JPH06315662A - Liquid coating device - Google Patents

Liquid coating device

Info

Publication number
JPH06315662A
JPH06315662A JP5127962A JP12796293A JPH06315662A JP H06315662 A JPH06315662 A JP H06315662A JP 5127962 A JP5127962 A JP 5127962A JP 12796293 A JP12796293 A JP 12796293A JP H06315662 A JPH06315662 A JP H06315662A
Authority
JP
Japan
Prior art keywords
liquid
silver paste
vessel
light
syringe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5127962A
Other languages
Japanese (ja)
Inventor
Yasuteru Miyashita
保輝 宮下
Tetsuo Yamashita
哲生 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP5127962A priority Critical patent/JPH06315662A/en
Publication of JPH06315662A publication Critical patent/JPH06315662A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To surely detect the residual quantity of a liquid difficult to confirm from the outside of a vessel by providing a photosensor to detect the height of the liquid level 'at the cap of the vessel in a liquid coating device having the vessel, in which the high viscous liquid reflecting light in a specific ratio is housed, and for dropping the liquid from the vessel by adequate quantity. CONSTITUTION:In the liquid coating device 8, having the vessel 2 housing the high viscous liquid 3 reflecting the light LA1 in the specific ratio and for dropping the liquid 3 from the vessel 2 by the adequate quantity, the photosensor 9 to detect the height of the liquid level 11 of the liquid 3 is attached at the cap 10 of the vessel 2. As a result, the residual quantity of the liquid (e.g. silver paste) easily sticking to the inside wall of the vessel and difficult to confirm the residual quantity from the outside of the vessel due to reflecting light is stably and surely detected.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は液体塗布装置に関し、例
えば集積回路用リードフレームに滴下される接着剤の残
量を検知する測定部を有するものに適用して好適なもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid coating apparatus, and is suitable for application to, for example, a liquid coating apparatus having a measuring section for detecting the remaining amount of adhesive dropped on an integrated circuit lead frame.

【0002】[0002]

【従来の技術】従来、集積回路チツプをリードフレーム
に接着するダイボンド装置においては銀ペーストと呼ば
れる接着剤が用いられており、銀ペーストを滴下させる
装置として図2に示す構成のものが用いられている。
2. Description of the Related Art Conventionally, an adhesive called a silver paste has been used in a die bonding apparatus for adhering an integrated circuit chip to a lead frame, and an apparatus for dropping the silver paste having the structure shown in FIG. 2 has been used. There is.

【0003】図2において、1は全体として銀ペースト
滴下装置を示し、シリンジ2内に銀ペースト3を収容し
ている。銀ペースト滴下装置1は、シリンジ2に取り付
けられたキヤツプ4上部のエアホース5を介して圧縮空
気6を与える。これにより銀ペースト3は圧縮空気6の
圧力に応じて押し下げられてノズル7より各リードフレ
ーム(図示せず)上に滴下される。
In FIG. 2, reference numeral 1 denotes a silver paste dropping device as a whole, and a silver paste 3 is contained in a syringe 2. The silver paste dropping device 1 supplies compressed air 6 through an air hose 5 above the cap 4 attached to the syringe 2. As a result, the silver paste 3 is pushed down according to the pressure of the compressed air 6 and dropped from the nozzle 7 onto each lead frame (not shown).

【0004】[0004]

【発明が解決しようとする課題】ところで銀ペースト滴
下装置1においては、一連の接着工程で滴下できる銀ペ
ースト3の量がシリンジ2の容積により制約される。こ
のためシリンジ2内の銀ペースト3の残量を検知し、銀
ペースト3の不足又は欠乏による接着不良品が発生する
前にシリンジ2が銀ペースト3を充填された新しいシリ
ンジ2に交換する必要がある。
In the silver paste dropping device 1, the amount of the silver paste 3 that can be dropped in a series of bonding steps is limited by the volume of the syringe 2. Therefore, it is necessary to detect the remaining amount of the silver paste 3 in the syringe 2 and replace the syringe 2 with a new syringe 2 filled with the silver paste 3 before a defective adhesive product is generated due to the lack or lack of the silver paste 3. is there.

