JPH0629111A - Method of adjusting resistance value of resistor - Google Patents
Method of adjusting resistance value of resistorInfo
- Publication number
- JPH0629111A JPH0629111A JP4183499A JP18349992A JPH0629111A JP H0629111 A JPH0629111 A JP H0629111A JP 4183499 A JP4183499 A JP 4183499A JP 18349992 A JP18349992 A JP 18349992A JP H0629111 A JPH0629111 A JP H0629111A
- Authority
- JP
- Japan
- Prior art keywords
- resistance value
- resistor
- resistance
- film
- laser irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板上面に抵抗膜を形
成してなる抵抗体の抵抗値調整方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistance value adjusting method for a resistor having a resistive film formed on the upper surface of a substrate.
【０００２】[0002]
【従来の技術】図３は、基板１上面に形成した一対の端
子電極２，３にまたがって抵抗膜４を設けてなる抵抗体
を示している。この抵抗体は、基板１にアルミナ等のセ
ラミック材料が用いられ、端子電極２，３にＡｇ，Ａｇ
・Ｐｄ合金等の金属材料が用いられ、抵抗膜４に酸化ル
テニウム等のサーメット材料が用いられて構成されてい
る。2. Description of the Related Art FIG. 3 shows a resistor having a resistance film 4 formed on a pair of terminal electrodes 2 and 3 formed on a top surface of a substrate 1. In this resistor, a ceramic material such as alumina is used for the substrate 1, and Ag, Ag are used for the terminal electrodes 2 and 3.
A metal material such as a Pd alloy is used, and the resistance film 4 is formed using a cermet material such as ruthenium oxide.
【０００３】従来、このような抵抗体においては、抵抗
膜４に、その側端からレーザ光線でカット溝５を形成
し、そのカット溝５の長さを調節することにより、その
抵抗値を調整していた。Conventionally, in such a resistor, the resistance value is adjusted by forming a cut groove 5 with a laser beam from the side end of the resistance film 4 and adjusting the length of the cut groove 5. Was.
【０００４】[0004]
【発明が解決しようとする課題】ところが、このような
抵抗値の調整方法においては、カット溝５の周辺部にマ
イクロクラックが生じるため、抵抗値の安定性に欠ける
という問題があった。However, in such a resistance value adjusting method, there is a problem in that the resistance value is not stable because microcracks are generated in the peripheral portion of the cut groove 5.
【０００５】また、カット溝５の長さが長くなると、そ
の部分の抵抗膜４の幅が狭くなるため、その幅の狭い部
分における電流密度が増大して電気的ストレスに弱くな
るととともに、その幅の狭い部分によって定格電力が制
約されるという問題があった。Further, as the length of the cut groove 5 becomes longer, the width of the resistance film 4 at that portion becomes narrower, so that the current density at the narrow portion increases and becomes weak against electrical stress, and at the same time, the width thereof increases. There was a problem that the rated power was restricted by the narrow part of the.
【０００６】したがって、本発明においては、抵抗値の
安定性に優れ、電気的ストレスに弱くなったり、定格電
力に余計な制約を受けることのない抵抗体の抵抗値調整
方法を提供することを目的としている。Therefore, it is an object of the present invention to provide a resistance value adjusting method for a resistor which is excellent in stability of resistance value, weak in electric stress, and free from an extra restriction in rated power. I am trying.
【０００７】[0007]
【課題を解決するための手段】このような目的を達成す
るために、本発明の抵抗値調整方法においては、抵抗膜
上面に抵抗膜を保護するレーザ照射パッドを形成し、該
レーザ照射パッドにレーザ光線を照射することにより該
レーザ照射パッドを介して前記抵抗膜を加熱し、その熱
により該抵抗膜の抵抗値を変化させて所定の値にするこ
とを特徴としている。In order to achieve such an object, in the resistance value adjusting method of the present invention, a laser irradiation pad for protecting the resistance film is formed on the upper surface of the resistance film, and the laser irradiation pad is formed on the laser irradiation pad. It is characterized in that the resistance film is heated through the laser irradiation pad by irradiating with a laser beam, and the resistance value of the resistance film is changed by the heat to a predetermined value.
