JPH06295852A - Aligner - Google Patents

Abstract

PURPOSE:To realize stabilized positioning accuracy by positioning a photosensitive substrate P using the positioning results depending on the positions of masks R1-R4 thereby suppressing the error caused by the distortion of a structure depending on the position of a mask exchanging means. CONSTITUTION:The aligner 20 comprises a plurality of masks R1-R4, means 9, 11 for exposing the image of each mask onto a photosensitive substrate P, means 3, 4, 12, 13 for positioning the substrate P with respect to the aligners 9, 11, and base members 2, 5 for holding the means 7, 9, 11, wherein the exposure is conducted while sequentially positioning the masks R1-R4 at predetermined positions using the mask exchanging means 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus, and in particular, a plurality of reticles (masks) are placed on a reticle engine, and while a plurality of reticles are sequentially positioned with respect to predetermined positions, a plate It is suitable for application to an exposure device adapted to perform exposure on a substrate).

[0002]

2. Description of the Related Art Conventionally, when manufacturing a semiconductor integrated circuit, a liquid crystal display panel or the like, an exposure apparatus for projecting and exposing a predetermined pattern formed on a reticle on a plate (wafer) to be exposed is used.

As an exposure apparatus of this type, the reticle pattern is sequentially exposed on a predetermined area of the plate while moving the plate by the step-and-repeat method. In this type of exposure apparatus, a plurality of reticles are held on a reticle engine, and by moving the reticle engineers, the patterns of a plurality of reticles are overlaid on a plate and the plate is moved at this time. The reticle pattern is connected to the plate for exposure.

That is, as shown in FIG. 9, the exposure apparatus 1 has a stage 3 moving in the X direction and a stage 4 moving in the Y direction on a base 2, and a plate P is held on the stage 4. It

A column 5 is fixed on the base 2, and a reticle chain guide 6 is fixed to the upper end of the column 5. In this reticle guide 6, the reticle guide 3 is attached to the reticle guide 6.
It is provided so that it can be moved in the direction indicated by the arrow a or in the opposite direction while being guided by. The reticle engine 7 includes a plurality of reticles R1, R2, R3.
And R4 can be adsorbed and held.

A projection lens 9 is fixed to the column 5, and the exposure light from the light source 11 is moved onto the optical path of the exposure light (that is, on the projection lens 9).
2, R3 or R4) and the projection lens 9 to irradiate the plate P to form an image of the pattern formed on the reticle (R1, R2, R3 or R4) moved on the projection lens 9 at this time. The plate P is exposed.

In this type of exposure apparatus 1, the reticle microscope 12 is used to form an alignment mark formed on the reticle R1 positioned on the projection lens 9 and a reference mark formed on the stage 4 (hereinafter referred to as "reference mark"). Are moved so as to match the reticle R1 with the coordinate values of the stage 3 and the stage 4.
Measure the position of.

Further, the position of the plate microscope 9 is coordinated with the coordinate values of the stage 3 and the stage 4 by aligning the index mark of the plate microscope 13 fixed to the projection lens 9 with the visual mark formed on the stage 4. To measure. From these measurement results, reticle R1
And the relative position of the plate microscope 13 is obtained from the coordinate values of the stages 3 and 4 (this relative position is referred to as a baseline), and the stage 4 of the exposure apparatus 1 is based on the baseline value thus measured. The plate P placed on the reticle is aligned with the reticle.

That is, as shown in FIG. 10, the exposure apparatus 1
Enters the exposure processing procedure from step SP1 and goes to step S
After holding n reticles R1, R2, ... Rn on the reticle engine 7 at P2, the reticle engine 7 is moved to a position on the projection lens 9 (this is referred to as reticle engine position 1). Move to perform baseline measurement.

In this state, the exposure apparatus 1 moves to step S.
In P3, the plate P is held on the stage 4 (or the plate P on the stage 4 is exchanged), and in the subsequent step SP5, plate alignment (plate positioning) is performed on the plate P based on the baseline value. To do.

Further, in the next step SP6, the exposure apparatus 1 determines whether the plate P held on the stage 4 at this time is an odd number plate or an even number plate after the baseline measurement. .

If the plate is an odd-numbered plate, the exposure apparatus 1 moves to step SP7, at which
Reticle R1 is on the optical path of the exposure light. While moving reticle engine 7 in the direction of arrow a from the state of reticle engine position 1, each reticle R1 to R4 is sequentially moved to the optical path of the exposure light. Expose.

