JPH06287726A - Production of high strength and high electric conductivity copper alloy - Google Patents
Production of high strength and high electric conductivity copper alloyInfo
- Publication number
- JPH06287726A JPH06287726A JP5074788A JP7478893A JPH06287726A JP H06287726 A JPH06287726 A JP H06287726A JP 5074788 A JP5074788 A JP 5074788A JP 7478893 A JP7478893 A JP 7478893A JP H06287726 A JPH06287726 A JP H06287726A
- Authority
- JP
- Japan
- Prior art keywords
- strength
- heat treatment
- copper alloy
- electric conductivity
- cold working
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高強度高導電率銅合金
であるＣｕ−Ａｇ合金の製造方法に関し、特にＡｇ濃度
が１乃至１０重量％のＣｕ−Ａｇ合金の強度を向上させ
た高強度高導電率銅合金の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a Cu-Ag alloy which is a high-strength and high-conductivity copper alloy. The present invention relates to a method for producing a high-conductivity copper alloy.
【０００２】[0002]
【従来の技術】電子部品等の軽量化、薄型化及び小型化
に伴い、近年、電子部品用電線も細線化してきていると
共に、この電子部品用電線には高強度と高導電率を兼ね
備えた特性が要求されている。しかし、導電材料用銅合
金の導電率と強度とは相反するものであり、強度を高め
るべく合金成分を添加すると、導電率が低下し、純度を
高めて導電率を高めると、強度が不足するというよう
に、高強度と高導電率とを両立させることは困難であ
る。2. Description of the Related Art In recent years, along with the weight reduction, thinning and miniaturization of electronic parts and the like, electric wires for electronic parts have become thinner, and the electric wires for electronic parts have both high strength and high electrical conductivity. Characteristics are required. However, the conductivity and the strength of the copper alloy for a conductive material are contradictory to each other, and when alloy components are added to increase the strength, the conductivity decreases, and when the purity is increased to increase the conductivity, the strength is insufficient. Thus, it is difficult to achieve both high strength and high conductivity.
【０００３】而して、このような問題点を解決した高強
度高導電率銅合金として、４〜３２at％（６．５〜５２
重量％）のＡｇを含有する銅合金及びその製造方法が提
案されている（特開平4-120227号）。この銅合金は、Ｃ
ｕに４〜３２at％のＡｇを添加することにより、初晶Ｃ
ｕと、Ｃｕ及びＡｇの共晶相とを均一且つ微細に晶出さ
せたものである。そして、伸線加工を行うことにより、
初相Ｃｕと共晶相がフィラメント状に引き延ばされて、
Ｃｕ−Ａｇ合金の強度を向上させることができる。更
に、加工途中において、真空雰囲気又は不活性ガス中で
温度３００〜５５０℃、熱処理時間０．５〜４０時間の
条件で多段熱処理を施すことにより、初晶及び共晶相中
に固溶しているＡｇ及びＣｕを析出させ、強度と共に導
電率を向上させることを可能としている。As a high-strength and high-conductivity copper alloy that solves the above-mentioned problems, 4-32 at% (6.5-52 at%) is obtained.
