JP3175994B2 - Laser irradiation method and laser irradiation apparatus, and three-dimensional circuit forming method, surface treatment method, and powder adhering method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for irradiating a surface of a substrate with a laser beam, and a method for forming a three-dimensional circuit, a surface treatment method and a powder adhering method using the laser beam irradiation technique. is there.

[0002]

2. Description of the Related Art Base 4
As a general method of irradiating the surface of the substrate 4 with the laser light L and scanning the laser light L to draw on the surface of the base 4, a method of operating a galvanometer as shown in FIG. 22 is well known. In FIG. 22, the X mirror 1 is attached to the rotation axis 21a of the X galvanometer 21 and the Y mirror 2 is attached to the rotation axis 22a of the Y galvanometer 22, and the rotation axis 21a of the X galvanometer 21 and the Y galvanometer 22 are attached. Are arranged to be orthogonal to each other. The laser light L oscillated from the laser oscillator is reflected by the X mirror 1 and further reflected by the Y mirror 2 to irradiate the surface of the base 1.
By controlling the galvanometer 21 and the Y galvanometer 22, the X mirror 1 is rotated about the rotation shaft 21a, and the laser light L
The reflection angle of the mirror along the X axis and the Y mirror 2
Is rotated by the rotation shaft 22a to change the reflection angle of the laser light L to Y.
By displacing along the axis, the laser beam L can be scanned along the surface of the base 4 and drawn in an arbitrary pattern by the laser beam L.

However, the method shown in FIG. 22 has no problem when two-dimensionally drawing on the surface formed as a plane of the substrate 4, but the surface of the substrate 4 has a three-dimensional surface as shown in FIG. 8, the surface of the projection 8a of the three-dimensional surface 8 and the surface of the recess 8b are
Since the distance from the laser beam L is different, the irradiation spot diameter of the laser beam L changes and the scanning speed of the laser beam L also changes,
Furthermore, the irradiation power of the laser light L will also change,
The accuracy of the pattern drawn by the laser beam L is deteriorated.

When the inclined surface 8c is formed between the protrusion 8a and the concave portion 8b of the three-dimensional surface 8 of the base 4 as in the case of FIG. The three-dimensional surface 8 of the laser beam L
Can be irradiated. However, when the vertical surface 8d is formed between the projection 8a and the concave portion 8b of the three-dimensional surface 8 of the base 4 as in the case of FIG. 24, the vertical surface 8d becomes a shadow and emits the laser beam L. In some cases, laser light L is three-dimensionally applied to the three-dimensional surface 8 of the base 4.
Irradiation cannot be performed.

On the other hand, a conductive circuit pattern 9
In forming a printed wiring board etc. by forming
The conductor circuit pattern 9 is formed as a three-dimensional circuit board provided in a three-dimensional shape. 25 to 27
Shows a conventional method of manufacturing a three-dimensional circuit board,
25A is formed by forming a conductive circuit pattern 9 on the surface formed as a flat surface of the flat substrate 4 as shown in FIG. In this manner, the base 4 is bent so that the conductive circuit pattern 9 is formed in a three-dimensional shape. In the case of FIG. 26, a film 23 provided with a conductor circuit pattern 9 is attached to the surface of a substrate 4 which has been bent and formed in advance as shown in FIG. The circuit pattern 9 is formed in a three-dimensional shape. 27, the conductor circuit pattern 9 is previously formed in the cavity 25 of the mold 24 as shown in FIG. The conductor circuit pattern 9 is formed on the substrate 4 in a three-dimensional shape by molding and transferring the conductor circuit pattern 9 to the surface of the substrate 4 as shown in FIG.

However, in FIG. 25, since a load for deforming the base 4 is applied, the conductor circuit pattern 9 is not provided.
However, there is also a problem that it is difficult to form the position of the conductive circuit pattern 9 and the shape of the base 4 in a complicated and accurate manner. 26 has a problem that it is difficult to accurately attach the film 21 provided with the conductor circuit pattern 9 to the surface of the base 4 and it is difficult to cope with the base 4 having a complicated shape. Further, in the case of FIG. 27, there is a problem that the shape of the mold 24 becomes complicated, and it is impossible to cope with the substrate 4 having a complicated shape. 25 to 27, there is also a problem that the manufacturing process becomes complicated because the conductor circuit pattern 9 is not formed three-dimensionally directly on the surface of the base 4.

For this purpose, a method of directly providing the conductor circuit pattern 9 on the three-dimensional surface 8 of the base 4 is disclosed in Japanese Patent Laid-Open No. 26529/1990.
No. 3 publication. That is, a metal layer is provided on the three-dimensional surface of the base 4 and a photosensitive resist layer is formed on the metal layer. The base 4 is set on the NC processing table 27 as shown in FIG. Light L
Is focused by the laser irradiation head 28 to irradiate the base 4, and the NC controller 29 drives the NC processing table 27 to scan the focused beam of the laser light L along the three-dimensional surface 8 of the base 4. The photosensitive resist layer is exposed in the formed pattern shape. In FIG. 28, 30 is a control computer, 31 is a sensor controller, and 32 is a non-contact distance sensor. Then, the laser light L is applied to the photosensitive resist layer on the three-dimensional surface 8 of the base 4 as described above.
After exposure to a pattern shape by irradiating, a metal layer exposed by development of the photosensitive resist layer is etched away to form a conductive circuit pattern 9 on the three-dimensional surface 8 of the base 4. It is.

As described above, in Japanese Unexamined Patent Publication No. 2-265293, the conductor circuit pattern 9 is formed by irradiating the three-dimensional surface 8 of the substrate 4 with the laser beam L. There is a limit to the exposure speed because the irradiation by the laser beam L is scanned by moving the laser beam 27, and the laser beam L cannot be irradiated depending on the shape of the three-dimensional surface 8 as in the case of FIG. There is a problem that the conductor circuit pattern 9 cannot be formed depending on the shape of the three-dimensional surface 8 of the base 4.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has an object to irradiate a three-dimensional laser beam onto a three-dimensional surface of a substrate and to be limited by the shape of the three-dimensional surface of the substrate. It is an object of the present invention to be able to form a conductor circuit pattern without using the same.

[0010]

According to the laser irradiation method of the present invention, the laser beam L is reflected by the X and Y mirrors 1 and 2 in the X-axis direction and the Y-axis direction, and the reflected laser beam L is further reflected. When irradiating the surface of the substrate 4 with the laser beam L by reflecting the laser beam L in the Z-axis direction , the laser beam L
Irradiation power and irradiation spot of laser beam L according to optical path
Diameter, the scanning speed of the laser beam L on the surface of the substrate 4 should be small.
Also characterized in the this <br/> irradiating the surface of the substrate 4 by changing the one laser beam L.

According to the present invention, at least one of the irradiation power of the laser beam L, the irradiation spot diameter, and the scanning speed of the laser beam L on the surface of the substrate 4 according to the angle of incidence of the laser beam L on the surface of the substrate 4. Alternatively, the surface of the base 4 can be irradiated with the laser beam L.

In the present invention, when there are a plurality of optical paths of the laser beam L incident on a predetermined irradiation location on the surface of the substrate 4, the shortest distance optical path is selected and the surface of the substrate 4 is irradiated with the laser beam L. can do. Further, in the present invention, when there are a plurality of optical paths of the laser beam L incident on a predetermined irradiation location on the surface of the substrate 4, the optical path whose incident angle on the surface of the substrate 4 is closest to the normal direction is selected. 4 can be irradiated with the laser beam L.

In the present invention, when capable of irradiating a laser beam L on the surface of the substrate 4 reflected only in the X · Y mirror 1 and 2 rather good even allow choose not to use the Z mirror 3, in this case The surface of the base 4 is irradiated with the laser light L by changing at least one of the irradiation power of the laser light L, the irradiation spot diameter, and the scanning speed of the laser light L on the surface of the base 4 in accordance with the optical path of the laser light L. You may do so.

