JPH06283638A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To suppress the occurrence of current losses at an external lead terminal fixing section and, at the same time, to reduce the size of a power hybrid integrated circuit. CONSTITUTION:Parts of first and third copper plates 4 and 6 are firmly fixed onto a substrate 1 and, at the same time, part of the copper plate 6 and the surface of the copper plate 4 and a second copper plate 4 and the surface of the copper plate 6 are respectively arranged in crossing states in separated states on an area where a switching element is firmly fixed. Then the control electrodes of a source-side switching element 7A and a sink-side switching element 8A are respectively connected to a first and second control patterns through wires and, at the same time, a control substrate 20 on which a drive circuit for driving the switching element is mounted is connected to the first and second control patterns through wires.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates to hybrid integrated circuits,
In particular, it relates to a large current hybrid integrated circuit in which a power circuit such as an inverter circuit is mounted.

[0002]

2. Description of the Related Art Conventionally, as a hybrid integrated circuit, one based on a ceramic substrate has been widely used.
Since the circuit pattern formed on the ceramic substrate is formed of a noble metal paste, its sheet resistance is large and the thermal conductivity of the ceramic substrate is poor, making it unsuitable as a high-current type hybrid integrated circuit. In recent years, a large-current type hybrid integrated circuit has components constituting a power circuit mounted on a copper foil pattern formed on a metal substrate, for example, an aluminum or copper base substrate via an insulating resin layer. That is, the power circuit component is mounted on a metal piece (heat sink) such as copper and mounted on the board, and a plurality of external power lead terminals for connecting to an external circuit are soldered to predetermined positions on the board. It has a structure that Such hybrid integrated circuits for large currents are disclosed in JP-A-63-302530 and JP-A-64.
No. 25554 and Japanese Patent Laid-Open No. 64-5092.

[0003]

In the large-current hybrid integrated circuit of the conventional structure, as described above, the lead terminals for connecting to the external circuit are fixed on the substrate through the solder layer. There are the following defects. That is, since the solder layer itself has a large electric resistance value, a current loss is caused to increase the amount of heat generation.

When an external lead terminal is fixed on a conductive path of a current output path via a solder layer, when the surface of the solder layer is oxidized, the solder layer deteriorates with the lapse of time and the reliability is remarkably lowered. There's a problem. Dedicated lands (pads) for soldering each lead terminal to the board must be formed, which is an adverse effect when the board size is reduced, and the hybrid integrated circuit itself for high current can be downsized. Can not do it.

Also, an inverter circuit is formed on a metal substrate, and each switching means of the inverter circuit is connected in parallel as shown in FIG.
In the above hybrid integrated circuit for a high power inverter, the wire wiring connecting each switching element and the conductive path is inevitably long in pattern design. Therefore, when the wire wiring is long, there is a problem that the resistance and the inductance component of the wire wiring itself increase and the switching noise of the switching element increases to cause the switching element to malfunction.

Due to the different lengths of wire wiring,
Since the amount of current flowing through each switching element connected in parallel is different, an overcurrent exceeding the rating of the switching element may flow into the switching element having a short wire wiring, which may damage the switching element.

[0007]

[Means for Solving the Problems]
To achieve the object, in a hybrid integrated circuit according to the present invention, an inverter circuit is formed on a metal substrate via an insulating layer, and a first power supply line forming the inverter circuit is a first power line.
Copper plate, the second power supply line is the second copper plate, the output line connected to the load and supplying the current is formed of the third copper plate, and a plurality of switching elements on the source side are provided on the first copper plate. A plurality of sink-side switching elements are fixed on the third copper plate, and first and second controls for controlling each switching element on the second and third copper plates via an insulating layer. A pattern is formed, a part of the first copper plate and the third copper plate are fixed on the substrate,
Moreover, a part of the third copper plate and the surface of the first copper plate are cross-arranged so as to separate the surface of the second copper plate and the surface of the third copper plate on the region where the switching element is fixed, and The control electrode and the first control pattern, and the control electrode of the switching element on the sink side and the second control pattern are connected by wires.

In a second hybrid integrated circuit according to the present invention, an inverter circuit is formed on a metal substrate via an insulating layer, and a first power supply line forming the inverter circuit is a first power line.
Copper plate, the second power supply line is the second copper plate, the output line connected to the load and supplying the current is formed of the third copper plate, the plurality of source side switching connected in parallel on the first copper plate. A plurality of sink side switching elements connected in parallel are fixed on the third copper plate, and a first element for controlling each switching element on the second and third copper plates via an insulating layer. 1. A hybrid integrated circuit in which first and second control patterns are formed, and at least a part of the third copper plate is also used as a bent external lead terminal, wherein the first copper plate and the third copper plate are partly a substrate. A portion of the third copper plate and a surface of the first copper plate are cross-arranged so as to separate the second copper plate and the surface of the third copper plate from each other on a region fixed on the switching element and the switching element. ,
The control electrode of the switching element on the source side and the first control pattern, and the control electrode of the switching element on the sink side and the second control pattern
The control patterns are connected to each other by wires, and the control board on which the drive circuit for driving the switching elements is formed is connected to the first and second control patterns by wires.

[0009]

In the hybrid integrated circuit configured as described above, a part or all of the first and third copper plates to which the switching elements are fixed are fixed on the substrate, and the region where the switching elements are fixed is fixed. The first part of the third copper plate above
Of the switching element and the second copper plate by making the surface of the second copper plate and the surface of the second copper plate separate from and intersect the surface of the third copper plate.
The length of each wire wiring connecting the third copper plate and the third copper plate can be made uniform and shortest.

A control pattern connected to the control electrode of the switching element via an insulating layer is formed on the second and third copper plates, so that the second or third copper plate-insulating layer-control Parasitic capacitance is formed between the patterns,
In addition, since the capacitance has a structure in which it is connected between the gate and the source (or between the base and the emitter) of the switching element, noise can be removed without the need for a noise removing capacitor.

Further, by bending a part of the third copper plate to which the switching element on the sink side is fixed and also serving as an external lead terminal, it is possible to eliminate the need for soldering only the external lead terminal. As a result, current loss due to the solder layer of the lead terminal can be suppressed. Further, it is not necessary to form a dedicated land (pad) for fixing the lead terminal on the substrate, and the third copper plate is located in the hollow, so that the substrate size can be reduced.

Furthermore, since the control board arranged on the third copper plate and the control patterns formed on the second and third copper plates are connected by wire wiring, the drive circuit is miniaturized. A hybrid integrated circuit for an inverter can be provided.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The hybrid integrated circuit of the present invention will be described in detail below with reference to the embodiments shown in FIGS. FIG. 1 is a cross-sectional view of the hybrid integrated circuit of the present invention, and FIG. 2 is a plan view of the hybrid integrated circuit of the present invention.

As shown in FIGS. 1 and 2, the hybrid integrated circuit of the present invention comprises a metal substrate (1) and a conductive path (3) formed on the substrate (1) via an insulating layer (2). And a first copper plate (4) fixed to a predetermined position of the conductive path (3),
A second copper plate (5) and a third copper plate (6), switching elements (7) and (8) fixed on the first and third copper plates (4) and (6), and a case material (10) It is composed of a control board (20) for driving the switching elements (7) and (8).

As the metal substrate (1), an aluminum substrate or a copper substrate having a thickness of about 2 to 5 mm is used in consideration of heat radiation characteristics and workability. The metal substrate (1) is formed in a rectangular shape with a predetermined size, and is divided and pressed into a desired size before or after the hybrid integrated circuit is completed. When an aluminum substrate is used, the surface of the aluminum substrate may be covered with a thin film of aluminum oxide. When a copper substrate is used, the surface of the copper substrate is plated with nickel or chromium to protect the surface.

On one main surface of the metal substrate (1), a clad material made of a thermosetting insulating resin having adhesiveness such as epoxy or polyimide resin and a copper foil having a thickness of about 35 to 105 μm and a temperature of 150 to 180 ° C. 50 per square centimeter
Hot pressed at a pressure of ~ 100 Kg. The thermosetting insulating resin becomes an insulating layer (2) by hot pressing the clad material onto the substrate (1), and the copper foil on the insulating layer (2) is photo-etched to form a conductive path having a desired shape. (3) is formed.

The conductive paths (3) formed on the metal substrate (1) have first and third conductive paths (3) as shown in FIGS. 1 and 2, for example, to form the inverter circuit shown in FIG.
Only the conductive paths (3) for fixing the copper plates (4) and (6) are formed. In the present invention, a dedicated land (pad) for fixing the external lead terminal is not formed. A solder paste printed by screen printing is attached to the conductive paths (3) to form a solder layer (9). First and third copper plates (4) on the solder layer (9)
(6) is placed and the solder paste is melted by a solder reflow process to firmly connect the conductive paths (3) to the copper plates (4) and (6).