A copper alloy containing (wt%) Ag and a method for producing the same have been proposed (JP-A-4-120227). This copper alloy is C
By adding 4 to 32 at% Ag to u, the primary crystal C
u and the eutectic phase of Cu and Ag are crystallized uniformly and finely. And by performing wire drawing,
The primary phase Cu and the eutectic phase are drawn into filaments,
The strength of the Cu-Ag alloy can be improved. Further, during processing, multi-stage heat treatment is performed in a vacuum atmosphere or an inert gas at a temperature of 300 to 550 ° C. and a heat treatment time of 0.5 to 40 hours to form a solid solution in the primary and eutectic phases. It is possible to precipitate Ag and Cu present and improve the electrical conductivity as well as the strength.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、この従
来の製造方法により高強度高導電率銅合金を製造する場
合、４at％（６．５重量％）以上のように比較的高濃度
のＡｇを添加してあるものは問題ないが、６．５重量％
以下のようなＡｇ添加量が少ないものは鋳造時のＣｕー
Ａｇ合金の共晶相の晶出量が少ないため、伸線後に多段
熱処理を行う際に、１回目の熱処理時にＣｕマトリクス
が再結晶してしまうという難点がある。この再結晶によ
り、銅合金の強度が著しく低下する。更に、添加Ａｇ量
が少ない場合、１回目の熱処理で初晶及び共晶相中に固
溶しているＡｇ及びＣｕの大部分が析出してしまうた
め、２回目以降の熱処理での析出物の量は少なく、熱処
理を行う効果が殆ど認められない。このため、６．５重
量％以下のようにＡｇ添加量が少ないＣｕ−Ａｇ合金に
おいては、熱処理によって強度を改善する効果が得られ
ず、高価なＡｇの添加及び熱処理コストが無駄であっ
た。However, when a high-strength and high-conductivity copper alloy is manufactured by this conventional manufacturing method, a relatively high concentration of Ag such as 4 at% (6.5% by weight) or more is added. There is no problem with the product, but 6.5% by weight
When the amount of added Ag is small as described below, the crystallization amount of the eutectic phase of the Cu-Ag alloy during casting is small, so when performing multi-step heat treatment after wire drawing, the Cu matrix is recrystallized during the first heat treatment. There is a drawback that it does. This recrystallization significantly reduces the strength of the copper alloy. Further, when the amount of added Ag is small, most of Ag and Cu which are solid-solved in the primary crystal and the eutectic phase are precipitated in the first heat treatment, so that precipitates in the second and subsequent heat treatments The amount is small, and the effect of heat treatment is hardly recognized. For this reason, in a Cu-Ag alloy having a small Ag addition amount of 6.5% by weight or less, the effect of improving the strength by heat treatment cannot be obtained, and expensive Ag addition and heat treatment costs are wasted.
【０００５】本発明はかかる問題点に鑑みてなされたも
のであって、比較的低濃度のＡｇを含有する銅合金にお
いても、その強度を高めることができ、強度及び導電率
の双方を改善することができる高強度高導電率銅合金の
製造方法を提供することを目的とする。The present invention has been made in view of the above problems. Even in a copper alloy containing a relatively low concentration of Ag, its strength can be increased and both strength and conductivity are improved. An object of the present invention is to provide a method for producing a high-strength and high-conductivity copper alloy that can be manufactured.
【０００６】[0006]
【課題を解決するための手段】本発明に係る高強度高導
電率銅合金の製造方法は、１乃至１０重量％のＡｇを含
有し、残部がＣｕ及び不可避的不純物からなる銅合金組
成の鋳塊に５７０乃至６８０℃で熱間加工を施し、更に
冷間加工を行い、この冷間加工の途中で、真空雰囲気又
は不活性ガス雰囲気中で、４００乃至５５０℃の温度で
０．５乃至４０時間にわたり熱処理を施すことを特徴と
する。A method for producing a high strength and high conductivity copper alloy according to the present invention is a casting of a copper alloy composition containing 1 to 10% by weight of Ag and the balance being Cu and inevitable impurities. The ingot is subjected to hot working at 570 to 680 ° C. and further cold working. During the cold working, 0.5 to 40 at a temperature of 400 to 550 ° C. in a vacuum atmosphere or an inert gas atmosphere. It is characterized in that it is subjected to heat treatment for a period of time.
【０００７】[0007]
【作用】本発明においては、１乃至１０重量％のＡｇを
Ｃｕに添加することにより初晶Ｃｕと、ＣｕとＡｇとの
共晶相を晶出させた鋳塊を熱間加工し、この熱間加工に
より、初晶及び共晶相中に固溶しているＡｇ及びＣｕを
若干析出させながら、Ｃｕマトリクスを再結晶させて粒
界を細かくする。その結果、その後工程で低温側での熱
処理を施した際に再結晶が起こらず、初晶及び共晶相中
に固溶している残りのＡｇ及びＣｕを析出させて、強度
と共に導電率をも向上させることができる。In the present invention, the ingot in which the primary crystal Cu and the eutectic phase of Cu and Ag are crystallized by adding 1 to 10% by weight of Ag to Cu is hot worked, By the inter-working, the Cu matrix is recrystallized and the grain boundaries are made finer while a small amount of Ag and Cu solid-solved in the primary crystal and the eutectic phase are precipitated. As a result, recrystallization does not occur when heat treatment is performed on the low temperature side in the subsequent step, and the remaining Ag and Cu solid-dissolved in the primary crystal and the eutectic phase are precipitated to improve strength and conductivity. Can also be improved.
【０００８】本発明においては、Ａｇの添加量は１乃至
１０重量％である。Ａｇ含有量が１重量％未満の場合で
は、共晶相の晶出量が極めて少ない。また、Ａｇ含有量
が１重量％未満の場合には、後工程のＡｇ及びＣｕを析
出させるための熱処理において、Ａｇ及びＣｕの析出量
が少なくなるため、熱処理による特性改善の効果を殆ど
得ることができない。逆に、Ａｇの添加量が１０重量％
を超えると、低温側の析出を目的とした熱処理を施した
際に再結晶が起こりにくいので、熱間加工を特に行わな
くても、強度の著しい低下は見られなくなり、高価なＡ
ｇの過剰の添加は無駄である。以上の点から、Ａｇの添
加量は１乃至１０重量％とする。なお、本願発明におい
ては、Ａｇ以外の種々の成分の存在は、不純物量程度で
あれば、合金の特性上さしつかえない。In the present invention, the addition amount of Ag is 1 to 10% by weight. When the Ag content is less than 1% by weight, the crystallization amount of the eutectic phase is extremely small. Further, when the Ag content is less than 1% by weight, the precipitation amount of Ag and Cu is reduced in the heat treatment for precipitating Ag and Cu in the subsequent step, so that the effect of improving the characteristics by the heat treatment is almost obtained. I can't. Conversely, the amount of Ag added is 10% by weight
If it exceeds, recrystallization is less likely to occur when a heat treatment for precipitation on the low temperature side is performed, so that no significant decrease in strength is observed even if hot working is not particularly performed, and expensive A
Excessive addition of g is useless. From the above points, the addition amount of Ag is set to 1 to 10% by weight. In the invention of the present application, the presence of various components other than Ag may be sufficient for the characteristics of the alloy as long as the amount of impurities is approximately.
【０００９】本願発明においては、熱間加工の温度範囲
が５７０乃至６８０℃である。５７０℃未満の温度で熱
間加工を行うと、固溶していたＡｇ及びＣｕの析出量は
多いが、この熱間熱処理時に再結晶を起こし、次の低温
側での熱処理時にＡｇ及びＣｕが殆ど析出しないため、
強度が上がらない。また、熱間加工温度が６８０℃を超
える場合には、Ａｇ及びＣｕがいずれも固溶してしま
い、Ａｇ及びＣｕの析出が全く生じないため、次の低温
側での熱処理時に再結晶が起こりやすくなり、低温側熱
処理で強度が著しく低下する。In the present invention, the hot working temperature range is 570 to 680 ° C. When hot working is performed at a temperature of less than 570 ° C., the amount of solid solution Ag and Cu precipitated is large, but recrystallization occurs during this hot heat treatment, and Ag and Cu are dissolved during the heat treatment at the next low temperature side. Because it hardly precipitates,
The strength does not increase. Further, when the hot working temperature exceeds 680 ° C., Ag and Cu both form a solid solution and no precipitation of Ag and Cu occurs, so recrystallization occurs during the heat treatment on the next low temperature side. It becomes easy, and the strength is remarkably reduced by heat treatment on the low temperature side.
【００１０】このＣｕ−Ａｇ合金は鋳造後、５７０乃至
６８０℃の高温で熱間加工した後、冷間加工を行い、４
００乃至５５０℃の低温側での熱処理によってＣｕ又は
Ａｇを析出させ、強度と導電率を上昇させているが、高
温側の熱処理（熱間加工）を省くと次の低温側熱処理時
に再結晶が起こり、強度が著しく低下してしまう。この
ため、冷間加工に先立ち５７０℃〜６８０℃の温度で熱
間加工を行い、Ａｇを若干析出させるが、この熱処理に
際しては、次の低温側での熱処理時の析出用として、全
てのＡｇを析出させることなく、固溶中に残しておくよ
うにするのが好ましい。This Cu-Ag alloy is hot-worked at a high temperature of 570 to 680 ° C. after casting and then cold-worked.
Cu or Ag is precipitated by the heat treatment at the low temperature side of 00 to 550 ° C. to increase the strength and the conductivity. However, if the heat treatment at the high temperature side (hot working) is omitted, recrystallization occurs at the next heat treatment at the low temperature side. Occurs and the strength is significantly reduced. Therefore, prior to cold working, hot working is performed at a temperature of 570 ° C. to 680 ° C. to slightly precipitate Ag. In this heat treatment, all Ag is used for precipitation during heat treatment on the next low temperature side. It is preferable to leave the solid solution in the solid solution without precipitating it.
【００１１】[0011]
【実施例】次に、本発明の実施例について、その比較例
と比較して説明する。Ｃｕに１〜１０重量％の範囲の種
々の割合でＡｇを添加し、真空又は不活性ガス雰囲気中
でＣｕ−Ａｇ合金の鋳塊を溶製した。次いで、この鋳塊
の表面を研削した後、スウェージングによる熱間加工を
５７０℃、６００℃、６８０℃の温度で夫々減面率５０
％まで行った。EXAMPLES Next, examples of the present invention will be described in comparison with comparative examples. Ag was added to Cu at various ratios in the range of 1 to 10% by weight, and ingots of Cu-Ag alloy were melted in a vacuum or an inert gas atmosphere. Then, after grinding the surface of the ingot, hot working by swaging is performed at a temperature of 570 ° C., 600 ° C., and 680 ° C. to reduce the surface reduction rate of 50.
Went up to.
【００１２】更に、減面率７０％まで冷間伸線加工を施
し、その後４００℃〜５００℃で０．５〜５時間の熱処
理を施した。更に、減面率８０％まで冷間伸線加工を施
した後、再度４００〜５００℃で０．５〜１時間の熱処
理を施したものも作製した。熱処理後、再び伸線加工を
行い、所定の径で室温での引張試験及び導電率測定を行
った。Further, cold drawing was carried out to a surface reduction rate of 70%, and then heat treatment was carried out at 400 ° C. to 500 ° C. for 0.5 to 5 hours. Furthermore, after cold-drawing was performed up to a surface reduction rate of 80%, a heat treatment was again performed at 400 to 500 ° C. for 0.5 to 1 hour, to prepare a product. After the heat treatment, wire drawing was performed again, and a tensile test and a conductivity measurement were performed at room temperature with a predetermined diameter.
【００１３】図１は、横軸にＡｇ添加量（重量％）をと
り、縦軸に引張強さ（ｋｇｆ／ｍｍ2）をとって、９
９．３％の減面率まで伸線加工した場合の、Ａｇ添加量
と、引張強さ及び導電率との関係を示すグラフ図であ
る。図１中白抜き○、□は本発明にて規定した熱間加工
を行った後、冷間伸線加工した場合、黒●、■は従来の
ように熱間加工せずに冷間伸線とその途中の熱処理のみ
を施した場合である。本発明の場合は、従来法と比較す
ると、導電率が低下することなく、強度が大きく上昇し
ている。特に、Ａｇ添加量が１〜７重量％という低Ａｇ
含有量の場合にも引張強さが極めて高い。In FIG. 1, the horizontal axis represents the amount of Ag added (% by weight), and the vertical axis represents the tensile strength (kgf / mm 2 ).
It is a graph which shows the relationship of Ag addition amount, tensile strength, and electrical conductivity at the time of wire-drawing to the area reduction rate of 9.3%. In FIG. 1, white circles ◯ and □ are black wire drawn by cold drawing after hot working specified in the present invention. And the case where only the heat treatment in the middle is performed. In the case of the present invention, as compared with the conventional method, the electrical conductivity is not lowered and the strength is greatly increased. Especially, low Ag of 1 to 7 wt% is added.
Even in the case of the content, the tensile strength is extremely high.
【００１４】また、図２はＣｕ−５重量％Ａｇ合金の伸
線加工の減面率に対する強度の変化を示したものであ
る。図中の曲線２は非熱処理材を示し、曲線３は減面率
７０％まで冷間伸線加工し、その後４５０℃で１時間の
熱処理を行った後、再度伸線加工したもの、曲線１は本
実施例にて減面率５０％まで６００℃で熱間加工（スウ
ェージング）を行い、その後冷間伸線加工し、減面率７
０％において、４５０℃で１時間の熱処理を行った後、
再度伸線加工したものを示している。非熱処理材（曲線
２）及び低温側の熱処理のみを行ったもの（曲線３）と
比較して、熱間加工及び低温側の熱処理を併せて行った
もの（曲線１）は、最終製品において、強度が高いこと
がわかる。FIG. 2 shows the change in strength with respect to the area reduction rate in the wire drawing of a Cu-5 wt% Ag alloy. Curve 2 in the figure shows a non-heat treated material, curve 3 is cold drawn to 70% reduction in area, then heat treated at 450 ° C. for 1 hour and then drawn again, curve 1 In this example, hot working (swaging) was performed at 600 ° C. to a surface reduction rate of 50%, and then cold wire drawing was performed to obtain a surface reduction rate of 7
After heat treatment at 0% at 450 ° C. for 1 hour,
The drawing is performed again. Compared with the non-heat treated material (curve 2) and the one subjected to only the heat treatment on the low temperature side (curve 3), the one subjected to the hot working and the heat treatment on the low temperature side (curve 1) is It can be seen that the strength is high.
