JPH06302483A - Formation method of external electrode - Google Patents

Abstract

PURPOSE:To obtain a chip component having external electrodes with uniform continuous coating. CONSTITUTION:End parts of chip components 15 held by a holding plate 1 are immersed in a conductive paste 13 supplied to the surface of a surface plate 10, and then are pressed to the surface plate 10. The surface of the surface plate 10 is etched, worked and roughened by grooves 11. Consequently, the chip components 15 pressed to the surface plate 10 do not remove the conductive paste 13 from the grooves 11. Consequently, when the holding plate is pulled up, the conductive paste in a proper amount is given to the edge of the chip components 15, with no sagging and no part remaining uncoated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming external electrodes on a chip part.

[0002]

2. Description of the Related Art Conventionally, a dipping method has been known as one method for forming an external electrode on a chip component composed of electronic components such as a multilayer capacitor, a multilayer inductor and a resistor. This method is a method of supplying a conductive paste to the surface of a surface plate having a smooth surface, then pressing the chip component against the surface plate and immersing it in the conductive paste, and applying the conductive paste to the surface of the chip component. It was

However, since the surface plate is a smooth surface, when the chip component is dipped and pressed against the surface plate, the conductive paste is extruded (escapes), and when the chip component is pulled up, the end surface of the chip component is electrically conductive. There is a problem that a non-adhered portion of the paste is generated. Moreover, in order to prevent the non-adhered portion of the conductive paste from being generated on the end surface of the chip component, if an extra conductive paste is applied, the conductive paste drips on the end surface of the chip component and the film thickness of the external electrode is increased. There was also the problem of unevenness.

Therefore, an object of the present invention is to provide a chip component provided with an external electrode having no non-adhered portion and having a small thickness variation.

[0005]

In order to solve the above problems, the method of forming an external electrode according to the present invention is a method of forming an external electrode after supplying a conductive paste to the surface of a surface plate having a roughened surface, The chip component held by the holding jig is pressed against the surface plate to apply the conductive paste to the chip component.

In the above method, since the surface plate having the roughened surface is used, even if the chip component is pressed against the surface plate, the conductive paste filling the concave portion of the roughened surface is extruded. There is no escape. Therefore,
An appropriate amount of conductive paste adheres to the end surface of the chip component.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method of forming an external electrode according to the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1, a holding plate 1 having a plurality of holes 2 is prepared. As shown in FIG. 2, the holding plate 1 is composed of a metal base member 3 and a rubber member 4.
The base member 3 is provided with a hole 3a.
Is covered with a rubber member 4. A hole 2 is provided in the rubber member 4. The chip component 15 is inserted into the hole 2 of the holding plate 1, and the elastic force of the rubber member 4 holds the chip component 15. The chip component 15 is an electronic component such as, but not limited to, a multilayer capacitor, a multilayer inductor, a multilayer composite component or a resistor.

Next, as shown in FIG. 3, the conductive paste 13 is supplied to the upper surface of the surface plate 10. The surface plate 10 is made of stainless steel or the like, and the upper surface is etched to form a rectangular groove 1.
By forming No. 1, the surface is roughened. The conductive paste 13 supplied to the surface plate 10 is squeezed by a blade (not shown) to fill the groove 11 and have a uniform thickness.

The holding plate 1 is conveyed above the surface plate 10 with the side where the end of the chip component 15 is exposed facing down. The holding plate 1 is lowered until the chip component 15 is dipped in the conductive paste 13 and pressed against the surface plate 10. As shown in FIG. 4, the chip component 15 pressed against the surface plate 10 has the conductive paste 13 filled in the groove 11.
Never extrude. Therefore, when the holding plate 1 is pulled up, an appropriate amount of the conductive paste 16 is applied to the end surface of the chip component 15 (see FIG. 5), the conductive paste does not drip, and the conductive paste is not attached. .

Similarly, an appropriate amount of conductive paste 16 is applied to the other end of the chip component 15 as shown in FIG. Then, the conductive paste 16 is cured to form the external electrode 16 '. The chip component 15 thus obtained has little variation in the thickness T of the external electrode 16 ', and
The unattached portion of the external electrode 16 'does not occur. Tables 1 and 2 show the results of evaluating the external electrodes 16 'of the chip part 15 manufactured according to this example. Table 1 is an evaluation of the variation in the thickness T, and Table 2 is an evaluation of the rate of occurrence of unattached portions. For comparison, the evaluation results of chip parts manufactured by the conventional method are also shown.

[0011]

[Table 1]

[0012]

[Table 2]

It can be seen from Tables 1 and 2 that the variation in the thickness T of the external electrode 16 'and the occurrence rate of the non-adhered portion are improved. The method of forming the external electrode according to the present invention is not limited to the above-mentioned embodiment, but can be variously modified within the scope of the gist. The surface of the surface plate may be roughened, and the surface of the surface plate may be roughened by disposing a mesh or a sponge. Further, in addition to roughening the surface with the rectangular groove, the surface may be roughened with a triangular groove, a semicircular groove, a hole, or the like.

The method of holding the chip component is arbitrary. For example, as shown in FIG. 7, a notch 31 is provided at the edge of a holding jig 30 made of an elastic member, and the notch 3
You may hold | maintain the chip component 15 by press-fitting the chip component 15 in 1.

[0015]

As is apparent from the above description, according to the present invention, since the surface of the surface plate is roughened, even if the chip component is pressed against the surface plate, the recessed portion of the roughened surface is not removed. The filled conductive paste is not extruded (escaped). Therefore, it is possible to obtain a chip component provided with an external electrode in which an appropriate amount of the conductive paste is attached to the end surface of the chip component, variation in thickness is small, and an unattached portion does not occur.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a method for forming an external electrode according to the present invention.

FIG. 2 is a vertical cross-sectional view of a portion XX ′ of the holding plate shown in FIG.

FIG. 3 is a partial vertical cross-sectional view showing the procedure of a method for forming external electrodes, which is subsequent to FIG.

FIG. 4 is a partial vertical cross-sectional view showing the procedure of a method of forming external electrodes, which is subsequent to FIG.

5 is a partial vertical cross-sectional view showing the procedure of a method of forming external electrodes, which is subsequent to FIG.

FIG. 6 is a vertical cross-sectional view of a chip part on which external electrodes are formed.

FIG. 7 is a partial perspective view showing another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Holding plate 10 ... Surface plate 11 ... Groove 13 ... Conductive paste 15 ... Chip component 16 ... Conductive paste 16 '... External electrode

Claims (1)

[Claims] 1. A conductive component is applied to the surface of a surface plate having a roughened surface, and then the chip component held by a holding jig is pressed against the surface plate to apply the conductive paste to the chip component. A method for forming an external electrode, comprising: