JPH06316018A - Damping metallic plate and manufacture thereof - Google Patents

Damping metallic plate and manufacture thereof

Info

Publication number
JPH06316018A
JPH06316018A JP10844293A JP10844293A JPH06316018A JP H06316018 A JPH06316018 A JP H06316018A JP 10844293 A JP10844293 A JP 10844293A JP 10844293 A JP10844293 A JP 10844293A JP H06316018 A JPH06316018 A JP H06316018A
Authority
JP
Japan
Prior art keywords
damping
metal plate
vibration
conductive filler
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10844293A
Other languages
Japanese (ja)
Inventor
Ryuichi Ishida
隆一 石田
Hiroshi Nishikawa
廣士 西川
Motoo Sato
始夫 佐藤
Takashi Saito
隆司 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP10844293A priority Critical patent/JPH06316018A/en
Publication of JPH06316018A publication Critical patent/JPH06316018A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/06Polyurethanes from polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2350/00Acoustic or vibration damping material

Abstract

PURPOSE:To provide damping metallic plates which ensure excellent weldability without degrading damping property and adhesive property and a method for manufacturing the plates. CONSTITUTION:Damping metallic plates contain particle-like conductive filler. A porous resin layer having a porosity of 0.1-2.5% is adhered between the metallic plates. This damping metallic plate can be obtained in such a manner that a foaming resin containing particle-like conductive filler is interposed between the metallic plates, heated, and welded. Thereafter, gas is generated in the foaming resin so as to obtain the porous resin layer having the porosity of 0.1-2.5%.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、制振金属板及びその製
造方法に関し、詳しくは、微粒子状の導電性充填材を含
む発泡性樹脂を一対の金属板間に挟んで加熱圧着した
後、上記発泡性樹脂における発泡反応を制御して、所定
の気孔率を有する多孔性樹脂層とし、かくして、金属板
と樹脂層との間の接着性と制振性能とを低下させること
なく、すぐれた溶接性を確保してなる制振金属板及びそ
のような制振金属板の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibration-damping metal plate and a method for manufacturing the same, and more specifically, it is formed by sandwiching a foaming resin containing a particulate conductive filler between a pair of metal plates, followed by thermocompression bonding. By controlling the foaming reaction in the foamable resin to form a porous resin layer having a predetermined porosity, thus, it is excellent without lowering the adhesiveness between the metal plate and the resin layer and the vibration damping performance. The present invention relates to a vibration-damping metal plate that ensures weldability and a method for manufacturing such a vibration-damping metal plate.

【0002】[0002]

【従来の技術】近年、一対の金属板の間に弾性を有する
樹脂層を積層接着してなる制振金属板が騒音対策の観点
から種々の産業分野、例えば、自動車や一般車両の分野
において注目されており、従来、種々の改良が提案され
ている。例えば、特開昭62−170338号公報に
は、金属板と弾性樹脂層との接着面に接着剤を塗布する
際に、部分的に接着剤が塗布されない非接着部を導入
し、このようにして、非接着部を有する接着面を形成し
て、制振性と共に比剛性を改善してなる制振金属板が提
案されている。
2. Description of the Related Art In recent years, a vibration-damping metal plate obtained by laminating and bonding a resin layer having elasticity between a pair of metal plates has attracted attention in various industrial fields such as automobiles and general vehicles from the viewpoint of noise suppression. Therefore, various improvements have been conventionally proposed. For example, JP-A-62-170338 introduces a non-adhesive portion where the adhesive is not partially applied when applying the adhesive to the adhesive surface between the metal plate and the elastic resin layer. Then, a vibration-damping metal plate has been proposed in which a bonding surface having a non-bonding portion is formed to improve vibration damping properties and specific rigidity.