【００１５】また、下記表１はＣｕ−３重量％Ａｇ合金
の強度と導電率に及ぼす熱間加工及び熱処理の効果を示
したものである。熱間加工及び熱処理条件により強度及
び導電率が著しく変化し、熱間加工（スウェージング）
を行ってから低温側で熱処理を行ったものが導電率を低
下させずに強度を向上させていることがわかる。Table 1 below shows the effects of hot working and heat treatment on the strength and conductivity of Cu-3 wt% Ag alloy. Strength and electrical conductivity change significantly depending on hot working and heat treatment conditions, and hot working (swaging)
It can be seen that the result of performing the heat treatment on the low temperature side after performing the heat treatment improves the strength without lowering the conductivity.
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【発明の効果】以上説明したように、本発明は鋳塊の熱
間加工（スウェージング）を５７０乃至６８０℃の温度
で行うことにより、低濃度のＡｇを添加したＣｕ合金に
おいて、導電率を低下させることなく、強度を著しく向
上させることができる。その結果、比較的安価に高強度
及び高導電性を兼ね備えた線材を得ることができる。As described above, according to the present invention, the hot working (swaging) of the ingot is performed at a temperature of 570 to 680 ° C., so that the conductivity of the Cu alloy containing a low concentration of Ag is increased. The strength can be significantly improved without lowering. As a result, it is possible to obtain a wire having high strength and high conductivity at a relatively low cost.
【図面の簡単な説明】[Brief description of drawings]
【図１】Ａｇ添加量と引張強さ及び導電率との関係を本
発明方法と従来方法との場合を比較して示すグラフ図で
ある。FIG. 1 is a graph showing the relationship between the amount of Ag added and the tensile strength and the electrical conductivity in comparison between the method of the present invention and the conventional method.
【図２】減面率に対する強度の変化を、本発明方法、従
来方法及び熱処理なしの場合と比較して示すグラフ図で
ある。FIG. 2 is a graph showing a change in strength with respect to a surface reduction rate in comparison with the method of the present invention, the conventional method, and the case without heat treatment.
Claims (1)
がＣｕ及び不可避的不純物からなる銅合金組成の鋳塊に
５７０乃至６８０℃で熱間加工を施し、更に冷間加工を
行い、この冷間加工の途中で、真空雰囲気又は不活性ガ
ス雰囲気中で、４００乃至５５０℃の温度で０．５乃至
４０時間にわたり熱処理を施すことを特徴とする高強度
高導電率銅合金の製造方法。1. An ingot of a copper alloy composition containing 1 to 10% by weight of Ag, the balance of which is Cu and inevitable impurities, is hot-worked at 570 to 680 ° C., and further cold-worked, A method for producing a high-strength and high-conductivity copper alloy, characterized in that, during this cold working, a heat treatment is performed in a vacuum atmosphere or an inert gas atmosphere at a temperature of 400 to 550 ° C. for 0.5 to 40 hours. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07478893A JP3325638B2 (en) | 1993-03-31 | 1993-03-31 | Method for producing high-strength high-conductivity copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07478893A JP3325638B2 (en) | 1993-03-31 | 1993-03-31 | Method for producing high-strength high-conductivity copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06287726A true JPH06287726A (en) | 1994-10-11 |
| JP3325638B2 JP3325638B2 (en) | 2002-09-17 |
Family
ID=13557384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07478893A Expired - Lifetime JP3325638B2 (en) | 1993-03-31 | 1993-03-31 | Method for producing high-strength high-conductivity copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3325638B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8163110B2 (en) | 2004-05-24 | 2012-04-24 | Hitachi Cable, Ltd. | Superfine copper alloy wire and method for manufacturing same |
-
1993
- 1993-03-31 JP JP07478893A patent/JP3325638B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8163110B2 (en) | 2004-05-24 | 2012-04-24 | Hitachi Cable, Ltd. | Superfine copper alloy wire and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3325638B2 (en) | 2002-09-17 |
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