【0005】ところが銀ペースト3は粘度が高いのでシ
リンジ2の内壁面に付着したまま残留し易いことに加え
て透明度が低いので、銀ペースト3の残量を外部より肉
眼で確認することは非常に困難である。そのためキヤツ
プ4を取り外し、シリンジ2の上方より銀ペースト3の
残量を確認していた。
However, since the silver paste 3 has a high viscosity, the silver paste 3 is likely to remain attached to the inner wall surface of the syringe 2 and has a low transparency. Therefore, it is very difficult to visually confirm the remaining amount of the silver paste 3 from the outside. Have difficulty. Therefore, the cap 4 was removed and the remaining amount of the silver paste 3 was confirmed from above the syringe 2.

【0006】この確認方法では確認作業のために稼働中
のダイボンド装置を一旦停止させる必要があり、1本の
シリンジ2を交換するまでの間に接着作業が数回中断さ
れるという問題があつた。また残量確認の遅れや目測誤
りによつて銀ペースト3が不足し又は欠乏したままダイ
ボンド装置が接着作業を継続することによつて不良品を
製造するおそれがあるという問題があつた。
In this confirmation method, it is necessary to temporarily stop the die bonder in operation for the confirmation work, and there is a problem that the bonding work is interrupted several times before the replacement of one syringe 2. . Further, there is a problem that a defective product may be produced by continuing the bonding work with the die bonding apparatus while the silver paste 3 is insufficient or lacking due to a delay in residual amount confirmation or an error in visual measurement.

【0007】またキヤツプ4を取り外さず銀ペースト3
の残量をシリンジ2の外部より検知するため、フロート
を銀ペースト3上に置くことが考えられる。ところが実
験ではフロートの沈みや、フロートに銀ペースト3が付
着する等のために銀ペースト3の残量を正確に検知する
ことは困難であつた。
Also, the silver paste 3 is used without removing the cap 4.
It is conceivable to place the float on the silver paste 3 in order to detect the remaining amount of the above from the outside of the syringe 2. However, in the experiment, it was difficult to accurately detect the remaining amount of the silver paste 3 due to sinking of the float, adhesion of the silver paste 3 to the float, and the like.

【0008】本発明は以上の点を考慮してなされたもの
で、容器内壁に付着し易く容器外より肉眼で残量の確認
が困難な液体の残量を安定かつ確実に検知できる液体塗
布装置を提案しようとするものである。
The present invention has been made in consideration of the above points, and is capable of stably and reliably detecting the remaining amount of liquid which is easily attached to the inner wall of the container and is difficult to confirm with the naked eye from outside the container. Is to propose.

【0009】[0009]

【課題を解決するための手段】かかる課題を解決するた
め本発明においては、高粘度かつ光LA1を所定の率で
反射する液体3が格納された容器2を有し、容器2より
液体3を適量づつ滴下する液体塗布装置8において、容
器2の蓋10に液体3の液面の高さを検知する光センサ
9を取り付ける。
In order to solve such a problem, the present invention has a container 2 in which a liquid 3 having a high viscosity and reflecting the light LA1 at a predetermined rate is stored. In the liquid application device 8 that drops an appropriate amount, an optical sensor 9 that detects the height of the liquid surface of the liquid 3 is attached to the lid 10 of the container 2.

【0010】[0010]

【作用】容器2内の液体3の液面11の高さを光センサ
9で非接触かつ直接に測定することによつて、光LA1
を反射する液面11の状態が乱されず、液体3の残量を
安定かつ確実に検知できる。
By measuring the height of the liquid surface 11 of the liquid 3 in the container 2 directly and in a non-contact manner with the optical sensor 9, the light LA1 is obtained.
The state of the liquid surface 11 that reflects the light is not disturbed, and the remaining amount of the liquid 3 can be detected stably and reliably.