【0003】更に、金属板の間に挟み込む樹脂層に微粒
子状の導電性充填材を配合してなる溶接可能な制振金属
板も種々提案されている。しかし、このような制振金属
板においては、導電性充填材を配合しない場合にはすぐ
れた制振性能を示す樹脂であつても、導電性充填材を配
合することによつて、制振性能が大幅に低下することが
知られている。しかも、制振金属板の溶接性を高めるた
めに、このような導電性充填材の樹脂層への配合量を多
くすればするほど、また、導電性充填材と金属板との間
の密着性を高めれば高めるほど、制振性能が一層低下す
る。一般に、制振金属板の溶接性を高めるためには、金
属板と導電性充填材とを十分に密着させることが必要で
あるが、このように、金属板と導電性充填材とを十分に
密着させれば、金属板が相互に固定されるために、樹脂
層の所謂ずり変形が阻害されることとなつて、樹脂が本
来、制振性能にすぐれていても、上記のように、導電性
充填材を金属板に十分に密着させつつ、金属板の間に接
着することによつて、制振性能が大幅に低下するのであ
る。
Further, various weldable vibration-damping metal plates have been proposed in which a resin layer sandwiched between metal plates is mixed with a particulate conductive filler. However, in such a vibration-damping metal plate, even if the resin exhibits excellent vibration-damping performance when the conductive filler is not mixed, the vibration-damping performance can be improved by adding the conductive filler. Is known to decrease significantly. Moreover, in order to improve the weldability of the vibration-damping metal plate, the more the amount of the conductive filler compounded into the resin layer is increased, and the adhesion between the conductive filler and the metal plate is increased. The higher the value, the lower the damping performance. Generally, in order to improve the weldability of the damping metal plate, it is necessary to sufficiently adhere the metal plate and the conductive filler, but in this way, the metal plate and the conductive filler should be sufficiently adhered. If they are brought into close contact with each other, the metal plates are fixed to each other, so that the so-called shear deformation of the resin layer is hindered, and even if the resin originally has excellent vibration damping performance, as described above, The vibration-damping performance is significantly reduced by adhering the conductive filler between the metal plates while sufficiently adhering it to the metal plates.

【0004】[0004]

【発明が解決しようとする課題】本発明は、従来の制振
金属板とは全く異なる技術的観点に立つて、制振性及び
接着性とを低下させることなく、すぐれた溶接性を確保
してなる制振金属板及びそのような制振金属板の製造方
法を提供することを目的とする。
DISCLOSURE OF THE INVENTION The present invention is based on a technical point of view which is completely different from the conventional vibration-damping metal plate, and ensures excellent weldability without lowering the vibration-damping property and the adhesive property. It is an object of the present invention to provide a vibration-damping metal plate and a method for manufacturing such a vibration-damping metal plate.

【0005】[0005]

【課題を解決するための手段】本発明による制振金属板
は、微粒子状の導電性充填材を含み、気孔率0.1〜2.5
%の多孔性樹脂層が金属板間に接着されてなることを特
徴とする。また、本発明によるかかる制振金属板は、本
発明に従つて、微粒子状の導電性充填材を含む発泡性樹
脂を金属板間に挟み込み、上記導電性充填材を偏平にし
つつ、上記発泡性樹脂を金属板間に加熱圧着した後、上
記発泡性樹脂においてガスを発生させて、気孔率0.1〜
2.5%の多孔性樹脂層とすることを特徴とすることによ
つて得ることができる。
A vibration-damping metal plate according to the present invention contains a particulate conductive filler and has a porosity of 0.1 to 2.5.
% Of the porous resin layer is bonded between the metal plates. Further, such a vibration-damping metal plate according to the present invention is, according to the present invention, sandwiching a foamable resin containing a particulate conductive filler between metal plates to flatten the conductive filler while maintaining the foamability. After heat-pressing the resin between the metal plates, a gas is generated in the foamable resin, and the porosity is 0.1 to 1.
It can be obtained by being characterized by having a porous resin layer of 2.5%.

