JPH06310552A - Molding die - Google Patents

Abstract

PURPOSE:To shorten the time of the temperature rise of a chase part in a molding die for a semiconductor device when the chase part of the molding die for changing the products is exchanged. CONSTITUTION:A chase part 3b, which is exchanged for changing the product kind, is attached to a base part 3a of a molding upper die 3. A chase part 4b of a base part 4a of a molding lower die 4 is also attached. Heaters 11 are respectively inserted into a hole 3c and an hole 3d of the base part 3a and the base part 4a and a hole 4d and a hole 4f of the chase parts 3b and 4b. Electric power is supplied into the heaters 11. Thus, the molding upper die 3 and the molding lower die 4 are heated to the specified temperature.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding die for a semiconductor device, and more particularly to a technique which is effective when applied to a molding die for small-lot production of a wide variety of products.

[0002]

2. Description of the Related Art As shown in FIG. 5, a mold die capable of exchanging types of semiconductor devices has a structure in which a base portion 30a and a chase portion 30b of an upper die 30 are detachable.

The base 31 of the lower mold 31
On the upper part of a, pots 31b for inserting a tablet obtained by compressing a fixed amount of a mold resin material into a cylindrical shape and inserting the same are formed in the same number or different numbers as the cavities 31d formed in the chase portion 31c. The base portion 31a and the chase portion 31c are also detachable.

These base portion 30a and base portion 31
A hole 30c and a hole 31e for inserting the heater 32 are formed in a.

After the chase portion 30b and the chase portion 31c have been attached, the upper mold 30 and the lower mold 31 are heated by the heater 32 embedded in the base 30a and the base 31a, and the chase portion 30b is heated. And when the chase portion 31c reaches a predetermined temperature, the molding operation is performed.

[0006]

However, in this mold, the heater embedded in the base of the mold must heat the base and the chase to a predetermined temperature. However, it takes a lot of time to raise the temperature of the chase portion, and during that time, semiconductor products cannot be manufactured.

Therefore, when a large amount of a large variety of products are produced in a small amount, the productivity is reduced.

Although the chase portion can be heated in advance by an electric furnace or the like before replacement, a device for heating the chase portion of the electric furnace or the like must be newly invested.

An object of the present invention is to provide a molding die capable of shortening the time for raising the temperature of the chase portion when exchanging the chase portion for exchanging the type of semiconductor device.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the chase part of the upper mold and the chase part of the lower mold in which a cavity for injecting the mold resin is formed, the base part of the upper mold for fixing the chase part, and A plurality of holes or grooves into which heaters are inserted are provided in the base of the lower mold.

A high temperature liquid or gas is passed through the hole into which the heater is inserted.

[0014]

According to the above-described molding die, even if the chase portion is exchanged by the type exchange, the entire heating molding die can be efficiently heated to a predetermined temperature in a short time by the heating means of the chase portion.

As a result, the production efficiency of semiconductor products whose product type is frequently exchanged is improved.

[0016]

EXAMPLES Examples of the present invention will be described in detail below.

FIG. 1 is an external perspective view of a semiconductor molding apparatus according to one embodiment of the present invention, FIG. 2 is a side view of a press section of the semiconductor molding apparatus according to one embodiment of the present invention, and FIG.
FIG. 3 is a configuration diagram of a molding die of a semiconductor molding apparatus according to an embodiment of the present invention.

In this embodiment, as shown in FIG. 1, a wire-bonded semiconductor element (not shown) stored in the loader 1 is conveyed by the suction pad 2 or the like,
Resin molding is performed by the upper mold 3 and the lower mold 4 of the press section. The resin-sealed semiconductor device (not shown) is conveyed to the unloader 5 by the suction pad 2a or the like.

Next, as shown in FIG. 2, the upper mold die 3 of the press section of the molding apparatus is fixed to the upper platen 6, and the lower mold die 4 is fixed to the movable platen 7. A transfer jack 8 for press-fitting a resin is arranged below the lower mold 4 of the mold.

Further, a press jack 9 for moving the moving platen 7 up and down is arranged at the lower part thereof. Further, the entire press section is fixed by the lower platen 10.

Further, as shown in FIG. 3, the upper mold 3 has a structure in which a base portion 3a and a chase portion 3b in which a cavity (not shown) for injecting a molding resin is formed are detachable. ing.

