JPH0627746U - Chip circuit component supply device - Google Patents

Chip circuit component supply device

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Publication number
JPH0627746U
JPH0627746U JP4031091U JP4031091U JPH0627746U JP H0627746 U JPH0627746 U JP H0627746U JP 4031091 U JP4031091 U JP 4031091U JP 4031091 U JP4031091 U JP 4031091U JP H0627746 U JPH0627746 U JP H0627746U
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JP
Japan
Prior art keywords
component
chip
shaped circuit
slider
discharge pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4031091U
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Japanese (ja)
Other versions
JP2517844Y2 (en
Inventor
高志 今川
勝 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1991040310U priority Critical patent/JP2517844Y2/en
Publication of JPH0627746U publication Critical patent/JPH0627746U/en
Application granted granted Critical
Publication of JP2517844Y2 publication Critical patent/JP2517844Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

(57)【要約】 (修正有) 【目的】 部品排出パイプからスライダの部品収納孔に
チップ状回路部品を受け入れ、次に送る前に部品収納孔
の中のチップ状回路部品の有無を検査することにより、
欠品を未然に防ぐ。 【構成】 スライダの回転に伴い部品排出パイプから部
品収納孔64にチップ状回路部品aを受け入れた後、同
部品収納孔64が触針52の下を通過する。ここでソレ
ノイド56により触針52が押し下げられる深さの違い
で部品収納孔64の中にチップ状回路部品aが有るか否
かが検査される。そして、もし或る部品収納孔64の中
にチップ状回路部品aが無いことが発見されたときは、
スライダ54を回転させて、当該部品収納孔64を再び
部品排出パイプ49の下に移動させ、その中にチップ状
回路部品aを受け入れる。
(57) [Summary] (Corrected) [Purpose] Accepting chip-shaped circuit components from the component discharge pipe to the component storage hole of the slider, and inspecting the presence of chip-shaped circuit components in the component storage hole before sending them next. By
Prevent shortages. [Structure] After the chip-shaped circuit component a is received from the component discharge pipe into the component storage hole 64 as the slider rotates, the component storage hole 64 passes under the stylus 52. Here, it is inspected whether or not the chip-shaped circuit component a is present in the component accommodating hole 64, depending on the depth of depression of the stylus 52 by the solenoid 56. Then, if it is found that the chip-shaped circuit component a is not present in the certain component storage hole 64,
The slider 54 is rotated to move the component storage hole 64 again below the component discharge pipe 49, and the chip-shaped circuit component a is received therein.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、チップ状回路部品をバルク状に収納した容器から、同チップ部品を 部品排出パイプに一列に取り出し、これを部品搬送路に1つずつ送り出す装置に 関する。 The present invention relates to a device for taking out chip-shaped circuit components in a line from a container in which the chip-shaped circuit components are stored in a bulk, and sending them one by one to a component transport path.

【0003】[0003]

【従来の技術】[Prior art]

複数の容器の中にバルク状に収納されたチップ状回路部品を1つずつ取り出し 、これを回路基板の所定の位置に搭載する自動マウント装置が用いられている。 この装置において用いられる部品供給装置では、容器の中にバルク状に収納され たチップ状回路部品を部品排出パイプに一列に取り出し、例えばこれをディスト リビュータの案内パイプに通じる部品搬送路へ1つずつ送る。 2. Description of the Related Art An automatic mounting device is used in which chip-shaped circuit components stored in bulk in a plurality of containers are taken out one by one and mounted at predetermined positions on a circuit board. In the component supply device used in this device, the chip-shaped circuit components stored in bulk in the container are taken out in a line to the component discharge pipe, for example, one by one to the component transfer path leading to the guide pipe of the distributor. send.

【0004】 この種の従来のチップ状回路部品供給装置において、前記部品排出パイプから 部品搬送路へチップ状回路部品を送る機構は、その間でスライドし、2本の部品 搬送路へチップ状回路部品を交互に送るスライド板を備えるものであった。しか し、このような従来のスライド板を用いるものでは、スライダの一回の往復動作 により、チップ状回路部品が2本の部品搬送路に交互に1個ずつしか供給されな い。このため、回路基板に同じ種類のチップ状回路部品を複数マウントしようと する場合、そのマウントされるチップ状回路部品の数の半分の数の容器を備えな けらばならない。In the conventional chip-shaped circuit component supply device of this type, the mechanism for feeding the chip-shaped circuit component from the component discharge pipe to the component transfer path slides between them and the chip-shaped circuit component is transferred to the two component transfer paths. It was equipped with a slide plate for alternately feeding. However, in such a conventional slide plate, one reciprocating movement of the slider supplies only one chip-shaped circuit component to the two component transfer paths alternately. For this reason, when a plurality of chip-shaped circuit components of the same type are to be mounted on the circuit board, the number of containers that are half the number of mounted chip-shaped circuit components must be provided.

