JPH06297168A - Method and device for laser irradiation, forming method for three-dimensional circuit, surface treatment method, and method for sticking powder - Google Patents

Abstract

PURPOSE:To three dimensionally irradiate the three-dimensional surface of a substrate by a laser beam, and to form a conductor circuit pattern without limitation of the shape of the three dimensional surface of the substrate. CONSTITUTION:A laser beam L is allowed to reflect in the X axis direction and in the Y axis direction by X and Y mirrors 1 and 2. Further, this reflected laser beam L is allowed to reflect in the Z axis direction by a Z mirror 3, and the three dimensional surface 8 of the substrate 4 is irradiated by the laser beam L. The surface 8 of the substrate 4 can be three dimensionally irradiated by the laser beam L with the combination of the X. Y mirrors 1, 2 and the Z mirror 3. Also, like this, since the surface 8 of the substrate 4 can be three dimensionally irradiated by the laser beam L, a conductor circuit pattern is formed on the surface 8 of the substrate 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for irradiating a surface of a substrate with laser light, and a method for forming a three-dimensional circuit, a surface treatment method and a powder deposition method using this laser light irradiation technique. is there.

[0002]

2. Description of the Related Art Substrate 4
As a general method of irradiating the surface of the substrate with the laser light L and scanning the laser light L to draw on the surface of the substrate 4, a method of operating a galvanometer as shown in FIG. 22 is well known. In FIG. 22, the X mirror 1 is attached to the rotary shaft 21a of the X galvanometer 21, and the Y mirror 2 is mounted to the rotary shaft 22a of the Y galvanometer 22. The rotary shaft 21a of the X galvanometer 21 and the Y galvanometer 22 are mounted. The rotating shafts 22a are arranged so as to be orthogonal to each other. The laser light L oscillated from the laser oscillator is reflected by the X mirror 1 and further reflected by the Y mirror 2 so that the surface of the substrate 1 is irradiated with X.
The galvanometer 21 and the Y galvanometer 22 are controlled so that the X mirror 1 is rotated by the rotation shaft 21a so that the laser beam L
The reflection angle of the Y mirror 2 is displaced along the X axis.
By rotating the rotary shaft 22a to change the reflection angle of the laser light L to Y.
By displacing along the axis, the laser light L can be scanned along the surface of the substrate 4 and can be drawn in an arbitrary pattern by the laser light L.

However, the method of FIG. 22 has no problem when two-dimensionally drawing on the surface formed as a flat surface of the substrate 4, but as shown in FIG. 23, the surface of the substrate 4 is a three-dimensional solid surface. In the case of being formed as 8, the surface of the projection 8a and the surface of the recess 8b of the three-dimensional surface 8 are the X / Y mirrors 1 and 2.
Since the distance from is different, the spot diameter of the irradiation of the laser light L changes and the scanning speed of the laser light L also changes,
Furthermore, the irradiation power of the laser light L will also change,
The accuracy of the drawing pattern by the laser light L was deteriorated.

As shown in FIG. 23, when the inclined surface 8c is formed between the projection 8a and the recess 8b of the three-dimensional surface 8 of the substrate 4, it is accepted that the accuracy of the drawing pattern is deteriorated. Laser beam L three-dimensionally on three-dimensional surface 8 of 4
Can be irradiated. However, as in the case of FIG. 24, when the vertical surface 8d is formed between the projection 8a and the concave portion 8b of the three-dimensional surface 8 of the base 4, the vertical surface 8d is shaded and the laser beam L is irradiated. Sometimes becomes impossible, and the laser beam L is three-dimensionally formed on the three-dimensional surface 8 of the substrate 4.
There was a problem that it could not be irradiated.

On the other hand, the conductor circuit pattern 9 is formed on the surface of the substrate 4.
To form a printed wiring board, etc.
A conductor circuit pattern 9 is formed as a three-dimensional circuit board provided in a three-dimensional shape. 25 to 27
Shows a conventional method for manufacturing a three-dimensional circuit board,
In FIG. 25, the conductor circuit pattern 9 is formed on the surface formed as the flat surface of the flat substrate 4 as shown in FIG. Thus, the base 4 is bent to form the conductor circuit pattern 9 in a three-dimensional shape. In addition, as shown in FIG. 26 (a), the conductor 23 shown in FIG. 26 (a) is formed by attaching a film 23 having a conductor circuit pattern 9 on the surface of a base body 4 which has been bent and formed in advance. The circuit pattern 9 is formed into a three-dimensional shape. 27, the conductor circuit pattern 9 is previously formed in the cavity 25 of the mold 24 as shown in FIG. 27A, and the resin is injection-molded in the cavity 25 of the mold 24 to form the base 4. The conductor circuit pattern 9 is formed in a three-dimensional shape on the base body 4 by molding and transferring the conductor circuit pattern 9 onto the surface of the base body 4 as shown in FIG.

However, in the structure shown in FIG. 25, a load for deforming the substrate 4 is applied, so that the conductor circuit pattern 9 is formed.
May peel off from the surface of the substrate 4, and it is difficult to form the position of the conductor circuit pattern 9 and the shape of the substrate 4 in a complicated manner with high accuracy. Further, in the case of FIG. 26, there is a problem that it is difficult to accurately adhere the film 21 provided with the conductor circuit pattern 9 to the surface of the base body 4, and it is difficult to deal with the base body 4 having a complicated shape. Further, in the case of FIG. 27, there is a problem that the shape of the mold 24 becomes complicated, and even this one cannot cope with the base body 4 having a complicated shape. 25 to 27, there is also a problem that the manufacturing process becomes complicated because the conductor circuit pattern 9 is not formed three-dimensionally directly on the surface of the base body 4.

For this reason, a method of directly providing the conductor circuit pattern 9 on the three-dimensional surface 8 of the substrate 4 is disclosed in JP-A-2-26529.
No. 3 publication. That is, a metal layer is provided on the three-dimensional surface of the substrate 4, a photosensitive resist layer is formed on the metal layer, and the substrate 4 is set on the NC processing table 27 as shown in FIG. Light L
Is focused by the laser irradiation head 28 to irradiate the substrate 4, and the NC processing table 27 is driven by the NC controller 29 to scan the focused beam of the laser light L along the three-dimensional surface 8 of the substrate 4 for scanning. The photosensitive resist layer is exposed with the above pattern shape. In FIG. 28, 30 is a control computer, 31 is a sensor controller, and 32 is a non-contact distance sensor. Then, in this way, the laser light L is applied to the photosensitive resist layer on the three-dimensional surface 8 of the substrate 4.
To expose a pattern shape, and then develop, and then etch away the metal layer exposed by the development of the photosensitive resist layer to form the conductor circuit pattern 9 on the three-dimensional surface 8 of the substrate 4. There is.

As described above, in Japanese Patent Application Laid-Open No. 2-265293, the conductor circuit pattern 9 is formed by irradiating the three-dimensional surface 8 of the substrate 4 with the laser beam L. Since the irradiation of the laser light L is scanned by moving 27, the exposure speed is limited, and the laser light L cannot be irradiated depending on the shape of the three-dimensional surface 8 as in the case of FIG. However, there is a problem that the conductor circuit pattern 9 cannot be formed depending on the shape of the three-dimensional surface 8 of the substrate 4.

The present invention has been made in view of the above points, and makes it possible to three-dimensionally irradiate a three-dimensional surface of a substrate with laser light, and is limited by the shape of the three-dimensional surface of the substrate. It is an object of the present invention to enable a conductor circuit pattern to be formed without using it.

[0010]

In the laser irradiation method according to the present invention, the laser light L is reflected by the XY mirrors 1 and 2 in the X-axis direction and the Y-axis direction, and the reflected laser light L is further reflected. It is characterized in that the surface of the substrate 4 is irradiated with the laser light L after being reflected by the Z mirror 3 in the Z-axis direction.

According to the present invention, at least one of the irradiation power of the laser beam L, the irradiation spot diameter, and the scanning speed of the laser beam L on the surface of the substrate 4 is changed according to the optical path of the laser beam L. The surface can be irradiated with the laser light L.
Further, in the present invention, at least one of the irradiation power of the laser light L, the irradiation spot diameter, and the scanning speed of the laser light L on the surface of the substrate 4 is set according to the incident angle of the laser light L on the surface of the substrate 4. Alternatively, the surface of the substrate 4 may be irradiated with the laser light L.

