JPH0628270B2 - Foil sticking device - Google Patents

Foil sticking device

Info

Publication number
JPH0628270B2
JPH0628270B2 JP62287730A JP28773087A JPH0628270B2 JP H0628270 B2 JPH0628270 B2 JP H0628270B2 JP 62287730 A JP62287730 A JP 62287730A JP 28773087 A JP28773087 A JP 28773087A JP H0628270 B2 JPH0628270 B2 JP H0628270B2
Authority
JP
Japan
Prior art keywords
foil
lead frame
cut
cutter
notch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62287730A
Other languages
Japanese (ja)
Other versions
JPS63232340A (en
Inventor
英昭 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP62287730A priority Critical patent/JPH0628270B2/en
Publication of JPS63232340A publication Critical patent/JPS63232340A/en
Publication of JPH0628270B2 publication Critical patent/JPH0628270B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Nonmetal Cutting Devices (AREA)

Abstract

PURPOSE:To adhere a foil on a lead frame stably by a method wherein the edge part of the tip of a cutter is pressed against the upper surface of the foil and a notch is formed in the lead frame through the foil by the edge part to fix the cut end of the foil to the lead frame by pressure. CONSTITUTION:When the end of a belt-shape foil 2 is cut and the cut foil 2 is bonded to a lead frame 24, a notch is formed in the lead frame 24 by the edge part 35 of a cutter 13 through the foil 2 at the time of cutting the foil 2 to fix the cut end of the foil 2 to the lead frame 24 by pressure. When the notch is formed, the cut end of the foil 2 is pressed against the lead frame 24 and the foil 2 is made to bite into the notch. With this constitution, even if the foil on the lead frame is not sufficiently melted, the foil does not peel off and a stable adherence can be realized.

Description

【発明の詳細な説明】 (イ) 産業上の利用分野 本発明は、箔送り装置により送られた帯状体の箔の端部
を切断して、切断された箔をリードフレーム上に貼り付
けるようにした箔貼付装置に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention is designed to cut an end portion of a foil of a band-shaped body fed by a foil feeding device and attach the cut foil onto a lead frame. The present invention relates to a foil sticking device.

(ロ) 従来の技術 一般に半導体の組立装置として、リードフレーム上に金
箔又は半田箔を載置し、その上に半導体ペレットを載せ
る場合、前記リードフレームの下方から加熱装置によつ
て予め加熱しておき、前記箔を所定長さに切断したもの
を吸着手段、例えば真空チヤックにて吸着後前記リード
フレーム上に載置し、前記箔が溶解した状態において、
半導体ペレットを搭載すると、該ペレットは前記リード
フレームに一体化され、前記加熱手段から前記リードフ
レームを移動させて冷却すると、前記ペレットはリード
フレームに固着される。
(B) Conventional technology Generally, as a semiconductor assembly device, a gold foil or a solder foil is placed on a lead frame, and when semiconductor pellets are placed on the gold foil or solder foil, it is preheated from below the lead frame by a heating device. Place the foil cut into a predetermined length by suction means, for example, placed on the lead frame after suction with a vacuum chuck, in a state where the foil is melted,
When a semiconductor pellet is mounted, the pellet is integrated with the lead frame, and when the lead frame is moved from the heating means and cooled, the pellet is fixed to the lead frame.

その一例が株式会社新川製のダイボンダー、HIGH−
SPEED FULL AUTOMATIC DIE
BONDERモデルSPM−FA−TC−5に添付され
ている取扱説明書の図面(DOO 9100)に記載さ
れた前述の構成が挙げられる。
An example of this is the die bonder made by Shinkawa Co., Ltd., HIGH-.
SPEED FULL AUTOMATIC DIE
The above-mentioned structure described in the drawing (DOO 9100) of the instruction manual attached to the BONDER model SPM-FA-TC-5 can be mentioned.

この従来技術によれば、先ず吸着手段としての真空チャ
ックを要し、然もリードフレーム上に前記真空チャック
により吸着された箔を置くのみであるため、箔の位置が
ずれたり、また箔が溶融しない場合にはフレーム上に箔
が接着せずに剥がれてしまうという欠点があった。
According to this conventional technique, a vacuum chuck is first required as a suction means, and since only the foil sucked by the vacuum chuck is placed on the lead frame, the position of the foil is displaced or the foil is melted. If not, there was a drawback that the foil would peel off without adhering to the frame.