When the exposure of the reticle R4 is completed when the nth (n = 4) reticle R4 is positioned on the optical path of the exposure light, that is, the reticle engine 7 is moved in the direction of the arrow a. The apparatus 1 proceeds to the subsequent step SP7A and determines whether or not exposure of all the plates has been completed. If a positive result is obtained here, the exposure apparatus 1 moves to step SP7B and ends the processing procedure. On the other hand, if a negative result is obtained in step SP7A, the exposure apparatus 1 returns to step SP4 described above and replaces the plate P held on the stage 4.

On the other hand, in step SP6, if the plate P held on the stage 4 at this time is the even-numbered plate after the baseline measurement, the exposure apparatus 1 moves to step SP8. At this time, the nth (n =
While the reticle R4 in 4) is on the optical path of the exposure light and is in the state of the reticle chain position n (n = 4), while moving the reticle chain 7 in the direction opposite to the arrow a, the reticles R4 to R1 are moved. The exposure is performed by sequentially moving to the optical path of the exposure light.

When the exposure of the reticle R1 is completed in the state where the first reticle R1 is located on the optical path of the exposure light, that is, the state where the reticle engine 7 is moved in the direction opposite to the arrow a, the exposure apparatus is exposed. In step 1, the process proceeds to the next step SP8A to determine whether or not exposure of all the plates has been completed. If a positive result is obtained here, the exposure apparatus 1 moves to step SP7B and ends the processing procedure. On the other hand, if a negative result is obtained in step SP8A, the exposure apparatus 1 returns to step SP4 and exchanges the plate P held on the stage 4.

In this way, after the reticle engine 7 has performed the baseline measurement in the state of the reticle engine position 1, the plate P exchanged and held on the stage 4 has the baseline measured, and then the odd-numbered plate. If the reticle engine 7 at this time is in the state of the reticle engineer position 1, and the plate P exchanged and held on the stage 4 is the even-numbered plate after the baseline measurement. The reticle engine position 7 at this time is the reticle engine position n (n = 4).
In this state, the exposure order of the reticles R1 to Rn is switched to R1 to Rn or Rn to R1 so that the exposure is sequentially started from the position of the reticle chainer 7 when the plate is replaced. .

[0017]

By the way, in the exposure apparatus 1 having such a structure, the reticle engine 7 has an arrow a.
By moving the reticle engine 7 in the direction indicated by or in the opposite direction, when the position of the reticle engine 7 changes, the center of gravity of the reticle engine 7 moves accordingly, and the exposure apparatus The structure 1 (especially column 5) is distorted.

Accordingly, when plate alignment is performed at different positions of the reticle engine 7 (reticle engine position 1 and reticle engine position n), an alignment error due to the distortion of the structure occurs, so There is a problem that the overlay accuracy of the pattern exposure position with respect to the plate is different between the odd-numbered plate and the even-numbered plate when performing the overlay exposure or the joint exposure.

The present invention has been made in consideration of the above points, and is intended to propose an exposure apparatus capable of making the precision of the exposure position of the pattern subjected to the overlay exposure or the joint exposure of the pattern constant in all the plates. is there.

[0020]

In order to solve such a problem, according to the present invention, a mask replacement means 7 for selectively holding a plurality of masks R1 to R4 at a predetermined position and integrally holding them. , Exposure means 9 and 11 for exposing the images of the masks R1 to R4 positioned at predetermined positions onto the photosensitive substrate P, and substrate positioning means 3 and 4 for positioning the photosensitive substrate P with respect to the exposure means 9 and 11. 12, 13,
The mask exchanging means 7 and the base members 2 and 5 for holding the exposing means 9 and 11 are provided. The mask exchanging means 7 sequentially exposes each of the plurality of masks R1 to R4 to a predetermined position. In the exposure apparatus 20 for exposing the substrate P, when the photosensitive substrate P is exchanged, the substrate positioning means 3, 4, 12, with the specific mask among the plurality of masks R1 to R4 being always positioned at a predetermined position.
Positioning control means 14 for positioning by means of 13 is provided, and the base members 2, 5 at the time of starting exposure of the photosensitive substrate P.
The positional relationship between the mask replacement means 7 and the mask replacement means 7 is always constant.