Further, the base portion 4a of the lower mold 4 of the mold
The pots 4b for inserting tablets, which are obtained by compressing a certain amount of molding resin material into a cylindrical shape, are formed in the upper part of the same number as the number of cavities 4d formed in the chase portion 4c. The chase portion 4c also has a detachable structure. The number of pots 4b may be different from the number of cavities 4d.

These base portion 3a and base portion 4a
A hole 3c and a hole 4e into which the heater (heating means) 11 is inserted are formed in the hole. Similarly, the chase portion 3b and the chase portion 4c are also formed with holes 3d and 4f into which the heater 11 is inserted.

Next, the operation of this embodiment will be described.

The chase portion 3b exchanged for the type exchange is attached to the base portion 3a of the upper mold 3.
The chase portion 4b is also attached to the base portion 4a of the lower mold 4 for molding.

Then, the base portion 3a and the base portion 4a.
The heater 11 is fitted into the holes 3c and 4e of the above, and the holes 3d and 4f of the chase portion 3b and the chase portion 4b, respectively. After that, supply power to the heater 11,
The upper mold 3 and the lower mold 4 are heated to a predetermined temperature.

Thus, according to this embodiment, since the heater is provided not only in the base portion but also in the chase portion, the die can be efficiently heated to a predetermined temperature in a short time.
It eliminates the need for a long waiting time due to the heating of the mold when changing the product type, improving productivity.

The invention made by the present inventor has been described above based on the embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made without departing from the scope of the invention. There is no end.

For example, the mold die may be heated by a heater other than the heater of the above embodiment, and may be heated by circulating a high temperature liquid or gas through the holes of the base portion and the chase portion.

Further, the heater may be attached other than the holes of the above-mentioned embodiment, and as shown in FIG. 4, grooves 3e and 4g into which the heater 11 is fitted are formed in the base portion 3a and the base portion 4a. Chase part 3b and chase part 4c
Alternatively, the groove 3f and the groove 4h into which the heater 11 is fitted may be formed.

[0031]

Of the inventions disclosed by the present invention,
The following is a brief description of the effects obtained by the typical ones.

(1) According to the present invention, since the chase portion also includes the heater, it is possible to efficiently heat the molding die to a predetermined temperature in a short time.

(2) Further, according to the above (1), even when the chase portion needs to be frequently replaced as in a semiconductor device of high-mix low-volume production, the down time of the molding device due to heating of the molding die is shortened. Therefore, the production efficiency is improved.

[Brief description of drawings]

FIG. 1 is an external perspective view of a semiconductor mold device according to an embodiment of the present invention.

FIG. 2 is a side view of a press unit of the semiconductor mold device according to the embodiment of the present invention.

FIG. 3 is a configuration diagram of a molding die of a semiconductor molding apparatus according to an embodiment of the present invention.

FIG. 4 is a configuration diagram of a molding die of a semiconductor molding apparatus according to another embodiment of the present invention.

FIG. 5 is a configuration diagram of a pressing unit of a conventional semiconductor molding device.

[Explanation of symbols]

 1 Loader 2 Suction Pad 2a Suction Pad 3 Upper Mold 3a Base 3b Chase 3c Hole 3d Hole 3e Groove 3f Groove 4 Lower Mold 4a Base 4b Pot 4c Chase 4d Cavity 4e Hole 4f Hole 4g Groove 4g 5 Unloader 6 Upper platen 7 Moving platen 8 Transfer jack 9 Press jack 10 Lower platen 11 Heater (heating means) 30 Mold upper mold 30a Base part 30b Chase part 30c Hole 31 Mold lower mold 31a Base part 31b Pot 31c Chase part 31d Cavity 31e Hole 32 Heater

Claims (2)

[Claims] 1. In a mold of a semiconductor device, for fixing the chase part to a chase part of an upper mold part and a chase part of a lower mold part in which a cavity for injecting a mold resin is formed. 2. A mold die, wherein a plurality of holes or grooves into which heating means are inserted are provided in the base portion of the upper mold die and the base portion of the lower mold die. 2. A high temperature liquid or gas is circulated through a hole into which the heating means is fitted.
The described molding apparatus.