【0005】 そこで、本件考案者らは先に、回転するスライダを用いた部品供給装置を提案 し、これを実用新案登録出願した(平成2年実用新案登録願第35122号)。 その概要を図3〜図5により説明すると、次の通りである。すなわち、図3にお いて矢印で示すように、容器1が上下に往復されるのに伴い、同容器1の中にバ ルク状に収納されたチップ状回路部品aが部品排出パイプ49の中に一列に取り 出される。この排出パイプ49に並んだチップ状回路部品aは、円盤状のスライ ダ54が図3及ぶ図4において矢印の方向に間欠回転するのに伴い、その部品収 納孔64、64…に一つずつ収納される。スライダ54の部品収納孔64、64 …の全てにチップ状回路部品aが収納されたところで、スライダ54が図3及び 図4において矢印で示す方向にさらに回転し、部品収納孔64、64とその下の 部品搬送路10、10…の上端とが各々上下に合う。その後、シャッタ50が図 4に矢印で示すようにスライドし、図5で示すように、その部品通過孔51、5 1…が部品収納孔64、64…と部品搬送路10、10…の上端とを通じさせる 。このため、部品収納孔64、64…の中に各々収納されたチップ状回路部品a 、a…が部品搬送路10、10…に各々に送り出される。その後スライダ54と シャッタ50が元位置に戻り、以下同様の動作を繰り返す。Therefore, the inventors of the present invention have previously proposed a component supply device using a rotating slider, and filed a utility model registration application (1990 utility model registration application No. 35122). The outline will be described below with reference to FIGS. 3 to 5. That is, as shown by the arrow in FIG. 3, as the container 1 is reciprocated up and down, the chip-shaped circuit parts a housed in the container 1 in a bulk shape are placed in the part discharge pipe 49. Are taken out in a line. One of the chip-shaped circuit parts a arranged in the discharge pipe 49 is placed in each of the part storage holes 64, 64, ... As the disk-shaped slider 54 intermittently rotates in the direction of the arrow in FIGS. Stored one by one. When the chip-shaped circuit component a is stored in all of the component storage holes 64, 64 ... Of the slider 54, the slider 54 further rotates in the direction shown by the arrow in FIGS. The upper ends of the lower component transport paths 10, 10 ... Align vertically with each other. Thereafter, the shutter 50 slides as shown by an arrow in FIG. 4, and as shown in FIG. 5, the component passage holes 51, 51 ... Include the component storage holes 64, 64. Through. Therefore, the chip-shaped circuit components a 1, a ... Stored in the component storage holes 64, 64 ... Are sent to the component transport paths 10, 10 ,. After that, the slider 54 and the shutter 50 return to their original positions, and the same operation is repeated thereafter.

【0006】[0006]

【考案が解決しようとしている課題】[Problems that the device is trying to solve]

本件考案者らが提案した前記の部品供給装置では、一度に多数のチップ状回路 部品aを各々その数に応じた部品搬送路10、10…に送り出すことができる。 しかしこの場合に、誤動作により部品排出パイプ49側からスライダ54の部品 収納孔64、64の中にチップ状回路部品aが送られないことがある。そのよう な場合には、一部または全部の部品収納孔64の中にチップ状回路部品aが存在 しないまま前記シャッタ50によるチップ状回路部品aの送り出しの動作が行な われてしまう。そうすると、通常供給されるべきチップ状回路部品aが所定の供 給先に供給されないというトラブル、いわゆる欠品が生じてしまう。 そこで本考案は、この課題を解消し、部品排出パイプ49からスライダの部品 収納孔64にチップ状回路部品aを受け入れ、次に送る前に部品収納孔64の中 のチップ状回路部品aの有無を検査することができる部品供給装置を提供するこ とを目的とする。 In the above-mentioned component supply device proposed by the present inventors, a large number of chip-shaped circuit components a can be sent at a time to the component transfer paths 10, 10 ... However, in this case, the chip-shaped circuit component a may not be sent from the component discharge pipe 49 side into the component storage holes 64, 64 of the slider 54 due to a malfunction. In such a case, the operation of sending out the chip-shaped circuit component a by the shutter 50 is performed without the chip-shaped circuit component a existing in some or all of the component storage holes 64. Then, a trouble that the chip-shaped circuit component a to be normally supplied is not supplied to a predetermined supply destination, that is, a so-called out-of-stock product occurs. Therefore, the present invention solves this problem and accepts the chip-shaped circuit component a from the component discharge pipe 49 into the component storage hole 64 of the slider, and the presence or absence of the chip-shaped circuit component a in the component storage hole 64 before sending it next. An object of the present invention is to provide a component supply device capable of inspecting.