Further, in the present invention, a plurality of masks R1
~ R4 can be selectively positioned to a predetermined position,
Further, the mask exchanging means 7 for integrally holding it, the exposing means 9, 11 for exposing the images of the masks R1 to R4 positioned at predetermined positions on the photosensitive substrate P, and the exposing means 9, 11 for exposing the photosensitive substrate P to the exposing means 9, 11 Board positioning means 3 for positioning by
4, 12, 13 and mask exchange means 7 and exposure means 9,
An exposure apparatus 1 that has a base member 2 and 5 that holds 11 and that exposes the photosensitive substrate P while sequentially positioning each of the plurality of masks R1 to R4 by a mask replacement unit 7 with respect to a predetermined position. In the mask replacement means 7
Therefore, the first positioning result by the substrate positioning means 3, 4, 12, 13 obtained when the first mask of the plurality of masks R1 to R4 is arranged at a predetermined position, and
Positioning result detecting means 15 for respectively obtaining second positioning results by the substrate positioning means 3, 4, 12, 13 obtained when the second mask is arranged at a predetermined position.
And the substrate positioning means 3 when the photosensitive substrate P is replaced,
Substrate positioning means 3, 4, 12, 13 using the first positioning result when the masks R1 to R4 positioned at predetermined positions by 4, 12, 13 are the first masks.
The photosensitive substrate P is positioned by the substrate positioning means 3, 4, 12, 13 when the photosensitive substrate P is replaced.
Masks R1 to R4 positioned at predetermined positions by
Is a second mask, and a positioning control means 16 for positioning the photosensitive substrate P by the substrate positioning means 3, 4, 12, 13 using the second positioning result.
The positional relationship between the base members 2 and 5 and the photosensitive substrate P at the start of exposure of the photosensitive substrate P is always constant.

Further, in the present invention, the positioning control means 41 (16) stores the difference between the first positioning result and the second positioning result in advance, and when the photosensitive substrate P is replaced, the substrate positioning means 3, 4 , 12, 13 is used to determine the position of the photosensitive substrate P positioned using the first positioning result when the masks R1 to R4 which are positioned at predetermined positions by the first positioning result. Is corrected by using the difference of the second positioning result with respect to.

[0023]

When the photosensitive substrate P is positioned, the photosensitive substrate P is positioned by using the positioning result according to the positions of the masks R1 to R4 at the time of the positioning, so that it occurs depending on the position of the mask exchanging means 7. An error in the positioning result of the photosensitive substrate P due to the distortion of the structure is suppressed.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

(1) First Embodiment In FIG. 1 in which the same parts as those in FIG. 9 are designated by the same reference numerals, the exposure apparatus 20 has a positioning controller 14. The positioning control unit 14 obtains the relative positions of the reticle and the plate microscope 13 positioned on the projection lens 9 from the measurement results of the reticle microscope 12 and the plate microscope 13 by using the coordinate values of the stages 3 and 4, and obtains the relative position. By moving the stages 3 and 4 based on the baseline value, the alignment of the plate P placed on the stage 4 with respect to the reticle is executed.

The positioning control section 14 always puts a specific reticle (for example, reticle R1) among the reticles R1 to R4 on the projection lens 9 when the plate P placed on the stage 4 is exchanged. It is designed to be positioned.

FIG. 2 shows an alignment and exposure operation sequence in the exposure apparatus 20.
Enters the processing procedure from step SP10, holds n (n = 4) reticles on the reticle engineer 7 in step SP11, and n sheets of reticles R1 held on the reticle engineer 7 in step SP12. Rn (n = 4) of the reticle R7 held closest to the direction of the arrow a is located on the projection lens 9, the position of the reticle engine 7 (that is, the reticle engine 7 is in the opposite direction to the arrow a). The state in which the reticle has been moved to (1) is defined as the reticle position 1 and the baseline value is measured at the reticle position 1.

In this state, the exposure apparatus 20 holds (or exchanges) the plate P on the stage 4 in the subsequent step SP13, and moves the reticle engine 7 to the reticle engine position 1 in step SP14. However, when the plate P held on the stage 4 is the first plate after the baseline measurement, the reticle engine 7 is already in the state of the reticle engine position 1, so the reticle engine There is no need to go to Position 1.

Further, the exposure apparatus 20 continues the step SP1.
5, after performing plate alignment on the plate P held on the stage 4 at this time, in step SP16, exposure is performed while moving the reticle engine 7 in the order of the reticle engine positions 1 to n. First reticle R1 and second reticle R
2. The pattern of the nth reticle Rn (n = 4) is exposed on the plate P.

After exposing the patterns of the reticles R1 to Rn on the first plate P in this way, it is judged in subsequent step SP17 whether or not all the plates have been exposed, and a positive result is obtained. And step S
Moving to P18, the processing procedure is ended.