The first power supply line (for example, V _CC line) of the inverter circuit shown in FIG. 5 has a first copper plate (4), and the second power supply line (for example, ground line) has a second copper plate (5) and a current. The supply output line is formed by the third copper plate (6). First to third copper plates (4) (5)
(6) has a wall thickness of about 1 to 5 mm because it is necessary to handle a large current of about 50 to 300 A.

Switching elements (7A) (7B) (7C) on the source side of the inverter circuit are provided on the first copper plate (4).
Are fixed by the solder layer (11). In the hybrid integrated circuit of the present invention, in order to be able to handle a current of approximately 100 A or more, each switching element is connected in parallel as shown in FIG. The switching elements connected in parallel are fixed so as to be adjacent to each other in every three blocks. Those source side switching elements (7A)
Since (7B) and (7C) are commonly connected by the first power supply line, the first copper plate (4) is commonly used in this embodiment,
The switching elements (7A) (7B) (7C) were fixed, but the first copper plate (4) was divided into three, and the divided first
It is also possible to fix the switching elements respectively connected in parallel on the copper plate.

When the metal substrate (1) is a copper substrate,
When the first copper plate (4) is commonly used as an aluminum substrate, when the first copper plate (4) is commonly used, the aluminum substrate is warped because the difference in thermal expansion coefficient between aluminum and copper is large. It is preferable to divide the first copper plate (4) by the number of the switching elements because of the possibility of occurrence.

On the other hand, switching elements (8A) (8B) on the sink side of the inverter circuit are provided on the third copper plate (6).
(8C) is fixed via the solder layer (11). Similarly to the switching element on the source side, the switching element on the sink side is also fixedly attached adjacent to the third copper plate (6). The third copper plate (6) is individually divided according to the number of output lines.

The switching elements (7A) to (7C) (8A) to (8C) fixed on the first and third copper plates (4) and (6) via the solder layers (11) and (11) are power-operated. A large current type semiconductor switching element such as a transistor, a power MOSFET, or an IGBT is used. The feature of the present invention resides in that the first copper plate (4) and the third copper plate (6) to which the switching elements are fixedly attached.
Part of the third copper plate (6) and the first copper plate (4) on the fixing region where the source side switching elements (7A) to (7C) are fixed to the substrate (1). To
The second copper plate (5) and the third copper plate (6) are spaced apart from each other on the fixing region where the switching elements (8A) to (8C) on the sink side are fixed, and are crossed, and
And the first and second control patterns (21) and (22) and the switching elements (7A) to (7C) (8A) to (8C) formed on the third copper plates (5) and (6) by wires. To connect.

More specifically, the fixing region of the third copper plate (6), to which the switching elements (8A) to (8C) on the sink side are fixed, is fixed on the substrate (1) and extended. The tip portion is arranged so as to partially overlap the source side switching elements (7A) to (7C) fixed on the first copper plate (4), and the second copper plate (5) is arranged on the sink side switching element. (8A) to (8C) are separated from each other so as to overlap with (8C) and are arranged in a space.

As described above, in the third copper plate (6), the fixing region to which the switching elements (8A) to (8C) on the sink side are fixed is fixed on the substrate (1) and extends from the fixing region. The leading end portion is bent at the intermediate portion so as to overlap with and separate from the first copper plate (4). further,
The tip portion is arranged so as to overlap with a part of all the source side switching elements (7A) to (7C) fixed on the first copper plate (4). Specifically, when the emitter or source electrode of each switching element and the third copper plate (6) are connected by a wire, the length of each wire wiring is made uniform and the shortest length. The tip portion of the copper plate (6) is not overlapped with the source or emitter electrode, gate or base electrode of each switching element, but is placed so as to be line symmetrical with the approximate center line of the fixed region of the switching elements connected in parallel. ing.

A first control pattern (21) connected to the switching elements (7A) to (7C) is formed at the tip of the above-mentioned third copper plate (6). The first control pattern (21) is formed of a metal foil such as a copper foil on the third copper plate (6) via an insulating layer (23) based on epoxy resin. The first control pattern (2
1) is a switching element (7A) to (7C) on the source side
Two patterns for connecting the gate or base electrode and the source or emitter electrode are formed. That is, the first control pattern (21A) is the gate or base electrode and the first control pattern (21B).
Is connected to the source or emitter electrode. In the present embodiment, the first control patterns (21A) and (21B) are formed in a U shape so as to surround the tip of the third copper plate (6).

The second copper plate (5) connected to the switching elements (8A) to (8C) on the sink side fixed to the third copper plate (6) is superposed on the third copper plate (6). Are spaced apart from each other. Specifically, the second copper plate (5) is supported by a case member (10) described later, and when the substrate (1) and the case member (10) are integrated, the third copper plate (6) is formed. Are arranged so as to be spaced apart from each other. The second copper plate (5) is a switching element (8A) to (8) on the sink side.
C) is connected with a wire by a switching element (8
The base or gate electrodes of A) to (8C) are arranged so as to overlap with other regions where the emitter or source electrode remains.

A second control pattern (22) connected to the switching elements (8A) to (8C) is formed on the second copper plate (5). The second control pattern (22) is an insulating layer (24) based on epoxy resin.
Is formed of a metal foil such as a copper foil. The second control pattern (22) is formed with two types of patterns for connecting to the gate or base electrode and the source or emitter electrode of the switching elements (8A) to (8C) on the sink side. That is, the second control pattern (22A) is connected to the gate or base electrode, and the second control pattern (22B) is connected to the source or emitter electrode. In this embodiment, the second control pattern (22A) connected to the base or gate electrode is formed corresponding to each switching number (output number), and the second control pattern (22A) connected to the source or emitter electrode ( 22
B) is formed on the entire surface of the second copper plate (5) in the longitudinal direction so as to be commonly connected.

A first copper plate (4), a third copper plate (6), and a third copper plate (4) which are spaced apart from each other on the fixed region of the switching element.
The separation distance between the copper plate (6) and the second copper plate (5) seems to be relatively in the drawing, but actually it is about 2 to 5.
They are arranged at a distance of about mm. By the way, a part of the third copper plate (6) is also used as an external lead terminal (6A) for connecting to an external circuit. That is, the third
A part of the copper plate (6) is bent at an angle of approximately 90 ° toward the upper surface, and the bent tip part is used as an external lead terminal (6A), and the copper plate (6) serving as a heat sink and the external lead ( 6A) is also used. The external lead terminals (6A) of the third copper plate (6) are extended so as to protrude from the upper surface of the case material described later, and are bent at an angle of approximately 90 ° in the present embodiment as described above. However, the angle can be arbitrarily adjusted according to the connection state with the external circuit.

It is necessary to form a fixing pad dedicated to the external lead terminal on the substrate (1) by bending a part of the third copper plate (6) and using the tip part thereof also as the external lead terminal (6A). The size of the substrate (1) can be reduced because there is no such a problem. In addition, since the dedicated solder layer for fixing the lead terminals disappears as the fixing pad dedicated to the external lead terminals disappears, the loss of the output current due to the solder layer can be suppressed and the reliability can be improved. You can

The first copper plate (4) to which the switching element on the source side is fixed is fixed on the metal substrate (1), and the switching element on the sink side is fixed so as to intersect with the first copper plate (4). The third copper plate (6) thus formed is arranged adjacently and fixed on the substrate (1), and then the substrate (1) is attached to the case member (1).
0) is integrated. The case material (10) is made of an insulating resin such as fiberglass rain hose PET (FRPET) and is formed into a substantially frame shape by injection molding. Case material (10)
The second copper plate (5) is insert-molded at the time of injection molding, and specifically, the second copper plate (5) is formed by each bar (10A) provided in the case material (10).
Is fixedly supported. That is, since the second copper plate (5) is formed so as to be embedded in each bar (10A) during insert molding, the second copper plate (5) is firmly fixed and supported by each bar (10A). Become.

The case material (10) is fixed and integrated with an epoxy-based or silicon-based adhesive so that it is substantially aligned with the peripheral edge of the substrate (1). After the metal substrate (1) and the case material (10) are integrated, each copper plate and each switching element are interconnected by a bonding wire based on the inverter circuit shown in FIG. That is, the source side switching elements (7A) to (7C)
Base or gate electrode is connected to the first control pattern (21A) formed on the third copper plate (6), and the emitter or source electrode is connected to the first control pattern (21A).
B) and the third copper plate (6) directly about 200-500μ
Bonding connection is made with an Al wire of m diameter.