In this case, at least one of the irradiation power of the laser beam L, the irradiation spot diameter, and the scanning speed of the laser beam L on the surface of the substrate 4 according to the angle of incidence of the laser beam L on the surface of the substrate 4. Alternatively, the surface of the base 4 may be irradiated with the laser beam L. The laser irradiation device according to the present invention includes: a laser oscillator 5 that oscillates a laser beam L;
XY mirrors 1 and 2 for reflecting the laser light L oscillated from the laser oscillator 5 in the X-axis direction and the Y-axis direction;
A Z mirror 3 for reflecting the laser beam L reflected by the mirrors 1 and 2 toward the base 3 so that the Z mirror 3 is movable.
It is characterized by being formed .

[0015]

In the present invention, the Z mirror 3 can be formed in any one of a cylindrical shape, a conical shape, a spherical mirror, and an aspherical mirror. In the present invention, the laser light L incident on the Z mirror 3 is
Is not coaxial with the center axis of the Z mirror 3 .

In the method of manufacturing a three-dimensional circuit according to the present invention, the three-dimensional surface 8 of the substrate 4 is irradiated with the laser light L by using the above-described laser irradiation method, so that the substrate is formed in a pattern corresponding to the drawing shape by the laser light L. The conductor circuit pattern 9 is formed on the three-dimensional surface 8 of the fourth embodiment. Further, in the method of manufacturing a three-dimensional circuit according to the present invention, a conductive film 10 is provided on the three-dimensional surface 8 of the base 4 and a photosensitive etching resistant film 11 is provided on the conductive film 10. The conductive circuit pattern 9 is formed by irradiating the photosensitive etching resistant film 11 with a laser beam L, exposing it to light, developing the exposed film, and etching the conductive film 10 exposed by the development of the photosensitive etching resistant film 11. Is what you do.

Further, the method for manufacturing a three-dimensional circuit according to the present invention comprises:
A base conductor film 12 is provided on the three-dimensional surface 8 of the base 4 and a photosensitive insulating film 13 is provided on the base conductor film 12. The photosensitive insulating film 13 is irradiated with a laser beam L by using the laser irradiation method described above. After exposure and development, the conductive metal 14 is thickened on the underlying conductive film 12 exposed by the development of the photosensitive insulating film 13, and after the photosensitive insulating film 13 is removed, the conductive metal 14 is covered with the conductive metal 14. The conductive circuit pattern 9 is formed by etching and removing the underlying conductive film 12 which is not covered.

Further, the method for manufacturing a three-dimensional circuit according to the present invention comprises:
A photosensitive plating-resistant film 19 is provided on the three-dimensional surface 8 of the substrate 4, and the photosensitive plating-resistant film 19 is exposed to laser light L by using the above-described laser irradiation method, exposed to light, and developed. The conductive circuit pattern 9 is formed by plating the three-dimensional surface 8 of the base 4 exposed by the development of the above and attaching the conductive metal 14 thereto.

Further, the method of manufacturing a three-dimensional circuit according to the present invention comprises:
The photoreactive material 15 is applied to the three-dimensional surface 8 of the substrate 4 is irradiated with laser light L to the light reactive material 15 by using the laser irradiation method according to any one of claims 1 to 6, the laser beam L
And reacting the exposed portion of the photoreactive material 15 and removing the unexposed portion of the photoreactive material 15.

Further, the method of manufacturing a three-dimensional circuit according to the present invention
By irradiating the three-dimensional surface 8 of the substrate 4 with the laser beam L using the above-described laser irradiation method in a reaction gas atmosphere,
A conductive circuit pattern 9 is formed by forming a vapor-deposited film 16 on the three-dimensional surface 8 of the substrate 4 by a photo-CVD method. Further, the method of manufacturing a three-dimensional circuit according to the present invention,
The conductor layer 17 is provided on the three-dimensional surface 8 of the base 4, and the conductor layer 17 is irradiated with the laser beam L using the laser irradiation method described above.
The conductor circuit pattern 9 is formed by the conductor layer 17 by removing the portion of the conductor layer 17 exposed to the laser beam L or removing the other portion while leaving the portion of the conductor layer 17 exposed to the laser beam L. It is characterized by forming.

In the surface treatment method according to the present invention, the substrate 4
The three-dimensional surface 8 is irradiated with the laser beam L using the above-described laser irradiation method. Further, in the method for applying powder according to the present invention, the three-dimensional surface 8 of the base 4 is supplied with the powder 18 and the three-dimensional surface 8 of the base 4 is irradiated with the laser light L using the above-described laser irradiation method. The three-dimensional surface 8 of the substrate 4 at the irradiation position of L
The method is characterized in that powder 18 is adhered to the substrate.

[0023]

The laser beam L is reflected by the X and Y mirrors 1 and 2 in the X-axis direction and the Y-axis direction, and the reflected laser beam L is further reflected by the Z mirror 3 in the Z-axis direction to form a three-dimensional By irradiating the surface 8 with the laser beam L, X ·
The laser light L can be scanned in the X-axis direction and the Y-axis direction of the base 4 by the Y mirrors 1 and 2, and the laser light L is reflected in the Z-axis direction by the Z mirror 3 so that the laser beam can be scanned in the Z-axis direction of the base 4. The light L can be scanned, and the three-dimensional surface 8
Can be three-dimensionally irradiated with the laser light L. Further, as described above, the laser light L is three-dimensionally formed on the three-dimensional surface 8 of the base 4.
Irradiates the conductor circuit pattern 9 without being limited by the shape of the three-dimensional surface 8 of the base 4.
Can be formed.

[0024]

The present invention will be described below in detail with reference to examples. FIG.
1 shows an embodiment of the present invention in principle.
The X mirror 1 and the Y mirror 2 are disposed above the three-dimensional surface 8. The XY mirrors 1 and 2 are attached to the X galvanometer 21 and the Y galvanometer 22 as in the case of FIG. The Z mirror 3 is disposed between the X / Y mirrors 1 and 2 and the base 4 on the side of the base 4. Further, as shown in FIG.
Is controlled to control the oscillation of the laser beam L, and the control device 34 controls the X-galvanometer 21 and the Y-galvanometer 22 to control the rotation of the XY mirrors 1 and 2.

The laser light L oscillated from the laser oscillator 5 is reflected by the X mirror 1 and further reflected by the Y mirror 2 so as to irradiate the three-dimensional surface of the base 1. By rotating the mirror 1 to displace the reflection angle of the laser beam L along the X-axis and controlling the rotation of the Y mirror 2 to displace the reflection angle of the laser beam L along the Y-axis, By scanning the laser light L along the three-dimensional surface 8, an arbitrary pattern can be drawn by the laser light L. When the laser beam L is reflected by the XY mirrors 1 and 2, a two-dimensional description is obtained. The surface of the projection 8 a of the three-dimensional surface 8, the surface of the concave portion 8 b, and the slope 8 c are indicated by L _{1 to} L ₅ in FIG. The laser beam L reflected by the XY mirrors 1 and 2 is further reflected by the Z mirror 3 on a surface on which the laser beam L cannot be incident on the three-dimensional surface 8 such as the vertical surface 8d. by reflecting to displace in the Z-axis direction can also be irradiated with the laser beam L on the vertical surface 8d and the like as shown in L ₆ ~L ₁₀ of FIG.

As described above, the laser beam L is reflected by the XY mirrors 1 and 2 in the X-axis and Y-axis directions and further reflected by the Z mirror 3 in the Z-axis direction.
Can be three-dimensionally scanned so that the laser light L can be three-dimensionally drawn on the three-dimensional surface 8 of the base 4. Here, the X, Y, and Z axes are 90 ° each with two axes orthogonal to the horizontal plane as the X axis and the Y axis, and the axis perpendicular to the horizontal plane as the Z axis.
Can be defined as orthogonal to each other, but it is not necessarily strictly such an axis, and any axis that shows three directions three-dimensionally may be used.