On the other hand, when a negative result is obtained in step SP17, the exposure apparatus 20 determines the above-mentioned step S.
Returning to P13, the plate P is exchanged for the second plate P, and the process proceeds to step SP14. Here, in the state where the exposure of the first plate P is completed in the order of the reticles R1 to Rn, the reticle engine 7 determines that the reticle Rn is in the optical path of the exposure light (reticle engine position n). Therefore, the exposure apparatus 20 moves the reticle engine 7 to the reticle engine position 1 by moving the reticle engine 7 in the direction opposite to the arrow a at step SP14.
Thereafter, the same processing as the above-mentioned processing is executed in steps SP15 and SP16.

In the above arrangement, the exposure apparatus 1 moves the reticle engine 7 to the reticle engine position 1 similar to that at the time of baseline measurement every time the plate P is replaced, and performs plate alignment on the replaced plate P. By executing the above, the position of the reticle engine 7 at the time of plate alignment is always the same position.

Accordingly, plate alignment can be performed for each plate P under the condition that the distortion of the structure of the exposure apparatus 1 corresponding to the position of the reticle engine 7 is similar, so that the plate P is replaced. Each plate P can be positioned at the same position.

According to the above-mentioned structure, the plate alignment is carried out in the state where the reticle engine 7 is moved to the same reticle engine position 1 for each plate P, so that each plate P is moved to the same position. Therefore, when the patterns of a plurality of reticles R1 to Rn are overlaid or joined on the plate P, the pattern overlay accuracy can be made constant on all the plates P.

(2) Second Embodiment In FIG. 3 in which parts corresponding to those in FIG. 9 are designated by the same reference numerals, the exposure apparatus 30 includes a reticle positioned on the projection lens 9 and a relative position (base) of the plate microscope 13. A positioning result detecting unit 15 for detecting a line value) and a positioning control unit 16 for executing alignment of the plate P with respect to the reticle based on the detection result of the positioning result detecting unit 15.

The positioning result detector 15 includes a projection lens 9
The first baseline value obtained with the first reticle R1 positioned above and the n-th (n = n
2) Obtained with the reticle R4 of 4) positioned
And the baseline value of. Further, when the reticle positioned on the projection lens 9 as the initial state when the plate P is placed on the stage 4 is the first reticle R1, the first baseline value is used for the plate P. Alignment of Reticle R
Exposure is sequentially performed in the order of 1, R2, R3, and R4.

On the other hand, when the reticle positioned on the projection lens 9 as the initial state when the plate P is placed on the stage 4 is the nth (n = 4) reticle R4, The alignment of the plate P is performed using the baseline value of 2, and the reticles R4, R3,
Exposure is sequentially performed in the order of R2 and R1.

FIG. 4 shows an alignment and exposure operation sequence in the exposure apparatus 30.
Enters the processing procedure from step SP20, holds n sheets (n = 4) of reticle on the reticle engine 7 at step SP21, and continues the reticle R1 held on the reticle engine 7 at step SP22. Reticle engine 7 when located on 9
Is set as the reticle chain position 1, and the baseline value is measured at the reticle chain position 1.

Further, the exposure apparatus 30 continues the step SP2.
3, the reticle engine 7 is moved in the direction of arrow a (FIG. 3) to move the reticle engine 7 to the reticle Rn (n = n = n) held at the end opposite to the end where the reticle R1 is held. 4) is located on the projection lens 9, the position of the reticle engine position 7 is defined as the reticle chain position n, and the reticle chain position n is set.
At, the baseline value is measured, and the reticle engine 7 is moved in the direction opposite to the arrow a to bring the reticle engineer position 1 into the state.

In this state, the exposure apparatus 30 holds (or exchanges) the plate P on the stage 4 in the subsequent step SP24, and in the subsequent step SP25, the plate P held on the stage 4 at this time is measured with an odd number after the baseline measurement. It is determined whether the plate is the first plate or the even plate.

In the case of an odd-numbered plate, since the reticle engine 7 is in the reticle engine position 1 at this time, the exposure apparatus 30 moves to step SP26 and is measured in step SP22 described above. Stage 4 at this time using the baseline values
After the plate alignment is performed on the plate P held above, exposure is performed while moving the reticle engineers 7 in order of the reticle engineers positions 1 to n in step SP27, whereby the first reticle R1, Second reticle R2, ... Nth reticle Rn
The pattern (n = 4) is sequentially exposed on the plate P.

In the subsequent step SP27A, it is determined whether or not exposure of all the plates has been completed. If a positive result is obtained here, the exposure apparatus 1 proceeds to step SP27.
The process moves to B and the processing procedure is ended. On the other hand, when a negative result is obtained in step SP27A, the exposure apparatus 30 returns to step SP24 described above, and the stage 4
The plate P held on the upper side is replaced with the second plate P, and in the subsequent step SP25, the stage 4
After the baseline measurement, it is determined whether the plate P held above is an odd-numbered plate or an even-numbered plate.