【0011】[0011]

【実施例】以下図面について、本発明の一実施例を詳述
する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

【0012】図2との対応部分に同一符号を付して示す
図1において、8は全体として銀ペースト滴下装置を示
し、銀ペースト滴下装置1のキヤツプ4に代えてフアイ
バセンサ9を有するキヤツプ10がシリンジ2の上部に
取り付けられ、銀ペースト3の残量を検知させるように
なされている。
In FIG. 1 in which parts corresponding to those in FIG. 2 are designated by the same reference numerals, numeral 8 indicates a silver paste dropping device as a whole, and a cap 10 having a fiber sensor 9 in place of the cap 4 of the silver paste dropping device 1. Is attached to the upper portion of the syringe 2 so as to detect the remaining amount of the silver paste 3.

【0013】シリンジ2は、半透明の硬い合成樹脂材料
でなり、これにより銀ペースト3が充填されるときに限
り液面11の大まかな高さをシリンジ2外より肉眼で確
認し得るようになされている。またシリンジ2は、全長
の大部分が直径約15〔mm〕の長い円筒形状をなすと共
に、丸く絞られ細い流出口が形成された底部の下端には
リードフレームの形状に応じた所定形状のノズル7が装
着されている。
The syringe 2 is made of a semi-transparent hard synthetic resin material so that the rough height of the liquid surface 11 can be visually confirmed from the outside of the syringe 2 only when the silver paste 3 is filled. ing. The syringe 2 has a long cylindrical shape with a large diameter of about 15 mm and a nozzle with a predetermined shape corresponding to the shape of the lead frame at the lower end of the bottom where a round outlet is formed and a thin outlet is formed. 7 is attached.

【0014】シリンジ2の上端側開口部には開口に沿つ
て円環形のフランジ2Aが形成される。またフランジ2
Aには、180 °対向する位置にシリンジ2の外周面のほ
ぼ近傍まで達すると共に約90°に開くように切り欠かれ
た切欠き部が設けられる。
An annular flange 2A is formed along the opening at the opening on the upper end side of the syringe 2. Also flange 2
A is provided with a notch at a position opposed to 180 ° so as to reach almost the outer peripheral surface of the syringe 2 and open at about 90 °.

【0015】キヤツプ10は、半透明の硬い合成樹脂材
料でなり、円筒部10Aの上端に連なる円形の天井部1
0Bにはフアイバセンサ9が取り付けられている。円筒
部10Aの下端の縁は平滑な平面状に形成され、シリン
ジ2に対する接合面となされている。
The cap 10 is made of a semi-transparent hard synthetic resin material, and has a circular ceiling portion 1 continuous with the upper end of the cylindrical portion 10A.
A fiber sensor 9 is attached to 0B. The edge of the lower end of the cylindrical portion 10A is formed into a smooth flat surface and serves as a joint surface for the syringe 2.

【0016】キヤツプ10の接合面の周縁部には断面コ
字形状で円環形ののフランジ10Cが形成される。また
フランジ10Cには、180 °対向する位置に円筒部10
Aの外周面近傍に達すると共に約90°に開くように切り
欠かれた切欠き部が設けられる。フランジ10Cはフラ
ンジ2Aを内側面において挟み込むようになされてい
る。
An annular flange 10C having a U-shaped cross section is formed on the peripheral portion of the joint surface of the cap 10. In addition, the cylindrical portion 10 is provided at a position opposite to the flange 10C by 180 °.
A notched portion is provided so as to reach the vicinity of the outer peripheral surface of A and open at about 90 °. The flange 10C is configured to sandwich the flange 2A on the inner side surface.

【0017】キヤツプ10がシリンジ2に取り付けられ
る際は、フランジ2A及びフランジ10Cが互いに相手
側の切り欠き部に組み合わされて接合面が当接される。
さらにフランジ10Cの折り返し部がフランジ2Aを挟
み込むようにキヤツプ10がシリンジ2に対して約90
°摺接しながら回動される。
When the cap 10 is attached to the syringe 2, the flange 2A and the flange 10C are combined with each other in the notches and the joint surfaces are brought into contact with each other.
Further, the cap 10 is about 90 mm larger than the syringe 2 so that the folded portion of the flange 10C sandwiches the flange 2A.
Rotated while sliding.