【０００８】[0008]
【作用】抵抗膜を形成している酸化ルテニウム等の抵抗
材料は、加熱温度に応じて抵抗値が変化し、元の値に戻
ることはないという熱特性を有している。一方、レーザ
照射パッドに照射するレーザ光線の照射量、照射時間、
照射面積等を変えることによって抵抗膜の加熱温度を変
えることができる。そのため、その加熱温度に応じて抵
抗膜の抵抗値を調整することができる。Function The resistance material such as ruthenium oxide forming the resistance film has a thermal characteristic that the resistance value changes according to the heating temperature and does not return to the original value. On the other hand, the irradiation amount of the laser beam applied to the laser irradiation pad, the irradiation time,
The heating temperature of the resistance film can be changed by changing the irradiation area and the like. Therefore, the resistance value of the resistance film can be adjusted according to the heating temperature.
【０００９】しかも、レーザ光線はレーザ照射パッドに
照射し、直接、抵抗膜に照射するものではないため、抵
抗膜を損傷することなく抵抗値を調整することができ
る。Further, since the laser beam is applied to the laser irradiation pad and not directly to the resistance film, the resistance value can be adjusted without damaging the resistance film.
【００１０】[0010]
【実施例】以下、本発明の一実施例を図面を参照して詳
細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.
【００１１】まず、図１に示すように従来例と同様の抵
抗体は、基板１上面の一対の端子電極２，３にまたがっ
て抵抗膜４を設けたものである。First, as shown in FIG. 1, a resistor similar to the conventional example has a resistor film 4 provided on a pair of terminal electrodes 2 and 3 on the upper surface of a substrate 1.
【００１２】ついで、図２に示すように図１に示す抵抗
体の抵抗膜４上面に複数個のレーザ照射パッド６を形成
する。このレーザ照射パッド６は、Ａｇペーストをスク
リーン印刷し乾燥したのちに焼成して形成したものであ
って、レーザ光線によって損傷を受けないように抵抗膜
４を保護する。Then, as shown in FIG. 2, a plurality of laser irradiation pads 6 are formed on the upper surface of the resistance film 4 of the resistor shown in FIG. The laser irradiation pad 6 is formed by screen-printing Ag paste, drying it, and then firing it, and protects the resistance film 4 so as not to be damaged by the laser beam.
【００１３】ついで、レーザ照射パッド６に順次にレー
ザ光線を照射する。これによって、レーザ照射パッド６
を介して抵抗膜４が加熱される。このときの加熱温度
は、レーザ光線の照射量、照射時間、レーザ照射パッド
６の面積等を変えることにより適宜の値に調節すること
ができる。Then, the laser irradiation pad 6 is sequentially irradiated with a laser beam. Thereby, the laser irradiation pad 6
The resistance film 4 is heated via the. The heating temperature at this time can be adjusted to an appropriate value by changing the irradiation amount of the laser beam, the irradiation time, the area of the laser irradiation pad 6, and the like.
【００１４】抵抗膜４が加熱されると、抵抗膜４を形成
している抵抗材料の熱特性に応じた抵抗値に変化する。
このようにして変化した抵抗膜４の抵抗値は、温度特性
に応じた若干の変動はあっても冷却されたのちに元の抵
抗値に戻ることはない。When the resistance film 4 is heated, the resistance value changes according to the thermal characteristics of the resistance material forming the resistance film 4.
The resistance value of the resistance film 4 thus changed does not return to the original resistance value after being cooled, although there is a slight variation depending on the temperature characteristic.
【００１５】なお、抵抗材料の熱特性は、材料の種類に
よって加熱することにより抵抗値が高くなるものと、抵
抗値が低くなるものとが存在する。したがって、加熱す
ることにより抵抗値が高くなる抵抗材料を用いる場合
は、抵抗膜の初期抵抗値を低めに設定しておけばよく、
加熱することにより抵抗値が低くなる抵抗材料を用いる
場合は、抵抗膜の初期抵抗値を高めに設定しておけばよ
い。Regarding the thermal characteristics of the resistance material, there are those which have a high resistance value and those which have a low resistance value depending on the type of material. Therefore, when a resistance material whose resistance value increases by heating is used, the initial resistance value of the resistance film may be set lower,
When a resistance material whose resistance value is lowered by heating is used, the initial resistance value of the resistance film may be set higher.