Here, a state in which the exposure is completed in order of the reticles R1 to Rn on the first (odd) plate P,
That is, in the state where the second (even number) plate P is held on the stage 4, the reticle engine 7
Is in a state where the reticle Rn is on the projection lens 9 (reticle position n), the exposure apparatus 30 moves to step SP28 when it is determined in step SP25 that it is an even number. After performing the plate alignment on the plate P held on the stage 4 at this time by using the baseline value measured in step SP23,
At 29, the reticle chain 7 is moved in the order of the reticle chain position n to 1 to perform exposure, so that the pattern of the n-th (n = 4) reticle Rn ,. Are sequentially exposed.

Further, in step SP29A, it is judged whether or not the exposure has been completed for all the plates, and if a positive result is obtained, the process proceeds to step SP27B to end the processing procedure, and if a negative result is obtained, the exposure apparatus. 30 returns to the above-mentioned step SP24, replaces the plate P held on the stage 4, and repeats the same processing from the subsequent step SP24.

In the above-described structure, the exposure apparatus 30 includes the first (odd number) plate P held on the stage 4.
On the other hand, by exposing the reticle R1 to Rn in this order while moving the reticle engine 7 in the direction of arrow a,
The position of the reticle engine 7 when the exposure of the first (odd number) plate P is completed is the reticle engine position n.

Therefore, for the second (even number) plate P, the reticle position at this time n
From reticle Rn to R1 in this order,
Exposure can be performed without returning the reticle engine 7 to the reticle engine position 1 once, and the exposure process can be shortened as a whole.

At this time, the baseline values are measured in advance in reticle chain position 1 and reticle chain position n, respectively, and the position of reticle chain position 7 becomes reticle chain position 1.
During plate alignment for the second (odd) plate P, the baseline value in reticle chain position 1 is used, and the position of reticle chain position 7 becomes reticle chain position n. When performing plate alignment for the (first) plate P, the reticle position adjustment n
By using the baseline value in, the plate alignment can be performed using the baseline values measured under the distortion of the structure of the exposure apparatus 30 that occurs depending on the position of the reticle engine 7.

According to the above configuration, when the odd-numbered or even-numbered plate P is exposed, the reticle engine 7 performs exposure while moving in the direction indicated by arrow a or in the opposite direction to arrow a. In addition, when performing plate alignment for the odd-numbered plate or even-numbered plate P, by using the baseline value according to the position of the reticle chainer 7 at each plate alignment, P can be positioned at the same position regardless of the odd-numbered sheet and the even-numbered sheet, respectively, and thus, a plurality of reticles R1 to Rn (n =
When the pattern 4) is overlaid or spliced on the plate P, the pattern overlay accuracy can be constant on all plates.

(3) Third Embodiment In FIG. 5, in which parts corresponding to those in FIG. 9 are designated by the same reference numerals, the exposure apparatus 40 controls the positioning result detector 15 and the positioning controller 16 described above with reference to FIG. The relative position of the reticle and the plate microscope 13 having the computer 41 and positioned on the projection lens 9 is obtained by the coordinate values of the stages 3 and 4, and the relative position of the reticle and the plate microscope 13 is set on the stage 4 based on the obtained baseline value. The alignment of the placed plate P with respect to the reticle is executed.

FIG. 6 shows an alignment and exposure operation sequence in the exposure apparatus 40.
Enters the processing procedure from step SP30, holds N reticles as the maximum number that can be held in the reticle engine 7 in step SP31, and holds them on the reticle engine 7 in step SP32. For each of the N reticles R1 to RN, the position of the reticle chainer 7 when located on the projection lens 9 is set as a reticle chain position 1 to a reticle chain position N as a base for each reticle chain position. Measure the line value.

Further, the exposure device 40 continues the step SP3.
3, the difference between the baseline value of the reticle chain position 1 and the baseline value of another reticle chain position 1 is stored in the memory of the control computer 41.

In this state, the exposure apparatus 40 finishes the baseline measurement as the pretreatment, and the subsequent step SP3.
The exposure process after 4 starts. That is, the exposure device 40 moves to step SP34 and holds n (n = 4) reticles necessary for exposure on the reticle engine 7, and then measures the baseline value in the reticle chain position 1 at step SP35. To do.

Further, the exposure device 40 continues the step SP3.
In step 6, the plate P is held (or exchanged) on the stage 4, and in the subsequent step SP37, the plate P held on the stage 4 at this time is an odd-numbered plate or an even-numbered plate after the baseline measurement in step SP35. Determine if it is the first plate.