When the surface of the base 4 is a three-dimensional three-dimensional surface 8 as described above, the surfaces of the projections 8a and the concave portions 8b of the three-dimensional surface 8 correspond to the X and Y mirrors 1, 2 and Z. Mirror 3
Since the distance from the laser beam L differs, the optical path length of the laser beam L changes. When the optical path length of the laser beam L changes in this way, the spot diameter of the irradiation of the laser beam L onto the three-dimensional surface 8 changes according to the change in the optical path length, and the three-dimensional surface 8
The scanning speed (drawing speed) of the laser light L in the laser beam L also changes, and the irradiation power of the laser light L on the three-dimensional surface 8 also changes. As a result, for example, when the exposure is performed with the laser light L, the energy of the exposure is increased. And exposure cannot be performed under certain conditions, and the exposure line width becomes unstable. That is, if the energy density of exposure is E, the irradiation power is P, the spot diameter is A, and the scanning speed is S, E = P
/ (A · S), and if any one of the irradiation power P, the spot diameter A, and the scanning speed S changes, the energy density E changes. Conversely, when the energy density E changes with the change of the optical path length of the laser light L,
Adjusting so as to change at least one of the irradiation power P, the spot diameter A, and the scanning speed S means that the energy density E can always be kept constant.

Therefore, in the present invention, at least one of the irradiation power P of the laser beam L, the irradiation spot diameter A, and the scanning speed S of the laser beam L on the surface of the substrate 4 is changed according to the optical path of the laser beam L. By irradiating the laser light L to the surface of the substrate 4, the laser light L can always be irradiated to the three-dimensional surface 8 of the base 4 under a constant energy condition. FIG. 3 shows an embodiment in which the irradiation power P of the laser light L can be changed in accordance with the optical path length of the laser light L. The power in the optical path of the laser light L oscillated from the laser oscillator 5 is shown in FIG. A variable mechanism 6 is provided. As shown in FIG. 4, for example, the variable power mechanism 6 has a plurality of through holes 36 provided in the filter mounting plate 35 at a plurality of positions along the circumferential direction, and a plurality of types of ND filters having different light transmittances in each through hole 36. Filters 37a, 37b, and 37c are attached and formed, and one of the through holes 36 is a transmission hole 36a without attaching a filter. The rotation of the filter mounting plate 35 is controlled by a control mechanism 34 about a center axis 35 a of the filter mounting plate 35, and the laser light L between the laser oscillator 5 and the three-dimensional surface 8 of the base 4 is adjusted.
Are rotated in accordance with the optical path length of the optical path. For example, when the optical path length of the laser light L between the laser oscillator 5 and the three-dimensional surface 8 of the base 4 is long, the power is not attenuated through the transmission hole 36a, and conversely, as the optical path length of the laser light L becomes shorter, Filter 37 with high transmittance
If the power is attenuated through the laser light L through the a, 37b, and 37c, the three-dimensional surface 8 can always be irradiated with the laser light L with a constant irradiation power. By adjusting the light transmittance, the irradiation power to the three-dimensional surface 8 of the base 4 can be freely changed. In the embodiment of FIG. 4, the irradiation power can be adjusted by changing the irradiation power in four stages, but the irradiation power can be freely adjusted in more stages by increasing the number of filters.

FIG. 5 shows an embodiment in which the irradiation spot diameter (beam diameter) A of the laser light L can be changed according to the optical path length of the laser light L. The beam diameter variable mechanism 7 is provided in the optical path of the laser light L. The beam diameter variable mechanism 7 is formed by, for example, a condenser lens 7a as shown in FIG. 6A, and the condenser lens 7a is driven to move back and forth along the optical path of the laser light L. The driving of the condenser lens 7a is controlled by the control device 5. For example, when the optical path length of the laser light L between the laser oscillator 5 and the three-dimensional surface 8 of the base 4 is short, FIG.
The focusing lens 7a is moved in the direction approaching the laser oscillator 5 from the position indicated by the broken line in FIG. 6A to the position indicated by the solid line, and the focusing distance of the laser beam L is shortened from the position indicated by the broken line in FIG. Laser beam L can be focused on the three-dimensional surface 8 of
When the optical path length of the laser light L is long, the laser oscillator 5
The laser beam L can be focused on the three-dimensional surface 8 of the base body 4 by moving the focusing lens 7a in a direction away from the laser beam L to shorten the focusing distance of the laser beam L. By moving the laser beam L along the optical path in accordance with the optical path length, the three-dimensional surface 8 can always be irradiated with the laser beam L with a constant beam diameter. By moving the condenser lens 7a in this way, the irradiation spot diameter of the laser light L on the three-dimensional surface 8 of the base 4 can be freely changed. Although FIG. 6A uses one condensing lens 7a, the irradiation spot diameter can be changed more freely by combining a plurality of condensing lenses.

When changing the scanning speed (drawing speed) S of the laser beam L according to the optical path of the laser beam L, X
The adjustment can be performed by adjusting the rotation speed of the Y mirrors 1 and 2. In the embodiment shown in FIG. 7, the Z mirror 3 can be driven to rotate in the vertical direction, and the laser beam L is scanned along the three-dimensional surface 8 of the base 4 by rotating the Z mirror 3. And Z mirror 3
The scanning speed S of the laser light L on the three-dimensional surface 8 of the base 4 can be changed by adjusting the rotation speed of the laser beam L. For example, when exposing the three-dimensional surface 8 of the base 4 with the laser beam L, the exposure line width is set to the XY mirror 1,
2 can be adjusted, but the exposure line width can also be changed by adjusting the oscillation frequency of the rotation by allowing the Z mirror 3 to be driven to rotate vertically so as to vibrate. You can also do so. XY mirror 1,
The rotation speed of the 2 and Z mirrors 3 is controlled by the control device 34.

In each of the above embodiments, at least one of the irradiation power P of the laser beam L, the irradiation spot diameter A, and the scanning speed S of the laser beam L on the surface of the substrate 4 is changed according to the optical path of the laser beam L. However, even when the angle of incidence on the three-dimensional surface 8 of the base 4 changes, the irradiation energy of the laser beam L changes. Therefore, in the present invention, the irradiation power P of the laser beam L, the irradiation spot diameter A, and the laser beam L on the surface of the substrate 4 according to the incident angle of the laser beam L on the three-dimensional surface 8 of the substrate 4.
By irradiating the surface of the substrate 4 with the laser beam L while changing at least one of the scanning speeds S, the three-dimensional surface 8 of the substrate 4 can always be irradiated with the laser beam L under a constant energy condition.

Here, when irradiating the laser beam L to a predetermined portion of the three-dimensional surface 8 of the base 4, the XY mirrors 1, 2
The laser light L reflected by the laser beam L is directly incident on the three-dimensional surface 8 of the base 4 or the laser light L is further reflected by the Z mirror 3 and then incident on the three-dimensional surface 8 of the base 4, as shown in FIG. The laser beam L through a plurality of optical paths
May be able to be incident on the three-dimensional surface 8. At this time, it is preferable that the shortest optical path is selected from the plurality of optical paths and the laser beam L is irradiated. Irradiation with the laser beam L in the optical path of the shortest distance has the smallest change in the irradiation condition (exposure condition) and is easy to control.
The laser beam L in the shortest optical path is selected. For example, in FIG. 8, the optical paths L ₁ to L ₂ (the optical path of A), the optical paths L ₃ to
Optical path L ₄ (optical path of B), optical path L ₅ to optical path L ₆ (optical path of C)
Laser light L can be applied to the three-dimensional surface 8 of the substrate 4 by using the three optical paths described above. However, since the optical path of A is the shortest distance, the optical path of A is selected and the laser light L is applied. It is better to do it.

Further, according to the present invention, the three-dimensional surface 8 of the substrate 4 is provided.
When there are a plurality of optical paths of the laser beam L incident on the predetermined irradiation position, the incident angle of the three-dimensional surface 8 of the base 4 is
It is preferable to select the optical path closest to the normal line direction and irradiate the three-dimensional surface of the base body 4 with the laser light L. Irradiation with a laser beam L having an incident angle close to the normal direction has the smallest change in irradiation conditions (exposure conditions) and is easy to control.
The laser beam L of the optical path whose incident angle is closest to the normal direction is selected. For example, in FIG. 8, the optical path of A is selected from the three optical paths of the optical path of A, the optical path of B, and the optical path of C because the optical path of A is closest to the normal direction of the three-dimensional surface 8.
Is preferably irradiated.