【0018】こうしてキヤツプ10がシリンジ2に係止
されると、接合面は接合面自身の弾性力によつて密着さ
れ、キヤツプ10及びシリンジ2の気密性が容易に保た
れるようになされている。
When the cap 10 is locked to the syringe 2 in this manner, the joint surface is brought into close contact with the elastic force of the joint surface itself, and the airtightness of the cap 10 and the syringe 2 is easily maintained. .

【0019】円筒部10Aの側面には圧縮空気供給用の
L型継ぎ手12の一端がねじによつて固着されており、
この継ぎ手の吹き出し穴より圧縮空気6がフアイバセン
サ9に向かつて吹き出すようになされている。またエア
ホース5の先端には着脱自在の口金13が装着され、こ
れが継ぎ手12の他端に接続されるようになされてい
る。
One end of an L-shaped joint 12 for supplying compressed air is fixed to the side surface of the cylindrical portion 10A with a screw.
The compressed air 6 is blown out toward the fiber sensor 9 from the blowout hole of this joint. A detachable base 13 is attached to the tip of the air hose 5, and this is connected to the other end of the joint 12.

【0020】フアイバセンサ9は、直径約 3〔mm〕のセ
ンサ頭部9Aがフアイバケーブル14を介して液面高さ
検知装置(図示せず)に接続され、長さ約 4〔mm〕の送
受端部9Bが鉛直方向に向けられており、ねじ部9Cに
よつてキヤツプ10の天井部10Bの中央に取り付けら
れている。送受端部9Bは、直径約 0.3〔mm〕の射出用
フアイバ及び受光用フアイバ、及びこの2本のフアイバ
を隣接させて収めるステンレス鋼の細いチユーブでな
る。
The fiber sensor 9 has a sensor head 9A having a diameter of about 3 mm connected to a liquid level detecting device (not shown) via a fiber cable 14, and has a length of about 4 mm. The end portion 9B is oriented in the vertical direction, and is attached to the center of the ceiling portion 10B of the cap 10 by the screw portion 9C. The transmission / reception end portion 9B is composed of an injection fiber and a light reception fiber having a diameter of about 0.3 mm, and a thin stainless steel tube for accommodating the two fibers adjacent to each other.

【0021】液面高さ検知装置よりフアイバケーブル1
4を介して与えられた射出光LA1は、射出用フアイバ
より銀ペースト3の液面11のほぼ中央付近に照射され
る。また射出光LA1が液面11で反射及び散乱されて
得られる反射光LA2は、距離に応じて拡散することに
よつて光量が減衰し、受光用フアイバで受光されフアイ
バケーブル14を介して液面高さ検知装置に与えられ
る。
Fiber cable 1 from the liquid level detector
The emission light LA1 given via 4 is emitted from the emission fiber to approximately the center of the liquid surface 11 of the silver paste 3. Further, the reflected light LA2 obtained by reflecting and scattering the emitted light LA1 on the liquid surface 11 is diffused according to the distance, so that the light amount is attenuated and is received by the light receiving fiber, and is received by the fiber cable 14 and the liquid surface. Given to the height sensing device.

【0022】これにより液面高さ検知装置は、反射光L
A2の光量を測定し、この光量が所定の値に達すると送
受端部9Bの先端より液面11の中央までの距離が所定
の設定値に達したことを検知してアラームを発生すると
共に、ダイボンド装置を停止させるようになされてい
る。
As a result, the liquid level detector detects the reflected light L.
The light amount of A2 is measured, and when the light amount reaches a predetermined value, an alarm is generated by detecting that the distance from the tip of the transmission / reception end portion 9B to the center of the liquid surface 11 has reached a predetermined set value, It is designed to stop the die bond machine.

【0023】因みに銀ペースト3は、常温のエポキシ樹
脂のバインダ中に銀の微粒子が均一に混合された灰白色
の泥状をなし、射出光LA1に対する高い反射率を有す
ると共に、その液面11が銀の微粒子のために微小な凹
凸をなすことによつてある程度射出光LA1を散乱させ
る。
Incidentally, the silver paste 3 is in the form of an off-white mud in which silver fine particles are uniformly mixed in a binder of epoxy resin at room temperature, has a high reflectance for the emitted light LA1, and its liquid surface 11 is silver. The emitted light LA1 is scattered to some extent by forming minute unevenness due to the fine particles.