In the case of an odd-numbered plate, the reticle engine 7 is in the reticle engine position 1 at this time, so that the exposure device 40 moves to step SP38 and is measured in step SP35 described above. Stage 4 at this time using the baseline values
After performing plate alignment on the plate P held above, exposure is performed while moving the reticle engineers 7 in the order of the reticle engineers positions 1 to n in step SP39, and the first reticle R1 Second reticle R2, ... Nth reticle Rn
The pattern (n = 4) is sequentially exposed on the plate P.

In a succeeding step SP43, it is judged whether or not the exposure of all the plates has been completed. If a positive result is obtained here, the exposure apparatus 40 proceeds to the step SP44.
Then, the processing procedure is finished. On the other hand, if a negative result is obtained in step SP43, the exposure apparatus 40 returns to step SP36 described above, and replaces the plate P held on the stage 4 with the second plate P,
At the subsequent step SP37, it is determined whether the plate P held on the stage 4 at this time is an odd-numbered plate or an even-numbered plate after the baseline measurement.

Here, the exposure is completed for the first (odd number) plate P in the order of the reticles R1 to Rn,
That is, in the state where the second (even number) plate P is held on the stage 4, the reticle engine 7
Since the reticle Rn is in a state where the reticle Rn is on the projection lens 9 (reticle engineering position n), when the exposure apparatus 40 determines in step SP37 that it is an even number of sheets, it moves to step SP40. Perform plate alignment at reticle engine position n.

Further, the exposure apparatus 40 continues the step SP4.
1 of the baseline values stored in the control computer 41 in step SP33 described above, the baseline difference between the reticle chain position n and the reticle chain position n (n = 4) is read out, and the baseline is read. Using the difference, the above step SP4
Correct the alignment result obtained at 0.

In this state, the exposure apparatus 40 performs exposure while moving the reticle engine 7 in the order of the reticle engine positions n to 1 in step SP42, whereby the nth (n = 4) reticle Rn ,. First
The pattern of the reticle R1 is sequentially exposed on the plate P.

In a succeeding step SP45, it is judged whether or not the exposure of all the plates has been completed. If a positive result is obtained here, the exposure apparatus 40 proceeds to the step SP44.
Then, the processing procedure is finished. On the other hand, if a negative result is obtained in step SP45, the exposure apparatus 40 returns to step SP36 described above, replaces the plate P held on the stage 4, and continues to step SP37.
The same processing is repeated from.

In the above-described structure, the exposure apparatus 40 includes the first (odd number) plate P held on the stage 4.
On the other hand, by exposing the reticle R1 to Rn in this order while moving the reticle engine 7 in the direction of arrow a,
The position of the reticle engine 7 when the exposure of the first (odd number) plate P is completed is the reticle engine position n.

Therefore, for the second (even number) plate P, the reticle position at this time n
From reticle Rn to R1 in this order,
Exposure can be performed without returning the reticle engine 7 to the reticle engine position 1 once, and the exposure process can be shortened as a whole.

At this time, for the maximum number of reticles R1 to RN that can be held by the reticle chain 7, the baseline values are previously measured at the reticle chain position 1 to the reticle chain position N, respectively.
By storing the difference between each baseline value and the baseline value of the reticle engine position 1 in the memory of the control computer 41, the reticle engine 7
At the time of plate alignment for the second (even number) plate P whose position is the reticle chain position n, the plate alignment result is used as the base for the reticle chain position n for the reticle chain position n. By correcting using the line difference, it is possible to correct the plate alignment result using the baseline values that are respectively measured under the distortion of the structure of the exposure apparatus 40 that occurs according to the position of the reticle engine 7. it can.

Therefore, according to the above configuration, each plate P
Can be positioned at the same position regardless of the odd-numbered sheet and the even-numbered sheet.
When the patterns 1 to Rn are overlaid or joined on the plate P, the pattern overlay accuracy can be made constant on all the plates.

In the second and third embodiments described above, the baseline value to be used is selected by determining whether the plate is an odd number plate or an even number plate. However, the present invention is not limited to this, and detects which reticle is positioned among the reticles on the reticle engine 7,
The plate alignment may be performed based on the detection result.

(4) Fourth Embodiment In FIG. 7 in which parts corresponding to those in FIG. 9 are assigned the same reference numerals, an exposure apparatus 50 has a control computer 51, and a reticle and plate positioned on the projection lens 9 are positioned. The relative position of the microscope 13 is obtained by the coordinate values of the stages 3 and 4, and the alignment of the plate P placed on the stage 4 with respect to the reticle is executed based on the obtained baseline value. There is.