As shown in FIG. 8, the shortest optical path and the optical path whose incident angle is closest to the normal direction are reflected by the XY mirrors 1 and 2 and directly incident on the three-dimensional surface 8 of the base 4. The laser light L, which is light L and further reflected by the Z mirror 3, has a shortest optical path, and the incident angle is also away from the normal direction. Therefore, in the present invention, when three-dimensional drawing can be performed by irradiating the three-dimensional surface 8 of the base body 4 with the laser beam L only by reflecting the light on the X and Y mirrors 1 and 2,
As long as the accuracy (exposure condition) of the drawing pattern by the laser light L is within an allowable range, the use of the Z mirror 3 can be selected so that the irradiation of the laser light L is performed without using the Z mirror 3.

FIG. 9 shows the Z mirror 3, and FIG.
Any reflecting mirror such as a cylindrical mirror as shown in FIG. 9A, a conical mirror as shown in FIG. 9B, a spherical mirror as shown in FIG. 9C, and other aspherical mirrors can be used. Here, in forming the Z mirror 3 as described above, for example, when it is formed by a cylindrical mirror, as shown in FIG.
When the starting point of the laser light L incident on the mirror 3 (that is, the reflection point by the Y mirror 2) is coaxial, the laser light L
Even if the light is incident on any part of the mirror 3, the light is reflected only in the same center direction. However, as shown in FIG. 10B, the center axis O of the Z mirror 3 and the starting point of the laser beam L are slightly shifted so as not to be coaxial. This makes it possible to reflect the laser light L in all directions according to the position where the laser light L is incident on the Z mirror 3.

As the Z mirror 3, a plane mirror 3a can be used in addition to the curved mirror as described above. Plane mirror 3
In some cases, a may be only one, but the Z mirror 3 may be formed by combining a plurality of plane mirrors 3a. In the embodiment of FIG. 11, the Z mirror 3 is formed in a square tube shape by combining four plane mirrors 3a.

The operation of three-dimensionally irradiating the three-dimensional surface 8 of the substrate 4 with the laser beam L using the XY mirrors 1 and 2 and the Z mirror 3 for exposure will now be described in more detail with reference to the flowchart of FIG. I do. First, measure the inclination angle theta ₁ of the inclined surface 8c of the three-dimensional surface 8 of the substrate 4 as shown in FIG. 13 (a), whether compared to the reference angle theta (e.g. 45 °) using the Z mirror 3 To determine. That is, if θ ₁ ≧ θ, the Z mirror 3 is used, and if θ ₁ <θ, the Z mirror 3 is not used. Next, when the Z mirror 3 is used, a plurality of optical paths can be made, so that it is necessary to determine an optical path. First, the possible optical paths are calculated by a computer, and the optical paths A, B, and C are extracted as shown in, for example, FIG. 8, and the shortest optical path or the optical path whose incident angle is closest to the normal is calculated by the computer.
By determining, for example, the optical path A as shown in FIG.
To determine. Next, it is necessary to determine the line width to be exposed.
First, exposure conditions are extracted from the optical path length and the incident angle of the optical path A,
Extract the line width W ₁ by calculating the line width to be exposed on the basis of the condition in the computer, the difference was calculated by comparing the line width W ₀ and widths W ₁ necessary for exposure, based on the Then, the change value of the exposure condition is calculated by the computer. For example, FIG.
Since the line width and the irradiation power of the exposure as shown in (b) has a fixed relationship, so that the W ₀ = W ₁ by calculating the change value of the irradiation power in the computer. After determining the irradiation power in this way, the XY mirror 1
The laser beam L is reflected by the mirror 2 and the Z mirror 3 to irradiate the three-dimensional surface 8 of the base body 4 to perform exposure. In the case where the laser beam L is irradiated by reflecting only the X and Y mirrors 1 and 2 without using the Z mirror 3, the optical path does not have a plurality of paths, so that it is not necessary to determine the optical path. The width may be determined.

In irradiating the three-dimensional surface 8 of the base body 4 with the laser beam L as described above to perform three-dimensional depiction, the laser irradiating technique is used to form a three-dimensional circuit, which will be described later, as well as cutting and drilling in laser processing. It can be applied to all kinds of processing such as dawning, welding, and surface modification. Next, the three-dimensional surface 8 of the base 4 is irradiated with the laser light L by using the laser irradiation method or the laser irradiation apparatus described above, so that the base 4 is formed in a pattern corresponding to the drawing shape by the laser light L. A method for forming the conductor circuit pattern 9 on the three-dimensional surface 8 will be described.

FIG. 14 shows an embodiment of the formation of a three-dimensional circuit by a subtractive method. First, a three-dimensional surface of a base 4 formed as shown in FIG. The conductor film 10 is provided on the entire surface including
It is formed as shown in FIG. The conductor film 10 has a thickness of, for example, 10 μm by electroless plating or electroplating copper.
m can be formed as a metal film. Next, FIG.
As shown in FIG. 4C, a photosensitive etching resistant film 11 is formed on the entire surface of the conductor film 10. As the photosensitive etching resistant film 11, a photo etching resist can be used, and it can be formed by applying by a method such as dip, spray, and electrodeposition. And FIG.
XY mirrors 1 and 2 and Z mirror 3 as shown in FIG.
The three-dimensional surface 8 of the substrate 4 is irradiated three-dimensionally with a laser beam L such as an argon laser by a method using
The photosensitive etching resistant film 11 is removed as shown in FIG. Thereafter, the exposed portion of the conductor film 10 is subjected to an etching process so that the exposed portion of FIG.
The conductive circuit pattern 9 is formed three-dimensionally on the three-dimensional surface 8 of the substrate 4 as shown in FIG. Is what you can do.

The photosensitive etching-resistant film 11 may be made of various materials having etching resistance that can be removed by exposure to laser light L, in addition to a photo-etching resist. An organic film such as a polyethylene terephthalate) film or an inorganic film such as a titanium film can be used. In addition to removing the photosensitive etching resistant film 11 as shown in FIG. 14 (g), the photosensitive etching resistant film 11 may be left as a protective film on all or part of the surface of the conductor circuit pattern 9 as shown in FIG. 14 (f).

