JPH06283572A - Mechanism for correcting parallelism - Google Patents

Abstract

PURPOSE:To provide mechanism for correcting parallelism capable of correcting parallelism of a pressurizing tool and a mounting base in a short time. CONSTITUTION:In the region containing a movable part like an universal coupling mechanism 5 of a mechanism for correcting of parallelism, a low melting point material holding part 9 is arranged, the low melting point material holding part 9 is filled with low melting point material, which is fused by heating, and a pressurizing tool 7 is brought into contact with a mounting surface 17 at the time of fusing, thereby performing correction of parallelism. After correction parallelism is finished, the low melting point material is again hardened, and correction of parallelism is completed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parallel extension mechanism for pressing means such as an inner lead bonding apparatus, an outer lead bonding apparatus, etc. and a mounting table.

[0002]

2. Description of the Related Art A conventional parallel extension mechanism will be described by exemplifying an inner lead bonding apparatus. The inner lead bonding apparatus will be described. As shown in the perspective view of FIG. 3, the semiconductor element 2 mounted on the semiconductor element mounting table 32 is shown.
0 is positioned at a predetermined position by a positioning guide (not shown). On the other hand, the film substrate 21 guided by a tape rail (not shown) and conveyed by the feeder stops at a position where the device hole 30 reaches the semiconductor element 20, and a large number of electrodes 31 provided on the semiconductor element 20 and each lead. 22 and 22, respectively. Next, the heated bonding tool 18 is lowered to pressurize and heat each lead 22 to connect with each electrode 31. At this time, if the parallel state between the semiconductor element mounting surface 29 of the semiconductor element mounting base 32 and the bonding surface 28 of the bonding tool 18 is not ensured, a large number of electrodes 31 of the semiconductor element 20 mounted on the semiconductor element mounting surface 29, A uniform connection with the leads 22 arranged on the film substrate 21 is impossible. For this reason, the bonding tool holder 33 for fixing the bonding tool 18 includes a parallel adjustment screw 34 capable of freely tilting the bonding tool holder 33 and an X stage movable in the X direction horizontal to the tool holding portion 35 of the bonding apparatus. 36 and a Y stage 37 movable in the horizontal Y direction orthogonal to the X direction
Are adjustable with the respective adjusting screws 38, and are fixed with the fixing screws 39.

By the parallel adjustment screw 34, the bonding surface 2
8 and the semiconductor element mounting surface 29 are adjusted in parallel, and then the bonding surface 28 of the bonding tool 18 and the semiconductor element mounting surface 2 are adjusted by using the adjusting screws 38 in the X and Y directions.
It was paralleled with 9 and fixed with a fixing screw 39.

[0004]

According to the above-mentioned prior art, since the tool is parallelized due to the delicate movement of the adjusting screw, it is difficult to parallelize the tool, and skilled work and a great amount of adjustment time are required. In some cases, it was impossible to perform good bonding due to the failure of parallelization.

The present invention has been made to solve the above problems, and an object thereof is to provide a paralleling mechanism for facilitating parallelizing of a tool.

[0006]

In the parallel squeezing mechanism of the present invention, a universal joint is arranged at a connecting portion for connecting a pressure transmitting portion and a pressure body, and a low melting point material is included in a range including the universal joint portion. The holding portion and the heat generating portion are arranged, and the low melting point material holding portion in the range including the universal joint portion is filled with the low melting point material.

Alternatively, the movable table is provided with a movable mechanism, and the low melting point material holding portion and the heat generating portion are arranged in a range including the movable mechanism, and the periphery of the movable mechanism is made of the low melting point material in the low melting point material holding portion. Fill.

Next, the low-melting-point material in the low-melting-point material holding section is brought into a molten state or a softened state by heating the heating section, and the processing surface of the pressure tool connected to the pressure body is brought into contact with the mounting table to apply pressure. As a result, the pressurizing surface and the mounting surface of the mounting table are parallelized by the copying action of the universal joint.

Alternatively, the low-melting-point material in the low-melting-point material holding portion is melted or softened by heating the heat-generating portion,
The working surface of the pressure tool connected to the pressurizing body and the mounting table are brought into contact with each other to apply pressure, whereby the descending surface and the mounting surface of the mounting table are parallelized by the copying action of the movable mechanism of the mounting table.

By stopping the heat generation of the heat generating portion after the parallel alignment is completed, the low melting point material is solidified again and the universal joint portion or the movable mechanism is fixed, and the parallel state between the pressing surface and the mounting surface can be maintained. It will be possible.