FIG. 8 shows an alignment and exposure operation sequence in the exposure apparatus 50.
Enters the processing procedure from step SP50, holds n (n = 4) reticles required for exposure on the reticle engine 7 in step SP51, and then continues the reticle engine 7 in step SP52. Move to Shion 1, then step SP5
In 3, the baseline value B in the reticle engine position 1 is measured and stored in the control computer 51.

In this state, the exposure apparatus 50 moves to the next step SP54, holds the plate P on the stage 4 and performs plate alignment with respect to the plate P, and at the next step SP55, the reticle R1.
The pattern P is exposed on the plate P.

Further, the exposure apparatus 50 moves the reticle chain 7 to the reticle chain position 2 at step SP56, measures the baseline value at the reticle chain position 2 at step SP57, and at step SP53 described above. The control computer 51 calculates the amount of baseline change in the reticle chain position 2 with respect to the measured baseline value B, and corrects the baseline value B in the reticle chain position 1 using the amount of change. Further, the exposure position of the plate P is corrected by using the corrected baseline value, and the subsequent step SP58
At, the pattern of reticle R2 is exposed.

Further, the exposure apparatus 50 moves the reticle chain 7 to the reticle chain position 3 at step SP59, measures the baseline value at the reticle chain position 3 at step SP60, and at step SP53 described above. A baseline change amount in the reticle chain position 3 with respect to the measured baseline value B is calculated, and the baseline value B in the reticle chain position 1 is corrected using the change amount. Further, the exposure position of the plate P is corrected using the corrected baseline value, and the pattern of the reticle R3 is exposed in the subsequent step SP61.

Further, the exposure apparatus 50 moves the reticle engine 7 to the reticle engine position n (n = 4) in step SP62 and measures the baseline value in the reticle engine position n in the following step SP63. The baseline change amount in the reticle chain position n with respect to the baseline value B measured in step SP53 is calculated, and the baseline value B in the reticle chain position n is corrected using the change amount. Further, the exposure position of the plate P is corrected by using the corrected baseline value, and the reticle R is read at step SP64.
Expose n patterns.

In the subsequent step SP76, it is determined whether or not the exposure of all the plates has been completed. If a positive result is obtained here, the exposure apparatus 50 determines in step SP77.
Then, the processing procedure is finished. On the other hand, if a negative result is obtained in step SP76, the exposure apparatus 50 moves to the following step SP65 to replace the plate P and performs plate alignment, and then moves to step SP66 to expose the pattern of the reticle Rn. .

Further, the exposure apparatus 50 moves the reticle chain 7 to the reticle chain position 3 at step SP67, measures the baseline value at the reticle chain position 3 at step SP68, and at step SP53 described above. A baseline change amount in the reticle chain position 3 with respect to the measured baseline value B is calculated, and the baseline value B in the reticle chain position 1 is corrected using the change amount. Further, the exposure position of the plate P is corrected using the corrected baseline value, and the pattern of the reticle R3 is exposed in the subsequent step SP69.

Further, the exposure apparatus 50 moves the reticle chain 7 to the reticle chain position 2 at step SP70, measures the baseline value at the reticle chain position 2 at step SP71, and at step SP53 described above. A baseline change amount in the reticle chain position 2 with respect to the measured baseline value B is calculated, and the baseline value B in the reticle chain position 1 is corrected using the changed amount. Further, the exposure position of the plate P is corrected using the corrected baseline value, and the pattern of the reticle R2 is exposed in the subsequent step SP72.

Further, the exposure apparatus 50 moves the reticle engine 7 to the reticle engine position 1 at step SP73, and at the subsequent step SP74, uses the baseline value B measured at the above step SP53 to expose the plate P at the exposure position. Is corrected, and the pattern of the reticle R1 is exposed in step SP75.

When the pattern exposure of the reticles Rn to R1 on the plate P is completed in this way, it is judged in the subsequent step SP78 whether or not all the plates have been exposed. If a positive result is obtained here, the exposure apparatus 50 moves to step SP77 to end the processing procedure. On the other hand, if a negative result is obtained in step SP78, the exposure apparatus 50 proceeds to the above-mentioned step SP54.
Then, the plate P is exchanged and the plate alignment is executed, and thereafter, the processing from step SP66 is repeated.

In the above configuration, when the exposure apparatus 1 moves the reticle engine 7 to perform exposure in order of the reticles R1 to Rn or Rn to R1 (n = 4), the reticle engine 7 causes the reticle engine 7 to move. Positions 1-n
Alternatively, the distortion of the structure of the exposure apparatus 50 is changed by moving to the reticle chain positions n to 1. Therefore, each reticle engine position 1, 2, 3
And n (n = 4), measuring the respective baseline values, calculating the amount of change in the reticle chain position 1 with respect to the baseline value B, and correcting the exposure position for the plate P in accordance with the amount of change. Therefore, regardless of the position of the reticle engine 7, the plate P
The exposure position for can be constant.