In the present invention, when there are a plurality of optical paths of the laser light L incident on a predetermined irradiation position on the surface of the substrate 4, the shortest optical path is selected and the surface of the substrate 4 is irradiated with the laser light L. can do. Further, in the present invention, when there are a plurality of optical paths of the laser light L incident on a predetermined irradiation position on the surface of the substrate 4, the optical path whose incident angle on the surface of the substrate 4 is closest to the normal direction is selected. It is also possible to irradiate the surface of 4 with the laser beam L.

In the present invention, when the surface of the substrate 4 can be irradiated with the laser light L only by the reflection of the XY mirrors 1 and 2, the Z mirror 3 may be selected not to be used. In this case, at least one of the irradiation power of the laser light L, the irradiation spot diameter, and the scanning speed of the laser light L on the surface of the base 4 is changed according to the optical path of the laser light L, and the laser light L is applied to the surface of the base 4. May be irradiated.

Further, in this case, at least one of the irradiation power of the laser light L, the irradiation spot diameter, and the scanning speed of the laser light L on the surface of the base body 4 according to the incident angle of the laser light L on the surface of the base body 4. Alternatively, the surface of the substrate 4 may be irradiated with the laser light L. A laser irradiation apparatus according to the present invention includes a laser oscillator 5 that oscillates a laser beam L,
XY mirrors 1 and 2 for reflecting the laser light L oscillated from the laser oscillator 5 in the X-axis direction and the Y-axis direction;
A Z mirror 3 for reflecting the laser light L reflected by the mirrors 1 and 2 toward the substrate 3 is provided.

In the present invention, the power varying mechanism 6 for changing the irradiation power of the laser light L can be provided in the optical path of the laser light L. Further, in the present invention, the beam diameter changing mechanism 7 for changing the beam diameter of the laser light L can be provided in the optical path of the laser light L. Furthermore, in the present invention, the Z mirror 3 can be formed movably.

In the present invention, the Z mirror 3 can be formed in any of a cylindrical shape, a conical shape, a spherical mirror and an aspherical mirror. Further, in the present invention, the laser light L incident on the Z mirror 3 is
It is preferable that the origin of is not coaxial with the central axis of the Z mirror 3. Further, in the present invention, the Z mirror 3 can be formed by a plane mirror.

In the method for manufacturing a three-dimensional circuit according to the present invention, the three-dimensional surface 8 of the substrate 4 is irradiated with the laser light L using the laser irradiation method described above, so that the substrate is formed in a pattern according to the drawing shape of the laser light L. The conductor circuit pattern 9 is formed on the three-dimensional surface 8 of FIG. Further, in the method for manufacturing a three-dimensional circuit according to the present invention, the conductor film 10 is provided on the three-dimensional surface 8 of the base body 4, the photosensitive etching resistant film 11 is provided on the conductor film 10, and the above-mentioned laser irradiation method is used to expose the conductor film 10. The conductive circuit pattern 9 is formed by irradiating the photosensitive etching resistant film 11 with a laser beam L, exposing the same, and developing the conductive film 10 exposed by the development of the photosensitive etching resistant film 11. To do.

The method for manufacturing a three-dimensional circuit according to the present invention is
A base conductor film 12 is provided on the three-dimensional surface 8 of the base body 4, a photosensitive insulating film 13 is provided on the base conductor film 12, and the photosensitive insulating film 13 is irradiated with the laser beam L using the above laser irradiation method. And exposing and then developing, thickening the conductor metal 14 on the underlying conductor film 12 exposed by the development of the photosensitive insulating film 13, then removing the photosensitive insulating film 13, and then covering with the conductor metal 14. The conductor circuit pattern 9 is formed by etching away the uncovered underlying conductor film 12.

The method for manufacturing a three-dimensional circuit according to the present invention is
A photosensitive anti-plating film 19 is provided on the three-dimensional surface 8 of the substrate 4, and the photosensitive anti-plating film 19 is irradiated with the laser beam L by the laser irradiation method described above to be exposed and then developed to obtain the photosensitive anti-plating film 19. The conductor circuit pattern 9 is formed by plating the three-dimensional surface 8 of the substrate 4 exposed by the development and depositing the conductor metal 14.

The method for manufacturing a three-dimensional circuit according to the present invention is
The photoreactive material 15 is applied to the three-dimensional surface 8 of the substrate 4, and the photoreactive material 15 is irradiated with the laser light L by using the laser irradiation method according to claim 1, and the laser light L
It is characterized in that the photoreactive material 15 in the exposed portion is reacted and the photoreactive material 15 in the unexposed portion is removed.

The method for manufacturing a three-dimensional circuit according to the present invention is
By irradiating the three-dimensional surface 8 of the substrate 4 with the laser light L in the reaction gas atmosphere by using the above laser irradiation method,
The vapor deposition film 16 is formed on the three-dimensional surface 8 of the substrate 4 by the photo-CVD method to form the conductor circuit pattern 9. Furthermore, the method for manufacturing a three-dimensional circuit according to the present invention,
The conductor layer 17 is provided on the three-dimensional surface 8 of the base 4, and the conductor layer 17 is irradiated with the laser beam L using the above laser irradiation method,
The conductor circuit pattern 9 is formed on the conductor layer 17 by removing the conductor layer 17 in the portion exposed by the laser light L or removing the other portion while leaving the conductor layer 17 in the portion exposed by the laser light L. It is characterized by forming.

The surface treatment method according to the present invention also includes a substrate 4
The three-dimensional surface 8 is irradiated with the laser light L by using the above laser irradiation method. Further, in the powder depositing method according to the present invention, the powder 18 is supplied to the three-dimensional surface 8 of the base body 4, and the three-dimensional surface 8 of the base body 4 is irradiated with the laser light L by using the above laser irradiation method. The three-dimensional surface 8 of the substrate 4 at the L irradiation position
The powder 18 is attached to the.

[0023]

The laser beam L is reflected by the X / Y mirrors 1 and 2 in the X-axis direction and the Y-axis direction, and the reflected laser beam L is further reflected by the Z mirror 3 in the Z-axis direction to form a solid body of the substrate 4. By irradiating the surface 8 with the laser beam L, X.
The Y mirrors 1 and 2 can scan the laser light L in the X-axis direction and the Y-axis direction of the base body 4, and the Z mirror 3 reflects the laser light L in the Z-axis direction to laser the laser light in the Z-axis direction of the base body 4. The light L can be scanned, and the three-dimensional surface 8 of the substrate 4 can be scanned.
It is possible to irradiate the laser light L three-dimensionally. Further, in this way, the laser light L is three-dimensionally applied to the three-dimensional surface 8 of the substrate 4.
Therefore, the conductor circuit pattern 9 is not limited by the shape of the three-dimensional surface 8 of the substrate 4.
Can be formed.

[0024]

EXAMPLES The present invention will be described in detail below with reference to examples. Figure 1
In principle, one embodiment of the present invention is shown.
An X mirror 1 and a Y mirror 2 are disposed above the three-dimensional surface 8 of. The X and Y mirrors 1 and 2 are attached to the X galvanometer 21 and the Y galvanometer 22 as in the case of FIG. The Z mirror 3 is arranged laterally of the base body 4 between the X and Y mirrors 1 and 2 and the base body 4. In addition, as shown in FIG.
Is controlled to control the oscillation of the laser light L, and the control device 34 controls the X galvanometer 21 and the Y galvanometer 22 to control the rotation of the X / Y mirrors 1 and 2.

The laser light L oscillated from the laser oscillator 5 is reflected by the X mirror 1 and further by the Y mirror 2 so as to be applied to the three-dimensional surface of the base 1. By rotating 1 to displace the reflection angle of the laser light L along the X-axis and by rotating the Y mirror 2 to displace the reflection angle of the laser light L along the Y-axis, the base 4 By scanning the laser light L along the three-dimensional surface 8 of, the laser light L can draw an arbitrary pattern. When reflecting the laser beam L in X · Y mirror 1 becomes a two-dimensional representation, the surface of the surface and the recess 8b of the projection 8a of the three-dimensional surface 8, the inclined surface 8c shown in L ₁ ~L ₅ in FIG. 1 However, the laser light L reflected by the XY mirrors 1 and 2 is further reflected by the Z mirror 3 on a surface such as the vertical surface 8d on which the laser light L cannot be incident on the three-dimensional surface 8. by reflecting to displace in the Z-axis direction can also be irradiated with the laser beam L on the vertical surface 8d and the like as shown in L ₆ ~L ₁₀ of FIG.