[0011]

According to the parallel squeezing mechanism of the present invention, the low melting point material holding portion, the heat generating portion, and the range including the universal joint portion for connecting the pressure transmitting portion and the pressure body or the range including the movable mechanism of the mounting table are provided. Are arranged, and the low melting point material is filled in the low melting point material holding portion in the range including the universal joint portion or the range including the movable mechanism portion of the mounting table.

The low melting point material in the low melting point material holding portion is brought into a molten state or a softened state by heating the heat generating portion.

When the low-melting-point material is melted or softened, the working surface of the pressure tool connected to the pressure body and the mounting surface of the mounting table are brought into contact with each other to pressurize them, thereby imitating the copying action of the universal joint portion or the movable mechanism portion. Thus, the processed surface of the pressurizing body and the mounting surface of the mounting table are parallel to each other.

After that, the low melting point material in the low melting point material holding portion arranged in the range including the universal joint portion or the movable mechanism portion is cooled and solidified by stopping the heating of the heat generating portion, and the universal joint portion or the movable mechanism portion is removed. Fix it. With the above, the parallelization of the processed surface of the pressing body and the mounting surface of the mounting table is completed.

[0015]

(Embodiment 1) Structural sectional view for explaining an embodiment of the present invention. In FIG. 1, a pressure transmitting portion 1 and a pressure body 2 are provided.
Is a spherical body portion 3 at the tip of the pressure transmitting portion 1 and a pressure body 2
They are connected by a ball seat portion 4 which includes a ball portion 3 arranged at the tip end, and the ball portion 3 and the ball seat portion 4 constitute a universal joint mechanism 5, which connects the pressure transmitting portion 1 and the pressure body 2. ing. The other end of the pressure transmission unit 1 is connected to a vertical movement mechanism and a pressure mechanism (not shown).

At the other end of the pressure body 2, a pressure tool attachment portion 6 is provided.
And the pressurizing tool 7 is connected.

A low-melting material holding portion 9 is arranged on the side surface portion 8 of the pressurizing body 2, and a band-shaped heating element 11 is arranged on the inner wall 10 of the low-melting material holding portion 9 to enable heating to hold the low-melting material. A low melting point material 12 was filled in the portion 9.

A screw 13 and a sealing body 14 are arranged at a connecting portion between the low-melting-point material holding portion 9 and the side surface portion 8 of the pressurizing body 2 to prevent the low-melting-point material 12 from flowing out. did.
The pressing tool 7 has a pressing surface 15, and the pressing surface 15 is arranged to face the mounting surface 17 of the mounting table 16. The structure as described above will be described in detail below.

When the placing surface 17 and the pressing surface 15 are parallelly arranged, first, the low-melting-point material 12 filled in the low-melting-point material holding portion 9 is heated by the band-shaped heat generating element 11 to be in a molten state or Let it soften.

The low melting point material 12 is a thermoplastic resin this time,
We used a hot-melt resin made from petroleum wax, natural wax, etc., and selected a hot-melt resin with a softening point of about 120 degrees Celsius, but the low temperature of alloys such as tin, lead, bismuth, and indium. The same effect can be obtained by using a melting point metal.

In order to heat the low melting point material 12 with the strip heating element 11 to bring it into a molten state, the heating temperature of the strip heating element needs to be about 160 to 220 degrees Celsius.

When the low-melting-point material 12 is in a molten state, it is connected by a sphere portion 3 having the tip of the pressure transmitting portion and a sphere seat portion 4 containing the sphere portion 3 arranged at the tip of the pressure body 2 to form a sphere. Since the portion 3 and the ball seat portion 4 constitute the universal joint mechanism 5, when the force is applied to the pressure body 2, it becomes very easy to move.

When the low melting point material 12 is in a molten state or a softened state, the pressure transmitting section 1, the universal joint mechanism 5 and the pressure body 2 are moved by an up / down moving mechanism and a pressure mechanism (not shown).
Then, the pressing surface 15 of the pressing tool 7 connected to the pressing body 2 is brought into contact with the mounting surface 17 of the mounting table 16, and the pressing tool 7 slightly presses the pressing tool 7. Pressurized surface 1
5 contacts the mounting surface 17 of the mounting table 16 and then the pressing tool 7
Even if the pressurizing surface 15 is slightly inclined, the pressurizing surface 15 can obtain a uniform contact surface with the mounting surface 17 by following the mounting surface 17 by the movement of the universal joint mechanism 5. The pressing surface 15 of the pressing tool 7 can be parallel to 17.