また、実開昭54−157561号公報には箔に相当す
るものとしての半田線材をリードフレームに相当するも
のとしての金属基体に圧着体により圧着した状態で、該
半田線材をカッターで切断する技術が開示されている。
Further, Japanese Utility Model Laid-Open No. 54-157561 discloses a technique in which a solder wire material equivalent to a foil is crimped to a metal base material equivalent to a lead frame by a pressure-bonding body, and the solder wire material is cut by a cutter. Is disclosed.

しかし、この場合少なくとも圧着体及びカッターを要
し、装置構造が複雑となるという欠点があった。
However, in this case, at least a crimping body and a cutter are required, and there is a drawback that the device structure becomes complicated.

(ハ)発明が解決しようとする課題 従って、本発明は簡易な装置構造で、然もリードフレー
ムへの箔の接着が確実に行なえるようにすることを目的
とする。
(C) Problem to be Solved by the Invention Therefore, an object of the present invention is to make it possible to surely adhere the foil to the lead frame with a simple device structure.

(ニ)課題を解決するための手段 そこで、本発明は箔送り装置により送られた帯状体の箔
の端部を切断して、切断された箔を加熱されているリー
ドフレーム上に貼り付けるようにした箔貼付装置に於い
て、前記リードフレーム上に所定長さ送り出された箔の
切断側端部側に該箔を通して該リードフレームにノッチ
を形成するようにその下端部を鋭角なエッジ部とした上
下動可能なカッターと、往動時にはスプールからの箔を
挟持して前記リードフレーム上に送り出し、復動時には
下動した前記カッターのエッジ部によりリードフレーム
に形成されたノッチに食い込まされた状態の箔を挟持し
たまま引張り前記切断側端部で切断する往復動可能なチ
ャックとを設けたものである。
(D) Means for Solving the Problems Therefore, according to the present invention, the end of the foil of the strip-shaped body fed by the foil feeding device is cut, and the cut foil is pasted on the heated lead frame. In the foil sticking device described above, the lower end portion is formed into an acute-angled edge portion so as to form a notch in the lead frame by passing the foil through the cut side end portion side of the foil sent out on the lead frame by a predetermined length. A cutter that can move up and down, and a foil from the spool is sandwiched when it is forwarded and sent out onto the lead frame, and when it is returned, it is caught in the notch formed in the lead frame by the edge part of the cutter that moved down And a reciprocating chuck that pulls the foil while holding it and cuts at the end on the cutting side.

(ホ)作用 以上の構成から、箔はチャックに挟持された状態で、該
チャックの往動によりスプールからリードフレーム上に
所定長さ送り出される。次に、該所定長さ送り出された
箔の切断側端部に該箔を通して該リードフレームにノッ
チを形成するように下端部が鋭角なエッジ部を有するカ
ッターが下動し、該箔を通して前記リードフレームにノ
ッチを形成しながら該ノッチに箔を食い込ませた状態と
する。そして、前記チャックが箔を挟持したまま復動し
て引張ることにより、該箔は前記切断側端部で切断され
リードフレーム上に貼り付けられる。
(E) Action With the above configuration, the foil is fed from the spool to the lead frame for a predetermined length by the forward movement of the chuck while being sandwiched by the chuck. Next, a cutter having a sharp edge at the lower end moves downward so as to form a notch in the lead frame by passing the foil through the cut side end of the foil fed out by the predetermined length, and the lead is passed through the foil. While forming a notch in the frame, the notch is in a state of being bitten by the foil. Then, the chuck moves the foil while sandwiching the foil and pulls the foil, so that the foil is cut at the end portion on the cutting side and attached to the lead frame.

(ヘ) 実施例 図面に従つて本発明を説明すると、第1図は箔送り装置
及び箔貼付装置の正面図、第2図(イ)〜(ニ)は箔送り装置
の動作説明図、第3図(イ)(ニ)は箔貼付装置に用いるカッ
ターの一例を示す側面図及び平面図、第4図はカッター
の動作時の説明図を示す。
(F) Embodiments The present invention will be described with reference to the drawings. FIG. 1 is a front view of a foil feeding device and a foil sticking device, and FIGS. 2 (a) to (d) are operation explanatory diagrams of the foil feeding device. 3 (a) and 3 (d) are side views and plan views showing an example of a cutter used in the foil sticking apparatus, and FIG. 4 is an explanatory view when the cutter is in operation.

