and durability when handling, managing, storing and using the printed wiring board as a product. A printed wiring board having excellent properties can be provided.
特に、前記合成樹脂材料から成るペースト中にはカーボ
ンあるいは銀の耐熱，耐候性を有する金属あるいは非金
属材料を含有して実施するもので、かかる構成により前
記封止部材１０に耐熱性および耐候性を付与することが
でき、同時に、スルーホール部６の導電体皮膜の保護に
加えて、当該封止部材１０を形成する銀ペーストあるい
はカーボンペーストの導電性によってスルーホール部６
自体の導通信頼性を向上することができる。In particular, the paste made of the synthetic resin material contains a metal or non-metal material having heat resistance and weather resistance such as carbon or silver, and with such a configuration, the sealing member 10 has heat resistance and weather resistance. At the same time, in addition to protecting the conductor film of the through-hole portion 6, the through-hole portion 6 is protected by the conductivity of the silver paste or carbon paste forming the sealing member 10.
The conduction reliability of itself can be improved.
第１図は本発明プリント配線板の実施例を示す要部の断
面図、第２図は従来のプリント配線板の部分断面図であ
る。 １……絶縁基板 ２……スルーホール ３，４……回路 ５……導体 ６……スルーホール部 ７……ソルダーレジスト １０……封止部材 １１……プリント配線板FIG. 1 is a sectional view of a main part showing an embodiment of a printed wiring board of the present invention, and FIG. 2 is a partial sectional view of a conventional printed wiring board. 1 ... Insulating substrate 2 ... Through hole 3,4 ... Circuit 5 ... Conductor 6 ... Through hole part 7 ... Solder resist 10 ... Sealing member 11 ... Printed wiring board
───────────────────────────────────────────────────── フロントページの続き (72)発明者 川上 伸 埼玉県入間郡三芳町藤久保1106 日本シイ エムケイ株式会社内 (56)参考文献 特開 昭61−121491（ＪＰ，Ａ) 特開 昭57−198697（ＪＰ，Ａ) 特開 昭56−73498（ＪＰ，Ａ) 特開 昭55−151073（ＪＰ，Ａ) 実開 昭60−144263（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Shin Kawakami 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Nihon CMK Co., Ltd. (56) References JP 61-121491 (JP, A) JP 57- 198697 (JP, A) JP 56-73498 (JP, A) JP 55-151073 (JP, A) Actual development 60-144263 (JP, U)
Claims (1)
面の回路３，４を導通する導体５をメッキにより形成し
たスルーホール部６に封止部材１０を充填することによ
り形成したプリント配線板１１において、 前記封止部材１０を、合成樹脂にカーボンあるいは銀を
含有し、耐熱，耐候性並びに電導性を有するペーストを
充填することにより形成したことを特徴とするプリント
配線板。1. A printed wiring board formed by filling a sealing member 10 into a through hole portion 6 formed by plating a through hole 2 penetrating an insulating substrate 1 with a conductor 5 for conducting circuits 3 and 4 on both surfaces. 11. The printed wiring board according to 11, wherein the sealing member 10 is formed by filling a synthetic resin containing carbon or silver with a paste having heat resistance, weather resistance and electrical conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61148786A JPH0632368B2 (en) | 1986-06-25 | 1986-06-25 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61148786A JPH0632368B2 (en) | 1986-06-25 | 1986-06-25 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS635592A JPS635592A (en) | 1988-01-11 |
| JPH0632368B2 true JPH0632368B2 (en) | 1994-04-27 |
Family
ID=15460648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61148786A Expired - Fee Related JPH0632368B2 (en) | 1986-06-25 | 1986-06-25 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632368B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6090474A (en) | 1998-09-01 | 2000-07-18 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61121491A (en) * | 1984-11-19 | 1986-06-09 | 松下電器産業株式会社 | Thick film circuit board |
-
1986
- 1986-06-25 JP JP61148786A patent/JPH0632368B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS635592A (en) | 1988-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |