JPH06290993A - Electronic component - Google Patents

Electronic component

Info

Publication number
JPH06290993A
JPH06290993A JP9722393A JP9722393A JPH06290993A JP H06290993 A JPH06290993 A JP H06290993A JP 9722393 A JP9722393 A JP 9722393A JP 9722393 A JP9722393 A JP 9722393A JP H06290993 A JPH06290993 A JP H06290993A
Authority
JP
Japan
Prior art keywords
base plate
lead pin
feedthrough capacitor
acceleration sensor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9722393A
Other languages
Japanese (ja)
Inventor
Hiroyuki Sato
浩之 佐藤
Hiroshi Seki
宏志 関
Shigeru Tamura
茂 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seiki Co Ltd
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Priority to JP9722393A priority Critical patent/JPH06290993A/en
Publication of JPH06290993A publication Critical patent/JPH06290993A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide an electronic device, such as acceleration sensor or pressure sensor, in which a noise suppresser element and a base member are integrally formed to simplify its structure and adequately absorb external noises. CONSTITUTION:An acceleration sensor 8 (electronic device) comprises a circuit housed in a space between a base plate 1 and a cap cover. The base plate is fitted with a lead pin 2 through which the circuit is connected to an external member. A coaxial capacitor 6 (noise suppresser) is fixed integrally with that part of the base plate where the lead pin is fitted.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子素子の外来ノイズ
による誤動作を抑制するノイズ防止素子の取付構造に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a noise prevention element mounting structure for suppressing malfunction of an electronic element due to external noise.

【0002】[0002]

【従来の技術】従来の電子素子を加速度センサを例に挙
げ説明する。
2. Description of the Related Art A conventional electronic device will be described by taking an acceleration sensor as an example.

【0003】加速度センサ(電子素子)8は、図4に示
す様に、SPC鋼板,SOS304等の鉄系材量にニッ
ケル(Ni)メッキを施し、複数個から成る孔1aを形
成したベース板(ベース部材)1上の孔1aを除く位置
に図示しないHIC,チップ部品等の回路部品から成る
構成部材を実装したプリント基板を配設し、SPC鋼
板,SOS304等の鉄系材量にニッケルメッキを施し
たキャップカバー(カバー部材)4で孔1a及び前記構
成部材を外部から隔離する為にベース板1にプロジェク
ション溶接等で溶着している。前記構成部材を電気的に
外部に導出する為、ベース板1の孔1aにニッケルメッ
キを施した50Ni−Fe合金等から成るリードピン2
をソーダライム系,ソーダバリウム系等から成る高融点
ガラス3を介してハーメチックシールし、ベース板1の
裏面に引き出している。そして、このリードピン2と前
記構成部材とは、ベース板1上によりワイヤボンディン
グ等の手段により電気的に接続されている。
As shown in FIG. 4, the acceleration sensor (electronic element) 8 is a base plate (a plate having a plurality of holes 1a formed by plating nickel (Ni) on an iron-based material such as SPC steel plate or SOS304. A printed circuit board on which components such as HIC and chip components (not shown) are mounted is disposed on the base member 1 except the holes 1a, and nickel plating is applied to the amount of iron-based material such as SPC steel plate and SOS304. The cap cover (cover member) 4 applied is welded to the base plate 1 by projection welding or the like in order to isolate the hole 1a and the constituent members from the outside. In order to electrically lead the constituent members out to the outside, a lead pin 2 made of a 50Ni—Fe alloy or the like in which nickel is plated in the hole 1a of the base plate 1
Is hermetically sealed through a high melting point glass 3 made of soda lime type, soda barium type, etc., and is drawn out to the back surface of the base plate 1. The lead pins 2 and the constituent members are electrically connected to each other on the base plate 1 by means such as wire bonding.

【0004】一方、外来ノイズを抑制するノイズ防止素
子の取付構造は、特開平1−15205号公報に開示さ
れ図5に示す様に、SPC鋼板等にニッケルメッキを施
したシールド材から成る取付部材5が、図4に示すリー
ドピン2を挿通させる為の複数個から成る孔5aと、後
述する貫通コンデンサをセットする為の複数個から成る
孔5bとを有し、この取付部材5の孔5bに前記ノイズ
防止素子である貫通コンデンサ6をセットし、この貫通
コンデンサ6の孔6aに50Ni−Fe合金にニッケル
メッキを施したリード線7を挿入し、取付部材5の孔5
bにセットされた貫通コンデンサ6と貫通コンデンサ6
の孔6aに挿入されたリード線7とを図示しない半田等
により固定している。
On the other hand, a mounting structure of a noise prevention element for suppressing external noise is disclosed in Japanese Patent Application Laid-Open No. 1-15205, and as shown in FIG. 5, a mounting member made of a shield material obtained by nickel-plating an SPC steel plate or the like. 5 has a plurality of holes 5a for inserting the lead pins 2 shown in FIG. 4 and a plurality of holes 5b for setting a feedthrough capacitor described later. The feedthrough capacitor 6, which is the noise prevention element, is set, the lead wire 7 of nickel-plated 50Ni—Fe alloy is inserted into the hole 6a of the feedthrough capacitor 6, and the hole 5 of the mounting member 5 is inserted.
Feedthrough capacitor 6 and feedthrough capacitor 6 set in b
The lead wire 7 inserted into the hole 6a is fixed by solder or the like (not shown).

