JPH0631257A - Dust removal device in solid-state image pickup device - Google Patents

Abstract

PURPOSE:To surely remove dusts in a package to improve reliability of products by incorporating one end of an air feed pipe into an hollow zone of a hollow nozzle and arranging a blowoff port provided on the side of said end so as to face a communicating port. CONSTITUTION:In a dust removal device for drawing and removing the dusts in a package 11, one end of an air feed pipe 5 is incorporated into a hollow zone 2 of a hollow nozzle 1 and a blowoff port 6 provided on the side of the end is arranged so as to face a communicating port 3. And since the air can be blown off against a recess 12 of the package 11 from the port 6 of the pipe 5, the dusts which have not been removed, that is, the dusts attached to the surface of the recess 12 or to the surface of a semiconductor chip 13 are blown off, whereby the dusts are caused to float in the package 11. Further the dusts floating in the package 11 are drawn and removed through an exhaust pipe 4 connected to the nozzle 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dust removing device used for removing dust in a package on which a semiconductor chip is mounted in a manufacturing process of a solid-state image pickup device.

[0002]

2. Description of the Related Art FIG. 4 is a schematic side view illustrating a conventional dust removing device. In the figure, 51 is a hollow nozzle having a hollow portion 52, and a communication port 53 is provided at the tip of this hollow nozzle 51. An exhaust pipe 54 is connected to the hollow nozzle 51, and one end of the exhaust pipe 54 is connected to a vacuum device (not shown).

When the dust of the package 57 in which the semiconductor chip 56 is mounted in the recess 55 is removed by using the conventional dust removing device having the above structure, first, the recess 55 of the package 57 is formed at the tip of the hollow nozzle 51. The opening is closed to connect the hollow portion 52 of the hollow nozzle 51 and the recess 55 of the package 57 to each other. Then, the air in the hollow nozzle 51 and the package 57 is sucked through the exhaust pipe 54 by driving a vacuum device (not shown). As a result, the dust present in the package 57 is sucked along the air flow indicated by the alternate long and short dash line in the figure, and is further removed through the exhaust pipe 54 to a vacuum device (not shown).

[0004]

However, in the above-mentioned conventional dust removing device, although the dust (∘) floating in the package 57 can be removed, the package 57 can be removed.
There is a problem that the dust (●) attached to the surface of the recess 55 and the surface of the semiconductor chip 56 cannot be removed. As a result, the dust (●) attached to the upper surface of the semiconductor chip 56, particularly to the effective pixel portion, has an adverse effect on the function and is one factor that reduces the reliability of the product.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a dust removing device in a solid-state image pickup device which can reliably remove dust in a package.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and is for a package including a hollow nozzle having a communication port at its tip and a semiconductor chip mounted in a recess. The opening of the recess is closed by the tip of the hollow nozzle so that the hollow part of the hollow nozzle communicates with the recess of the package, and air is sucked at a predetermined vacuum pressure from an exhaust pipe connected to the hollow nozzle, In a dust removing device for sucking and removing dust therein, one end side of an air supply pipe is incorporated in a hollow portion of a hollow nozzle, and a blowout port provided at this one end side is arranged so as to face the communication port.

[0007]

In the dust removing apparatus of the present invention, air is blown from the air outlet of the air supply pipe toward the concave portion of the package, so that dust which cannot be removed by the conventional apparatus, that is, the concave surface of the package or the semiconductor chip is removed. The dust adhering to the surface is blown off and floats inside the package. Further, the dust thus floated is sucked and removed through the exhaust pipe connected to the hollow nozzle, so that the dust in the package is surely removed.

[0008]

FIG. 1 is a schematic side view illustrating an embodiment of the dust removing device of the present invention. In the figure, 1 is a hollow portion 2
The hollow nozzle 1 has a communication port 3 at the tip thereof. An exhaust pipe 4 is connected to the hollow nozzle 1, and one end of the exhaust pipe 4 is connected to a vacuum device (not shown).

In addition, one end side of an air supply pipe 5 is incorporated in the hollow portion 2 of the hollow nozzle 1. One end side of the air supply pipe 5 is incorporated so as to penetrate the side wall of the hollow nozzle 1. The other end of the air supply pipe 5 is connected to a compression device (not shown). Furthermore, an air outlet 6 is provided on one end side of the air supply pipe 5, and the air outlet 6 is arranged so as to face the communication port 3 described above.

FIG. 2 is a pneumatic circuit diagram of the apparatus in this embodiment. As shown in the figure, a solenoid valve 7 is provided in the middle of the exhaust pipe 4, and the air in the hollow nozzle 1 is sucked from the exhaust pipe 4 to the vacuum device by the opening / closing operation of the solenoid valve 7. ing.