FIG. 15 shows an embodiment of the formation of a three-dimensional circuit by the semi-additive method. First, an underlying conductor is formed on a three-dimensional surface 8 of a base 4 made of a resin molded product or the like as shown in FIG. The film 12 is provided as shown in FIG. The underlying conductor film 12 can be formed as a thin metal film having a thickness of, for example, about 2 to 5 μm by electroless plating of copper or the like. Next, as shown in FIG.
2, a photosensitive insulating film 13 is formed on the entire surface. As the photosensitive insulating film 13, a photoresist can be used, and can be formed by applying a method such as dip, spray, or electrodeposition. And FIG.
XY mirrors 1 and 2 and Z mirror 3 as shown in FIG.
The three-dimensional surface 8 of the substrate 4 is three-dimensionally irradiated with a laser beam L such as an argon laser by using the method described above, and the photosensitive insulating film 13 is exposed in a pattern shape. The conductive insulating film 13 is removed as shown in FIG. 15E, and the underlying conductive film 12 at the circuit formation location is exposed. Thereafter, the conductive metal 14 is applied with a thickness of, for example, about 20 μm to the exposed surface of the base conductive film 12 as shown in FIG. After the photosensitive insulating film 13 is removed as shown in FIG. 15G, a light etching process for dissolving by the thickness of the underlying conductor film 12 is performed to remove the underlying conductor film 12, thereby obtaining the structure shown in FIG. Thus, the conductor circuit pattern 9 can be formed three-dimensionally on the three-dimensional surface 8 of the base 4. The surface of the conductive circuit pattern 9 can be plated with Ni or Au as needed. As the photosensitive insulating film 13, various materials such as an organic material film and an inorganic material film can be used as long as they do not adhere to electroplating which can be removed by exposure to the laser beam L. FIG. 16 shows an embodiment of the formation of a three-dimensional circuit by the full-additive method. First, a three-dimensional surface 8 of a base 4 made of a resin molded product or the like as shown in FIG. The base 4 is formed from a resin molded article containing a catalyst or a catalyst for electroless plating, and then a photosensitive plating resistant film 19 is formed on the entire surface of the base 4 including the three-dimensional surface 8 as shown in FIG. It is formed as follows. As the photosensitive plating resistant film 19, a photoresist to which electroless plating does not adhere can be used, and can be formed by applying a method such as dip, spray, or electrodeposition. Then, FIG.
The three-dimensional surface 8 of the substrate 4 is three-dimensionally irradiated with a laser beam L such as an argon laser by a method using the XY mirrors 1 and 2 and the Z mirror 3 as shown in FIG. Exposure and subsequent development are performed to remove the photosensitive plating-resistant film 19 at the portion where the circuit is to be formed as shown in FIG. 16D, thereby exposing the three-dimensional surface 8 of the base 4 at the portion where the circuit is to be formed. Thereafter, the substrate 4 is immersed in an electroless plating bath, and a conductive metal is adhered to the exposed surface of the three-dimensional surface 8 by electroless plating of copper or the like to a thickness of about 2 to 10 μm to form a conductive circuit as shown in FIG. The pattern 9 can be formed. Then, by removing the photosensitive plating resistant film 19, FIG.
As shown in FIG. 6F, a three-dimensional circuit in which a conductor circuit pattern 9 is formed three-dimensionally on the three-dimensional surface 8 of the base 4 can be obtained. The photosensitive plating resistant film 19 may be removed in this way, or may be left as it is in FIG. The conductive circuit pattern 9 may be further plated by electroplating to increase the thickness, and the surface of the conductive circuit pattern 9 may be plated with Ni or Au as necessary. As the photosensitive plating-resistant film 19, various films such as an organic material film and an inorganic material film can be used as long as they do not adhere to a plating that can be removed by exposure to the laser beam L.

FIG. 17 shows another method of forming a three-dimensional circuit. First, a photoreactive material is applied to the entire surface including the three-dimensional surface 8 of the substrate 4 formed as shown in FIG. The material 15 is applied and a film is provided as shown in FIG. As the photoreactive material 15, an organic metal such as copper acetate, copper alkoxide, or dimethylaluminum can be used. By coating these as they are or by dissolving them in a solvent, the surface of the base 4 is coated with an organic metal. Photoreactive material 15 can be deposited. And
As shown in FIG. 17C, the laser beam L is applied to the three-dimensional surface 8 of the base 4 by using the XY mirrors 1 and 2 and the Z mirror 3.
To expose the photoreactive material 15 at the circuit formation location in a pattern shape, and react or decompose the exposed portion of the photoreactive material 15 formed of an organic metal with the light energy of the laser beam L. By forming a metal film or a mixed film of a metal and an organic material, and removing the unreacted portion of the photoreactive material 15 by washing with a solvent or the like, a metal film or a mixed film of a metal and an organic material is formed as shown in FIG. The conductor circuit pattern 9 as shown in FIG. 3D can be formed three-dimensionally on the three-dimensional surface 8 of the base 4. The conductive circuit pattern 9 may be further thickened by electroplating or the like, or the surface of the conductive circuit pattern 9 may be plated with Ni or Au as necessary.

In the above embodiment, an organic metal is used as the photoreactive material 15. However, the photoreactive material 15 may be any other conductive material capable of adhering only the exposed portion to the substrate 4 by photoreaction. For example, a material having conductivity by mixing a conductive powder such as a metal powder such as nickel or copper or a carbon powder with a photocurable adhesive can be used. In this case, as in the case of FIG. 17, the surface of the base 4 is coated with the photoreactive material 15 and then irradiated with a laser beam L such as an ultraviolet laser. Only the resin is cured in the pattern shape and is cured and adhered to the three-dimensional surface 8 of the base 4. The unreacted and uncured portion of the photoreactive material 15 is removed by washing with a solvent, so that the conductive circuit pattern 9 composed of the cured layer of the conductive adhesive is three-dimensionally formed on the three-dimensional surface 8 of the base 4. It can be formed. Also in this case, the conductor circuit pattern 9 may be further thickened by electroplating or the like, and the surface of the conductor circuit pattern 9 may be plated with Ni or Au as necessary.

FIG. 18 shows a method of forming a three-dimensional circuit by a photo-CVD method. In FIG. 18A, a substrate 4 having a three-dimensional surface 8 as shown in FIG. And one or more of reactive gases, such as titanium tetrachloride, tungsten carbonyl, copper DPM, etc., together with a carrier gas such as hydrogen or nitrogen are introduced into the vapor deposition vessel 39 through the inlet 40. I do.
41 is an exhaust port. Then, as shown in FIG. 18C, the laser beam L is transmitted three-dimensionally to the three-dimensional surface 8 of the base 4 by passing through the vapor deposition container 39 by a method using the X and Y mirrors 1 and 2 and the Z mirror 3, The three-dimensional surface 8 is exposed to a pattern shape at a circuit formation location. At this time, it is preferable to preheat the substrate 4 to, for example, about 200 ° C. so that the reaction gas reacts and decomposes on the three-dimensional surface 8 of the substrate 4 to facilitate the chemical vapor deposition of the metal film. Thus, when the exposure is performed in this manner, the reaction gas causes a decomposition reaction on the three-dimensional surface 8 of the base 4, and a metal deposition film 16 can be formed on the surface of the base 4 in an exposure pattern.
The conductor pattern 9 made of the metal deposition film 16 is shown in FIG.
It can be formed on the three-dimensional surface 8 of the base 4 as shown in FIG. The thickness of the conductive circuit pattern 9 may be further increased by electroplating or the like, and Ni plating or A
u plating may be performed.

FIG. 19 shows still another method of forming a three-dimensional circuit. First, a conductor layer is formed on the entire surface including the three-dimensional surface 8 of the base 4 made of a resin molded product or the like as shown in FIG. 17 are provided as shown in FIG. The conductor layer 17 can be formed by electroless plating a metal such as nickel or copper or by a method such as a PVD method.
It is desirable to form the film as thin as about 5 to 2 μm.
Then, as shown in FIG.
And irradiating the surface of the substrate 4 with a laser beam L such as an excimer laser by a method using the Z mirror 3 and irradiating a portion other than the circuit forming portion in a pattern shape, thereby obtaining a laser beam L
The conductor layer 17 is removed by flying with the energy of. By removing the conductor layer 17 other than the portion where the circuit is formed with the laser beam L, the conductor pattern 9 formed by the conductor layer 17 is formed on the three-dimensional surface 8 of the base 4 as shown in FIG. Can be done. The thickness of the conductive circuit pattern 9 may be further increased by electroplating or the like.
i plating or Au plating may be performed. In this embodiment, the conductor circuit pattern 9 is formed by forming the conductor layer 17 of a metal and removing the conductor layer 17 other than the circuit formation portion with the laser beam L.
As in the embodiment, only the portion irradiated with the laser beam L is left on the three-dimensional surface 8 of the base 4 so that the conductor circuit pattern 9
May be formed.