【0024】また銀ペースト3は、シリンジ2内に満た
された状態より使用限界のレベルAに至るまで液面11
がほぼ平面をなすが、銀ペースト3が滴下されて液面1
1が降下するに従つて液面11の中央部にわずかな凹部
が発生する。
Further, the silver paste 3 has a liquid level 11 from the state in which the syringe 2 is filled to the level A at the limit of use.
Is almost flat, but the silver paste 3 is dropped and the liquid level 1
As 1 drops, a slight recess is generated in the center of the liquid surface 11.

【0025】以上の構成において、まず銀ペースト3が
減少して液面11の高さがレベルAに達したときアラー
ムを発生するように液面高さ検知装置を調整する。新し
いシリンジ2に交換する際は、エアホース5が装着され
たままのキヤツプ10がシリンジ2に取り付けられる。
このとき圧縮空気6が継ぎ手12の吹き出し口よりフア
イバセンサ9に吹き付けられ、これによりフアイバセン
サ9に対する銀ペースト3の飛沫の付着が防がれる。
In the above structure, first, the liquid level detector is adjusted so that an alarm is generated when the silver paste 3 decreases and the liquid level 11 reaches level A. When replacing with a new syringe 2, the cap 10 with the air hose 5 still attached is attached to the syringe 2.
At this time, the compressed air 6 is blown from the outlet of the joint 12 onto the fiber sensor 9, which prevents the splash of the silver paste 3 from adhering to the fiber sensor 9.

【0026】液面11が例えばレベルAより高いレベル
Bである場合、送受端部9Bの先端より液面11までの
距離は短い。従つて反射光LA2の光量は多く、液面高
さ検知装置は液面11がレベルAに達していないと判断
してアラームを発生しない。
When the liquid level 11 is, for example, level B higher than level A, the distance from the tip of the transmitting / receiving end 9B to the liquid level 11 is short. Therefore, the light amount of the reflected light LA2 is large, and the liquid surface height detection device determines that the liquid surface 11 has not reached the level A and does not generate an alarm.

【0027】圧縮空気6は銀ペースト3を 0.1〜 0.2
〔kg/cm2 〕で押し下げて滴下させる。このとき銀ペー
スト3は、高い粘度を有するためにシリンジ2の内壁に
付着残留してシリンジ2の外部より到来する光を大部分
遮る。これにより外部の光の反射光LA2に対する影響
が大部分抑えられる。
The compressed air 6 is 0.1 to 0.2 times the silver paste 3.
Press down with [kg / cm 2 ] to drop. At this time, since the silver paste 3 has a high viscosity, the silver paste 3 remains attached to the inner wall of the syringe 2 and largely blocks the light coming from the outside of the syringe 2. This largely suppresses the influence of external light on the reflected light LA2.

【0028】銀ペースト3が消費されて液面11が降下
し、送受端部9Bの先端より液面11までの距離が増加
するに従つて反射光LA2の光量は減少する。これによ
り液面11がレベルAに到達すると、反射光LA2の光
量が所定の設定値になる。従つて液面高さ検知装置は、
銀ペースト3の残量が不足したことを検知してアラーム
を発生すると共に、ダイボンド装置を停止させる。
As the silver paste 3 is consumed and the liquid surface 11 descends, the light amount of the reflected light LA2 decreases as the distance from the tip of the transmitting / receiving end 9B to the liquid surface 11 increases. As a result, when the liquid surface 11 reaches the level A, the light quantity of the reflected light LA2 becomes a predetermined set value. Therefore, the liquid level detector
An alarm is generated by detecting that the remaining amount of the silver paste 3 is insufficient, and the die bond device is stopped.

【0029】以上の構成によれば、液面11の高さがフ
アイバセンサ9で非接触かつ直接に測定されることによ
り、液面11の状態が乱されることがなく、安定かつ確
実に銀ペースト3の残量を検知できる。また銀ペースト
3の不足又は欠乏による接着不良品の発生を防げる。
According to the above construction, since the height of the liquid surface 11 is directly measured by the fiber sensor 9 in a non-contact manner, the state of the liquid surface 11 is not disturbed and the silver is stable and reliable. The remaining amount of the paste 3 can be detected. Further, it is possible to prevent the generation of defective adhesion products due to lack or deficiency of the silver paste 3.

