JPH06300819A - Ic tester - Google Patents

Abstract

PURPOSE:To obtain an IC tester enabling simple replacement of a contact part of a test head which is necessary for changing the kind of IC to be tested. CONSTITUTION:In regard to an IC tester constructed of a test head 200A which is connected electrically to a tester 100 by a cable bundle 401 and of a handler 300 which is positioned above the test head and executes an operation of supplying IC to be tested to a contact part 201 provided on the upper side of this test head and an operation of discharging the tested IC from the contact part 201, an IC tester made to have such a structure as to move the test head 200A in the direction wherein the cable bundle 401 is not present and to expose the test head 200A in the front or lateral part of the handler 300 by this movement.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is an IC for carrying out a test by carrying an IC under test by a handler adopting a horizontal carrying system.
Regarding test equipment.

[0002]

2. Description of the Related Art An IC test apparatus is roughly divided into a tester main body for testing the operation of an IC under test and a contact portion electrically connected to the tester main body by a cable bundle and electrically contacting the IC under test. It is composed of a test head and a handler that sequentially supplies ICs to be tested to the contact portion of the test head, ejects the ICs after the test, and sorts the ICs into good products and defective products.

6 and 7 show a schematic structure of a conventional IC test apparatus. In the figure, 100 is a tester main body, 200A, 2
00B indicates a test head, and 300 indicates a handler. The tester body 100 is composed of an electric circuit assembly having a cubicle structure. Tester body 100 and test head 2
Cable bundles 401, 402 between 00A and 200B
Are connected to electrically connect the test heads 200A and 200B to the tester main body 100.

A handler 300 is arranged above the test heads 200A and 200B. Handler 300 is X,
Equipped with a Y, Z triaxial transport mechanism and a vacuum suction head, the IC under test is sucked onto the vacuum suction head, and the IC under test is placed at an arbitrary position in the horizontal direction by the X, Y drive mechanism. The IC to be tested is conveyed and moved vertically by the Z drive mechanism, the IC to be tested is carried to the contact portion 201 provided on the upper surfaces of the test heads 200A and 200B, and the IC after the test is carried out from the contact portion 201. Take action.

That is, although the surface-mounting type IC has a structure in which the terminal pins are led out from the four sides of a rectangular insulating package in a radial direction, which is not particularly shown, the IC under test is transported by a structure in which it flows along a flow path. It's difficult. Therefore, conventionally, the IC to be tested is carried by the horizontal carrying mechanism and the vacuum suction head. From this, the test head 20
It will be appreciated why the handler 300 is placed on top of the 0A, 200B.

The contact portions 201 provided on the upper surfaces of the test heads 200A and 200B must be replaced according to the standard of the terminal pin of the IC under test. For this reason, the test heads 200A and 200B are provided with the handler 300 as required.
It has a structure that can be pulled out from the bottom of the.
For this reason, the test heads 200A and 200B are supported so as to be able to move up and down by the elevating device 202 configured by a pantograph mechanism. That is, in order to draw the test heads 200A and 200B from the lower part of the handler 300 to the outside, the test heads 200A and 200B are moved downward, moved in the direction of approaching the tester body 100 at the lowered position, and drawn out to the outside.

[0007]

PROBLEM TO BE SOLVED BY THE INVENTION Test head 200A
And the 200B itself is quite heavy. For this reason, the work of pulling out is difficult. Also, the tester body 100
And the test heads 200A and 200B are arranged as close to each other as necessary to reduce the installation area. As a result, the distance between the tester main body 100 and the handler 300 is narrow, and the work of bending the cable bundles 401 and 402 must be performed. Therefore, the work of replacing the contact portion 201 requires a lot of manpower and time. This is a great obstacle to operating the IC test equipment. In addition, the contact portion 201
Cable bundles 401, 40 each time
Since an unreasonable force is applied to 2, there is a problem that a cable disconnection accident is likely to occur.

Furthermore, in the conventional IC test apparatus, a part 301 of the apparatus constituting the handler 300 is arranged on the front side FR of the test heads 200A and 200B. For this reason, no special air inlet is required to cool the test heads 200A and 200B. That is, since the air is sucked from the gap of the device 301 and blown out, the amount of air required for cooling cannot be sufficiently obtained. Further, since the exhausted warm air blows out toward the tester main body 100, there is a disadvantage that the warm air warms the tester main body 100.

An object of the present invention is to provide a structure of an IC test apparatus having a structure in which the contact portion can be easily replaced and a sufficient amount of air for cooling the test head can be obtained. It is what

[0010]

In the present invention, the IC to be tested is
Tester for testing the operation of the tester, a test head electrically connected to the tester body by a cable bundle, and a test head located above the test head and mechanically linked to the test head to test the IC under test. An IC test apparatus composed of a handler for supplying to a contact portion provided on the upper surface of the test head, and a guide and drive device for moving the test head in the direction in which the cable bundle does not exist and exposing the test head from the lower part of the handler to the outside. A cable feeding device for feeding the cable bundle in synchronism with the movement of the test head by the guide and drive device is provided.