【0006】特に、本発明によれば、上記のようにし
て、金属板間に発泡性樹脂を塗布するに際して、その塗
布厚さを導電性充填材の粒子径の1.2〜2倍の範囲とす
ることが好ましい。即ち、本発明によれば、微粒子状の
導電性充填材を含む発泡性樹脂を一対の金属板の間に加
熱圧着し、その際、上記導電性充填材を上記圧着方向に
偏平にした後、上記発泡性樹脂を微量のガス発泡によつ
て発泡させ、気孔率を所定の範囲として、金属板に密着
している導電性充填材の微粒子と金属板との間に微細な
隙間を設けることによつて、制振性と接着性とを低下さ
せることなく、溶接性にすぐれる制振金属板を得ること
ができるのである。
In particular, according to the present invention, when the foamable resin is applied between the metal plates as described above, the application thickness is in the range of 1.2 to 2 times the particle diameter of the conductive filler. It is preferable that That is, according to the present invention, a foaming resin containing a particulate conductive filler is thermocompression-bonded between a pair of metal plates, in which case the conductive filler is flattened in the pressure-bonding direction and then foamed. A small amount of gas foaming the conductive resin, and by setting the porosity to a predetermined range, by providing a fine gap between the fine particles of the conductive filler adhered to the metal plate and the metal plate. Thus, it is possible to obtain a vibration-damping metal plate having excellent weldability without lowering the vibration-damping property and the adhesive property.

【0007】本発明においては、微粒子状の導電性充填
材として、例えば、粒子径50〜200μmの範囲のニ
ツケル微粉末が好ましく用いられる。特に、本発明によ
れば、導電性充填材を偏平にして、樹脂層と共に、金属
板間に保持した後、上記発泡性樹脂を微量のガス発泡に
よつて発泡させ、気孔率を所定の範囲として、金属板に
密着している導電性充填材の微粒子と金属板との間に微
細な隙間を設けるために、樹脂を金属板に塗布するに際
して、その全塗布厚さを導電性充填材の粒子径の1.2〜
2倍、好ましくは、1.3〜1.7倍とすることが好まし
く、通常、1.5倍程度が好ましい。更に、本発明によれ
ば、このような導電性充填材は、通常、後述する発泡性
樹脂(発泡前)に容積率にて0.5〜6容量%、好ましく
は、0.8〜5容量%の範囲で含まれる。
In the present invention, nickel fine powder having a particle diameter in the range of 50 to 200 μm is preferably used as the particulate conductive filler. In particular, according to the present invention, the conductive filler is flattened and held between the metal plates together with the resin layer, and then the expandable resin is foamed by a slight amount of gas foaming to have a porosity within a predetermined range. As for the resin to be applied to the metal plate, in order to provide a fine gap between the metal plate and the fine particles of the conductive filler that are in close contact with the metal plate, the total coating thickness of the conductive filler is Particle size 1.2-
It is preferably twice, preferably 1.3 to 1.7 times, and usually about 1.5 times. Furthermore, according to the present invention, such a conductive filler is usually contained in a later-described expandable resin (before foaming) in a volume ratio of 0.5 to 6% by volume, preferably 0.8 to 5% by volume. It is included in the range of%.

【0008】本発明において、発泡性樹脂としては、こ
の発泡性樹脂を一対の金属板の間に挟み、加熱圧着した
後に、発泡させることができる樹脂であれば、特に、限
定されるものではないが、例えば、ブロツク化ポリイソ
シアネートを含むポリエステル系樹脂や、種々の発泡剤
を含有する樹脂を挙げることができる。このブロツク化
ポリイソシアネートを含むポリエステル系樹脂は、金属
板の接着面に塗布された際に、空気中の水分を吸着し、
この後、これら一対の金属板が重ね合わせられ、加熱圧
着され、樹脂の硬化時の昇温によつて、前記ブロツク化
ポリイソシアネートが熱解離して、遊離のイソシアネー
ト基が生じ、これが上記水分と反応して、炭酸ガスを生
成し、この炭酸ガスが樹脂の発泡現象を導くのである。
In the present invention, the foaming resin is not particularly limited as long as it is a resin which can be foamed after sandwiching the foaming resin between a pair of metal plates and thermocompression bonding. For example, polyester resins containing blocked polyisocyanate and resins containing various foaming agents can be mentioned. The polyester resin containing this blocked polyisocyanate, when applied to the adhesive surface of the metal plate, adsorbs moisture in the air,
After that, the pair of metal plates are overlapped with each other, heat-pressed, and by the temperature rise during curing of the resin, the blocked polyisocyanate is thermally dissociated to generate a free isocyanate group, which reacts with the water content. By reacting, carbon dioxide gas is generated, and this carbon dioxide gas leads to the foaming phenomenon of the resin.