【0007】[0007]

【課題を解決するための手段】[Means for Solving the Problems]

すなわち本考案では、前記目的を達成するため、チップ状回路部品がバルク状 に収納される容器と、該容器の中からチップ状回路部品が一列に排出される部品 排出パイプと、該部品排出パイプの下に配置された部品搬送路と、チップ状回路 部品を部品排出パイプから部品搬送路へ分配するスライダとを備えたチップ状回 路部品供給装置において、前記スライダが回転する板体であり、該スライダの回 転中心の周りに前記チップ状回路部品が収納される複数の部品収納孔が配列され 、前記部品収納孔はスライダの回転に伴い部品排出パイプの下端の下と、その中 のチップ状回路部品の有無を検知する検査手段とを通過することを特徴とするチ ップ状回路部品供給装置を提供する。 That is, according to the present invention, in order to achieve the above object, a container in which chip-shaped circuit components are stored in a bulk shape, a component discharge pipe in which the chip-shaped circuit components are discharged in a line from the container, and the component discharge pipe. In a chip-shaped circuit component supply device provided with a component transport path disposed below, and a slider that distributes a chip-shaped circuit component from a component discharge pipe to the component transport path, the slider is a plate that rotates, A plurality of component accommodating holes for accommodating the chip-shaped circuit components are arranged around the rotation center of the slider, and the component accommodating holes are below the lower end of the component discharge pipe as the slider rotates and the chips therein. Provided is a chip-shaped circuit component supply device, which is characterized by passing through an inspection means for detecting the presence or absence of the circuit component.

【0008】[0008]

【作用】[Action]

本考案によるチップ状回路部品の供給装置では、スライダの部品収納孔が部品 排出パイプの下を通過し、さらにチップ状回路部品の有無を検知する検査手段を 通過するため、部品排出パイプ49から部品収納孔にチップ状回路部品を受け入 れながら、確実にチップ状回路部品が受け入れられたかを検査することができる 。従って、この時点でチップ状回路部品の有無を検査した後、部品収納孔からチ ップ状回路部品を送ることができるため、供給先へ供給すべきチップ状回路部品 が欠品となるのが未然に防止される。 In the device for supplying chip-shaped circuit parts according to the present invention, the part storage hole of the slider passes under the part discharge pipe and further passes through the inspection means for detecting the presence or absence of the chip-shaped circuit part. It is possible to inspect whether the chip-shaped circuit components have been reliably received while receiving the chip-shaped circuit components in the storage hole. Therefore, at this point, after checking for the presence of chip-shaped circuit components, the chip-shaped circuit components can be sent from the component storage holes, so that the chip-shaped circuit components to be supplied to the supply destination are out of stock. Prevented in advance.

【0009】[0009]

【実施例】【Example】

次に、図1と図2を参照しながら、本考案の実施例について詳細に説明する。 本考案の実施例による部品供給装置が図1に示されている。この実施例におい て、漏斗状の底面を有するベース部材38と、このベース部材38の周辺部に嵌 め込まれた筒形の筒状部材39とから容器1が構成されている。ベース部材38 の底面が最も低くなった中央部に通孔が開設され、この通孔から部品排出パイプ 49の上端がスライド自在に嵌め込まれ、同パイプ49の上端が容器1の中に挿 入されている。図示の場合、部品排出パイプ49は、容器1の中心軸にほぼ一致 するよう挿入され、その上端は斜に開口している。 Next, an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2. A component feeder according to an embodiment of the present invention is shown in FIG. In this embodiment, the container 1 is composed of a base member 38 having a funnel-shaped bottom surface, and a cylindrical tubular member 39 fitted in the peripheral portion of the base member 38. A through hole is opened in the central portion where the bottom surface of the base member 38 is the lowest, and the upper end of the component discharge pipe 49 is slidably fitted through this through hole, and the upper end of the pipe 49 is inserted into the container 1. ing. In the illustrated case, the component discharge pipe 49 is inserted so as to substantially coincide with the central axis of the container 1, and the upper end thereof is obliquely opened.