Therefore, according to the above configuration, when the patterns of the plurality of reticles R1 to Rn are overlaid or joined on the plate P, the pattern overlay accuracy can be made constant.

[0078]

As described above, according to the present invention, when the photosensitive substrate is positioned, the photosensitive substrate is positioned by using the positioning result according to the position of the mask at the time of the positioning. It is possible to realize an exposure apparatus that can suppress the error in the positioning result of the photosensitive substrate due to the distortion of the structure that occurs depending on the position, and can obtain stable positioning accuracy.

[Brief description of drawings]

FIG. 1 is a side view showing a first embodiment of an exposure apparatus according to the present invention.

FIG. 2 is a flow chart showing an operation sequence of the exposure apparatus according to the first embodiment.

FIG. 3 is a side view showing a second embodiment of the exposure apparatus according to the present invention.

FIG. 4 is a flow chart showing an operation sequence of the exposure apparatus according to the second embodiment.

FIG. 5 is a side view showing a third embodiment of the exposure apparatus according to the present invention.

FIG. 6 is a flow chart showing an operation sequence of the exposure apparatus according to the third embodiment.

FIG. 7 is a side view showing a fourth embodiment of the exposure apparatus according to the present invention.

FIG. 8 is a flow chart showing an operation sequence of the exposure apparatus according to the fourth embodiment.

FIG. 9 is a side view showing the configuration of a conventional exposure apparatus.

FIG. 10 is a flow chart showing an operation sequence of a conventional exposure apparatus.

[Explanation of symbols]

1, 20, 30, 40, 50 ... Exposure device, 3, 4 ...
Stage, 7 ... Reticle engine, 13 ... Projection lens, 14, 16 ... Positioning control unit, 15 ... Positioning result detection unit, R1, R2, R3, R4 ... Reticle,
P: Plate.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location 7352-4M 311 C

Claims (3)

[Claims] 1. A mask exchanging means for selectively holding a plurality of masks at predetermined positions and integrally holding the masks, and exposing the image of the masks positioned at the predetermined positions onto a photosensitive substrate. An exposure means, a substrate positioning means for positioning the photosensitive substrate with respect to the exposure means, and a base member for holding the mask replacement means and the exposure means. In the exposure apparatus that exposes the photosensitive substrate while sequentially positioning each of them with respect to the predetermined position, when the photosensitive substrate is replaced, a specific mask among the plurality of masks is always placed at the predetermined position. Positioning control means for performing positioning by the substrate positioning means in a positioned state, the base member at the time of starting exposure of the photosensitive substrate Exposure and wherein the positional relationship between the mask exchange means is always set to be constant. 2. A mask exchanging means for selectively holding a plurality of masks at predetermined positions and integrally holding them, and exposing the image of the masks positioned at the predetermined positions on a photosensitive substrate. The exposure means, the substrate positioning means for positioning the photosensitive substrate with respect to the exposure means, and the base member for holding the mask exchange means and the exposure means are provided, and the plurality of masks are provided by the mask exchange means. In which the first mask of the plurality of masks is arranged at the predetermined position by the mask exchanging means, while exposing the photosensitive substrate while sequentially positioning each of them at the predetermined position. And the substrate obtained when the second mask is arranged at the predetermined position. The positioning result detecting means for respectively obtaining the second positioning result by the positioning means, and the mask positioned at the predetermined position by the substrate positioning means when the photosensitive substrate is exchanged are the first.
When the photosensitive substrate is replaced, the photosensitive substrate is positioned by the substrate positioning means using the first positioning result, and when the photosensitive substrate is replaced, the photosensitive substrate is positioned at the predetermined position by the substrate positioning means. And a positioning control means for positioning the photosensitive substrate by the substrate positioning means using the second positioning result when the mask is the second mask. An exposure apparatus characterized in that the positional relationship between the base member and the photosensitive substrate is always constant. 3. The positioning control means stores in advance a difference between the first positioning result and the second positioning result, and when the photosensitive substrate is replaced, the substrate positioning means allows the predetermined position to be set. When the mask to be positioned on the second mask is the second mask, the position of the photosensitive substrate positioned using the first positioning result is used as the difference between the second positioning result and the first positioning result. The exposure apparatus according to claim 2, wherein the exposure apparatus is configured to perform the correction.