【0009】上述したような導電性充填材を含む発泡性
樹脂は、それが含む導電性充填材の粒子径にもよるが、
通常、金属板に5〜100μm、好ましくは、10〜6
0μmの範囲の全塗布厚さとなるように塗布される。本
発明によれば、例えば、上述したようなブロツク化ポリ
イソシアネートを含むポリエステル系樹脂を用いる場合
は、この樹脂を金属板に塗布した後、金属板を重ね合わ
せるまでの時間を調節することによつて、樹脂が吸着す
る水分量を制御することができ、これによつて、一対の
金属板を加熱圧着した後、樹脂の発泡を制御することが
できる。
The foamable resin containing the conductive filler as described above depends on the particle diameter of the conductive filler contained therein,
Usually, 5 to 100 μm, preferably 10 to 6 on a metal plate.
The coating is performed so that the total coating thickness is in the range of 0 μm. According to the present invention, for example, when the polyester resin containing the blocked polyisocyanate as described above is used, it is possible to adjust the time until the metal plates are superposed after the resin is applied to the metal plates. Then, the amount of water adsorbed by the resin can be controlled, which makes it possible to control the foaming of the resin after the pair of metal plates are thermocompression bonded.

【0010】本発明によれば、発泡性樹脂を発泡させて
多孔性樹脂とするとき、その気孔率は、0.1〜2.5%の
範囲であることが必要である。気孔率をこの範囲に制御
することによつて、得られる制振金属板の制振性能と接
着性の低下を抑えつつ、溶接性を確保することができ
る。一般に、金属板間に樹脂層を加熱圧着して制振金属
板とした場合、その樹脂層の塗布厚さを薄くするほど、
即ち、導電性充填材の偏平化度を高めるほど、得られる
制振金属板の溶接性は良好となる。他方、一般に、樹脂
層の塗布厚さを薄くするほど、偏平化された導電性充填
材が対向する金属板を固定するので、制振性能が低下す
る。
According to the present invention, when the foamable resin is foamed into a porous resin, the porosity thereof needs to be in the range of 0.1 to 2.5%. By controlling the porosity within this range, it is possible to secure weldability while suppressing deterioration of the damping performance and adhesiveness of the obtained damping metal plate. Generally, when a resin layer is heat-pressed between metal plates to form a damping metal plate, the thinner the coating thickness of the resin layer is,
That is, the higher the flatness of the conductive filler, the better the weldability of the vibration damping metal plate obtained. On the other hand, generally, the thinner the coating thickness of the resin layer is, the more the flattened conductive filler fixes the opposing metal plates, so that the vibration damping performance deteriorates.

【0011】ここに、本発明によれば、樹脂層を発泡さ
せることによつて、上記した導電性充填材による金属板
の固定を解除するので、導電性充填材によるすぐれた溶
接性を保持しつつ、制振性能をも、従来、導電性充填材
を含有させない樹脂層を金属板間に介在させた制振金属
板とほぼ同等の制振性を有せしめることができる。
According to the present invention, since the metal plate is released from the fixing by the above-mentioned conductive filler by foaming the resin layer, excellent weldability by the conductive filler is maintained. At the same time, it is possible to provide vibration damping performance that is almost the same as that of a conventional vibration-damping metal plate in which a resin layer containing no conductive filler is interposed between the metal plates.