【0010】 前記ベース部材39の底面中央部から突設されたスライド部材37がガイドベ ース50に固定されたガイド部材36の凹部にスライド自在に嵌合している。さ らに、ガイドベース50は、フレーム35に取り付けられている。また、容器1 には、図示を省略した上下駆動機構が連結される。これにより、前記ガイド部材 36に案内されて、容器1が上下に往復駆動される。A slide member 37 protruding from the center of the bottom surface of the base member 39 is slidably fitted in a recess of a guide member 36 fixed to a guide base 50. Furthermore, the guide base 50 is attached to the frame 35. A vertical drive mechanism (not shown) is connected to the container 1. As a result, the container 1 is guided by the guide member 36 and reciprocally driven up and down.

【0011】 前記部品排出パイプ49の下端には、ディストリビュータ2の案内パイプ21 、21…に通じる部品搬送路10、10…へチップ状電子部品aを1つずつ逃が すエスケープメント機構が設けられている。すなわち、前記部品排出パイプ49 の下端の下に円盤状のスライダ54が配置され、このスライダ54は、その中心 の周りに矢印で示すように回転する。このスライダ54の前記回転中心の周りに は、チップ状電子部品aが縦に1個だけ入る大きさの複数の部品収納孔64、6 4…が一定の角度毎に開設されている。前記部品排出パイプ49の下端は、スラ イダ54の回転により、前記部品収納孔64、64…が通過する位置の真上に配 置されている。At the lower end of the component discharge pipe 49, an escapement mechanism is provided to allow the chip-shaped electronic components a to escape to the component transfer paths 10, 10 ... Which communicate with the guide pipes 21, 1 ,. ing. That is, a disk-shaped slider 54 is arranged below the lower end of the component discharge pipe 49, and the slider 54 rotates around its center as indicated by the arrow. Around the rotation center of the slider 54, a plurality of component accommodating holes 64, 64, ... Each of which has a size to accommodate only one chip-shaped electronic component a in the vertical direction are formed at constant angles. The lower end of the component discharge pipe 49 is disposed right above the position where the component storage holes 64, 64 ... Pass by the rotation of the slider 54.

【0012】 さらに、スライダ54の回転により、前記部品収納孔64、64…が通過する 個所に、その中のチップ状回路部品aの有無を検査する検査器が配置されている 。例えば図1及び図2で示した実施例では、ダンパ53を介してソレノイド56 に連結された触針52が部品収納孔64、64…が通過する上に配置されている 。図示の場合は、この触針52が部品排出パイプ49の位置からスライダ54が 180°回転した位置に配置されている。さらに、この触針52からアーム58 が突設され、その脇にこのアーム58を検知するセンサ57が配置されている。Further, by the rotation of the slider 54, an inspection device for inspecting the presence or absence of the chip-shaped circuit component a therein is arranged at a portion where the component storage holes 64, 64 ... Pass. For example, in the embodiment shown in FIGS. 1 and 2, the stylus 52 connected to the solenoid 56 via the damper 53 is arranged above the component storage holes 64, 64 ... In the illustrated case, the stylus 52 is arranged at a position where the slider 54 is rotated 180 ° from the position of the component discharge pipe 49. Further, an arm 58 is provided so as to project from the stylus 52, and a sensor 57 for detecting the arm 58 is arranged beside it.