As described above, the laser light L is reflected by the X / Y mirrors 1 and 2 in the X-axis / Y-axis direction and further reflected in the Z-axis direction by the Z-mirror 3 to obtain the laser light L.
The laser beam L can be three-dimensionally drawn on the three-dimensional surface 8 of the substrate 4 by three-dimensionally scanning. Here, regarding the X, Y, and Z axes, two axes perpendicular to the horizontal plane are the X axis and the Y axis, and an axis perpendicular to the horizontal plane is the Z axis, and each is 90 °.
Can be defined as being orthogonal to each other, but it is not always strictly necessary that such an axis be used, and an axis that shows three directions in three dimensions can be used.

When the surface of the substrate 4 is the three-dimensional solid surface 8 as described above, the surfaces of the projections 8a and the recesses 8b of the solid surface 8 are the X / Y mirrors 1, 2 and Z. Mirror 3
Since the distance from is different, the optical path length of the laser light L changes. When the optical path length of the laser light L changes in this way, the spot diameter of the laser light L irradiated to the three-dimensional surface 8 changes according to the change of the optical path length, and the three-dimensional surface 8
The scanning speed (drawing speed) of the laser light L in FIG. 2 also changes, and the irradiation power of the laser light L on the three-dimensional surface 8 also changes. As a result, for example, when the laser light L is used for exposure, the exposure energy is changed. Change and the exposure cannot be performed under certain conditions, and the exposure line width becomes unstable. That is, if the energy density of exposure is E, the irradiation power is P, the spot diameter is A, and the scanning speed is S, then E = P
/ (A · S), and if any one of the irradiation power P, the spot diameter A, and the scanning speed S changes, the energy density E changes. Conversely, in other words, when the energy density E tends to change as the optical path length of the laser light L changes,
This means that the energy density E can be kept constant by adjusting at least one of the irradiation power P, the spot diameter A, and the scanning speed S.

Therefore, in the present invention, at least one of the irradiation power P of the laser light L, the irradiation spot diameter A, and the scanning speed S of the laser light L on the surface of the base 4 is changed according to the optical path of the laser light L. By irradiating the surface 4 of the laser beam L with the laser beam L, the three-dimensional surface 8 of the substrate 4 can be always irradiated with the laser beam L under a constant energy condition. FIG. 3 shows an embodiment in which the irradiation power P of the laser light L can be changed according to the optical path length of the laser light L. The power of the laser light L oscillated from the laser oscillator 5 is changed in the optical path. A variable mechanism 6 is provided. For example, as shown in FIG. 4, the power varying mechanism 6 has through holes 36 provided at a plurality of locations along the circumferential direction in the filter mounting plate 35, and each through hole 36 is provided with a plurality of types such as ND filters having different light transmittances. The filter 37a, 37b, 37c is attached and formed, and one of the through holes 36 is a through hole 36a without the filter attached. The filter mounting plate 35 is rotationally controlled by the control mechanism 34 with the central axis 35a as a rotational center, and the laser light L between the laser oscillator 5 and the three-dimensional surface 8 of the base 4 is L.
It is adapted to be rotated according to the optical path length of. For example, when the optical path length of the laser light L between the laser oscillator 5 and the three-dimensional surface 8 of the substrate 4 is long, the power is not attenuated by passing through the transmission hole 36a, and conversely the optical path length of the laser light L becomes shorter. Filter 37 with high transmittance
If the power is attenuated by passing the laser light L through a, 37b, and 37c, the laser light L can be always applied to the three-dimensional surface 8 with a constant irradiation power. The irradiation power on the three-dimensional surface 8 of the substrate 4 can be freely changed by adjusting the light transmittance. In the embodiment of FIG. 4, the irradiation power can be adjusted by changing it in four steps, but it is possible to freely adjust the irradiation power in more steps by increasing the number of filters.

FIG. 5 shows an embodiment in which the irradiation spot diameter (beam diameter) A of the laser light L can be changed according to the optical path length of the laser light L, and the laser oscillator 5 oscillates. A beam diameter changing mechanism 7 is provided in the optical path of the laser light L. The beam diameter changing mechanism 7 is formed by a condenser lens 7a, for example, as shown in FIG. 6A, and the condenser lens 7a is driven to move back and forth along the optical path of the laser light L. The drive of the condenser lens 7a is controlled by the control device 5. Then, for example, when the optical path length of the laser light L between the laser oscillator 5 and the three-dimensional surface 8 of the substrate 4 is short, as shown in FIG.
The condensing lens 7a is moved in the direction approaching the laser oscillator 5 from the broken line position in FIG. 6A to the solid line position, and the focusing distance of the laser light L is shortened from the broken line in FIG. The laser light L can be focused on the three-dimensional surface 8 of
When the optical path length of the laser light L is long, the laser oscillator 5
The laser beam L can be focused on the three-dimensional surface 8 of the base body 4 by moving the focusing lens 7a in a direction away from the focusing lens 7a to shorten the focusing distance of the laser beam L. By moving along the optical path according to the optical path length of the laser light L, it is possible to irradiate the three-dimensional surface 8 with the laser light L with a constant beam diameter. By moving the condenser lens 7a in this way, the irradiation spot diameter of the laser light L on the three-dimensional surface 8 of the base 4 can be freely changed. Although one condenser lens 7a is used in FIG. 6A, the irradiation spot diameter can be changed more freely by combining a plurality of condenser lenses.

When changing the scanning speed (drawing speed) S of the laser light L according to the optical path of the laser light L, X
It can be performed by adjusting the rotation speed of the Y mirrors 1 and 2. Further, in the embodiment of FIG. 7, the Z mirror 3 can be driven to rotate in the vertical direction, and by rotating the Z mirror 3, the laser beam L is scanned along the three-dimensional surface 8 of the base 4. And Z mirror 3
The scanning speed S of the laser beam L on the three-dimensional surface 8 of the substrate 4 can be changed by adjusting the rotation speed of the. Then, for example, when the three-dimensional surface 8 of the substrate 4 is exposed with the laser light L, the exposure line width is the X / Y mirror 1,
The exposure line width can be changed by adjusting the rotation frequency of the rotation so that the Z mirror 3 can be driven to rotate in the vertical direction so as to vibrate. You can also do so. XY mirror 1,
The rotation speed of the 2 and the Z mirror 3 is controlled by the control device 34.

In each of the above embodiments, at least one of the irradiation power P of the laser light L, the irradiation spot diameter A, and the scanning speed S of the laser light L on the surface of the substrate 4 is changed according to the optical path of the laser light L. However, the irradiation energy of the laser beam L changes even when the incident angle of the base 4 on the three-dimensional surface 8 changes. Therefore, according to the present invention, the irradiation power P of the laser light L, the irradiation spot diameter A, and the laser light L on the surface of the base 4 are determined according to the incident angle of the laser light L on the three-dimensional surface 8 of the base 4.
By irradiating the surface of the substrate 4 with the laser light L while changing at least one of the scanning speeds S of 1), the three-dimensional surface 8 of the substrate 4 can be always irradiated with the laser light L under a constant energy condition.

Here, when the laser beam L is irradiated onto a predetermined portion of the three-dimensional surface 8 of the base body 4, the XY mirrors 1 and 2 are used.
The laser beam L reflected by the laser beam L is directly incident on the three-dimensional surface 8 of the substrate 4, or is further reflected by the Z mirror 3 and then the laser beam L is incident on the three-dimensional surface 8 of the substrate 4 as shown in FIG. The laser light L in the plurality of optical paths as shown in FIG.
It may be possible to make the light incident on the three-dimensional surface 8 of. At this time, it is preferable to select the shortest optical path among the plurality of optical paths and irradiate the laser light L. Irradiation with the laser light L of the shortest optical path causes the smallest change in the irradiation condition (exposure condition) and is easy to control.
The laser light L of the shortest optical path is selected. For example, in FIG. 8, optical path L ₁ to optical path L ₂ (optical path of A), optical path L ₃ to
Optical path L ₄ (optical path of B), optical path L ₅ to optical path L ₆ (optical path of C)
It is possible to irradiate and draw the laser light L on the three-dimensional surface 8 of the base body 4 by the three optical paths, but since the optical path of A is the shortest distance, the optical path of A is selected and the laser light L is irradiated. It is better to do so.

Further, according to the present invention, the three-dimensional surface 8 of the substrate 4 is
When there are a plurality of optical paths of the laser light L which is incident on the predetermined irradiation position of, the incident angle of the three-dimensional surface 8 of the base 4 is the three-dimensional surface 8
It is preferable to select the optical path closest to the normal direction to irradiate the laser beam L on the three-dimensional surface of the substrate 4. Irradiation with the laser beam L having an incident angle close to the normal direction causes the smallest change in irradiation condition (exposure condition) and is easy to control.
The laser light L of the optical path whose incident angle is the closest to the normal direction is selected. For example, in FIG. 8, the optical path A is the closest to the normal direction of the three-dimensional surface 8 among the three optical paths A, B, and C, so that the optical path A is selected and the laser light L is selected.
It is better to irradiate.

As shown in FIG. 8, the shortest optical path and the optical path whose incident angle is closest to the normal direction are lasers which are reflected by the XY mirrors 1 and 2 and are directly incident on the three-dimensional surface 8 of the substrate 4. The laser light L, which is the light L and further reflected by the Z mirror 3, has the shortest optical path, and the incident angle also deviates from the normal direction. Therefore, according to the present invention, when the three-dimensional drawing can be performed by irradiating the three-dimensional surface 8 of the substrate 4 with the laser light L simply by reflecting the light with the XY mirrors 1 and 2,
The use of the Z mirror 3 can be selected so that the laser light L is irradiated without using the Z mirror 3 as long as the accuracy (exposure condition) of the drawing pattern by the laser light L is within an allowable range.

FIG. 9 shows the Z mirror 3, which is shown in FIG.
Any reflecting mirror such as a cylindrical mirror as shown in FIG. 9A, a conical mirror as shown in FIG. 9B, a spherical mirror as shown in FIG. 9C, or other aspherical mirror can be used. Here, when forming the Z mirror 3 as described above, for example, when it is formed by a cylindrical mirror, as shown in FIG.
When the origin of the laser light L incident on the mirror 3 (that is, the reflection point by the Y mirror 2) is coaxial, the laser light L is changed to Z.
Although the light is reflected only in the same central direction regardless of where it enters the mirror 3, the central axis O of the Z mirror 3 and the starting point of the laser light L are slightly shifted so as not to be coaxial, as shown in FIG. 10B. As a result, the laser light L can be reflected in all directions depending on the location of incidence on the Z mirror 3.

As the Z mirror 3, a plane mirror 3a may be used in addition to the curved mirror as described above. Plane mirror 3
Although it may be possible to use only one a, a plurality of plane mirrors 3a may be combined to form the Z mirror 3. In the embodiment shown in FIG. 11, the Z mirror 3 is formed in a rectangular tube shape by combining four plane mirrors 3a.

Now, the operation of exposing the three-dimensional surface 8 of the substrate 4 by three-dimensionally irradiating the laser beam L with the X / Y mirrors 1, 2 and the Z mirror 3 will be described in more detail with reference to the flowchart of FIG. To do. First, as shown in FIG. 13A, the inclination angle θ ₁ of the inclined surface 8c of the three-dimensional surface 8 of the substrate 4 is measured and compared with the reference angle θ (for example, 45 °) to determine whether or not the Z mirror 3 is used. To decide. That is, if θ ₁ ≧ θ, the Z mirror 3 is used, and if θ ₁ <θ, the Z mirror 3 is not used. Next, when the Z mirror 3 is used, since there can be a plurality of optical paths, it is necessary to determine the optical path. First, a possible optical path is calculated by a computer, optical paths A, B, and C are extracted as in the case of FIG. 8, and the shortest optical path or the optical path whose incident angle is closest to the normal line is calculated by a computer.
By determining, for example, as in the case of FIG.
To decide. Next, it is necessary to determine the line width to be exposed.
First, the exposure conditions are extracted from the optical path length of the optical path A and the incident angle,
The line width to be exposed is calculated by a computer based on the condition, the line width W ₁ is extracted, the line width W ₀ necessary for the exposure is compared with the line width W ₁ , and the difference is calculated. Then, the computer calculates the change value of the exposure condition. For example, in FIG.
As shown in (b), since the exposure line width and the irradiation power have a constant relationship, the changed value of the irradiation power is calculated by a computer so that W ₀ = W ₁ . After determining the irradiation power in this way, the XY mirror 1,
The laser beam L is reflected on the second and Z mirrors 3 to irradiate the three-dimensional surface 8 of the substrate 4 for exposure. Further, when the laser light L is irradiated by reflecting only on the X / Y mirrors 1 and 2 without using the Z mirror 3, it is not necessary to determine the optical paths because the optical paths do not have a plurality of paths. The width should be decided.

As described above, when the laser beam L is applied to the three-dimensional surface 8 of the substrate 4 for three-dimensional drawing, this laser irradiation technique is used in addition to the formation of a three-dimensional circuit described later, cutting in laser processing, and holes. It can be applied to all kinds of processing such as opening, welding and surface modification. Next, by irradiating the three-dimensional surface 8 of the base body 4 with the laser light L using the laser irradiation method and the laser irradiation device described above, the base body 4 is patterned in a pattern according to the drawing shape of the laser light L. A method of forming the conductor circuit pattern 9 on the three-dimensional surface 8 will be described.

FIG. 14 shows an embodiment of the formation of a three-dimensional circuit by the subtractive method. First, the three-dimensional surface of the base body 4 made of a resin molding or the like as an electric insulator as shown in FIG. 14 (a). The conductor film 10 is formed on the entire surface including 8 in FIG.
It is formed as shown in (b). The conductor film 10 has a thickness of 10 μm, for example, by electroless plating or electroplating of copper.
It can be formed as a metal film of about m. Next in FIG.
4 (c), the photosensitive etching resistant film 11 is formed on the entire surface of the conductor film 10. As the photosensitive etching resistant film 11, a photo etching resist can be used, and it can be formed by applying by a method such as dipping, spraying, electrodeposition or the like. And in FIG.
As shown in (d), the X / Y mirrors 1 and 2 and the Z mirror 3
By three-dimensionally irradiating the three-dimensional surface 8 of the substrate 4 with a laser beam L such as an argon laser to expose the photosensitive anti-etching film 11 in a pattern shape, and then developing.
The photosensitive etching resistant film 11 is removed as shown in FIG. 14E except for the portion where the circuit is formed. After that, an etching process is performed to expose the exposed portion of the conductor film 10 in FIG.
By removing as shown in (f) and removing the photosensitive etching resistant film 11 as needed, the conductor circuit pattern 9 is three-dimensionally formed on the three-dimensional surface 8 of the base body 4 as shown in FIG. Is something that can be done.

As the photosensitive etching resistant film 11, various kinds of materials having etching resistance that can be removed by exposure to the laser beam L can be used other than the photo etching resist, for example, PET ( An organic material film such as a polyethylene terephthalate) film or an inorganic material film such as a titanium film can be used. In addition to removing the photosensitive etching resistant film 11 as shown in FIG. 14G, the photosensitive etching resistant film 11 may be left as a protective film on all or part of the surface of the conductor circuit pattern 9 as it is in FIG. 14F.