【0005】このような取付部材5は、図6に示す様
に、リードピン2を孔5aに挿通しスポット溶接等の手
段により溶着され、リードピン2とリード線7は図示し
ない半田等により固定されることで貫通コンデンサ6を
外付けした加速度センサ8を構成する。
As shown in FIG. 6, such a mounting member 5 has a lead pin 2 inserted into the hole 5a and welded thereto by means such as spot welding, and the lead pin 2 and the lead wire 7 are fixed by solder or the like (not shown). Thus, the acceleration sensor 8 to which the feedthrough capacitor 6 is externally attached is configured.

【0006】かかる構成によると、貫通コンデンサ6を
加速度センサ8に取付る際に、取付部材5,リード線7
等の構成部品が必要であり、部品点数が増え構成が複雑
になるだけでなく、半田付等の溶接箇所も多くなること
から工程上不利であり、信頼性にも問題があった。
According to this structure, when the feedthrough capacitor 6 is attached to the acceleration sensor 8, the attachment member 5 and the lead wire 7 are attached.
However, the number of parts is increased, the structure is complicated, and the number of welding points such as soldering is increased, which is disadvantageous in the process and has a problem in reliability.

【0007】[0007]

【課題を解決するための手段】本発明はベース部材とカ
バー部材とで構成される空間内に、物理量検出センサ及
び/又は、回路部品から成る構成部材を収納し、前記ベ
ース部材の外部に前記構成部材と接続されて導出される
リードピンを有する電子素子において、前記リードピン
が固定される前記ベース部材の箇所に前記構成部材に対
する外来ノイズを抑制するノイズ防止素子を一体的に固
定したことを特徴とする。
According to the present invention, a physical quantity detection sensor and / or a constituent member composed of a circuit component is housed in a space defined by a base member and a cover member, and the above-mentioned external member is provided outside the base member. In an electronic element having a lead pin that is connected to a constituent member and led out, a noise prevention element that suppresses external noise to the constituent member is integrally fixed to a location of the base member to which the lead pin is fixed. To do.

【0008】[0008]

【作用】ベース部材とノイズ防止素子とを一体に形成す
ることにより、取付部材等の構成部品が削減され、構造
が簡素化される。
By integrally forming the base member and the noise prevention element, the number of components such as the mounting member is reduced and the structure is simplified.

【0009】[0009]

【実施例】本発明を図1,2を用いて従来例と同様に加
速度センサにおけるノイズ防止素子の取付構造について
説明するが、前記従来例における同一もしくは相当箇所
には、同一符号を付してその詳細な説明は除く。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to FIGS. 1 and 2 as to the mounting structure of a noise prevention element in an acceleration sensor in the same manner as in the conventional example. The detailed explanation is excluded.

【0010】ベース板1は、後述する貫通コンデンサを
セットする為の孔1a′を複数個有しており、この孔1
a′に回路部品から成る構成部材に対する外来ノイズを
抑制する貫通コンデンサ6をセットし、この貫通コンデ
ンサ6の孔6aにリードピン2を挿通し鉛系ガラスで溶
融、軟化点の低いガラス(封着温度約520 ℃)から成る
封着用ガラス9を介して封着することにより、ベース板
1と貫通コンデンサ6とリードピン2とを一体に固定し
た加速度センサ8を構成する。
The base plate 1 has a plurality of holes 1a 'for setting through capacitors which will be described later.
A feedthrough capacitor 6 for suppressing external noise to a component made up of a circuit component is set in a ', and a lead pin 2 is inserted into a hole 6a of the feedthrough capacitor 6 to melt a lead-based glass, which has a low softening point (sealing temperature). The base plate 1, the feedthrough capacitor 6, and the lead pin 2 are integrally fixed to each other to form an acceleration sensor 8 by sealing with a sealing glass 9 made of about 520 ° C.).

【0011】次に本実施例のベース板1と貫通コンデン
サ6とリードピン2とを一体に固定する方法について図
2を用いて説明する。
Next, a method of integrally fixing the base plate 1, the feedthrough capacitor 6 and the lead pin 2 of this embodiment will be described with reference to FIG.

【0012】リードピン2の逃げ穴10aを複数個有する
カーボン(C)から成る治具10に、ベース板1の孔1
a′と治具10の逃げ穴10aとが対向する様にセットす
る。そして、ベース板1の孔1a′に低融点ガラス9が
コーティングされた貫通コンデンサ6をセットし、リー
ドピン2を貫通コンデンサ6の孔6aに挿通する。そし
て、この治具10をステンレストレーに配置し、約520 ℃
に設定した電気炉を通すと、貫通コンデンサ6の孔6a
と側面6bとにコーティングされた封着用ガラスが溶解
し、ベース板1と貫通コンデンサ6とリードピン2とを
封止する。
The jig 10 made of carbon (C) having a plurality of escape holes 10a for the lead pins 2 is attached to the hole 1 of the base plate 1.
Set so that a ′ and the escape hole 10a of the jig 10 face each other. Then, the feedthrough capacitor 6 coated with the low melting point glass 9 is set in the hole 1 a ′ of the base plate 1, and the lead pin 2 is inserted into the hole 6 a of the feedthrough capacitor 6. Then, place this jig 10 on a stainless steel tray and heat it to about 520 ° C.
Through the electric furnace set at
The glass for sealing coated on the side surface 6b is melted to seal the base plate 1, the feedthrough capacitor 6 and the lead pin 2.

【0013】また、前述した方法とは別に治具10上にベ
ース板1と貫通コンデンサ6とリードピン2とを順次配
設し、図示しない熔融ガラスを貫通コンデンサ6のリー
ドピン2が挿通されている孔6aとベース板1と貫通コ
ンデンサ6との図示しない隙間とに流し込み固定しても
よい。
In addition to the above-described method, the base plate 1, the feedthrough capacitor 6 and the lead pin 2 are sequentially arranged on the jig 10, and a glass hole (not shown) is inserted into the lead pin 2 of the feedthrough capacitor 6. 6a, the base plate 1 and the feedthrough capacitor 6 may be poured and fixed in a gap (not shown).

【0014】以上の様にベース板1と貫通コンデンサ6
とリードピン2とを一体に固定する方法を示したが、如
何なる方法であっても一体に固定すればよいことは言う
までもなく、図5に示す様な取付部材5,リード線7等
が不要と成り全体として製作工程も簡素化し、半田付等
の溶接箇所も減少する為、信頼性も向上する。
As described above, the base plate 1 and the feedthrough capacitor 6 are provided.
Although the method for integrally fixing the lead pin 2 and the lead pin 2 has been shown, it goes without saying that the fixing member 5, the lead wire 7 and the like as shown in FIG. As a whole, the manufacturing process is simplified and the number of welding points such as soldering is reduced, so reliability is also improved.

【0015】また、本発明品である加速度センサ8の耐
電磁波特性(外来ノイズによる影響)を調べた結果を図
3に示すが、aは本発明のベース板1と貫通コンデンサ
5とを一体化した加速度センサ8,bは図6に示す様な
従来の加速度センサ8,Cは図4に示す様な貫通コンデ
ンサ未使用の加速度センサ8の出力電圧(Vout)の
変化を夫々表している。
FIG. 3 shows the result of examination of the electromagnetic wave resistance characteristics (influence of external noise) of the acceleration sensor 8 of the present invention. In FIG. 3, a shows that the base plate 1 of the present invention and the feedthrough capacitor 5 are integrated. The acceleration sensors 8 and 8 shown in FIG. 6 represent changes in the output voltage (Vout) of the conventional acceleration sensor 8 and C shown in FIG. 6, respectively.

【0016】以上の各加速度センサ8を電磁波発生槽内
に入れ、電波形式をキャリーウェーブ(CW)および80
%AM変調波,電界強度を10V/m,周波数を2〜400
MHzの任意の周波数と設定した結果、本発明が最も効
果的に外来ノイズを抑制することが明らかとなった。こ
れは、従来の加速度センサ8(図4,6)に比べ貫通コ
ンデンサ6がベース板1に位置するため、貫通コンデン
サ6から前記構成部材への途中で外来ノイズが入りにく
いことによる。
Each of the acceleration sensors 8 described above is placed in an electromagnetic wave generation tank, and the radio wave types are carry wave (CW) and 80.
% AM modulated wave, electric field strength 10V / m, frequency 2 to 400
As a result of setting an arbitrary frequency of MHz, it became clear that the present invention most effectively suppresses external noise. This is because the feedthrough capacitor 6 is located on the base plate 1 as compared with the conventional acceleration sensor 8 (FIGS. 4 and 6), and thus external noise is less likely to enter along the way from the feedthrough capacitor 6 to the constituent members.