図面において、(1)は長尺の帯状体になした箔(2)が巻回
された箔スプール、(3)はガイドローラ、(4)(5)は箔エ
ンド検出部を構成する発光素子及び受光素子、(6)(6)は
スリット(7)(7)を有する光ガイド板、(8)(8)は第1チャ
ック、(9)(9)は前記第1のチャックを図面の左右方向に
往復運動を案内する第1のガイド部、(10)は第2のチャ
ック、(11)(11)は該第2のチヤックの上下運動を案内す
る第2のガイド部、(12)(12)は前記箔の右方向への引出
しを案内する固定箔ガイド、(13)はカツター、(14)(14)
は前記カッターの上下動を案内する第3のガイド部、(1
5)(16)(17)(18)は各々前記第1チヤックの上下移動及び
左右往復移動、第2のチヤックの上下移動、カツターの
上下移動のための第1、第2、第3及び第4の駆動源、
(19)(20)は各々前記発光素子用の第1の電源及び受光素
子に接続された制御部で、(21)は前記各構成素子を搭載
した機構部搭載板、(22)は第2の電源(23)に接続され上
方に対象物としてのリードフレーム(24)が載せられてい
るヒートブロツク、(25)は前記機構部搭載板を首振りさ
せるための回動カム、(26)はカム当接ローラー、(27)(2
8)は各々前記回動カム(25)及びカムレバー(29)の回動自
在に支持する支軸、(30)(31)は各々前記支軸(27)(28)が
取付けらえた支持脚、(32)は基部、(33)は前記機構部搭
載板の首振り角度を規制するストッパー、(34)は前記機
構部搭載板を時計方向に付勢するバネを示す。
In the drawing, (1) is a foil spool in which a long strip-shaped foil (2) is wound, (3) is a guide roller, and (4) and (5) are light-emitting elements constituting a foil end detection unit. And a light receiving element, (6) and (6) are optical guide plates having slits (7) and (7), (8) and (8) are first chucks, and (9) and (9) are the first chucks. A first guide part for guiding reciprocating motion in the left-right direction, (10) a second chuck, (11) and (11) a second guide part for guiding the vertical motion of the second chuck, (12) (12) is a fixed foil guide for guiding the rightward drawing of the foil, (13) is a cutter, (14), (14)
Is a third guide part for guiding the vertical movement of the cutter, (1
5) (16) (17) (18) are the first, second, third and third for vertically moving and reciprocating left and right of the first chuck, vertically moving the second chuck, and vertically moving the cutter, respectively. 4 drive source,
(19) (20) is a control section connected to the first power source and the light receiving element for the light emitting element, (21) is a mechanism section mounting plate on which the constituent elements are mounted, and (22) is a second section A heat block connected to the power supply (23) and having a lead frame (24) as an object mounted thereon, (25) is a rotating cam for swinging the mechanism mounting plate, and (26) is Cam contact roller, (27) (2
8) is a support shaft that rotatably supports the rotating cam (25) and the cam lever (29), and (30) and (31) are support legs to which the support shafts (27) and (28) are attached, respectively. Reference numeral (32) is a base portion, (33) is a stopper that regulates the swinging angle of the mechanism portion mounting plate, and (34) is a spring that biases the mechanism portion mounting plate in the clockwise direction.

今箔スプール(1)から箔(2)の先端を引出して操作者が第
2図(イ)に示すように、第1のチヤック(8)(8)は箔(2)を
挟持した状態で、Aの位置から駆動源により図面右方に
移動を開始する。このとき箔(2)はD位置から図面右方
に向つて移動する。(第2図(イ)) 次に前記第1のチヤック(8)(8)が第2図(ロ)に示すC位
置まで右方に移動し、箔(2)の先端がカッター(13)の下
位置に達すると、カッター(13)は上方から下方の箔(2)
に向つて下降し、E位置にてカツター(13)の先端のエッ
ジ部(35)が箔(2)に上方から押圧して箔(2)の切断側の端
部をリードフレーム(24)に圧着すると共に第1のチヤッ
ク(8)(8)を左方に向つて移動させ、第2図(ハ)に示すB
位置まで後退させる。
Now, with the tip of the foil (2) pulled out from the foil spool (1), the operator can hold the foil (2) between the first chucks (8) and (8) as shown in FIG. , A to the right in the drawing by the drive source. At this time, the foil (2) moves from the position D to the right in the drawing. (Fig. 2 (a)) Next, the first chucks (8) and (8) move to the right to the C position shown in Fig. 2 (b), and the tip of the foil (2) is cut (13). When reaching the lower position of the cutter (13), the cutter (13)
At the position E, the edge portion (35) of the tip of the cutter (13) presses the foil (2) from above so that the end portion of the foil (2) on the cutting side is attached to the lead frame (24). While crimping and moving the first chucks (8) (8) to the left, B shown in Fig. 2 (C)
Retract to position.

