JP2517844Y2 - Chip circuit component supply device - Google Patents

Chip circuit component supply device

Info

Publication number
JP2517844Y2
JP2517844Y2 JP1991040310U JP4031091U JP2517844Y2 JP 2517844 Y2 JP2517844 Y2 JP 2517844Y2 JP 1991040310 U JP1991040310 U JP 1991040310U JP 4031091 U JP4031091 U JP 4031091U JP 2517844 Y2 JP2517844 Y2 JP 2517844Y2
Authority
JP
Japan
Prior art keywords
component
chip
shaped circuit
slider
discharge pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1991040310U
Other languages
Japanese (ja)
Other versions
JPH0627746U (en
Inventor
高志 今川
勝 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1991040310U priority Critical patent/JP2517844Y2/en
Publication of JPH0627746U publication Critical patent/JPH0627746U/en
Application granted granted Critical
Publication of JP2517844Y2 publication Critical patent/JP2517844Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】本考案は、チップ状回路部品をバ
ルク状に収納した容器から、同チップ部品を部品排出パ
イプに一列に取り出し、これを部品搬送路に1つずつ送
り出す装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for taking out chip components from a container in which chip-like circuit components are stored in a bulk, into a component discharge pipe, and sending them out to a component conveying path one by one.

【0003】[0003]

【従来の技術】複数の容器の中にバルク状に収納された
チップ状回路部品を1つずつ取り出し、これを回路基板
の所定の位置に搭載する自動マウント装置が用いられて
いる。この装置において用いられる部品供給装置では、
容器の中にバルク状に収納されたチップ状回路部品を部
品排出パイプに一列に取り出し、例えばこれをディスト
リビュータの案内パイプに通じる部品搬送路へ1つずつ
送る。
2. Description of the Related Art An automatic mounting apparatus has been used in which chip-shaped circuit components stored in bulk in a plurality of containers are taken out one by one and mounted on a predetermined position of a circuit board. In the component supply device used in this device,
The chip-shaped circuit components stored in bulk in the container are taken out in a line to the component discharge pipe, and are fed one by one to the component transfer path leading to the guide pipe of the distributor.

【0004】この種の従来のチップ状回路部品供給装置
において、前記部品排出パイプから部品搬送路へチップ
状回路部品を送る機構は、その間でスライドし、2本の
部品搬送路へチップ状回路部品を交互に送るスライド板
を備えるものであった。しかし、このような従来のスラ
イド板を用いるものでは、スライダの一回の往復動作に
より、チップ状回路部品が2本の部品搬送路に交互に1
個ずつしか供給されない。このため、回路基板に同じ種
類のチップ状回路部品を複数マウントしようとする場
合、そのマウントされるチップ状回路部品の数の半分の
数の容器を備えなけらばならない。
In this type of conventional chip-shaped circuit component supply device, the mechanism for feeding the chip-shaped circuit component from the component discharge pipe to the component transport path slides between them and the chip-shaped circuit component is fed to the two component transport paths. It was equipped with a slide plate for alternately feeding. However, in such a conventional slide plate, one reciprocating movement of the slider causes the chip-shaped circuit components to alternate between the two component transfer paths.
Only one by one is supplied. For this reason, when a plurality of chip-shaped circuit components of the same type are to be mounted on the circuit board, it is necessary to equip with half as many containers as the mounted chip-shaped circuit components.

【0005】そこで、本件考案者らは先に、回転するス
ライダを用いた部品供給装置を提案し、これを実用新案
登録出願した(平成2年実用新案登録願第35122
号)。その概要を図3〜図5により説明すると、次の通
りである。すなわち、図3において矢印で示すように、
容器1が上下に往復されるのに伴い、同容器1の中にバ
ルク状に収納されたチップ状回路部品aが部品排出パイ
プ49の中に一列に取り出される。この排出パイプ49
に並んだチップ状回路部品aは、円盤状のスライダ54
が図3及ぶ図4において矢印の方向に間欠回転するのに
伴い、その部品収納孔64、64…に一つずつ収納され
る。スライダ54の部品収納孔64、64…の全てにチ
ップ状回路部品aが収納されたところで、スライダ54
が図3及び図4において矢印で示す方向にさらに回転
し、部品収納孔64、64とその下の部品搬送路10、
10…の上端とが各々上下に合う。その後、シャッタ5
0が図4に矢印で示すようにスライドし、図5で示すよ
うに、その部品通過孔51、51…が部品収納孔64、
64…と部品搬送路10、10…の上端とを通じさせ
る。このため、部品収納孔64、64…の中に各々収納
されたチップ状回路部品a、a…が部品搬送路10、1
0…に各々に送り出される。その後スライダ54とシャ
ッタ50が元位置に戻り、以下同様の動作を繰り返す。
Therefore, the inventors of the present invention have previously proposed a parts supply device using a rotating slider and filed a utility model registration application (1990 utility model registration application No. 35122).
issue). The outline will be described below with reference to FIGS. 3 to 5. That is, as shown by the arrow in FIG.
As the container 1 reciprocates up and down, the chip-shaped circuit components a stored in bulk in the container 1 are taken out in a line into the component discharge pipe 49. This discharge pipe 49
The chip-shaped circuit components a lined up in
Are intermittently rotated in the directions of the arrows in FIGS. 3 and 4, and are accommodated one by one in the component accommodating holes 64, 64 ... When the chip-shaped circuit component a is stored in all of the component storage holes 64, 64 ... Of the slider 54, the slider 54
3 further rotates in the direction indicated by the arrow in FIGS. 3 and 4, and the component storage holes 64, 64 and the component transport path 10 thereunder,
The upper ends of 10 ... Align vertically. After that, shutter 5
0 slides as shown by the arrow in FIG. 4, and as shown in FIG. 5, the component passage holes 51, 51 ...
64 ... and the upper ends of the component transport paths 10, 10 ... Therefore, the chip-shaped circuit components a, a ... Stored in the component storage holes 64, 64 ...
It is sent to each 0. After that, the slider 54 and the shutter 50 return to their original positions, and the same operation is repeated thereafter.