FIG. 15 shows an embodiment of the formation of a three-dimensional circuit by the semi-additive method. First, a base conductor is formed on the three-dimensional surface 8 of the base body 4 made of a resin molded product or the like as shown in FIG. 15 (a). The film 12 is provided as shown in FIG. The base conductor film 12 can be formed as a thin metal film having a thickness of, for example, about 2 to 5 μm by electroless plating of copper. Next, as shown in FIG. 15C, the underlying conductor film 1
A photosensitive insulating film 13 is formed on the entire surface of 2. Photoresist can be used as the photosensitive insulating film 13, and it can be formed by applying by a method such as dipping, spraying, electrodeposition or the like. And in FIG.
As shown in (d), the X / Y mirrors 1 and 2 and the Z mirror 3
Is used to three-dimensionally irradiate the three-dimensional surface 8 of the substrate 4 with a laser beam L such as an argon laser to expose the photosensitive insulating film 13 in a pattern shape, and then development is performed to expose a portion where a circuit is formed. The insulating film 13 is removed as shown in FIG. 15 (e) to expose the underlying conductor film 12 at the circuit formation location. After that, the underlying conductor film 12 is energized to perform electrolytic copper plating or the like, so that the conductor metal 14 is thickened to a thickness of, for example, about 20 μm on the exposed surface of the underlying conductor film 12 as shown in FIG. After removing the photosensitive insulating film 13 as shown in FIG. 15G, a light etching process is performed to dissolve the underlying conductor film 12 by the thickness of the underlying conductor film 12 to remove the underlying conductor film 12, thereby removing the underlying conductor film 12 of FIG. Thus, the conductor circuit pattern 9 can be three-dimensionally formed on the three-dimensional surface 8 of the substrate 4. The surface of the conductor circuit pattern 9 can be plated with Ni or Au as required. As the photosensitive insulating film 13, various materials such as an organic material film and an inorganic material film can be used as long as they do not have electroplating that can be removed by exposure with the laser beam L. FIG. 16 shows an example of formation of a three-dimensional circuit by the full additive method. First, a three-dimensional surface 8 of a substrate 4 made of a resin molded product or the like as shown in FIG. 16A is used for electroless plating. A substrate is made of a resin molding containing a catalyst or a catalyst for electroless plating, and then a photosensitive anti-plating film 19 is formed on the entire surface of the substrate 4 including a three-dimensional surface 8 as shown in FIG. 16 (b). To form. As the photosensitive anti-plating film 19, a photoresist to which electroless plating does not adhere can be used, and can be formed by applying it by a method such as dipping, spraying, electrodeposition or the like. Then, FIG. 16C
As shown in FIG. 3, the three-dimensional surface 8 of the substrate 4 is three-dimensionally irradiated with a laser beam L such as an argon laser by a method using the X / Y mirrors 1 and 2 and the Z mirror 3 to form the photosensitive plating resistant film 19 into a pattern shape. After exposure, development is performed to remove the photosensitive plating resistant film 19 at the portion where the circuit is formed as shown in FIG. 16D, and the three-dimensional surface 8 of the substrate 4 where the circuit is formed is exposed. After that, the substrate 4 is immersed in an electroless plating bath, and a conductor metal is attached to the exposed surface of the three-dimensional surface 8 to a thickness of about 2 to 10 μm by electroless plating of copper or the like to form a conductor circuit as shown in FIG. The pattern 9 can be formed. By removing the photosensitive anti-plating film 19, as shown in FIG.
As shown in 6 (f), a three-dimensional circuit in which the conductor circuit pattern 9 is three-dimensionally formed on the three-dimensional surface 8 of the substrate 4 can be obtained. The photosensitive anti-plating film 19 may be removed as described above, or may be left as it is in FIG. Further, the conductor circuit pattern 9 may be further electroplated to be thickened, and the surface of the conductor circuit pattern 9 may be Ni-plated or Au-plated if necessary. As the photosensitive anti-plating film 19, various films such as an organic film and an inorganic film can be used as long as they do not have plating that can be removed by exposure with the laser light L.

FIG. 17 shows another method for forming a three-dimensional circuit. First, all surfaces including the three-dimensional surface 8 of the substrate 4 made as shown in FIG. The material 15 is applied and the film is provided as shown in FIG. The photoreactive material 15 may be an organic metal such as copper acetate, copper alkoxide, or dimethylaluminum. The organic metal is applied to the surface of the substrate 4 as it is or after being dissolved in a solvent and applied. The photoreactive material 15 can be deposited. And
As shown in FIG. 17C, the laser light L is applied to the three-dimensional surface 8 of the substrate 4 by the method using the X / Y mirrors 1 and 2 and the Z mirror 3.
The photoreactive material 15 at the circuit forming portion is exposed in a pattern by three-dimensional irradiation, and the exposed portion of the photoreactive material 15 formed of an organic metal is reacted or decomposed by the light energy of the laser light L. 17, a metal film or a mixed film of a metal and an organic material is formed, and the unexposed portion of the photoreactive material 15 is removed by washing with a solvent or the like to form a metal film or a mixed film of a metal and an organic material. The conductor circuit pattern 9 as shown in (d) can be three-dimensionally formed on the three-dimensional surface 8 of the substrate 4. The conductor circuit pattern 9 may be further thickened by electroplating or the like, and the surface of the conductor circuit pattern 9 may be Ni-plated or Au-plated if necessary.

In the above embodiment, an organic metal is used as the photoreactive material 15. However, as the photoreactive material 15, in addition to this, a conductive material capable of adhering only the exposed portion to the substrate 4 by photoreaction. For example, it is possible to use a material in which a conductive powder such as a metal powder of nickel or copper or a carbon powder is mixed with a photocurable adhesive so as to have conductivity. In this case, as in the case of FIG. 17, when the laser light L such as an ultraviolet laser is applied after the photoreactive material 15 is applied to the surface of the substrate 4, the portion of the photoreactive material 15 to which the laser light L is applied. Only the hardened portion is cured in a pattern shape and hardened and adhered to the three-dimensional surface 8 of the substrate 4. Then, the unreacted and non-cured portion of the photoreactive material 15 is washed and removed with a solvent, so that the conductor circuit pattern 9 composed of the cured layer of the conductive adhesive is three-dimensionally formed on the three-dimensional surface 8 of the base 4. It can be formed. Also in this case, the conductor circuit pattern 9 may be further electroplated or the like to be thickened, and the surface of the conductor circuit pattern 9 may be Ni-plated or Au-plated if necessary.

FIG. 18 shows a method of forming a three-dimensional circuit by the photo-CVD method. A substrate 4 having a three-dimensional surface 8 as shown in FIG. 18 (a) is converted into a laser beam L as shown in FIG. 18 (b). Is set in a transparent vapor deposition container 39 that transmits water, and one or more kinds of reaction gases such as titanium tetrachloride, tungsten carbonyl, and copper DPM are introduced into the vapor deposition container 39 from an inlet 40 together with a carrier gas such as hydrogen and nitrogen. To do.
41 is an exhaust port. Then, as shown in FIG. 18C, the laser light L is three-dimensionally irradiated onto the three-dimensional surface 8 of the substrate 4 through the vapor deposition container 39 by the method using the X / Y mirrors 1, 2 and the Z mirror 3. The three-dimensional surface 8 is exposed to the pattern shape of the circuit forming portion. At this time, it is preferable to preheat the substrate 4 to, for example, about 200 ° C. so that the reaction gas reacts and decomposes on the three-dimensional surface 8 of the substrate 4 to facilitate the chemical vapor deposition of the metal film. However, when exposed in this way, the reaction gas undergoes a decomposition reaction on the three-dimensional surface 8 of the substrate 4, and a metal vapor deposition film 16 can be formed on the surface of the substrate 4 in an exposure pattern.
The conductor pattern 9 formed of the metal vapor deposition film 16 is shown in FIG.
It can be formed on the three-dimensional surface 8 of the substrate 4 as in (c). The conductor circuit pattern 9 may be further thickened by electroplating or the like, and the surface of the conductor circuit pattern 9 may be plated with Ni or A as needed.
You may perform u plating.

FIG. 19 shows still another method for forming a three-dimensional circuit. First, a conductor layer is formed on the entire surface including the three-dimensional surface 8 of the substrate 4 made of a resin molded product or the like as shown in FIG. 19 (a). 17 is provided as shown in FIG. The conductor layer 17 can be formed by electroless plating of a metal such as nickel or copper, or can be provided by a PVD method or the like.
It is desirable to form the film as thin as about 5 to 2 μm.
Then, as shown in FIG.
And a laser beam L such as an excimer laser is applied to the surface of the substrate 4 by a method using the Z mirror 3 to irradiate a pattern shape on a portion other than a circuit formation portion.
The conductor layer 17 is skipped and removed by the energy of. By removing the conductor layer 17 other than the circuit formation portion with the laser light L in this manner, the conductor pattern 9 formed by the conductor layer 17 is formed on the three-dimensional surface 8 of the substrate 4 as shown in FIG. Is something that can be done. The conductor circuit pattern 9 may be further thickened by electroplating or the like, and the surface of the conductor circuit pattern 9 may be N
You may perform i plating and Au plating. In this embodiment, the conductor layer 17 is made of metal, and the conductor layer 17 other than the portion where the circuit is formed is removed by the laser beam L to form the conductor circuit pattern 9. However, for example, FIG.
As in the above embodiment, the conductor circuit pattern 9 is formed so that only the portion irradiated with the laser beam L remains on the three-dimensional surface 8 of the substrate 4.
May be formed.