The mounting surface 17 of the mounting table 16 and the pressing tool 7 when the low melting point material 12 is in a molten state or a softened state.
After being laid parallel to the pressing surface 15 of the low melting point material 12, the pressing tool 7 is kept in the pressed state and the heat generation of the band-shaped heating element 11 arranged on the inner wall 10 of the low melting point material holding portion 9 is stopped to lower the low melting point material 12 It is possible to fix the universal joint mechanism 5 by the low-melting point material 12 by lowering the temperature and returning the low-melting point material 12 from the molten state or the softened state to the solidified state again.

When the parallel alignment mechanism having the above structure is adopted in the inner lead bonding apparatus, it is possible to finish the parallel alignment, which takes a very long time by the conventional parallel alignment mechanism, in a short time. In addition, if the pressure tool is heated with pressure, such as a bonding tool for inner lead bonding, a low-melting-point material with a cooling mechanism provided by a cooling medium is added to the pressure tool or the pressure tool mounting portion. Since it is clear that softening of the low melting point material can be prevented by blocking the heat transfer from the pressing tool to the holding portion, it is included in the present invention.

(Embodiment 2) As a second embodiment of this embodiment, an example in which a paralleling mechanism is applied to the semiconductor element mounting base of the inner lead bonding apparatus will be described with reference to the sectional view of FIG.

The bonding tool 18 connected to a vertical pressing mechanism (not shown) connects the semiconductor element 20 arranged on the semiconductor element mounting base 19 and each lead 22 provided on the film substrate 21. The semiconductor element mounting base 19 is placed on the concave spherical body 24 on the semiconductor element mounting base holding portion 23,
The contact portion 25 of the semiconductor element mounting base 19 with the semiconductor element mounting base holding portion 23 is a convex spherical body 26. As a result, the semiconductor element mounting base 19 can be moved by applying a slight force.

A low melting point material holding portion 9 is arranged around the semiconductor element mounting base holding portion 23 and fixed to the semiconductor element mounting base holding portion 23. A rod-shaped heating element 27 was embedded in the semiconductor element mounting base holding portion 23 so that heating was possible.

In the bonding apparatus having the above mechanism, the bonding surface 28 of the bonding tool 18 is
In parallel with the semiconductor element mounting surface 29 of the semiconductor element mounting base 19, first, the rod-shaped heating element 27 embedded in the semiconductor element mounting base holding portion 23 is heated, whereby the low melting point material 12 To a molten state or a softened state.

Next, the bonding tool 18 is lowered by an up-and-down mechanism (not shown) to contact the semiconductor element mounting surface 29 and apply a slight pressure to the semiconductor element mounting surface 29 of the semiconductor element mounting base 19. The bonding surface 28 of the bonding tool 18 can be made parallel.

The semiconductor element mounting base 19 which is kept parallel to the bonding surface 28 of the bonding tool 18 in a contact pressure state stops the heat generation of the rod-shaped heating element 27 embedded in the semiconductor element mounting base holder 23. As the temperature lowers and the low melting point material 12 returns to the solidified state, the convex spherical body 26 can be maintained and fixed because the low melting point material 12 holds it.

On the semiconductor element mounting surface 29 on the semiconductor element mounting base 19 which has completed parallel alignment as described above, the semiconductor element 2
0 is positioned and placed at a predetermined position. On the other hand, the film substrate 21 guided by a tape rail (not shown) and conveyed by the feeding device stops at the position where the device hole 30 reaches the semiconductor element 20, and a large number of electrodes 31 and the leads provided on the semiconductor element 20. 22 and 22, respectively.

Next, the bonding tool 18 connected to a vertical pressing mechanism (not shown) connects the semiconductor element 20 arranged on the semiconductor element mounting base 19 and each lead 22 provided on the film substrate 21.

At this time, in the molten or softened state of the low melting point material 12, the semiconductor element mounting surface 29 of the semiconductor element mounting base 19 and the bonding surface 2 of the bonding tool 18.
Since the parallel state with 8 is secured, a large number of electrodes 31 of the semiconductor element 20 mounted on the semiconductor element mounting surface 29 are provided.
And the leads 22 arranged on the film substrate 21 can be connected uniformly over the whole area.

As a method for further improving the parallelization accuracy, the semiconductor element 20 is mounted on the semiconductor element mounting surface 29.
Is mounted, the electrode 31 and the lead 22 are aligned, and the bonding surface 28 of the bonding tool 18 is connected to the lead 22.
By cooling the low-melting-point material 12 in the state of being contact-pressed on the upper surface, parallel spreading in a state closer to the actual connection state is possible.