【0012】[0012]

【実施例】以下に実施例を挙げて本発明を説明するが、
本発明はこれら実施例により何ら限定されるものではな
い。板厚0.4mmのアルミキルド鋼板の亜鉛系めつき処理
材を表皮の鋼板とし、そのうちの一方の鋼板の片面の接
着面に容積率にて3.0%で粒子径約70μmのニツケル
微粉末を含有すると共に、ブロック化ポリイソシアネー
トを含有するポリエステル系樹脂をバーコータにて45
μm厚(乾燥後)に塗布し、上記他方の鋼板の片面の接
着面にブロック化ポリイソシアネートを含有するポリエ
ステル系樹脂をバーコータにて5μm厚(乾燥後)に塗
布した(即ち、鋼板への塗布厚さは50μm)。
The present invention will be described below with reference to examples.
The present invention is not limited to these examples. Aluminum-killed steel sheet with a thickness of 0.4 mm was used as a skin steel sheet, and one of the steel sheets was coated with nickel fine powder with a volume ratio of 3.0% and a particle size of about 70 μm on one side of the bonded surface. A polyester resin containing a blocked polyisocyanate is contained in a bar coater in addition to 45
to a thickness of 5 μm (after drying), and a polyester resin containing a blocked polyisocyanate was applied to the adhesive surface on one side of the other steel plate to a thickness of 5 μm (after drying) with a bar coater (that is, coating to a steel plate). The thickness is 50 μm).

【0013】これらの一対の鋼板を160℃で2分間加
熱して乾燥させた後、所定時間(3〜20秒間)放置
し、この後、一対の鋼板を重ね合わせ、ロール圧着し
て、制振鋼板とした。このようにして得られたそれぞれ
の制振鋼板について、接着性(T剥離強度、JIS K
6854に準ずる。)、制振性(損失係数、共振法
(半値幅法による。))及び溶接性(溶接時の電気抵抗
値(μΩ))とを測定した。結果を図1及び図2に示
す。
After heating the pair of steel plates at 160 ° C. for 2 minutes to dry them, they are left for a predetermined time (3 to 20 seconds), after which the pair of steel plates are superposed, roll-pressed and vibration-damped. It was a steel plate. For each damping steel plate thus obtained, the adhesiveness (T peel strength, JIS K
According to 6854. ), Vibration damping (loss coefficient, resonance method (by half-width method)) and weldability (electrical resistance value (μΩ) during welding) were measured. The results are shown in FIGS. 1 and 2.

【0014】図1は、上記鋼板に樹脂を塗布し、乾燥さ
せた後、重ね合わせるまでの時間と樹脂層の気孔率との
関係を示し、上記重ね合わせるまでの時間によつて、樹
脂層の気孔率を制御することができる。図2は、上記樹
脂層の気孔率と上記T剥離強度、損失係数及び溶接時の
電気抵抗値との関係を示し、本発明に従つて、樹脂層の
気孔率を0.1〜2.5%の範囲とすることによつて、接着
性と溶接性とを確保しつつ、制振性能を改善することが
できる。しかし、樹脂層の気孔率が大きすぎるときは、
充填材と鋼板との間の隙間が開き過ぎて、通電が困難と
なるために、電気抵抗値が高くなるのであろう。
FIG. 1 shows the relationship between the time until the resin is applied to the steel sheet and dried, and then the layers are laminated, and the porosity of the resin layers. Porosity can be controlled. FIG. 2 shows the relationship between the porosity of the resin layer and the T-peel strength, loss coefficient, and electric resistance value at the time of welding. According to the present invention, the porosity of the resin layer is 0.1 to 2.5. By setting the ratio to be in the range of%, it is possible to improve the vibration damping performance while ensuring the adhesiveness and the weldability. However, when the porosity of the resin layer is too large,
It is likely that the gap between the filler and the steel plate is opened too much, making it difficult to energize, so that the electrical resistance value becomes high.