【0030】さらに銀ペースト3を最低使用量まで使い
切れるので、銀ペースト3の無駄がなくなる。さらに銀
ペースト3の残量を確認する作業工程が不要になる。
Furthermore, since the silver paste 3 can be used up to the minimum amount, the silver paste 3 is not wasted. Further, the work process for confirming the remaining amount of the silver paste 3 becomes unnecessary.

【0031】なお上述の実施例においては、光量を検知
して測距するフアイバセンサ9を用いる場合について述
べたが、本発明はこれに限らず、フアイバセンサ9に代
えて位相のずれにより測距するレーザセンサを用いる場
合にも適用し得る。
In the above-described embodiment, the fiber sensor 9 for detecting the amount of light to measure the distance is used. However, the present invention is not limited to this, and instead of the fiber sensor 9, the distance is measured by a phase shift. It can also be applied to the case of using a laser sensor.

【0032】また上述の実施例においては、射出用フア
イバ及び受光用フアイバを設けたフアイバセンサ9を用
いる場合について述べたが、本発明はこれに限らず、射
出及び受光を1本のフアイバで兼用させる光センサ、多
芯構造の光センサ、同軸の2重構造の光センサ等を用い
る場合にも適用し得る。
In the above embodiment, the case where the fiber sensor 9 provided with the emitting fiber and the light receiving fiber is used is described, but the present invention is not limited to this, and one fiber can be used for both emitting and receiving light. The present invention can also be applied to the case of using an optical sensor, a multi-core optical sensor, a coaxial dual optical sensor, or the like.

【0033】さらに上述の実施例においては、射出用フ
アイバ及び受光用フアイバを隣接して設けたフアイバセ
ンサ9を用いる場合について述べたが、本発明はこれに
限らず、射出部と受光部とが所定の距離を隔てて設けら
れ三角測距するための光センサを用いる場合にも適用し
得る。
Further, in the above-mentioned embodiment, the case where the fiber sensor 9 in which the emitting fiber and the light receiving fiber are provided adjacent to each other is used is described, but the present invention is not limited to this, and the emitting part and the light receiving part are not provided. The present invention can also be applied to the case where an optical sensor provided at a predetermined distance is used for triangulation.

【0034】さらに上述の実施例においては、液面11
の高さを測定することによつて残量を検知する場合につ
いて述べたが、本発明はこれに限らず、液面11の高さ
を測定することによつて銀ペースト3の滴下速度を検知
する場合にも適用し得る。
Further, in the above embodiment, the liquid surface 11
The case where the remaining amount is detected by measuring the height of the liquid paste has been described, but the present invention is not limited to this, and the dropping speed of the silver paste 3 is detected by measuring the height of the liquid surface 11. It can also be applied when doing.

【0035】さらに上述の実施例においては、銀ペース
ト3の液面11の高さを測定する場合について述べた
が、本発明はこれに限らず、容器内壁に付着し易く、光
を所定の率で反射したり散乱させる液体の液面11の高
さや残量を測定する場合に広く適用し得る。
Further, in the above-mentioned embodiment, the case where the height of the liquid surface 11 of the silver paste 3 is measured has been described, but the present invention is not limited to this, and the light easily adheres to the inner wall of the container and the light is irradiated at a predetermined rate. It can be widely applied to the measurement of the height and the remaining amount of the liquid surface 11 of the liquid that is reflected or scattered by.

【0036】さらに上述の実施例においては、シリンジ
2及びキヤツプ10が半透明の材料でなる場合について
述べたが、本発明はこれに限らず、シリンジ2及びキヤ
ツプ10が不透明の材料や光の吸収率が高い材料でなる
場合にも適用できる。
Further, in the above-described embodiment, the case where the syringe 2 and the cap 10 are made of a translucent material has been described, but the present invention is not limited to this, and the syringe 2 and the cap 10 are made of an opaque material and absorb light. It can also be applied when the material is made of a high material.