【００１６】また、レーザ照射パッド６の材料は、Ａｇ
に限らず、Ｃｕ等でもよい。要は、レーザ光線によって
損傷を受けないように抵抗膜を保護するものであればよ
い。The material of the laser irradiation pad 6 is Ag.
However, Cu or the like may be used. What is essential is that the resistance film is protected so as not to be damaged by the laser beam.
【００１７】また、抵抗膜４上面に形成するレーザ照射
パッド６の個数は任意であり、導電率のきわめて低い材
料であれば、抵抗膜４の全面に形成してもよい。Further, the number of laser irradiation pads 6 formed on the upper surface of the resistance film 4 is arbitrary, and may be formed on the entire surface of the resistance film 4 as long as the material has a very low conductivity.
【００１８】[0018]
【発明の効果】以上のように本発明によれば、抵抗膜上
面のレーザ照射パッドにレーザ光線を照射することによ
る熱によって抵抗膜の抵抗値を変えるもので、直接、抵
抗膜にレーザ光線を照射してカット溝を形成するもので
はないから、抵抗値の安定性に優れたものとなり、電気
的ストレスに弱くなったり、定格電力に余計な制約を受
けるようなことがなくなる。As described above, according to the present invention, the resistance value of the resistance film is changed by heat generated by irradiating the laser irradiation pad on the upper surface of the resistance film with the laser beam. Since the cut groove is not formed by irradiation, the stability of the resistance value is excellent, and it is not vulnerable to electrical stress and the power rating is not excessively restricted.
【図１】本発明の一実施例に係る抵抗体の抵抗値調整方
法を説明するための抵抗体の平面図である。FIG. 1 is a plan view of a resistor for explaining a resistance value adjusting method for a resistor according to an exemplary embodiment of the present invention.
【図２】図１に示す抵抗膜上面にレーザ照射パッドを形
成した抵抗体の平面図である。FIG. 2 is a plan view of a resistor having a laser irradiation pad formed on the upper surface of the resistance film shown in FIG.
【図３】従来の抵抗体の抵抗値調整方法を説明するため
の抵抗体の平面図である。FIG. 3 is a plan view of a resistor for explaining a conventional resistance value adjusting method of the resistor.
１ 基板 ２，３ 端子電極 ４ 導体膜 ６ レーザ照射パッド 1 substrate 2, 3 terminal electrode 4 conductor film 6 laser irradiation pad
Claims (1)
の抵抗値調整方法であって、 抵抗膜上面に抵抗膜を保護するレーザ照射パッドを形成
し、該レーザ照射パッドにレーザ光線を照射することに
より該レーザ照射パッドを介して前記抵抗膜を加熱し、
その熱により該抵抗膜の抵抗値を変化させて所定の値に
することを特徴とする抵抗体の抵抗値調整方法。1. A method of adjusting a resistance value of a resistor comprising a resistive film formed on an upper surface of a substrate, wherein a laser irradiation pad for protecting the resistive film is formed on the upper surface of the resistive film and a laser beam is applied to the laser irradiation pad. Heating the resistive film through the laser irradiation pad by irradiating,
A resistance value adjusting method of a resistor, characterized in that the resistance value of the resistance film is changed to a predetermined value by the heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4183499A JPH0629111A (en) | 1992-07-10 | 1992-07-10 | Method of adjusting resistance value of resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4183499A JPH0629111A (en) | 1992-07-10 | 1992-07-10 | Method of adjusting resistance value of resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0629111A true JPH0629111A (en) | 1994-02-04 |
Family
ID=16136898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4183499A Pending JPH0629111A (en) | 1992-07-10 | 1992-07-10 | Method of adjusting resistance value of resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0629111A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1717094A2 (en) | 2005-04-28 | 2006-11-02 | Toyo Denso Kabushiki Kaisha | Power seat operation switch |
-
1992
- 1992-07-10 JP JP4183499A patent/JPH0629111A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1717094A2 (en) | 2005-04-28 | 2006-11-02 | Toyo Denso Kabushiki Kaisha | Power seat operation switch |
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