前記第1のチヤック(8)(8)のC位置からB位置への後退
により、前記箔(2)はE−F間分即ち所定の長さ1に、
確実に前記カッター(13)及び第1のチヤック(8)(8)の引
張り力によつて切断される。
By retreating the first chucks (8) (8) from the C position to the B position, the foil (2) has a length of EF, that is, a predetermined length 1.
It is surely cut by the pulling force of the cutter (13) and the first chucks (8), (8).

前記切断作業が終了すると、前記第1のチヤック(8)(8)
の挟持力を解除し、前記B位置から第2図(ニ)に示すA
位置まで後退させると次の切断作業の待機状態となる。
When the cutting work is completed, the first chuck (8) (8)
The clamping force of is released, and the A position shown in FIG.
When it is retracted to the position, it becomes a standby state for the next cutting work.

ここで前記第1のチヤック(8)(8)のB位置から挟持力解
除待機位置としてのA位置までの後退移動のとき、第2
のチャック(10)を固定箔ガイド(12)に対して上昇させ、
箔(2)の後退を防止するため挟持しておく。前述の切断
工程において、リードフレーム(24)に前記所定の長さに
箔(2)を切断するために押しつけ、該フレーム(24)に対
し、前記所定の長さにした箔片(36)をできるだけ密着さ
せるために、前記支軸(27)を時計方向に回転させ、一方
前記箔(2)の供給工程では箔(2)の先端がリードフレーム
(24)に触れて曲げられるのを防止するため、反時計方向
に回転させておく。斯る回動に対しては駆動源としてモ
ータあるいはシリンダを用いれば良い。
Here, when the first chuck (8) (8) is moved backward from the position B to the position A as the holding force release standby position, the second
Raise the chuck (10) of the to the fixed foil guide (12),
Hold it to prevent the foil (2) from retracting. In the above cutting step, the lead frame (24) is pressed to cut the foil (2) to the predetermined length, the foil piece (36) having the predetermined length to the frame (24). In order to make the contact as close as possible, the spindle (27) is rotated clockwise, while the tip of the foil (2) is the lead frame in the step of feeding the foil (2).
Rotate it counterclockwise to prevent it from being bent by touching (24). For such rotation, a motor or a cylinder may be used as a drive source.

前記箔スプール(1)に巻回された箔(2)がなくなつて、発
光素子(4)からガイド孔(6)(7)を通して受光素子(5)に到
達した光によつて検出されると、前記第1のチヤック
(8)(8)及び第2のチヤック(10)に対する駆動源への付勢
は停止し、前記箔(2)がリードフレーム(24)への所定量
の載置作業が終了すると、前記箔エンド検出部の受光素
子(5)からの検出出力により制御部(20)が動作し、前記
駆動源の付勢停止と共に警報、例えば警報表示としてラ
ンプの点灯又は点滅、警報音の発生を行えば、前記箔の
終了が操作者(オペレータ)に報知でき、該操作者は箔
の補給又は、全作業の終了として、箔送り装置の作動全
体を停止させるため、電源スイッチをオフにする。
The foil (2) wound around the foil spool (1) disappears, and is detected by the light reaching the light receiving element (5) from the light emitting element (4) through the guide holes (6) and (7). And the first chuck
(8) When the urging of the drive source to the (8) and the second chuck (10) is stopped, and the foil (2) is placed on the lead frame (24) by a predetermined amount, the foil is removed. The control unit (20) operates by the detection output from the light receiving element (5) of the end detection unit, and when the drive source is de-energized, an alarm, for example, lighting or blinking of a lamp as an alarm display, and generation of an alarm sound are performed. The end of the foil can be notified to the operator (operator), and the operator turns off the power switch in order to stop the entire operation of the foil feeding device as the supply of the foil or the end of all work.