Further, the switching element (8
The base or gate electrode of A) to (8C) is the second control pattern (22A) formed on the second copper plate (5).
The emitter or source electrode is directly connected to the second control pattern (22B) and the second copper plate (5) by about 2
Bonding connection is made with an Al wire having a diameter of 00 to 500 μm.

First and second control patterns (21A)
Since (21B), (22A) and (22B) are formed on the copper plates (4) and (5) via the insulating layers (23) and (24),
Those control patterns (21A) (21B) (22A)
A predetermined parasitic capacitance is formed between (22B) and the copper plates (4) and (5), and as described above, each switching element (7A).
~ (7C) (8A) ~ (8C) base or gate electrode and first control pattern (21A) and second control pattern (22A), emitter or source electrode and first control pattern (21B) and When the control pattern (22B) of No. 2 is connected, as shown in FIG.
A parasitic capacitance is connected between the gate and the source of the S-type switching element. Therefore, the noise between the gate and the source can be removed without the need for a dedicated capacitor component for removing the noise, and the reliability of the switching element can be improved.

The sink side and source side switching elements (7A) to (7C) (8A) to (8) connected in parallel.
C) base or gate electrode, emitter or source electrode, and first and second control patterns (21A) (21A)
B) (22A) (22B) and the second and third copper plates (5) and (6) by wire bonding connection, the second and third copper plates (5) and (6) and the switching element (7)
The separation distance from A) to (7C) (8A) to (8C) is about 2
Approximately about 5 mm, and the second and third copper plates (5) and (6) are arranged so as to overlap with each other, so that the wire at the time of bonding has the shortest length,
In addition, the length of each wire wiring can be made uniform.
On the other hand, the stress at the time of bonding is also the second copper plate (5).
Is fixedly supported by the bar (10A) of the case material (10), so that there is no problem even if an ultrasonic bonding device is used.

By the way, the substrate (1) and the case material (10)
Are integrated and each switching element is connected to each copper plate, and then the control board (20) is connected to the first and second control patterns (21) and (22) by wires. A base substrate made of epoxy, ceramics, metal or the like is used as the control substrate (20), and a desired pattern is formed on one main surface or both main surfaces of the control foil by a copper foil. In this embodiment, the switching elements (7A) to (7C) on the source and sink sides are provided on the control board (20).
Driving circuits (25A) to (25C) (26A) to (26C) configured by a plurality of circuit elements such as transistors and chip resistors necessary for driving (8A) to (8C)
Are formed, and their drive circuits (25A) to (25C) (2
6A) to (26C) are dedicated pads (27A) to (27) for connecting to the gate electrodes of the switching elements.
C) (28A) to (28C) and dedicated pads (29A) to (29C) (30A) for connecting to the source electrode
~ (30C) are formed. In addition, the control board (2
Various protective circuits such as a temperature compensating circuit and a current detecting circuit are formed on 0). Further, a connector (31) for interconnection with an external circuit is fixedly connected to a predetermined position on the control board (20).

The control board (20) described above is a case member (1
0) integrated with the bar (10B),
The gate electrode pads (27A) to (27C) (28A) to (28C) formed on the control substrate (20) and the first
And the second control patterns (21A) and (22A) are the source electrode pads (29A) to (29C) (30A).
~ (30C) and the first and second control patterns (21
B) and (22B) are connected by an Al wire.

After interconnecting the switching elements, the first to third copper plates and the control board with wires, the case material (1
Silicon gel (40) and epoxy resin (50) are sequentially filled in the space area surrounded by 0) to protect each component and element necessary for the inverter circuit. Control board (2
0) and the first and second control patterns (21) (22)
Since the wire for connecting the wires is a relatively thick wire of about 200 to 500 μm and there is a margin at the time of wire wiring, the wire wire is disconnected due to expansion stress even when the silicon gel (40) expands. There is no such problem.

In the present embodiment, the output terminal of the inverter circuit is formed so as to extend upward, but the first and second copper plates (4) and (5) for the V _CC line and the ground line are formed.
Is designed to extend along one side of the substrate (1) and be bent and screwed.