According to the structure of the present invention, the cable bundle is held by being pulled up by the cable feeding device, and when the test head is moved in the direction in which the cable bundle does not exist, the cable bundle is sequentially synchronized with the movement. Perform the feeding operation. Therefore, according to the present invention, the test head can be exposed on the front side FR or side portion of the handler. The front side, operating side or side of the handler is not as narrow as between the tester body and the handler. Therefore, the contact portion can be easily replaced.

[0012]

1 and 2 show an embodiment of the present invention.
The parts corresponding to those in FIGS. 6 and 7 are designated by the same reference numerals. In the present invention, the cavities 302 and 303 that penetrate the lower portion of the handler 300 in the front-rear direction are provided, and the cavity 3
Test heads 200A and 200B along 02, 303
The structure is to move.

That is, the guide rail 203 is supported by the elevating device 202 for elevating the test heads 200A and 200B. The guide rail 203 includes an outer rail and an inner rail that slides inside the outer rail. For example, the outer rail is supported by the lifting device 202, and the inner rail supports the test heads 200A and 200B. Lifting device 202
In the descent position of, the inner rail slides in the outer rail,
The inner rail protrudes from the outer rail and moves forward. A suitable driving means such as a motor is used for this movement.

Reference numeral 500 denotes a cable feeding device. In this example, the cable feeding device 500 shows a case where the cable feeding device 500 is configured by a step-like member. One end of the step-like member is rotatably supported by the casing of the tester main body 100, and the other end is connected to, for example, an inner rail 203B that is interlocked with the movement of the test heads 200A and 200B. With this configuration, when the test heads 200A and 200B move, the step member is rotated. The cable feeding device 500 is normally held in a standing posture. Therefore, the cable bundles 401 and 402 are held in a state of being bent upward by the cable feeding device 500. Due to this bending, the cable bundles 401 and 402 are supported by the cable feeding device 500 with a slack.

When the test heads 200A and 200B start moving forward, the link mechanism starts to rotate to a posture in which the stepladder becomes flat. By this movement, the cable bundles 401 and 402 are paid out. A roller is provided at the bent portion of the stepladder to prevent the cable bundles 401 and 402 from being unduly tensioned when the cable bundles 401 and 402 are fed out, and also to prevent the test head 200
Smoothly move the A and 200B.

On the contrary, when the test heads 200A and 200B are moved backward, the stepping member is rotated in the rising direction,
The operation of lifting the cable bundles 401 and 402 is performed.
FIG. 3 shows another embodiment of the cable feeding device 500. In this example, a cantilever 101 protruding from the ceiling surface of the tester main body 100, two electric winches 502 suspended from the cantilever 101, wires 503 drawn from the two electric winches 502, and a wire 503. It shows a case in which the roller 504 is provided at the tip of the.

In this case, the test heads 200A, 20A
The electric winch 502 is driven in synchronization with the movement of 0B, the electric winch is driven in the descending direction when the test heads 200A and 200B are moved forward, and the electric winch 502 is driven in the upward direction when retracting the test heads 200A and 200B. FIG. 4 shows still another embodiment of the present invention. In this example, the test heads 200A and 200B are moved to the side of the handler 300. In this case, since the test heads 200A and 200B move in an arc shape, the cable bundles 401 and 402 may be arranged in the vertical direction so as to give a degree of freedom to bending. However, the cable bundle 4
When wiring 01 and 402 on a flat surface,
It is necessary to provide the cable feeding device 500 described in FIG.

[0018]

As described above, according to the present invention, the test heads 200A and 200B can be exposed in a wide working area. As a result, there is an advantage that the replacement work of the contact portion 201 can be easily performed. In addition, as shown in FIGS. 1 and 2, the test heads 200A, 2A
When the cavities 302 and 303 are provided as the moving passages of 00B, a large amount of cooling air can be taken into the test heads 200A and 200B.
B can be sufficiently cooled. The warm air blown from the test head is blown upward along the cable bundles 401 and 402. Therefore, the tester main body 100 is not loosened.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a side view showing another embodiment of the present invention.

FIG. 4 is a plan view showing still another embodiment of the present invention.

5 is a side view of FIG.

FIG. 6 is a plan view for explaining a conventional technique.

FIG. 7 is a side view of FIG.

[Explanation of symbols]

 100 Tester body 200A, 200B Test head 201 Contact part 202 Lifting device 300 Handler 401, 402 Cable bundle 500 Cable feeding device

Claims (1)

[Claims] 1. A tester main body for testing the operation of an IC under test, a test head electrically connected to the tester main body by a cable bundle, and a test head located above the test head and mechanically connected to the test head. In the IC test apparatus, which comprises a handler for supplying the IC under test to the contact portion provided on the upper surface of the test head, the test head is moved in the direction in which the cable bundle does not exist, An IC characterized in that a guide driving device exposed from the lower part of the handler to the outside and a cable feeding device feeding the cable bundle in synchronization with the movement of the test head by the guide driving device are provided. Test equipment.