第3図は前記箔送り装置に用いるカッターの一例を示
し、その側面を示す第3図(イ)で、前記エッジ部(35)の
角度(α)を所定の大きさに設定することによつて、箔
(2)に対する切断角度(α)が定まり、又第3図(イ)に示す
エッジ部(35)の長さ(d)を定まれば、リードフレーム(2
4)に対して箔(2)を切断する条件が決定される。即ち前
記角度(α)を大きくすると、エッジ部(35)の箔(2)に対
する挿入は鋭く、従つて箔(2)を通してリードフレーム
(24)へのノッチとしての傷は狭となり、一方これとは逆
に前記角度(α)を小さくすると、エッジ部(35)の箔(2)
に対する挿入は直角に近くなり、従つて箔(2)を通して
前記リードフレーム押(24)へのノッチとしての傷は幅広
となる。このノッチを形成する際には、箔(2)の切断側
端部はリードフレーム(24)に圧着され、箔(2)はノッチ
内に食い込むことになる(第4図参照)。
FIG. 3 shows an example of a cutter used in the foil feeding device, and FIG. 3 (a) showing the side surface thereof, in which the angle (α) of the edge portion (35) is set to a predetermined size. Foil
If the cutting angle (α) with respect to (2) is determined and the length (d) of the edge portion (35) shown in Fig. 3 (a) is determined, the lead frame (2
The conditions for cutting the foil (2) for 4) are determined. That is, when the angle (α) is increased, the edge portion (35) is sharply inserted into the foil (2), and accordingly, the lead frame is passed through the foil (2).
The scratch as a notch on (24) becomes narrower, and conversely, when the angle (α) is decreased, the foil (2) of the edge part (35) is reduced.
The insertion into is close to a right angle, thus widening the scratch as a notch through the foil (2) to the leadframe push (24). When this notch is formed, the cut-side end of the foil (2) is crimped to the lead frame (24) and the foil (2) bites into the notch (see FIG. 4).

従つて前記箔及びリードフレーム(24)の材質に対して、
前記角度(α)及びエッジ部(35)の長さ(d)は適応させれ
ば良い。
Therefore, for the material of the foil and the lead frame (24),
The angle (α) and the length (d) of the edge portion (35) may be adapted.

又前記機構搭載板(21)を支軸(27)に対して回動カム(25)
を回動用モータにて回転させ、レバー(29)の回動に伴つ
て支持片(38)を上下させて首振り揺動の構成になした実
施例について説明したが、単に上下動の機構になしても
良い。前記実施例において、(33)は上下動のストッパー
で、前記機構搭載板(21)を支持軸(27)に対して時計方向
にバネ(34)によつて付勢してあり、ストッパー(33)とし
てのネジは前記首振り角度の大きさを調整できる構成に
なしてある。
Also, the mechanism mounting plate (21) rotates the cam (25) with respect to the spindle (27).
The example in which the rotation motor is rotated and the supporting piece (38) is moved up and down in accordance with the rotation of the lever (29) to swing and swing is described. You can do it. In the above embodiment, (33) is a vertically movable stopper, and the mechanism mounting plate (21) is biased clockwise by the spring (34) with respect to the support shaft (27), and the stopper (33 The screw as) is constructed so that the size of the swing angle can be adjusted.

前述の第1図に示したリードフレーム(24)の加熱はヒー
タブロック(22)内のヒータ(37)により行つた場合、常温
以上に設定され、前記箔(2)が半田箔の場合は200度
強に加熱しておき、リードフレーム(24)上に載置された
ときには溶融するので、この状態で上方から例えば半導
体チップを搭載すれば、リードフレームに対して前記半
導体チップが固着される。
When the lead frame (24) shown in FIG. 1 is heated by the heater (37) in the heater block (22), the temperature is set to room temperature or higher, and when the foil (2) is a solder foil, it is heated to 200. It is heated strongly and melts when placed on the lead frame (24), so if a semiconductor chip is mounted from above in this state, the semiconductor chip is fixed to the lead frame.

(ト) 発明の効果 以上のように本発明は、箔の切断時にカッターのその下
端部が鋭角なエッジ部により該泊を通してリードフレー
ムにノッチを形成しながら該ノッチ箔を食い込ませた状
態でチャックが箔を挟持したまま復動して引張ることに
より該箔を所定長さに切断し、この切断された箔をリー
ドフレーム上に貼り付けるようにしたものである。
(G) Effect of the Invention As described above, the present invention is a chuck in which the notch foil is bitten while the lower end of the cutter forms a notch in the lead frame through the night by the sharp edge portion of the cutter when cutting the foil. Is to cut the foil into a predetermined length by pulling it back while holding the foil, and pasting the cut foil onto the lead frame.