[0036]

EFFECTS OF THE INVENTION The present invention has a pressure transmitting portion and a connecting portion for a pressure body, is arranged to face the processing surface of a pressure tool connected to the pressure body, and mounts a pressed body. In the parallel squeezing mechanism having a mounting table, a low-melting-point material holding portion and a heat generating portion are arranged in a connecting portion range that connects the pressure transmitting portion and the pressing body, and the periphery of the connecting portion has the low temperature. According to the parallel squeezing mechanism characterized by being filled with the low melting point material in the melting point material holding part, the universal joint part has the low melting point material holding part,
A heat generating portion is disposed, and the low melting point material holding portion in the range including the universal joint portion or the movable mechanism portion is filled with the low melting point material.

Furthermore, the low-melting-point material in the low-melting-point material holding portion is melted or softened by heating the heat-generating portion,
When the pressing surface and the mounting table are brought into contact with each other and pressed, the pressing surface and the mounting surface of the mounting table are parallelized by the copying action of the universal joint portion.

By stopping the heat generation of the heat generating portion after the completion of parallelizing, it becomes possible to solidify the low melting point material again and fix the universal joint portion or the movable mechanism to maintain the parallel state between the pressing surface and the mounting surface. .

Further, a movable mechanism is provided to the mounting table, a low melting point material holding portion and a heat generating portion are arranged in a range including the movable mechanism, and the periphery of the movable mechanism is filled with the low melting point material in the low melting point material holding portion. According to the parallel squeezing mechanism characterized in that the low melting point material holding portion and the heat generating portion are arranged in the range including the movable portion and the low melting point material holding portion is filled with the low melting point material, When the material is melted or softened, the pressure surface and the mounting surface of the mounting table are brought into contact with each other, and further pressure is applied to make the pressure surface and the mounting surface parallel to each other by the copying action of the movable part, and heat is generated after the parallelization is completed. By stopping the heat generation of the part, the low melting point material is solidified again, the movable mechanism is fixed, and the parallel state between the pressing surface and the mounting surface can be maintained.

According to the parallel alignment mechanism of the present invention as described above, it is possible to significantly reduce the adjustment time as compared with the conventional parallel alignment work of the tool due to the subtle movement of the adjustment screw. It is possible to avoid even a defective bonding.

Further, it becomes possible to change the skilled work required for parallel setting, which has been conventionally required, to an easy work by the parallel setting mechanism of the present invention. At the same time, it is possible to greatly improve the accuracy of parallelizing the pressing surface and the mounting table as compared with the conventional one.

[Brief description of drawings]

FIG. 1 is a structural sectional view for explaining a first embodiment of the present invention.

FIG. 2 is a sectional view illustrating a second embodiment of the present invention.

FIG. 3 is a perspective view for explaining a conventional parallel extension mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pressurization transmission part 2 Pressurizing body 3 Sphere part 4 Ball seat part 5 Universal joint mechanism 6 Pressurizing tool attachment part 7 Pressurizing tool 8 Side part 9 Low melting point material holding part 10 Inner wall 11 Belt heating element 12 Low melting point material 13 Screws 14 Sealing body 15 Pressurizing surface 16 Mounting table 17 Mounting surface 18 Bonding tool 19 Semiconductor element mounting table 20 Semiconductor element 21 Film substrate 22 Lead 23 Semiconductor element mounting table holding part 24 Concave spherical body 25 Contact part 26 Convex spherical body 27 Rod-shaped heating element 28 Bonding surface 29 Semiconductor element mounting surface 30 Device hole 31 Electrode

Claims (2)

[Claims] 1. A pressure transmitting portion and a connecting portion for connecting a pressure body, which is arranged to face a processing surface of a pressure tool connected to the pressure body and on which a pressed body is placed. In the parallel squeezing mechanism having a mounting table, a low-melting-point material holding portion and a heat generating portion are arranged in a connecting portion range that connects the pressure transmitting portion and the pressing body, and the periphery of the connecting portion has the low temperature. A parallel squeezing mechanism characterized by being filled with a low melting point material in a melting point material holding portion. 2. Arranged to face the processing surface of the pressure tool,
And, in the parallel feeding mechanism having a mounting table for mounting the pressed body, a movable mechanism is provided to the mounting table, and the low melting point material holding portion and the heat generating portion are arranged in a range including the movable mechanism. The parallel extension mechanism is characterized in that the periphery of the movable mechanism is filled with the low melting point material in the low melting point material holding portion.