Next, a surface treatment method for irradiating the substrate 4 with the laser light L using the above laser irradiation method and laser light irradiation apparatus will be described. The constituent material of the substrate 4 to be irradiated with the laser light L is resin, ceramic, metal, or the like, and the irradiation of the laser light L is not limited to the plane of the substrate 4 but also to the substrate 4.
It can also be performed on the three-dimensional surface 8 of. The irradiation pattern of the laser beam L is arbitrary such as dots and lines. Then, by irradiating the substrate 4 with the laser beam L, it is possible to perform a surface treatment for roughening the surface of the substrate 4, forming fine irregularities, improving adsorption, improving adhesiveness, and improving chemical reactivity. . For example, when the substrate 4 is irradiated with the laser light L as a base treatment for forming a circuit on the substrate 4, the adhesion strength of the circuit to the substrate 4 can be increased by roughening the surface of the substrate 4. When the substrate 4 is irradiated with the laser light L in a circuit pattern for electroless plating on the substrate 4, the electroless plating catalyst adheres only to the portion irradiated with the laser light L, and the pattern is electrolessly plated to form a circuit. Is something that can be done. Further, when the laser light L is irradiated to the ink-adhered portion of the printing plate, the ink adheres only to the portion irradiated with the laser light L, and printing can be performed by transferring this ink. In addition, laser light L
It is possible to improve the adhesion strength of the coating film for coating and to improve the coloring property of coloring by irradiating the substrate with the coating material and irradiating it with the base material for coating and coloring.

An example of a method for forming a three-dimensional circuit by surface-treating the substrate 4 with the laser light L in this way will be described with reference to FIG. First, on the three-dimensional surface 8 of the base 4 made of a resin molded product such as polyimide as shown in FIG.
A pattern for forming a circuit, as shown in FIG.
The surface of the substrate 4 is roughened by irradiating laser light L such as an excimer laser by a method using the mirrors 1 and 2 and the Z mirror 3, and the roughened portion 42 is formed by irradiating the laser light L in a pattern shape. It is formed in a pattern shape. Next, as shown in FIG. 20C, a base conductor film 12 is formed on the entire surface of the substrate 4 including the three-dimensional surface 8 to a thin thickness of, for example, about 1 to 2 μm by a method such as electroless plating of copper, vapor deposition, and sputtering. .
After that, as shown in FIG. 20D, the photosensitive insulating film 13 is formed by applying a photoresist or the like on the entire surface of the underlying conductor film 12 by a method such as dipping, spraying, or electrodeposition. Then, as shown in FIG. 20 (e), the three-dimensional surface 8 of the substrate 4 is three-dimensionally irradiated with the laser light L by a method using the XY mirrors 1 and 2 and the Z mirror 3 to pattern the photosensitive insulating film 13. The shape is exposed, and then development is performed to remove the photosensitive insulating film 13 at the portion where the circuit is to be formed, as shown in FIG. 20F, to expose the underlying conductor film 12 at the portion where the circuit is to be formed.
The surface of the exposed portion of the underlying conductor film 12 is a roughened portion 42. After that, the underlying conductor film 12 is energized to perform electrolytic copper plating, etc.
As shown in (g), the conductor metal 1 is formed on the exposed surface of the underlying conductor film 12.
4 is thickened to a thickness of, for example, about 20 μm, and FIG.
After the photosensitive insulating film 13 is removed as shown in 0 (h), a light etching process is performed to dissolve the underlying conductor film 12 by the thickness of the underlying conductor film 12, and the underlying conductor film 12 is removed. In addition, the conductor circuit pattern 9 can be three-dimensionally formed on the three-dimensional surface 8 of the substrate 4. The surface of the conductor circuit pattern 9 can be plated with Ni or Au as required. As described above, when the circuit is formed by the semi-additive method, the circuit forming portion is subjected to the surface roughening treatment for forming the surface roughened portion 42 by the irradiation of the laser beam L, so that the adhesion strength of the circuit can be increased. It is possible.

Next, while the powder 18 is being supplied to the three-dimensional surface 8 of the base body 4, the three-dimensional surface 8 of the base body 4 is irradiated with the laser light L, so that the three-dimensional surface 8 of the base body 4 is irradiated with the laser light L. A method of attaching the powder 18 will be described. At least the surface of the constituent material of the substrate 4 to be irradiated with the laser light L is a thermoplastic resin, and the irradiation of the laser light L can be performed not only on the plane of the substrate 4 but also on the three-dimensional surface 8 of the substrate 4. As the powder 18, for example,
Metal powder such as copper, nickel and brass, carbon powder, catalyst powder, coupling agent powder and the like can be used, and the particle diameter of the powder 18 is preferably in the range of several μm to several hundred μm. Then, the powder 18 is supplied to the surface of the base body 4 and the laser light L is irradiated to soften / adhesive the surface of the base body 4 with the energy of the laser light L so that the powder 18 is attached to the surface of the base body 4. By irradiating the surface of the substrate 4 with the laser light L with an arbitrary circuit pattern or decoration pattern such as dots or lines, the powder 18 can be attached in this pattern shape. For example, a circuit can be formed on the surface of the substrate 4 by depositing the metal powder 18 on the surface of the substrate 4 in a pattern shape, and the powder 18 of the electroless plating catalyst is deposited on the surface of the substrate 4 in a pattern shape. By performing the electroless plating by doing so, the circuit can be formed in a pattern shape by the electroless plating. The powder 18 can be supplied to the surface of the base body 4 by adhering the powder 18 to the surface of the base body 4 in advance. It can also be performed by spraying on the irradiated portion of the surface. By thus adhering the powder 18 to form a circuit, the circuit can be formed with high adhesion strength to the substrate 4.

An example of the method of forming the circuit by adhering the powder 18 to the surface of the substrate 4 in this way will be described with reference to FIG. As shown in FIG. 21 (b), the three-dimensional surface 8 of the base body 4 made of a molded product of a thermoplastic resin such as ABS resin as shown in FIG. Laser light L such as a YAG laser is three-dimensionally irradiated by the method using 3 to heat the three-dimensional surface 8 of the substrate 4 to soften and make it stick. Then, the powder 18 of a metal such as copper is sprayed from the nozzle 43 onto the three-dimensional surface 8 softened / adhered by using compressed gas or the like, so that the powder 18 is attached to the three-dimensional surface 8 at the softened / adhered portion. Can be glued. By irradiating the three-dimensional surface 8 of the base body 4 with the laser light L in a pattern shape, the conductor circuit pattern 9 can be formed of the powder 18. The conductor circuit pattern 9 may be further thickened by electroplating or the like, and the surface of the conductor circuit pattern 9 may be Ni-plated or Au-plated if necessary.

[0050]

As described above, in the laser irradiation method according to the present invention, the laser light is reflected by the XY mirror in the X-axis direction and the Y-axis direction, and the reflected laser light is further Z-turned.
Since the surface of the base is irradiated with the laser light by reflecting the laser light in the axial direction with the Z mirror, the laser light can be scanned in the X-axis direction and the Y-axis direction of the base with the XY mirror, and the Z-mirror can be used. The laser beam can be reflected in the Z-axis direction to scan the laser beam in the Z-axis direction of the base, and the three-dimensional surface of the base can be three-dimensionally irradiated with the laser light.

Further, the irradiation power of the laser light, the irradiation spot diameter, the
If at least one of the scanning speeds of the laser light on the surface of the base is changed so that the surface of the base is irradiated with the laser light,
Even when the optical path length or the incident angle changes when irradiating the laser beam on the three-dimensional surface of the substrate, the laser beam can always be irradiated under a constant energy condition.