【0037】さらに上述の実施例においては、銀ペース
ト3の所定の残量を検知してアラームを発生させる場合
について述べたが、本発明はこれに限らず、アラームに
代えてランプ等の光を用いても良い。
Further, in the above-mentioned embodiment, the case where the predetermined amount of the silver paste 3 is detected to generate the alarm has been described, but the present invention is not limited to this, and light such as a lamp may be used instead of the alarm. You may use.

【0038】[0038]

【発明の効果】上述のように本発明によれば、液面の高
さを光センサで非接触かつ直接に測定することによつ
て、容器内壁に付着し易く、光を所定の率で反射する液
体の残量を液面の状態を乱さず安定かつ確実に検知でき
る液体塗布装置を実現できる。
As described above, according to the present invention, since the height of the liquid surface is directly measured in a non-contact manner by an optical sensor, the liquid easily adheres to the inner wall of the container and reflects light at a predetermined rate. It is possible to realize a liquid application device that can stably and reliably detect the remaining amount of the liquid that remains without disturbing the state of the liquid surface.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による液体塗布装置の一実施例による全
体構成を示す断面図である。
FIG. 1 is a cross-sectional view showing the overall configuration of an embodiment of a liquid applying apparatus according to the present invention.

【図2】従来例の全体構成を示す断面図である。FIG. 2 is a cross-sectional view showing an overall configuration of a conventional example.

【符号の説明】[Explanation of symbols]

1、8……銀ペースト滴下装置、2……シリンジ、3…
…銀ペースト、4、10……キヤツプ、5……エアホー
ス、6……圧縮空気、7……ノズル、9……フアイバセ
ンサ、11……液面、12……継ぎ手、13……口金、
14……フアイバケーブル、LA1……射出光、LA2
……反射光。
1, 8 ... Silver paste dropping device, 2 ... Syringe, 3 ...
... Silver paste, 4,10 ... Cap, 5 ... Air hose, 6 ... Compressed air, 7 ... Nozzle, 9 ... Fiber sensor, 11 ... Liquid level, 12 ... Joint, 13 ... Base,
14 ... Fiber cable, LA1 ... Emitted light, LA2
……reflected light.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】高粘度かつ光を所定の率で反射する液体が
格納された容器を有し、当該容器より上記液体を適量づ
つ滴下する液体塗布装置において、 上記容器の蓋に上記液体の液面の高さを検知する光セン
サを取り付けることを特徴とする液体塗布装置。
1. A liquid application apparatus having a container containing a liquid having a high viscosity and reflecting light at a predetermined rate, and dropping an appropriate amount of the liquid from the container, wherein a liquid of the liquid is placed on a lid of the container. A liquid application device, wherein an optical sensor for detecting the height of a surface is attached.
【請求項2】上記光センサは、光フアイバセンサ又はレ
ーザセンサでなることを特徴とする請求項1に記載の液
体塗布装置。
2. The liquid coating apparatus according to claim 1, wherein the optical sensor is an optical fiber sensor or a laser sensor.
【請求項3】上記蓋は、上記液体の滴下量を調整する圧
縮空気の供給孔を上記蓋の側壁に有し、上記圧縮空気を
上記光センサに吹きつけることを特徴とする請求項1又
は請求項2に記載の液体塗布装置。
3. The lid has a compressed air supply hole for adjusting a dropping amount of the liquid on a side wall of the lid, and blows the compressed air to the optical sensor. The liquid application device according to claim 2.
JP5127962A 1993-04-30 1993-04-30 Liquid coating device Pending JPH06315662A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5127962A JPH06315662A (en) 1993-04-30 1993-04-30 Liquid coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5127962A JPH06315662A (en) 1993-04-30 1993-04-30 Liquid coating device

Publications (1)

Publication Number Publication Date
JPH06315662A true JPH06315662A (en) 1994-11-15

Family

ID=14972981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5127962A Pending JPH06315662A (en) 1993-04-30 1993-04-30 Liquid coating device

Country Status (1)