【0015】図3は、導電性充填材を容量%にて1.0〜
4.5%の範囲で含有する樹脂の発泡前の塗布厚さと得ら
れる制振金属板の電気抵抗値との関係を示し、樹脂の塗
布厚さを薄くするほど、即ち、導電性充填材の偏平化度
を高めるほど、得られる制振金属板の溶接性は良好とな
る。図4は、同様に、導電性充填材を容量%にて1.0〜
4.5%の範囲で含有する樹脂の発泡前の塗布厚さと得ら
れる制振金属板の損失係数との関係を示し、充填材の添
加によつて、得られる金属板が制振性能において低下す
ること、及び樹脂の塗布厚さを厚くするほど、充填材の
偏平化の度合いが小さくなつて、金属板が固定されるた
めに、得られる金属板の制振性能が低下する。
FIG. 3 shows that the conductive filler is 1.0 to 1.0% by volume.
The relationship between the coating thickness of the resin contained in the range of 4.5% before foaming and the electric resistance value of the obtained damping metal plate is shown. The thinner the coating thickness of the resin is, that is, the conductive filler is The higher the flatness, the better the weldability of the vibration-damping metal plate obtained. Similarly, FIG. 4 shows that the conductive filler is 1.0 to 1.0% by volume.
The relationship between the coating thickness of the resin contained in the range of 4.5% before foaming and the loss coefficient of the obtained vibration-damping metal plate is shown. The addition of filler reduces the vibration-damping performance of the metal plate obtained. As the coating thickness of the resin is increased and the thickness of the resin is increased, the degree of flattening of the filler is reduced and the metal plate is fixed, so that the vibration damping performance of the obtained metal plate is deteriorated.

【0016】しかし、本発明によれば、樹脂層を所定の
気孔率を有するように発泡させることによつて、上記し
た導電性充填材による金属板の固定を解除し、かくし
て、導電性充填材によるすぐれた溶接性を保持しつつ、
制振性能を従来の制振金属板に比べて、格段に改善し、
また、すぐれた接着性をも確保することができる。
However, according to the present invention, the resin layer is foamed so as to have a predetermined porosity, whereby the fixing of the metal plate by the above-mentioned conductive filler is released, and thus the conductive filler is obtained. While maintaining excellent weldability due to
Compared with the conventional damping metal plate, the damping performance has been improved significantly,
Also, excellent adhesiveness can be ensured.

【0017】[0017]

【発明の効果】以上のように、本発明によれば、接着性
と制振性能とを確保しつつ、溶接性を改善した制振金属
板を得ることができる。特に、本発明によれば、樹脂層
がガス発泡による発泡構造を有し、常温領域の制振性能
にすぐれるので、溶接性を有する常温用制振金属板を得
ることができる。
As described above, according to the present invention, it is possible to obtain a vibration-damping metal plate having improved weldability while ensuring adhesiveness and vibration-damping performance. In particular, according to the present invention, since the resin layer has a foamed structure by gas foaming and has excellent vibration damping performance in the room temperature region, it is possible to obtain a room-temperature damping metal plate having weldability.

【図面の簡単な説明】[Brief description of drawings]

【図1】は、一対の鋼板にブロック化ポリイソシアネー
トを含有するポリエステル系樹脂を塗布し、乾燥させた
後、重ね合わせるまでの時間と、このように処理した一
対の鋼板を重ね合わせ、加熱圧着して得られた制振鋼板
における多孔性樹脂の気孔率との関係を示すグラフであ
る。
FIG. 1 is a diagram showing a time period until a pair of steel plates are coated with a polyester resin containing a blocked polyisocyanate, dried, and then stacked, and a pair of steel plates thus treated are stacked and heat-pressed. 6 is a graph showing the relationship with the porosity of the porous resin in the vibration damping steel plate obtained in this way.