Next, a description will be given of a surface treatment method for irradiating the substrate 4 with the laser beam L using the above-described laser irradiation method or laser beam irradiation apparatus. The constituent material of the base 4 to be irradiated with the laser light L is resin, ceramic, metal, or the like. The irradiation of the laser light L is performed not only on the flat surface of the base 4 but also on the base 4.
Can be performed on the three-dimensional surface 8. The irradiation pattern of the laser light L is arbitrary such as a point or a line. By irradiating the substrate 4 with the laser beam L, it is possible to perform a surface treatment for roughening the surface of the substrate 4, forming fine irregularities, improving adsorption, improving adhesion, and improving chemical reactivity. . For example, when the substrate 4 is irradiated with the laser beam L as a base treatment for forming a circuit on the substrate 4, the adhesion strength of the circuit to the substrate 4 can be increased by roughening the surface of the substrate 4. When the substrate 4 is irradiated with the laser beam L in a circuit pattern when the substrate 4 is electrolessly plated, the electroless plating catalyst adheres only to the irradiated portion of the laser beam L, and the circuit is formed by electroless plating in a pattern shape. Is what you can do. Further, when the laser beam L is irradiated on the ink-attached portion of the printing plate, the ink adheres only to the irradiated portion of the laser beam L, and printing can be performed by transferring this ink. Also, the laser light L
By irradiating the substrate with a paint and coloring, it is possible to improve the adhesion strength of the coating film of the coating and to improve the coloring property of the coloring.

An example of a method of forming a three-dimensional circuit by subjecting the substrate 4 to the surface treatment with the laser beam L will be described with reference to FIG. First, a three-dimensional surface 8 of a base 4 made of a resin molded product such as polyimide as shown in FIG.
As shown in FIG. 20 (b), a pattern for forming a circuit
The surface of the substrate 4 is roughened by irradiating a laser beam L such as an excimer laser by a method using the mirrors 1 and 2 and the Z mirror 3, and the laser beam L is irradiated to the pattern shape to form the roughened portion 42. It is formed in a pattern shape. Next, as shown in FIG. 20C, the underlying conductive film 12 is formed on the entire surface of the base 4 including the three-dimensional surface 8 by a method such as electroless plating, vapor deposition, or sputtering of copper to a thin thickness of, for example, about 1 to 2 μm. .
Thereafter, as shown in FIG. 20D, a photosensitive insulating film 13 is formed by applying a photoresist or the like to the entire surface of the underlying conductor film 12 by a method such as dipping, spraying, and electrodeposition. Then, as shown in FIG. 20E, the photosensitive insulating film 13 is patterned by three-dimensionally irradiating the three-dimensional surface 8 of the substrate 4 with the laser beam L by the method using the XY mirrors 1 and 2 and the Z mirror 3. Exposure to a shape is performed, and then development is performed, and the photosensitive insulating film 13 at a portion where a circuit is to be formed is removed as shown in FIG.
The surface of the exposed portion of the base conductor film 12 is a roughened portion 42. 20. Thereafter, a current is applied to the underlying conductive film 12 to perform electrolytic copper plating, etc.
As shown in (g), the conductive metal 1
4 is thickened to a thickness of, for example, about 20 μm, and FIG.
After the photosensitive insulating film 13 is removed as shown in FIG. 2H, a light etching process is performed to dissolve the thickness of the underlying conductive film 12 to remove the underlying conductive film 12, thereby obtaining as shown in FIG. The conductor circuit pattern 9 can be formed three-dimensionally on the three-dimensional surface 8 of the base 4. The surface of the conductive circuit pattern 9 can be plated with Ni or Au as needed. When a circuit is formed by the semi-additive method as described above, the circuit forming portion is subjected to the surface roughening treatment for forming the roughened portion 42 by irradiation with the laser beam L, so that it is possible to obtain a high adhesion strength of the circuit. You can do it.

Next, while supplying the powder 18 to the three-dimensional surface 8 of the base 4, the three-dimensional surface 8 of the base 4 is irradiated with the laser light L, so that the three-dimensional surface 8 of the base 4 is irradiated at the irradiation position of the laser light L. A method for attaching the powder 18 will be described. The constituent material of the substrate 4 to be irradiated with the laser beam L is a thermoplastic resin at least on the surface, and the irradiation of the laser beam L can be performed not only on the flat surface of the substrate 4 but also on the three-dimensional surface 8 of the substrate 4. As the powder 18, for example,
Metal powders such as copper, nickel, and brass, carbon powders, catalyst powders, coupling agent powders, and the like can be used, and the particle size of the powder 18 is preferably in the range of several μm to several hundred μm. By irradiating the surface of the substrate 4 with the laser beam L while supplying the powder 18 thereto, the energy of the laser beam L softens and adheres the surface of the substrate 4 to adhere the powder 18 to the surface of the substrate 4. By irradiating the surface of the base 4 with the laser beam L in an arbitrary circuit pattern such as a point or a line or a decorative pattern, the powder 18 can be adhered in this pattern shape. For example, a circuit can be formed on the surface of the substrate 4 by attaching the metal powder 18 to the surface of the substrate 4 in a pattern, and the powder 18 of the electroless plating catalyst is attached to the surface of the substrate 4 in a pattern. Then, by performing the electroless plating, a circuit can be formed in a pattern shape by the electroless plating. The powder 18 can be supplied to the surface of the substrate 4 by attaching the powder 18 to the surface of the substrate 4 in advance. It can also be performed by spraying on the irradiated part of the surface. When a circuit is formed by adhering the powder 18 in this manner, a circuit can be formed with high adhesion strength to the base 4.

An example of a method for forming a circuit by adhering the powder 18 to the surface of the substrate 4 will be described with reference to FIG. As shown in FIG. 21 (a), on the three-dimensional surface 8 of the base 4 made of a molded article of a thermoplastic resin such as ABS resin, as shown in FIG. The three-dimensional surface 8 of the substrate 4 is heated and softened / adhered by three-dimensionally irradiating a laser beam L such as a YAG laser or the like with the method 3. Then, the powder 18 of a metal such as copper is sprayed from a nozzle 43 onto the softened and tackified three-dimensional surface 8 using a compressed gas or the like, so that the powder 18 is attached to the three-dimensional surface 8 at the softened and sticked portion. Can be glued. By irradiating the three-dimensional surface 8 of the base 4 with the laser light L by scanning it in a pattern shape, the conductive circuit pattern 9 can be formed from the powder 18. The conductive circuit pattern 9 may be further thickened by electroplating or the like, or the surface of the conductive circuit pattern 9 may be plated with Ni or Au as necessary.

[0050]

As described above, in the laser irradiation method according to the present invention, the laser light is reflected by the XY mirror in the X-axis direction and the Y-axis direction, and the reflected laser light is further reflected by the Z-axis mirror.
Since the laser light is irradiated on the surface of the base by being reflected by the Z mirror in the axial direction, the laser light can be scanned in the X-axis direction and the Y-axis direction of the base by the XY mirror, and the Z mirror can be used. The laser beam can be reflected in the Z-axis direction to scan the laser beam in the Z-axis direction of the substrate, and the three-dimensional surface of the substrate can be irradiated with the laser beam three-dimensionally.

Further, the irradiation power of the laser beam, the irradiation spot diameter,
By changing at least one of the scanning speeds of the laser beam on the surface of the substrate, the surface of the substrate is irradiated with the laser beam .
Thus, even when the optical path length or the incident angle changes when irradiating the three-dimensional surface of the substrate with the laser light, the laser light can always be irradiated under a constant energy condition.

Further, when there are a plurality of optical paths of the laser beam incident on a predetermined irradiation position on the surface of the substrate, the optical path having the shortest distance is selected, or the optical path whose incident angle on the surface of the substrate is closest to the normal direction is selected. Is selected and the surface of the base is irradiated with laser light, the change in the irradiation condition of laser light can be reduced. A laser irradiation apparatus according to the present invention includes a laser oscillator that oscillates a laser beam, an XY mirror that reflects a laser beam oscillated from the laser oscillator in an X-axis direction and a Y-axis direction, and a laser beam that is reflected by an XY mirror. And a Z mirror for reflecting the laser beam toward the substrate, so that the XY mirror scans the laser beam in the X-axis direction and the Y-axis direction of the substrate, and the Z mirror reflects the laser beam in the Z-axis direction. Then, the laser beam is scanned in the Z-axis direction of the substrate, and the three-dimensional surface of the substrate can be irradiated with the laser beam three-dimensionally.