Further, when there are a plurality of optical paths of the laser light incident on the predetermined irradiation position on the surface of the substrate, the optical path of the shortest distance is selected, or the optical path where the incident angle on the surface of the substrate is the closest to the normal direction. By selecting and irradiating the surface of the substrate with the laser light, the change in the irradiation condition of the laser light can be reduced. A laser irradiation apparatus according to the present invention includes a laser oscillator that oscillates laser light, an X / Y mirror that reflects the laser light oscillated from the laser oscillator in the X-axis direction and the Y-axis direction, and an XY mirror that reflects the laser light. And a Z mirror that reflects the laser light toward the base, the X and Y mirrors scan the laser light in the X axis direction and the Y axis direction of the base, and the Z mirror reflects the laser light in the Z axis direction. Then, the laser beam can be scanned in the Z-axis direction of the substrate, and the three-dimensional surface of the substrate can be three-dimensionally irradiated with the laser beam.

Further, since the power varying mechanism for changing the irradiation power of the laser light is provided in the optical path of the laser light, the irradiation power of the laser light is changed in accordance with the optical path of the laser light and the angle of incidence on the substrate to keep a constant value. It is possible to irradiate a laser beam under energy conditions. Furthermore, since a beam diameter changing mechanism that changes the beam diameter of the laser light is provided in the optical path of the laser light, the beam diameter of the laser light is changed according to the incident angle of the laser light on the optical path and the substrate, and constant energy conditions are maintained. It becomes possible to irradiate a laser beam with.

Further, since the Z mirror is movably formed, it is possible to always irradiate the laser light under a constant energy condition by changing the scanning speed of the laser light according to the optical path of the laser light and the angle of incidence on the substrate. It will be possible. A method for forming a three-dimensional circuit according to the present invention includes irradiating a three-dimensional surface of a substrate with laser light by using the above laser irradiation method to form a conductor circuit pattern on the three-dimensional surface of a substrate in a pattern according to a drawing shape by the laser light. Therefore, the three-dimensional surface of the substrate is irradiated with laser light three-dimensionally,
The conductor circuit pattern can be formed without being limited by the shape of the three-dimensional surface of the substrate.

In forming the three-dimensional circuit in the present invention, a conductive film is provided on the three-dimensional surface of the substrate, a photosensitive etching resistant film is provided on the conductive film, and the photosensitive etching resistant film is formed by using the above laser irradiation method. Since the conductive circuit pattern is formed by exposing the conductive film exposed to the laser beam to the conductive film exposed by the development of the photosensitive etching resistant film, the three-dimensional surface of the substrate is subtracted by the subtractive method. The conductor circuit pattern can be formed without being limited by the shape of the.

In forming a three-dimensional circuit in the present invention, a base conductive film is provided on the three-dimensional surface of the substrate, a photosensitive insulating film is provided on the base conductive film, and the photosensitive insulating film is formed by using the above laser irradiation method. Laser light on the surface of the photosensitive insulating film to develop it, and then develop the photosensitive insulating film to thicken the conductive metal on the underlying conductive film, and then remove the photosensitive insulating film. Since the conductor circuit pattern is formed by etching away the underlying conductor film that is not covered, the conductor circuit pattern can be formed by the semi-additive method without being restricted by the shape of the three-dimensional surface of the substrate. is there.

In forming the three-dimensional circuit in the present invention, a photosensitive plating resistant film is provided on the three-dimensional surface of the substrate, and the photosensitive plating resistant film is irradiated with laser light by the above laser irradiation method to be exposed and then developed. Since the conductive circuit pattern is formed by depositing a conductive metal on the three-dimensional surface of the substrate exposed by the development of the photosensitive anti-plating film, the three-dimensional surface of the substrate can be formed by the full additive method. The conductor circuit pattern can be formed without any limitation.

In forming a three-dimensional circuit in the present invention, a photoreactive material is applied to the three-dimensional surface of a substrate, the photoreactive material is irradiated with laser light using the above laser irradiation method, and exposed with laser light. The photoreactive material in the exposed portion is reacted and the photoreactive material in the unexposed portion is removed to form a conductor circuit pattern with the photoreactive material, so that the three-dimensional surface of the substrate is three-dimensionally formed. By irradiating with a laser beam, the conductor circuit pattern can be formed from the photoreactive material without being restricted by the shape of the three-dimensional surface of the substrate.

In forming the three-dimensional circuit in the present invention, the three-dimensional surface of the substrate is irradiated with laser light in the reaction gas atmosphere by using the above laser irradiation method.
Since the conductor circuit pattern is formed by forming a vapor deposition film on the three-dimensional surface of the substrate by the photo-CVD method,
The conductor circuit pattern can be formed by the photo CVD method without being restricted by the shape of the three-dimensional surface of the substrate.

In forming a three-dimensional circuit in the present invention, a conductor layer is provided on the three-dimensional surface of the substrate, and the conductor layer is irradiated with laser light by using the above laser irradiation method, so that the conductor exposed in the laser light is irradiated. Since the conductor circuit pattern is formed by the conductor layer by removing the layer or leaving the conductor layer of the part exposed by the laser beam and removing the other part, the three-dimensional surface of the substrate is three-dimensionally formed. It is possible to form a conductor circuit pattern on the conductor layer by irradiating the substrate with laser light without being restricted by the shape of the three-dimensional surface of the substrate.

The surface treatment method according to the present invention is characterized by irradiating the three-dimensional surface of the substrate with laser light by using the above laser irradiation method, and the three-dimensional laser beam is applied to the three-dimensional surface of the substrate. The surface treatment can be carried out by irradiating with, without being restricted by the shape of the three-dimensional surface of the substrate. In the powder deposition method according to the present invention, the powder is supplied to the three-dimensional surface of the substrate, and the three-dimensional surface of the substrate is irradiated with laser light using the above laser irradiation method, so that the three-dimensional surface of the substrate is irradiated at the laser light irradiation position. It is characterized in that powder is attached to the surface, and the three-dimensional laser beam is applied to the three-dimensional surface of the substrate so that the powder can be attached without being restricted by the shape of the three-dimensional surface of the substrate. It is a thing.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of the above-described embodiment.

FIG. 3 is a schematic configuration diagram of another embodiment of the present invention.

FIG. 4 is a perspective view of a part of the above embodiment.

FIG. 5 is a schematic configuration diagram of still another embodiment of the present invention.

FIG. 6 shows a part of the above-mentioned embodiment, (a)
FIG. 4 is an enlarged view of a beam diameter changing mechanism portion, and FIG.

FIG. 7 is a schematic configuration diagram of still another embodiment of the present invention.

FIG. 8 is a schematic configuration diagram of still another embodiment of the present invention.

9A and 9B are views showing various aspects of a Z mirror used in the present invention, in which FIGS. 9A and 9B are partially cutaway perspective views, and FIG.
FIG. 3 is a partially cutaway sectional view.

FIG. 10 shows a reflection state by a Z mirror used in the present invention, and (a) and (b) are sectional views.

FIG. 11 is a perspective view showing another aspect of the Z mirror used in the present invention.

FIG. 12 is a flowchart of control of exposure by laser irradiation in the present invention.

FIG. 13 (a) is a sectional view of a part of the substrate showing the angle of the inclined surface in the above, and FIG. 13 (b) is a graph showing the relationship between the line width of exposure and the irradiation power.

FIG. 14 shows an embodiment of a method for forming a three-dimensional circuit according to the present invention, in which (a) to (g) are cross-sectional views, respectively.

FIG. 15 shows another embodiment of the method for forming a three-dimensional circuit according to the present invention, in which (a) to (h) are sectional views, respectively.

FIG. 16 shows still another embodiment of the method for forming a three-dimensional circuit according to the present invention, in which (a) to (f) are cross-sectional views, respectively.

FIG. 17 shows still another embodiment of the method for forming a three-dimensional circuit according to the present invention, in which (a) to (d) are cross-sectional views, respectively.

FIG. 18 shows still another embodiment of the method for forming a three-dimensional circuit according to the present invention, in which (a) to (c) are sectional views, respectively.

FIG. 19 shows still another embodiment of the method for forming a three-dimensional circuit according to the present invention, in which (a) to (d) are cross-sectional views, respectively.

FIG. 20 shows an embodiment of the surface treatment method of the present invention, in which (a) to (i) are sectional views, respectively.