【図2】は、上記図1に基づいて、多孔性樹脂の気孔率
と得られた制振鋼板の制振性能(損失係数)と製造性
(T剥離強度)と溶接性(電気抵抗値)との関係を示す
グラフである。
2 is based on FIG. 1 above, the porosity of the porous resin and the damping performance (loss coefficient), manufacturability (T peel strength) and weldability (electrical resistance value) of the obtained damping steel sheet. It is a graph which shows the relationship with.

【図3】は、導電性充填材を容量%にて1.0〜4.5%の
範囲で含有する樹脂の発泡前の塗布厚さと得られる制振
金属板の電気抵抗値との関係を示すグラフである。
[Fig. 3] shows the relationship between the coating thickness of a resin containing a conductive filler in the range of 1.0 to 4.5% by volume before foaming and the electric resistance value of the obtained damping metal plate. It is a graph shown.

【図4】は、導電性充填材を容量%にて1.0〜4.5%の
範囲で含有する樹脂の発泡前の塗布厚さと得られる制振
金属板の損失係数との関係を示すグラフである。
FIG. 4 shows the relationship between the coating thickness of the resin containing the conductive filler in the range of 1.0 to 4.5% by volume before foaming and the loss coefficient of the obtained damping metal plate. It is a graph.

フロントページの続き (72)発明者 斉藤 隆司 兵庫県加古川市金沢町1番地 株式会社神 戸製鋼所加古川製鉄所内Front Page Continuation (72) Inventor Takashi Saito 1 Kanazawa-machi, Kakogawa-shi, Hyogo Kadogawa Works Kakogawa Works

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】微粒子状の導電性充填材を含み、気孔率0.
1〜2.5%の多孔性樹脂層が金属板間に接着されてなる
ことを特徴とする制振金属板。
1. A porosity of 0, containing a conductive filler in the form of fine particles.
A vibration-damping metal plate comprising a porous resin layer of 1 to 2.5% bonded between the metal plates.
【請求項2】多孔性樹脂層が金属板間に接着されてなる
制振金属板の製造方法において、微粒子状の導電性充填
材を含む発泡性樹脂を金属板間に挟み込み、上記導電性
充填材を偏平にしつつ、上記発泡性樹脂を金属板間に加
熱圧着した後、上記発泡性樹脂においてガスを発生させ
て、気孔率0.1〜2.5%の多孔性樹脂層とすることを特
徴とする制振金属板の製造方法。
2. A method for producing a vibration-damping metal plate, comprising a porous resin layer adhered between metal plates, wherein a foaming resin containing a particulate conductive filler is sandwiched between the metal plates, and the conductive filling is performed. While flattening the material, the foamable resin is heat-pressed between the metal plates, and then gas is generated in the foamable resin to form a porous resin layer having a porosity of 0.1 to 2.5%. A method of manufacturing a characteristic vibration-damping metal plate.
【請求項3】金属板間に発泡性樹脂を塗布するに際し
て、その塗布厚さを導電性充填材の粒子径の1.2〜2倍
の範囲とすることを特徴とする請求項2記載の制振金属
板の製造方法。
3. When the foamable resin is applied between the metal plates, the thickness of the applied resin is set in the range of 1.2 to 2 times the particle diameter of the conductive filler. Manufacturing method of vibration-damped metal plate.
【請求項4】導電性充填材がニツケル微粉末であること
を特徴とする請求項2記載の制振金属板の製造方法。
4. The method for producing a vibration damping metal plate according to claim 2, wherein the conductive filler is nickel fine powder.
JP10844293A 1993-05-10 1993-05-10 Damping metallic plate and manufacture thereof Pending JPH06316018A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10844293A JPH06316018A (en) 1993-05-10 1993-05-10 Damping metallic plate and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10844293A JPH06316018A (en) 1993-05-10 1993-05-10 Damping metallic plate and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH06316018A true JPH06316018A (en) 1994-11-15

Family

ID=14484886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10844293A Pending JPH06316018A (en) 1993-05-10 1993-05-10 Damping metallic plate and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH06316018A (en)

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