On the other hand, a clean air filter 8, a regulator 9 and a solenoid valve 10 are provided in the middle of the air supply pipe 5. Therefore, the air sent out from the compressor is first opened and closed by the solenoid valve 10 to open the regulator 9
And is adjusted to a predetermined pressure there. Further, the air that has passed through the regulator 9 is cleaned by the clean air filter 8, and then the air outlet 6 of the air supply pipe 5 is removed.
It is supposed to be blown out from.

Next, the operation of the dust removing device in this embodiment will be described. First, as shown in FIG. 1, the opening of the recess 12 of the package 11 is closed by the tip of the hollow nozzle 1 so that the hollow portion 2 of the hollow nozzle 1 and the recess 12 of the package 11 communicate with each other. Then, the solenoid valve 7 of the pneumatic circuit is operated to suck the air in the hollow nozzle 1 and the package 11 from the exhaust pipe 4 to a vacuum device (not shown). As a result, the dust (∘) floating in the package 11 is sucked and removed through the exhaust pipe 4 to a vacuum device (not shown).

In addition, in this embodiment, the solenoid valve 10 of the pneumatic circuit is operated from the suction state to blow out the air from the air outlet 6 of the air supply pipe 5 as shown by the alternate long and short dash line in the figure. At this time, the air blown out from the air outlet 6 is supplied to the recess 12 of the package 11 and further to the package 1 as shown in the figure.
It is sprayed onto the semiconductor chip 13 mounted in the concave portion 12 of No. 1. As a result, dust (●) attached to the surface of the recess 12 of the package 11 and the surface of the semiconductor chip 13 is blown off and floats in the package 11. Further, the dust () thus floated is sucked and removed to a vacuum device (not shown) by the suction action of air from the exhaust pipe 4.

As described above, in the dust removing apparatus of this embodiment, not only dust (∘) floating in the recess 12 of the package 11 but also dust that cannot be removed by the conventional apparatus, that is, the surface of the recess 12 of the package 11 is removed. Also, dust (●) attached to the surface of the semiconductor chip 13 can be reliably removed.

Here, a time chart of the operation of sucking air from the exhaust pipe 4 and the operation of blowing air from the air supply pipe 5 will be described. For example, as shown in FIG. 3, the suction operation is performed for T1 time. In the meantime, various timing settings are possible, such as when the blowing operation is performed for T2 time shorter than T1 time (blowing timing A), or when the blowing operation is intermittently performed for every T3 time (blowing timing B). Further, such dimming setting can be freely changed by appropriately operating the solenoid valves 7 and 10 of the pneumatic circuit.

As means for further improving the dust removal efficiency, for example, the air supply pressure of the air supply pipe 5 is continuously changed during the suction operation from the exhaust pipe 4, or the air supply pipe 5 is used. In which air is blown out spirally from the air outlet 6 of the air supply pipe 5, and further, the direction of the air outlet 6 of the air supply pipe 5 is changed to form the recess 1 of the package 11.
It is conceivable that the air is evenly blown onto the 2.

[0017]

As described above, according to the dust removing apparatus of the present invention, while sucking air from the exhaust pipe connected to the hollow nozzle, the air is appropriately supplied from the outlet of the air supply pipe to the recess of the package. By spraying, the dust in the package can be surely removed, so that the dust does not adhere and remain on the upper surface of the semiconductor chip (particularly, the effective pixel portion), so that the reliability of the product can be improved.

[Brief description of drawings]

FIG. 1 is a schematic side view illustrating an embodiment of a dust removing device according to the present invention.

FIG. 2 is a pneumatic circuit diagram of an apparatus according to an embodiment.

FIG. 3 is an operation time chart of the device in the example.

FIG. 4 is a schematic side view illustrating a conventional dust removing device.

[Explanation of symbols]

 1 Hollow Nozzle 2 Hollow Part 3 Communication Port 4 Exhaust Pipe 5 Air Supply Pipe 6 Outlet

Claims (1)

[Claims] 1. A hollow nozzle provided with a hollow nozzle having a communication port at its tip, wherein the opening of the recess of a package having a semiconductor chip mounted in the recess is closed by the tip of the hollow nozzle. Part and the recess of the package are communicated with each other, and a dust removing device for sucking and removing dust in the package by sucking air at a predetermined vacuum pressure from an exhaust pipe connected to the hollow nozzle, wherein the hollow nozzle The dust removing device in a solid-state imaging device, wherein one end side of an air supply pipe is incorporated in the hollow part of the above, and a blowout port provided at this one end side is arranged so as to face the communication port.