従って、リードフレーム上の箔の溶融性が悪くとも、該
リードフレームのノッチに箔の切断側端部を食い込ませ
ているから、該リードフレームから箔が剥がれることが
なく、安定した接着を行うことができる。
Therefore, even if the meltability of the foil on the lead frame is poor, the cut side edge of the foil is bite into the notch of the lead frame, so that the foil does not peel off from the lead frame and stable bonding is performed. You can

また、カッターのエッジ部が前記切断側端部をリードフ
レームに圧着した状態で、チャックが箔を引張るものだ
から、確実に所定長さに切断できリードフレーム上に貼
り付けることができる。
Further, since the chuck pulls the foil in a state where the edge portion of the cutter presses the cutting side end portion to the lead frame, the foil can be surely cut to a predetermined length and can be attached onto the lead frame.

【図面の簡単な説明】[Brief description of drawings]

第1図は箔送り装置及び箔貼付装置の正面図、第2図は
箔送り装置の動作説明図、第3図はカッターを示す図、
第4図はカッターの動作時の説明図を夫々示す。 主な図番の説明 (1)……箔スプール、(2)……箔、(8)……第1のチヤッ
ク、(10)……第2のチヤック、(13)……カッター、(24)
……リードフレーム、(35)……エッジ部。
FIG. 1 is a front view of a foil feeding device and a foil sticking device, FIG. 2 is an operation explanatory view of the foil feeding device, FIG. 3 is a diagram showing a cutter,
FIG. 4 shows explanatory views of the operation of the cutter, respectively. Explanation of main drawing numbers (1) …… Foil spool, (2) …… Foil, (8) …… First chuck, (10) …… Second chuck, (13) …… Cutter, (24 )
…… Lead frame, (35) …… Edge part.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】箔送り装置により送られた帯状体の箔の端
部を切断して、切断された箔を加熱されているリードフ
レーム上に貼り付けるようにした箔貼付装置に於いて、
前記リードフレーム上に所定長さ送り出された箔の切断
側端部側に該箔を通して該リードフレームにノッチを形
成するようにその下端部を鋭角なエッジ部とした上下動
可能なカッターと、往動時にはスプールからの箔を挟持
して前記リードフレーム上に送り出し、復動時には下動
した前記カッターのエッジ部によりリードフレームに形
成されたノッチに食い込まされた状態の箔を挟持したま
ま引張り前記切断側端部で切断する往復動可能なチャッ
クとを設けたことを特徴とする箔貼付装置。
1. A foil sticking device in which an end portion of a foil of a band-shaped body sent by a foil sending device is cut and the cut foil is stuck onto a heated lead frame.
A cutter that can move up and down with its lower end having an acute-angled edge so as to form a notch in the lead frame by passing the foil through the cut-side end of the foil sent out on the lead frame for a predetermined length; When moving, it holds the foil from the spool and sends it out onto the lead frame, and when it moves back, it pulls it while holding the foil in the state of being cut into the notch formed in the lead frame by the edge of the cutter that has moved downward. A foil sticking device provided with a reciprocating chuck that cuts at a side end.
JP62287730A 1987-11-13 1987-11-13 Foil sticking device Expired - Lifetime JPH0628270B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62287730A JPH0628270B2 (en) 1987-11-13 1987-11-13 Foil sticking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62287730A JPH0628270B2 (en) 1987-11-13 1987-11-13 Foil sticking device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9019785A Division JPS61280625A (en) 1985-04-25 1985-04-25 Foil feeding device

Publications (2)

Publication Number Publication Date
JPS63232340A JPS63232340A (en) 1988-09-28
JPH0628270B2 true JPH0628270B2 (en) 1994-04-13

Family

ID=17721008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62287730A Expired - Lifetime JPH0628270B2 (en) 1987-11-13 1987-11-13 Foil sticking device

Country Status (1)

Country Link
JP (1) JPH0628270B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS649629A (en) * 1987-07-01 1989-01-12 Mitsubishi Electric Corp Method for supplying and compressing solder
ITUB20155681A1 (en) * 2015-11-18 2017-05-18 St Microelectronics Srl RADIATION-RESISTANT ELECTRONIC DEVICE AND METHOD TO PROTECT AN ELECTRONIC DEVICE FROM IONIZING RADIATION

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940537A (en) * 1982-08-28 1984-03-06 Rohm Co Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS63232340A (en) 1988-09-28

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