[0053]

In addition , since the Z mirror is formed to be movable, it is possible to irradiate the laser beam constantly under constant energy conditions by changing the scanning speed of the laser beam according to the optical path of the laser beam and the angle of incidence on the substrate. It becomes possible. The method for forming a three-dimensional circuit according to the present invention includes irradiating a three-dimensional surface of the base with laser light using the above-described laser irradiation method, thereby forming a conductive circuit pattern on the three-dimensional surface of the base in a pattern corresponding to a drawing shape by the laser. So that the three-dimensional surface of the substrate is irradiated with laser light three-dimensionally,
The conductor circuit pattern can be formed without being restricted by the shape of the three-dimensional surface of the base.

In forming a three-dimensional circuit in the present invention, a conductive film is provided on the three-dimensional surface of the base, and a photosensitive etching-resistant film is provided on the conductive film. The substrate is exposed to laser light, exposed, developed, and the conductive film exposed by the development of the photosensitive etching resistant film is etched to form a conductive circuit pattern. The conductive circuit pattern can be formed without being limited by the shape of the conductive circuit.

In forming a three-dimensional circuit in the present invention, an underlying conductor film is provided on the three-dimensional surface of the substrate, a photosensitive insulating film is provided on the underlying conductor film, and the photosensitive insulating film is formed by using the laser irradiation method described above. Developed after irradiating with laser light to expose, develop a conductive metal film on the underlying conductive film exposed by the development of the photosensitive insulating film, then remove the photosensitive insulating film, Since the conductive circuit pattern is formed by etching away the uncovered underlying conductive film, the conductive circuit pattern can be formed by the semi-additive method without being limited by the shape of the three-dimensional surface of the base. is there.

In forming a three-dimensional circuit in the present invention, a photosensitive plating-resistant film is provided on the three-dimensional surface of the substrate, and the photosensitive plating-resistant film is irradiated with a laser beam using the above-described laser irradiation method, and then exposed to light. The conductive circuit pattern is formed by plating the three-dimensional surface of the substrate exposed by the development of the photosensitive plating-resistant film and attaching a conductive metal, so that the shape of the three-dimensional surface of the substrate is determined by a full additive method. The conductor circuit pattern can be formed without being restricted.

In forming a three-dimensional circuit in the present invention, a photoreactive material is applied to a three-dimensional surface of a substrate, and the photoreactive material is irradiated with laser light using the above-described laser irradiation method, and is exposed to laser light. By reacting the photoreactive material in the exposed portion and removing the photoreactive material in the unexposed portion to form a conductive circuit pattern with the photoreactive material, the three-dimensional surface of the substrate is three-dimensionally formed. By irradiating a laser beam, a conductor circuit pattern can be formed from a photoreactive material without being restricted by the shape of the three-dimensional surface of the base.

In forming a three-dimensional circuit in the present invention, the three-dimensional surface of the substrate is irradiated with laser light in a reaction gas atmosphere by using the above-described laser irradiation method.
Since a conductive circuit pattern was formed by generating a vapor-deposited film on the three-dimensional surface of the substrate by a light CVD method,
The conductor circuit pattern can be formed by the photo-CVD method without being restricted by the shape of the three-dimensional surface of the substrate.

In forming a three-dimensional circuit in the present invention, a conductor layer is provided on the three-dimensional surface of the substrate, and the conductor layer is irradiated with laser light by using the above-described laser irradiation method, and a portion of the conductor exposed by the laser light is exposed. By removing the layer or removing the other portion while leaving the portion of the conductor layer exposed by the laser beam, a conductor circuit pattern is formed by the conductor layer, so that the three-dimensional surface of the substrate is three-dimensionally formed. Is irradiated with laser light to form a conductor circuit pattern on the conductor layer without being restricted by the shape of the three-dimensional surface of the base.

A surface treatment method according to the present invention is characterized in that a three-dimensional surface of a substrate is irradiated with a laser beam using the above-described laser irradiation method, and the three-dimensional surface of the substrate is three-dimensionally irradiated with the laser beam. For surface treatment without being limited by the shape of the three-dimensional surface of the substrate. The powder adhering method according to the present invention comprises supplying the powder to the three-dimensional surface of the substrate, and irradiating the three-dimensional surface of the substrate with laser light using the above-described laser irradiation method. The method is characterized in that powder is attached to the surface, and the three-dimensional surface of the substrate is irradiated with laser light three-dimensionally so that the powder can be attached without being restricted by the shape of the three-dimensional surface of the substrate. Things.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of the embodiment of the above.

FIG. 3 is a schematic configuration diagram of another embodiment of the present invention.

FIG. 4 is a perspective view of a part of the embodiment.

FIG. 5 is a schematic configuration diagram of still another embodiment of the present invention.

FIG. 6 shows a part of the above embodiment, and (a)
3 is an enlarged view of a beam diameter variable mechanism, and FIG. 3B is an enlarged view of an irradiation part.

FIG. 7 is a schematic configuration diagram of still another embodiment of the present invention.

FIG. 8 is a schematic configuration diagram of still another embodiment of the present invention.

FIGS. 9A and 9B show aspects of a Z mirror used in the present invention, wherein FIGS. 9A and 9B are partially cutaway perspective views, and FIG.
Is a partially cutaway sectional view.

FIGS. 10A and 10B show a state of reflection by a Z mirror used in the present invention, and FIGS. 10A and 10B are cross-sectional views.

FIG. 11 is a perspective view showing another embodiment of the Z mirror used in the present invention.

FIG. 12 is a flowchart of control of exposure by laser irradiation in the present invention.

FIG. 13A is a cross-sectional view of a part of the substrate showing the angle of the inclined surface in the above, and FIG. 13B is a graph showing the relationship between the exposure line width and the irradiation power.

FIGS. 14A to 14G show one embodiment of a method for forming a three-dimensional circuit according to the present invention, and FIGS.

FIG. 15 shows another embodiment of the method of forming a three-dimensional circuit of the present invention, and (a) to (h) are cross-sectional views.

FIG. 16 shows still another embodiment of the method of forming a three-dimensional circuit according to the present invention, and (a) to (f) are cross-sectional views.

FIG. 17 shows still another embodiment of the method of forming a three-dimensional circuit of the present invention, and (a) to (d) are cross-sectional views.

FIG. 18 shows still another embodiment of the method for forming a three-dimensional circuit according to the present invention, and (a) to (c) are cross-sectional views.

FIG. 19 shows still another embodiment of the method of forming a three-dimensional circuit according to the present invention, and (a) to (d) are cross-sectional views.

FIG. 20 shows one embodiment of the surface treatment method of the present invention, and (a) to (i) are cross-sectional views, respectively.

FIG. 21 shows one embodiment of the method for adhering powder of the present invention, and (a) and (b) are cross-sectional views, respectively.

FIG. 22 is a perspective view of a conventional example.

FIG. 23 is a schematic view of the above.

FIG. 24 is a schematic configuration diagram showing the above problem.

FIG. 25 shows another conventional example, in which (a),
(B) is a sectional view, respectively.

FIG. 26 shows still another conventional example,
(A), (b) is a sectional view, respectively.

FIG. 27 shows still another conventional example,
(A), (b) is a sectional view, respectively.