【0013】 この触針52の下に部品収納孔64が来たとき、ソレノイド56が作動し、触 針52が押し下げられるが、このとき部品収納孔64の中にチップ状回路部品a があると、触針52の先端がチップ状回路部品aに当たってその下降が阻止され 、ソレノイド56のストロークがダンパ53で吸収される。この状態では、図2 に示すように、アーム58がセンサ57に達しないため、同センサ57がアーム 58を検知しない。他方、部品収納孔64の中にチップ状回路部品aが無いと、 触針52の先端が部品収納孔64の深くまで挿入される。この状態では、アーム 58が図2に示す位置よりさらに下降し、センサ57に達するため、同センサ5 7がアーム58を検知する。これにより、部品収納孔64にチップ状回路部品a が無いことが検知される。なおこのチップ状回路部品aの有無の検査は、部品排 出パイプ49の下で他の部品収納孔64がチップ状回路部品aを受け入れる時に 並行して行なわれる。When the component housing hole 64 comes under the stylus 52, the solenoid 56 is activated and the stylus 52 is pushed down. At this time, if the chip-shaped circuit component a exists in the component housing hole 64. The tip of the stylus 52 hits the chip-shaped circuit component a and its descending is blocked, and the stroke of the solenoid 56 is absorbed by the damper 53. In this state, as shown in FIG. 2, since the arm 58 does not reach the sensor 57, the sensor 57 does not detect the arm 58. On the other hand, if the chip-shaped circuit component a is not present in the component storage hole 64, the tip of the stylus 52 is inserted deep into the component storage hole 64. In this state, the arm 58 further descends from the position shown in FIG. 2 and reaches the sensor 57, so that the sensor 57 detects the arm 58. As a result, it is detected that the chip-shaped circuit component a 1 is not present in the component housing hole 64. The inspection of the presence or absence of the chip-shaped circuit component a is performed in parallel when the other component storage hole 64 receives the chip-shaped circuit component a under the component discharge pipe 49.

【0014】 スライダ54の下に配置されたフレーム35には、同スライダ54の部品収納 孔64、64…と同じ数の部品搬送路10、10…が連結され、この部品搬送路 10、10…の上端は、前記スライダ54の部品収納孔64、64…が配列され たのと同径の同心円状に同じ角度毎に配列されている。但しそれらの位置は、前 記スライダ54の部品収納孔64、64…に対して30°ずれている。To the frame 35 arranged below the slider 54, the same number of component transport paths 10, 10 ... As the component storage holes 64, 64 ... Of the slider 54 are connected, and the component transport paths 10, 10 ,. Are arranged at the same angle in concentric circles having the same diameter as the parts accommodating holes 64, 64 ... Of the slider 54 are arranged. However, their positions are deviated by 30 ° with respect to the component storage holes 64, 64 ... Of the slider 54.

【0015】 これらスライダ54とフレーム35との間には、図1において左右にスライド する板状のシャッタ50が配置されている。このシャッタ50には、前記部品搬 送路10、10…が配列されたのと同径の円上に同じ間隔で部品通過孔51、5 1…が開設され、そのスライドにより、この部品通過孔51、51…が前記部品 搬送路10、10…の上端と位置が合ったり、ずれたりする。Between the slider 54 and the frame 35, a plate-shaped shutter 50 that slides left and right in FIG. 1 is arranged. In this shutter 50, component passage holes 51, 51, ... Are opened at the same intervals on a circle having the same diameter as the arrangement of the component transport paths 10, 10 ,. The parts 51, 51 ... Are aligned with the upper ends of the parts conveying paths 10, 10, ...

【0016】 この部品供給装置では、前記容器1の上下動に伴い、その中に収納されたチッ プ状電子部品a、a…が部品排出パイプ49の中に縦に一列になって取り出され る。スライダ54が回転するのに伴い、図2にも示すように、部品収納孔64、 64…が部品排出パイプの下端を順次通過したところで、その中にチップ状電子 部品が1つずつ収納される。このとき、図1に示すように、シャッタ50は、そ の部品通過孔51、51…がスライダ54の部品収納孔64、64…と部品搬送 路10、10…の上端から何れもずれた位置にあり、従って、スライダ54の部 品収納孔64、64…の下端は閉じている。In this component supply device, as the container 1 moves up and down, the chip-shaped electronic components a, a ... Stored therein are taken out vertically in a line in the component discharge pipe 49. . As the slider 54 rotates, as shown in FIG. 2, when the component storage holes 64, 64, ... sequentially pass through the lower ends of the component discharge pipes, one chip-shaped electronic component is stored therein. . At this time, as shown in FIG. 1, in the shutter 50, the component passage holes 51, 51 ... Are displaced from the component storage holes 64, 64 ... Of the slider 54 and the upper ends of the component conveying paths 10, 10. Therefore, the lower ends of the component storage holes 64, 64 ... Of the slider 54 are closed.