Country Link
JP (1) JPH06315662A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009178667A (en) * 2008-01-31 2009-08-13 Toray Ind Inc Container for supplying coating solution and method for supplying coating solution
JP2012196600A (en) * 2011-03-18 2012-10-18 Hitachi Plant Technologies Ltd Paste application head, paste application device, and paste application method
CN103090931A (en) * 2011-11-08 2013-05-08 无锡华润安盛科技有限公司 System for monitoring needle cylinder remaining amount and chip mounting machine comprising same
CN115365075A (en) * 2022-07-12 2022-11-22 中国电子科技集团公司第二十九研究所 Dispensing follow-up height measurement structure and method suitable for deep cavity narrow groove

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123114A (en) * 1987-11-06 1989-05-16 Tokyo Seimitsu Sokki Kk Level measuring apparatus
JPH0268989A (en) * 1988-09-02 1990-03-08 Sanyo Electric Co Ltd Coating device
JPH02122858A (en) * 1988-10-31 1990-05-10 Sharp Corp Liquid material quantitative discharge device
JPH03131724A (en) * 1989-10-18 1991-06-05 Tadashi Iizuka Level gauge

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123114A (en) * 1987-11-06 1989-05-16 Tokyo Seimitsu Sokki Kk Level measuring apparatus
JPH0268989A (en) * 1988-09-02 1990-03-08 Sanyo Electric Co Ltd Coating device
JPH02122858A (en) * 1988-10-31 1990-05-10 Sharp Corp Liquid material quantitative discharge device
JPH03131724A (en) * 1989-10-18 1991-06-05 Tadashi Iizuka Level gauge

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009178667A (en) * 2008-01-31 2009-08-13 Toray Ind Inc Container for supplying coating solution and method for supplying coating solution
JP2012196600A (en) * 2011-03-18 2012-10-18 Hitachi Plant Technologies Ltd Paste application head, paste application device, and paste application method
TWI513514B (en) * 2011-03-18 2015-12-21 Hitachi Ltd Electrolytic coating head, electroplating coating device and electric paste coating method
CN103090931A (en) * 2011-11-08 2013-05-08 无锡华润安盛科技有限公司 System for monitoring needle cylinder remaining amount and chip mounting machine comprising same
CN115365075A (en) * 2022-07-12 2022-11-22 中国电子科技集团公司第二十九研究所 Dispensing follow-up height measurement structure and method suitable for deep cavity narrow groove
CN115365075B (en) * 2022-07-12 2023-07-14 中国电子科技集团公司第二十九研究所 Glue dispensing follow-up height measurement structure and method suitable for deep cavity narrow groove

Similar Documents

Publication Publication Date Title
US6100094A (en) Method for sucking/determining liquid and pipetting device driven and controlled according to method
JP2969935B2 (en) Liquid metering device
US4909080A (en) Ultrasonic level gauge
US20100043704A1 (en) Sealant dispenser and control method thereof
CN109998377B (en) Method and device for controlling fluid flow, computer equipment and storage medium
US8955720B2 (en) Container for flowable substances and dispensing apparatus
JPH01314573A (en) Apparatus for detecting presence of air in piping
JPH0514889U (en) Bubble detection device in reagent collection device
US4956560A (en) Liquid level detector system with fill-level signature detection
US5059812A (en) Control apparatus for controlling an aspirator tube in an automatic sample dispenser
JPH06315662A (en) Liquid coating device
US20050236591A1 (en) Optical transducer for detecting liquid level
KR20120070212A (en) Dispenser
US20150160252A1 (en) Method and apparatus for detecting position of liquid surface, liquid supply apparatus, and analyzing system
EP2942322A1 (en) A container filling machine with improved sensing of a filling level and related method
JP3032428B2 (en) Liquid supply device
US5905656A (en) Method and apparatus for dispensing a liquid
CN105446024B (en) A kind of liquid crystal drip device and liquid crystal drip-injection method
US6765662B2 (en) Surface analysis
JPS62194464A (en) Apparatus for detecting liquid quantity
AU2005211572B2 (en) Fluid dispense and fluid surface verification system and method
JP4790995B2 (en) Slurry dilution device
US10272452B2 (en) Mechanical gravimetric disk dispenser
KR200207033Y1 (en) Level meters
JP2000051715A (en) Buret