FIG. 28 is a schematic view showing still another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 X mirror 2 Y mirror 3 Z mirror 4 Substrate 5 Laser oscillator 6 Power variable mechanism 7 Beam diameter variable mechanism 8 Solid surface 9 Conductor circuit pattern 10 Conductive film 11 Photosensitive etching film 12 Underlayer conductive film 13 Photosensitive insulating film 14 Conductive metal 15 Photoreactive material 16 Evaporated film 17 Conductive layer 18 Powder 19 Photosensitive plating resistant film

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification code FI C23C 16/48 C23C 16/48 G02B 26/10 101 G02B 26/10 101 H01S 3/101 H01S 3/101 H05K 3/06 H05K 3 / 06 E 3/08 3/08 D 3/10 3/10 C 3/14 3/14 3/18 3/18 D // B23K 101: 42 (72) Inventor Sakuo Kamada 1048 Odakadoma, Kazuma, Kazuma, Osaka Matsushita Electric Works, Inc. Goh Okamoto 1048 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (56) References JP-A-6-226473 (JP, A) JP-A-6-678 (JP, A) JP-A-63-243218 ( JP, A) (58) Survey The field (Int.Cl. ^7, DB name) B23K 26/00 - 26/08 G02B 26/10 H05K 3/06 - 3/18

Claims (18)

(57) [Claims] 1. A laser beam is applied to an X-axis direction and a Y-axis direction.
When the laser light is reflected by the Y mirror and the reflected laser light is further reflected by the Z mirror in the Z-axis direction to irradiate the surface of the substrate with the laser light, the laser light is irradiated according to the optical path of the laser light.
Laser beam irradiation power, irradiation spot diameter, surface of substrate
At least one of the scanning speeds of the laser light
A laser irradiation method comprising irradiating a surface with laser light . 2. The laser beam is applied to the X-axis direction and the Y-axis direction
The reflected laser light is reflected by the Y mirror and
Further, the light is reflected by a Z mirror in the Z-axis direction and is reflected on the surface of the substrate.
In irradiating the laser light, at least one of the irradiation power of the laser light, the irradiation spot diameter, and the scanning speed of the laser light on the surface of the substrate is changed according to the incident angle of the laser light on the surface of the substrate. features and, Relais chromatography the irradiation method of irradiating a laser beam on the surface. 3. A laser beam is applied to the X-axis direction and the Y-axis direction
The reflected laser light is reflected by the Y mirror and
Further, the light is reflected by a Z mirror in the Z-axis direction and is reflected on the surface of the substrate.
When irradiating the laser light, when there are a plurality of optical paths of the laser light incident on a predetermined irradiation position on the surface of the base, the laser light is irradiated on the surface of the base by selecting the shortest optical path. , Relais over The irradiation method. 4. A laser beam is emitted in X-axis direction and Y-axis direction.
The reflected laser light is reflected by the Y mirror and
Further, the light is reflected by a Z mirror in the Z-axis direction and is reflected on the surface of the substrate.
When irradiating laser light, if there are multiple optical paths of laser light incident on a predetermined irradiation location on the surface of the substrate, select the optical path whose incident angle on the surface of the substrate is closest to the normal direction, and select the optical path. features and, Relais over <br/> the irradiation method of irradiating a laser beam on. 5. The method according to claim 1, wherein the laser beam is directed to X-axis direction and Y-axis direction.
The reflected laser light is reflected by the Y mirror and
Further, the light is reflected by a Z mirror in the Z-axis direction and is reflected on the surface of the substrate.
When irradiating laser light, only reflections from X and Y mirrors
When the surface of the base can be irradiated with laser light by using
The use of the Z mirror can be selected so that it is not used.
And irradiating the surface of the substrate with the laser beam by changing at least one of the irradiation power of the laser beam, the irradiation spot diameter, and the scanning speed of the laser beam on the surface of the substrate in accordance with the optical path of the laser beam. Relais over The irradiation method. 6. The laser beam is applied to the X-axis direction and the Y-axis direction
The reflected laser light is reflected by the Y mirror and
Further, the light is reflected by a Z mirror in the Z-axis direction and is reflected on the surface of the substrate.
When irradiating laser light, only reflections from X and Y mirrors
When the surface of the base can be irradiated with laser light by using
The use of the Z mirror can be selected so that it is not used.
The irradiation, the irradiation power of the laser light according to the incident angle of the laser beam to the substrate surface, the irradiation spot diameter, at least one by changing the substrate surface of the laser beam scanning speed on the surface of the substrate with laser light features and, Relais chromatography the irradiation method to. 7. A laser oscillator that oscillates a laser beam, an XY mirror that reflects the laser beam oscillated from the laser oscillator in the X-axis direction and the Y-axis direction, and a laser beam that is reflected by the XY mirror. What is claimed is: 1. A laser irradiation apparatus comprising: a Z mirror that reflects light toward a base;
The laser irradiation apparatus, characterized in that formed by deposition. 8. A laser oscillator for oscillating laser light, and a laser oscillator.
The laser light emitted from the laser oscillator in the X-axis direction and the Y-axis direction.
XY mirror that reflects light in the direction and XY mirror
And a Z-mirror that reflects the laser beam directed toward the base.
A laser irradiator comprising: a Z mirror having a cylindrical shape;
Conical, spherical mirror, characterized and, Relais chromatography The irradiation apparatus that are formed on one of the non-spherical mirror. 9. A laser oscillator for oscillating laser light, and a laser
The laser light emitted from the laser oscillator in the X-axis direction and the Y-axis direction.
XY mirror that reflects light in the direction and XY mirror
And a Z-mirror that reflects the laser beam directed toward the base.
A laser irradiation apparatus comprising, features and, Relais chromatography The irradiation device that starting point of the laser beam incident on the Z mirror is not central axis coaxial with the Z mirror. 10. A three-dimensional surface of a substrate is irradiated with laser light by using the laser irradiation method according to any one of claims 1 to 6 , so that the three-dimensional surface of the substrate is patterned in accordance with a drawing shape by the laser light. A method of forming a three-dimensional circuit, comprising forming a conductive circuit pattern. 11. The photosensitive etching resistant film on the conductive film with a three-dimensional surface of a substrate provided with a conductor film provided, a photosensitive etching-resistant using the laser irradiation method according to any one of claims 1 to 6 A method for forming a three-dimensional circuit, comprising: irradiating a film with a laser beam, exposing the film to light, developing the film, and etching the conductive film exposed by developing the photosensitive etching-resistant film to form a conductive circuit pattern. 12. A photosensitive insulating film provided on a three-dimensional surface of a substrate and a photosensitive insulating film provided on the underlying conductive film by using the laser irradiation method according to any one of claims 1 to 6. Developed after irradiating the laser light and exposing,
The conductive metal is thickened on the underlying conductive film exposed by the development of the photosensitive insulating film, and then the photosensitive insulating film is removed, and then the underlying conductive film that is not covered with the conductive metal is removed by etching. A method for forming a three-dimensional circuit, comprising forming a circuit pattern. To 13. The substrate of three-dimensional surface is provided a photosensitive resistant plating layer, after exposure by irradiating a laser beam to the photosensitive resistant plating film using the laser irradiation method according to any one of claims 1 to 6 A method of forming a three-dimensional circuit, comprising: developing and plating a three-dimensional surface of a substrate exposed by development of a photosensitive plating resistant film, and attaching a conductive metal to form a conductive circuit pattern. 14. A photoreactive material is applied to a three-dimensional surface of a substrate, and the photoreactive material is irradiated with laser light by using the laser irradiation method according to any one of claims 1 to 6 ; A method for forming a three-dimensional circuit, comprising: forming a conductive circuit pattern using a photoreactive material by reacting an exposed portion of the photoreactive material and removing an unexposed portion of the photoreactive material. 15. A three-dimensional surface of a substrate is irradiated with a laser beam using a laser irradiation method according to any one of claims 1 to 6 in a reaction gas atmosphere to deposit the three-dimensional surface of the substrate by a photo-CVD method. A method for forming a three-dimensional circuit, wherein a conductive circuit pattern is formed by forming a film. 16. A conductor layer is provided on a three-dimensional surface of a substrate, and the conductor layer is irradiated with laser light by using the laser irradiation method according to any one of claims 1 to 6 , thereby forming a portion exposed by the laser light. A method for forming a three-dimensional circuit, wherein a conductor circuit pattern is formed on a conductor layer by removing the conductor layer or leaving a portion of the conductor layer exposed to laser light and removing other portions. To 17. The substrate of three-dimensional surface, surface treatment method, which comprises irradiating a laser beam using the laser irradiation method according to any one of claims 1 to 6. 18. Irradiation of laser light by supplying powder to the three-dimensional surface of the substrate and irradiating the three-dimensional surface of the substrate with laser light by using the laser irradiation method according to any one of claims 1 to 6. A powder adhering method, comprising: adhering powder to a three-dimensional surface of a substrate at a location.