【0017】[0017]

【発明の効果】本発明は、ベース部材とカバー部材とで
構成される空間内に、物理量検出センサ及び/又は、回
路部品から成る構成部材を収納し、前記ベース部材の外
部に前記構成部材と接続されて導出されるリードピンを
有する電子素子において、前記リードピンが固定される
前記ベース部材の箇所に前記構成部材に対する外来ノイ
ズを抑制するノイズ防止素子を一体的に固定したことを
特徴とするもので、従来に比べ取付部材,リード線等の
部品が不要であり部品数,製作工数の削減と成るばかり
でなく、構造が簡単で溶接箇所が減少する為、接続不良
などの不具合がなくなり信頼性も向上する。また、貫通
コンデンサを回路部品から成る構成部品により近い位置
に設けることが出来る為、外来ノイズを十分に抑制する
ことが出来る。
According to the present invention, a constituent member composed of a physical quantity detection sensor and / or a circuit component is housed in a space defined by a base member and a cover member, and the constituent member is provided outside the base member. In an electronic device having a lead pin connected and led out, a noise prevention device for suppressing external noise to the constituent member is integrally fixed to a position of the base member to which the lead pin is fixed. In addition to the fact that parts such as mounting members and lead wires are not required compared to the past, not only the number of parts and manufacturing man-hours are reduced, but also the structure is simple and the number of welding points is reduced. improves. Further, since the feedthrough capacitor can be provided at a position closer to the constituent component including the circuit component, external noise can be sufficiently suppressed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例の要部断面図。FIG. 1 is a sectional view of an essential part of an embodiment of the present invention.

【図2】同上実施例の要部分解断面図。FIG. 2 is an exploded cross-sectional view of an essential part of the above embodiment.

【図3】同上実施例と従来例とにおける外来ノイズによ
る影響を表す説明図。
FIG. 3 is an explanatory diagram showing an influence of external noise in the embodiment and the conventional example.

【図4】従来例を示す加速度センサの斜視図。FIG. 4 is a perspective view of an acceleration sensor showing a conventional example.

【図5】同上従来例における取付部材を表す斜視図。FIG. 5 is a perspective view showing a mounting member in the conventional example.

【図6】同上従来例における取付部材を加速度センサに
組付けた斜視図。
FIG. 6 is a perspective view in which the mounting member in the conventional example is assembled to the acceleration sensor.

【符号の説明】[Explanation of symbols]

1 ベース板(ベース部材) 2 リードピン 4 キャップカバー(カバー部材) 6 貫通コンデンサ(ノイズ防止素子) 8 加速度センサ(電子素子) 9 封着用ガラス 1a′ 孔 6a 孔 1 base plate (base member) 2 lead pin 4 cap cover (cover member) 6 feedthrough capacitor (noise prevention element) 8 acceleration sensor (electronic element) 9 sealing glass 1a 'hole 6a hole

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ベース部材とカバー部材とで構成される
空間内に、物理量検出センサ及び/又は、回路部品から
成る構成部材を収納し、前記ベース部材の外部に前記構
成部材と接続されて導出されるリードピンを有する電子
素子において、前記リードピンが固定される前記ベース
部材の箇所に前記構成部材に対する外来ノイズを抑制す
るノイズ防止素子を一体的に固定したことを特徴とする
電子素子。
1. A constituent member including a physical quantity detection sensor and / or a circuit component is housed in a space formed by a base member and a cover member, and is connected to the outside of the base member and led out. In the electronic element having the lead pin, a noise prevention element that suppresses external noise to the constituent member is integrally fixed to a location of the base member to which the lead pin is fixed.
JP9722393A 1993-03-30 1993-03-30 Electronic component Pending JPH06290993A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9722393A JPH06290993A (en) 1993-03-30 1993-03-30 Electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9722393A JPH06290993A (en) 1993-03-30 1993-03-30 Electronic component

Publications (1)

Publication Number Publication Date
JPH06290993A true JPH06290993A (en) 1994-10-18

Family

ID=14186642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9722393A Pending JPH06290993A (en) 1993-03-30 1993-03-30 Electronic component

Country Status (1)

Country Link
JP (1) JPH06290993A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5864062A (en) * 1996-11-18 1999-01-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor acceleration sensor
WO1999048173A1 (en) * 1998-03-19 1999-09-23 Continental Teves Ag & Co. Ohg Shielded housing for electronic circuits or components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5864062A (en) * 1996-11-18 1999-01-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor acceleration sensor
WO1999048173A1 (en) * 1998-03-19 1999-09-23 Continental Teves Ag & Co. Ohg Shielded housing for electronic circuits or components
US6437993B1 (en) 1998-03-19 2002-08-20 Continental Teves Ag & Co., Ohg Shielded housing for electronic circuit or components

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