【0017】 その後スライダ54の回転により、部品収納孔64が触針52の下に移動する と、そこで前述のようにして部品収納孔64の中のチップ状回路部品aの有無が 検査される。そして、もし或る部品収納孔64の中にチップ状回路部品aが無い ことが発見されたときは、スライダ54を回転させて、当該部品収納孔64を再 び部品排出パイプ49の下に移動させ、その中にチップ状回路部品aを受け入れ る。After that, when the component storage hole 64 moves below the stylus 52 by the rotation of the slider 54, the presence or absence of the chip-shaped circuit component a in the component storage hole 64 is inspected there as described above. If it is found that the chip-shaped circuit component a does not exist in a certain component storage hole 64, the slider 54 is rotated to move the component storage hole 64 again below the component discharge pipe 49. Then, the chip-shaped circuit component a is received therein.

【0018】 こうしてその全ての部品収納孔64、64…にチップ状電子部品a、a…が収 納された後、スライダ54がさらに30°だけ回転する。すると、スライダ54 の部品収納孔64、64…とその下にある部品搬送路10、10…の上端とが上 下に位置合わせされる。この状態でシャッタ50をスライドさせ、その部品通過 孔51、51…を前記部品搬送路10、10…の上端と位置合わせすると、スラ イダ54の部品収納孔64、64…と部品搬送路10、10…とがシャッタの部 品通過孔51、51…を介して連通し、スライダ54の複数の部品収納孔64、 64…の中に各々収納されたチップ状電子部品a、a…が部品搬送路10、10 …に各々に送り出される。その後スライダ54が30°回転して元の位置に戻る と共に、シャッタ50も元位置に戻り、以下同様の動作を繰り返しながら、チッ プ状電子部品a、a…が送り出される。After the chip-shaped electronic components a, a ... Are stored in all the component storage holes 64, 64 ... In this way, the slider 54 is further rotated by 30 °. Then, the component storage holes 64, 64 ... Of the slider 54 and the upper ends of the component transport paths 10, 10 ... In this state, the shutter 50 is slid to align the component passage holes 51, 51 ... With the upper ends of the component transport paths 10, 10 ... And the component storage holes 64, 64 ... 10 communicate with each other through the component passage holes 51, 51 ... Of the shutter, and the chip-shaped electronic components a, a ... Stored in the plurality of component storage holes 64, 64. It is sent to each of the paths 10, 10 ... Thereafter, the slider 54 rotates 30 ° and returns to the original position, the shutter 50 also returns to the original position, and the chip-shaped electronic components a, a ... Are sent out by repeating the same operation.

【0019】 なお、前記の実施例においては、部品収納孔64のチップ状回路部品aの有無 を検査する手段として、触針52とソレノイド56及びセンサ57を組み合わせ たものを使用したが、この他の検査手段を用いることもできる。例えば、触針5 2の挿入深さをリニアスケールで直接測定するものや、部品収納孔64が通過す る上に発光器と受光器とを配置し、発光器から発射された光がチップ状回路部品 aの電極部分で反射される光を受光器で受光できるか否かでチップ状回路部品の 有無を判断する手段等が挙げられる。In the above-described embodiment, the combination of the stylus 52, the solenoid 56 and the sensor 57 is used as a means for inspecting the presence or absence of the chip-shaped circuit component a in the component storage hole 64. It is also possible to use the above inspection means. For example, by directly measuring the insertion depth of the stylus 52 with a linear scale, or by arranging a light emitter and a light receiver above the component storage hole 64, the light emitted from the light emitter is chip-shaped. There is a means for judging the presence or absence of the chip-shaped circuit component based on whether or not the light reflected by the electrode portion of the circuit component a can be received by the light receiver.

【0020】[0020]

【考案の効果】[Effect of device]

以上説明した通り、本考案によれば、部品排出パイプからスライダの部品収納 孔にチップ状回路部品を受け入れながら、別の部品収納孔のチップ状回路部品の 有無を検査することができるため、部品収納孔のチップ状回路部品を送り出す動 作をする前にチップ状回路部品が無いことを発見し、欠品を未然に防ぐことがで きるため、誤動作の少ないチップ状回路部品供給装置が提供できる効果がある。 As described above, according to the present invention, it is possible to inspect the presence or absence of a chip-shaped circuit component in another component storage hole while receiving the chip-shaped circuit component from the component discharge pipe into the component storage hole of the slider. It is possible to find out that there is no chip-shaped circuit component before the operation to send out the chip-shaped circuit component in the storage hole, and prevent out-of-stock items, so it is possible to provide a chip-shaped circuit component supply device with few malfunctions. effective.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の実施例であるチップ状回路部品供給装
置の要部縦断斜視図である。
FIG. 1 is a perspective view of a longitudinal section of a main part of a chip-shaped circuit component supply device according to an embodiment of the present invention.