[0039]

As described in detail above, according to the present invention,
In particular, a part or all of the first and third copper plates to which a plurality of switching elements connected in parallel are fixed are fixed on the substrate, and a part of the third copper plate is formed on the region where the switching elements are fixed. By making the first copper plate surface and the second copper plate separate and intersect the third copper plate surface, respectively, the length of each wire wiring connecting the switching element and the second and third copper plates can be made uniform. You can connect in the shortest time. As a result, it is possible to provide a highly reliable hybrid integrated circuit in which the resistance and the inductance component of the wire wiring can be minimized and the switching element does not malfunction due to switching noise. Moreover, since the wire wiring is uniform in each switching element, a stable current can be passed.

Further, according to the present invention, the control pattern connected to the control electrode of the switching element via the insulating layer is formed on the second and third copper plates, whereby the second or third copper plate is formed. Since a parasitic capacitance is formed between the copper plate-insulating layer-control pattern and the capacitance is connected between the gate-source (or base-emitter) of the switching element, the parasitic capacitance eliminates noise. It can be performed. As a result, it is not necessary to mount a capacitor component dedicated to noise removal on the substrate, so that it is possible to provide a hybrid integrated circuit that is low in cost and high in reliability.

Further, according to the present invention, by bending a part of the third copper plate to which the switching element on the sink side is fixed and also serving as the external lead terminal, it is not necessary to fix the solder only to the external lead terminal. be able to. As a result, current loss due to the solder layer of the lead terminal can be suppressed, and the amount of heat generated can be reduced. Further, according to the present invention, it is not necessary to form a dedicated land (pad) for fixing the lead terminal on the substrate, and the substrate size can be reduced because the third copper plate is hollow. it can.

Further, according to the present invention, since the control substrate arranged on the third copper plate and the control patterns formed on the second and third copper plates are connected by the wire wiring, the drive circuit is formed. It is possible to provide a hybrid integrated circuit for a miniaturized inverter having a.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a hybrid integrated circuit of the present invention.

FIG. 2 is a plan view of the hybrid integrated circuit of the present invention.

FIG. 3 is an equivalent circuit diagram of a switching element.

FIG. 4 is a plan view of a control board.

FIG. 5 is a circuit diagram showing an inverter circuit.

[Explanation of symbols]

 (1) Metal substrate (2) Insulating layer (3) Conductive path (4) First copper plate (5) Second copper plate (6) Third copper plate (7) (8) Switching element (9) (11) Solder layer (10) Case material (10A) (10B) bar (20) Control board (21) (22) Control pattern

Claims (2)

[Claims] 1. An inverter circuit is formed on a metal substrate via an insulating layer, a first power supply line forming the inverter circuit is a first copper plate, and a second power supply line is a second copper plate.
The output line connected to the load and supplying current is formed of a third copper plate, and a plurality of source side switching elements are provided on the first copper plate, and a plurality of sink side devices are provided on the third copper plate. The switching elements are fixed, and first and second control patterns for controlling each switching element are formed on the second and third copper plates via an insulating layer, and the first and second control patterns are formed. A copper plate and a part of the third copper plate are fixed on the substrate, and a part of the third copper plate on the region where the switching element is fixed, the first copper plate surface and the second copper plate. The surfaces of the third copper plates are cross-arranged so as to be spaced apart from each other, the control electrode of the switching element on the source side and the first control pattern, the control electrode of the switching element on the sink side, and the second control pattern. Hybrid integrated circuit, characterized in that the respectively connected by wires. 2. An inverter circuit is formed on a metal substrate via an insulating layer, a first power supply line forming the inverter circuit is a first copper plate, and a second power supply line is a second copper plate.
An output line connected to a load and supplying a current is formed of a third copper plate, and a plurality of source side switching elements connected in parallel on the first copper plate, and a plurality of source side switching elements connected in parallel on the third copper plate. A plurality of connected switching elements on the sink side are fixed, and first and second control patterns for controlling each switching element are formed on the second and third copper plates via an insulating layer. A hybrid integrated circuit in which at least a part of the third copper plate is also used as a bent external lead terminal, wherein the first copper plate and a part of the third copper plate are fixed on the substrate, and A portion of the third copper plate and a surface of the first copper plate are cross-arranged so as to separate the second copper plate and the surface of the third copper plate on the region where the switching element is fixed, and the source side Sui A control board on which a drive circuit for driving the switching element is formed while connecting the control electrode of the ching element and the first control pattern, and the control electrode of the switching element on the sink side and the second control pattern, respectively. And the first and second control patterns are connected by a wire.