FIG. 21 shows an example of the method of depositing powder according to the present invention, in which (a) and (b) are cross-sectional views, respectively.

FIG. 22 is a perspective view of a conventional example.

FIG. 23 is a schematic view of the above.

FIG. 24 is a schematic configuration diagram showing the above problems.

FIG. 25 shows another conventional example, (a),
(B) is a sectional view.

FIG. 26 shows still another conventional example,
(A), (b) is sectional drawing, respectively.

FIG. 27 shows still another conventional example,
(A), (b) is sectional drawing, respectively.

FIG. 28 is a schematic view showing still another conventional example.

[Explanation of symbols]

 1 X Mirror 2 Y Mirror 3 Z Mirror 4 Substrate 5 Laser Oscillator 6 Power Variable Mechanism 7 Beam Diameter Variable Mechanism 8 Solid Surface 9 Conductor Circuit Pattern 10 Conductor Film 11 Photosensitive Etching Film 12 Base Conductor Film 13 Photosensitive Insulating Film 14 Conductor Metal 15 Photoreactive Material 16 Vapor Deposition Film 17 Conductor Layer 18 Powder 19 Photosensitive Plating Resistant Film

Continuation of front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location B23K 26/08 N 7425-4E C23C 16/48 8116-4K G02B 26/10 101 H01S 3/101 8934-4M H05K 3/06 E 6921-4E 3/08 D 6921-4E 3/10 C 7511-4E 3/14 7511-4E 3/18 D 7511-4E (72) Inventor Sakuo Kamata 1048 Kadoma, Kadoma, Osaka Prefecture Matsushita Inside the Electric Works Co., Ltd. (72) Inventor Takako Otani 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Toshiyuki Suzuki, 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works Co., Ltd. Inventor Tsuyoshi Okamoto 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd.

Claims (24)

[Claims] 1. A laser beam is applied to the X-axis direction and the Y-axis direction by X.
A laser irradiation method characterized in that the laser light is reflected by a Y mirror and the reflected laser light is further reflected by a Z mirror in the Z-axis direction to irradiate the surface of the substrate with the laser light. 2. Irradiating the laser beam on the surface of the substrate by changing at least one of the irradiation power of the laser beam, the irradiation spot diameter, and the scanning speed of the laser beam on the surface of the substrate according to the optical path of the laser beam. The laser irradiation method according to claim 1, which is characterized in that. 3. The laser on the surface of the substrate is changed by changing at least one of the irradiation power of the laser light, the irradiation spot diameter, and the scanning speed of the laser light on the surface of the substrate according to the incident angle of the laser light on the surface of the substrate. The laser irradiation method according to claim 1 or 2, wherein light is irradiated. 4. The laser light is irradiated onto the surface of the substrate by selecting the shortest optical path when there are a plurality of optical paths of the laser light incident on a predetermined irradiation position on the surface of the substrate. 4. The laser irradiation method according to any one of 1 to 3. 5. When there are a plurality of optical paths of laser light incident on a predetermined irradiation position on the surface of the substrate, the optical path whose incident angle on the surface of the substrate is closest to the normal direction is selected to select the laser beam on the surface of the substrate. The laser irradiation method according to claim 1, wherein the laser irradiation method is irradiating. 6. The use of a Z mirror can be selected so that the Z mirror is not used when the surface of the substrate can be irradiated with laser light only by the reflection of the X and Y mirrors. The laser irradiation method according to any one of 1. 7. The surface of the substrate is irradiated with the laser beam by changing at least one of the irradiation power of the laser beam, the irradiation spot diameter, and the scanning speed of the laser beam on the surface of the substrate according to the optical path of the laser beam. The laser irradiation method according to claim 6, which is characterized in that. 8. The laser on the surface of the substrate is changed by changing at least one of the irradiation power of the laser light, the irradiation spot diameter, and the scanning speed of the laser light on the surface of the substrate according to the incident angle of the laser light on the surface of the substrate. The laser irradiation method according to claim 6 or 7, wherein light is irradiated. 9. A laser oscillator that oscillates laser light, an XY mirror that reflects the laser light oscillated from the laser oscillator in the X-axis direction and the Y-axis direction, and laser light that is reflected by the XY mirror. A laser irradiation device comprising: a Z mirror that reflects the light toward a substrate. 10. The laser irradiation apparatus according to claim 9, wherein a power variable mechanism for changing the irradiation power of the laser light is provided in the optical path of the laser light. 11. The laser irradiation apparatus according to claim 9, wherein a beam diameter changing mechanism for changing the beam diameter of the laser light is provided in the optical path of the laser light. 12. The laser irradiation apparatus according to claim 9, wherein a Z mirror is movably formed. 13. The Z mirror is cylindrical, conical, spherical mirror,
The laser irradiation device according to claim 9, wherein the laser irradiation device is formed on any of the aspherical mirrors. 14. The laser irradiation apparatus according to claim 9, wherein the starting point of the laser light incident on the Z mirror is not coaxial with the central axis of the Z mirror. 15. The laser irradiation apparatus according to claim 9, wherein the Z mirror is a plane mirror. 16. A laser beam is irradiated onto the three-dimensional surface of the substrate by using the laser irradiation method according to claim 1, whereby the three-dimensional surface of the substrate is patterned in a pattern corresponding to a drawing shape by the laser beam. A method for forming a three-dimensional circuit, which comprises forming a conductor circuit pattern. 17. A photosensitive film is provided on the three-dimensional surface of a substrate, and a photosensitive etching resistant film is provided on the conductive film, and the photosensitive etching resistant film is formed using the laser irradiation method according to claim 1. Description: A method for forming a three-dimensional circuit, comprising forming a conductor circuit pattern by irradiating a film with a laser beam, exposing the film, developing the film, and etching the conductor film exposed by the development of the photosensitive etching resistant film. 18. A photosensitive insulating film is provided by using the laser irradiation method according to claim 1, wherein a base conductor film is provided on a three-dimensional surface of a substrate, and a photosensitive insulating film is provided on the base conductor film. The film is irradiated with laser light to be exposed and then developed, and the conductive metal is thickly applied on the underlying conductive film exposed by the development of the photosensitive insulating film, and then the photosensitive insulating film is removed. A method for forming a three-dimensional circuit, comprising forming a conductor circuit pattern by etching and removing a base conductor film not covered with. 19. A photosensitive plating-resistant film is provided on the three-dimensional surface of a substrate, and the photosensitive plating-resistant film is irradiated with laser light by using the laser irradiation method according to claim 1, and then exposed. A method for forming a three-dimensional circuit, which comprises forming a conductor circuit pattern by developing and plating a three-dimensional surface of a substrate exposed by the development of a photosensitive anti-plating film to deposit a conductor metal. 20. A photoreactive material is applied to the three-dimensional surface of a substrate, and the photoreactive material is irradiated with a laser beam by using the laser irradiation method according to claim 1, and the laser beam is applied. A method for forming a three-dimensional circuit, which comprises forming a conductor circuit pattern with the photoreactive material by reacting the photoreactive material in the exposed portion and removing the photoreactive material in the unexposed portion. 21. A three-dimensional surface of a substrate is vapor-deposited by a photo-CVD method by irradiating the three-dimensional surface of the substrate with a laser beam by using the laser irradiation method according to any one of claims 1 to 8 in a reaction gas atmosphere. A method for forming a three-dimensional circuit, comprising forming a conductor circuit pattern by forming a film. 22. A conductor layer is provided on the three-dimensional surface of a substrate, and the conductor layer is irradiated with a laser beam by using the laser irradiation method according to claim 1, and the portion exposed by the laser beam is irradiated. A method for forming a three-dimensional circuit, characterized in that a conductor circuit pattern is formed by a conductor layer by removing the conductor layer or removing the other portion while leaving the conductor layer exposed by the laser beam. 23. A surface treatment method, which comprises irradiating a three-dimensional surface of a substrate with laser light by using the laser irradiation method according to claim 1. Description: 24. Irradiation of laser light by supplying powder to the three-dimensional surface of the substrate and irradiating laser light to the three-dimensional surface of the substrate using the laser irradiation method according to claim 1. A powder deposition method, characterized in that powder is deposited on a three-dimensional surface of a substrate at a location.