【図2】同部品供給装置のエスケープメント部分の要部
縦断側面図である。
FIG. 2 is a vertical sectional side view of a main part of an escapement portion of the component supply device.

【図3】従来例であるチップ状回路部品供給装置の要部
縦断斜視図である。
FIG. 3 is a vertical cross-sectional view of a main portion of a conventional chip-shaped circuit component supply device.

【図4】同部品供給装置のエスケープメント部分の部品
通路の配置関係を示す要部平面図である。
FIG. 4 is a plan view of relevant parts showing the arrangement relationship of component passages in the escapement portion of the component supply device.

【図5】図4のB−B部拡大断面図である。 1 容器 10 部品搬送路 49 部品排出パイプ 52 触針 53 ダンパ 54 スライダ 56 ソレノイド 57 センサ 58 触針のアーム 64 スライダの部品収納孔 a チップ状回路部品5 is an enlarged cross-sectional view taken along the line BB in FIG. 1 Container 10 Component Transfer Path 49 Component Discharge Pipe 52 Stylus 53 Damper 54 Slider 56 Solenoid 57 Sensor 58 Stylus Arm 64 Slider Component Storage Hole a Chip Circuit Component

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 チップ状回路部品がバルク状に収納され
る容器と、該容器の中からチップ状回路部品が一列に排
出される部品排出パイプと、該部品排出パイプの下に配
置された部品搬送路と、チップ状回路部品を部品排出パ
イプから部品搬送路へ分配するスライダとを備えたチッ
プ状回路部品供給装置において、前記スライダが回転す
る板体であり、該スライダの回転中心の周りに前記チッ
プ状回路部品が収納される複数の部品収納孔が配列さ
れ、前記部品収納孔はスライダの回転に伴い部品排出パ
イプの下端の下と、その中のチップ状回路部品の有無を
検知する検査手段とを通過することを特徴とするチップ
状回路部品供給装置。
1. A container in which chip-shaped circuit components are stored in a bulk shape, a component discharge pipe from which the chip-shaped circuit components are discharged in a row, and a component which is arranged under the component discharge pipe. In a chip-shaped circuit component supply device including a transport path and a slider for distributing chip-shaped circuit components from a component discharge pipe to a component transport path, the slider is a plate that rotates, and a slider is provided around a rotation center of the slider. A plurality of component accommodating holes for accommodating the chip-shaped circuit components are arranged, and the component accommodating holes are detected under the lower end of the component discharge pipe as the slider rotates and for detecting the presence or absence of the chip-shaped circuit components therein. And a chip-shaped circuit component supply device.
JP1991040310U 1991-04-30 1991-04-30 Chip circuit component supply device Expired - Lifetime JP2517844Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991040310U JP2517844Y2 (en) 1991-04-30 1991-04-30 Chip circuit component supply device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991040310U JP2517844Y2 (en) 1991-04-30 1991-04-30 Chip circuit component supply device

Publications (2)

Publication Number Publication Date
JPH0627746U true JPH0627746U (en) 1994-04-12
JP2517844Y2 JP2517844Y2 (en) 1996-11-20

Family

ID=12577048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991040310U Expired - Lifetime JP2517844Y2 (en) 1991-04-30 1991-04-30 Chip circuit component supply device

Country Status (1)

Country Link
JP (1) JP2517844Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2005003002A1 (en) * 2003-07-08 2007-09-20 アサヒ精機株式会社 Fine parts feeder

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832334A (en) * 1971-08-28 1973-04-28
JPS5997919A (en) * 1982-11-22 1984-06-06 Rohm Co Ltd Lining-up supplier for tip parts
JPS60197513A (en) * 1984-03-17 1985-10-07 Nitto Kogyo Kk Solid feeding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832334A (en) * 1971-08-28 1973-04-28
JPS5997919A (en) * 1982-11-22 1984-06-06 Rohm Co Ltd Lining-up supplier for tip parts
JPS60197513A (en) * 1984-03-17 1985-10-07 Nitto Kogyo Kk Solid feeding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2005003002A1 (en) * 2003-07-08 2007-09-20 アサヒ精機株式会社 Fine parts feeder

Also Published As

Publication number Publication date
JP2517844Y2 (en) 1996-11-20

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