【0006】[0006]

【考案が解決しようとしている課題】本件考案者らが提
案した前記の部品供給装置では、一度に多数のチップ状
回路部品aを各々その数に応じた部品搬送路10、10
…に送り出すことができる。しかしこの場合に、誤動作
により部品排出パイプ49側からスライダ54の部品収
納孔64、64の中にチップ状回路部品aが送られない
ことがある。そのような場合には、一部または全部の部
品収納孔64の中にチップ状回路部品aが存在しないま
ま前記シャッタ50によるチップ状回路部品aの送り出
しの動作が行なわれてしまう。そうすると、通常供給さ
れるべきチップ状回路部品aが所定の供給先に供給され
ないというトラブル、いわゆる欠品が生じてしまう。そ
こで本考案は、この課題を解消し、部品排出パイプ49
からスライダの部品収納孔64にチップ状回路部品aを
受け入れ、次に送る前に部品収納孔64の中のチップ状
回路部品aの有無を検査することができる部品供給装置
を提供することを目的とする。
DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In the above-mentioned component supply apparatus proposed by the present inventors, a large number of chip-shaped circuit components a at a time are provided with component transfer paths 10 and 10, respectively.
Can be sent to ... However, in this case, the chip-shaped circuit component a may not be fed from the component discharge pipe 49 side into the component storage holes 64, 64 of the slider 54 due to a malfunction. In such a case, the operation of sending out the chip-shaped circuit component a by the shutter 50 is performed without the chip-shaped circuit component a existing in some or all of the component storage holes 64. Then, there occurs a trouble that the chip-shaped circuit component a, which should be normally supplied, is not supplied to a predetermined supply destination, that is, a so-called defective product. Therefore, the present invention solves this problem and replaces the parts discharge pipe 49.
To provide a component supply device capable of receiving a chip-shaped circuit component a from a slider into a component storage hole 64 of a slider and inspecting the presence or absence of the chip-shaped circuit component a in the component storage hole 64 before the next sending. And

【0007】[0007]

【課題を解決するための手段】すなわち本考案では、前
記目的を達成するため、チップ状回路部品がバルク状に
収納される容器と、該容器の中からチップ状回路部品が
一列に排出される部品排出パイプと、該部品排出パイプ
の下に配置された部品搬送路と、チップ状回路部品を部
品排出パイプから部品搬送路へ分配するスライダとを備
えたチップ状回路部品供給装置において、前記スライダ
が回転する板体であり、該スライダの回転中心の周りに
前記チップ状回路部品が収納される複数の部品収納孔が
配列され、前記部品収納孔はスライダの回転に伴い部品
排出パイプの下端の下と、その中のチップ状回路部品の
有無を検知する検査位置とを通過し、この検査位置の上
方には、そこに停止した部品収納孔に向けて下降し、同
収納孔に収納されたチップ状回路部品への接触の有無に
より、チップ状回路部品の有無を検知する触針式の検知
手段を配置したことを特徴とするチップ状回路部品供給
装置を提供する。
[Means for Solving the Problems] That is, according to the present invention, in order to achieve the above-mentioned object, a container in which chip-shaped circuit components are stored in a bulk form, and the chip-shaped circuit components are discharged in a line from the container. In the chip-shaped circuit component supply device, comprising: a component discharge pipe, a component transport path arranged under the component discharge pipe, and a slider for distributing the chip-shaped circuit component from the component discharge pipe to the component transport path. Is a plate body that rotates, and a plurality of component storage holes for storing the chip-shaped circuit components are arranged around the rotation center of the slider, and the component storage holes are formed at the lower end of the component discharge pipe as the slider rotates. It passes through the bottom and the inspection position that detects the presence or absence of chip-shaped circuit components inside it, and above this inspection position.
Towards the component storage hole that stopped there,
Whether there is contact with the chip-shaped circuit components stored in the storage holes
-Based sensing by detecting the presence or absence of chip-shaped circuit components
There is provided a chip-shaped circuit component supply device characterized by arranging means .

【0008】[0008]

【作用】本考案によるチップ状回路部品の供給装置で
は、スライダの部品収納孔が部品排出パイプの下を通過
し、さらにチップ状回路部品の有無を検知する検査位置
をを通過し、そこで検査手段により、部品収納孔内のチ
ップ状回路部品の有無が検査されるため、部品排出パイ
プ49から部品収納孔にチップ状回路部品を受け入れな
がら、確実にチップ状回路部品が受け入れられたかを検
査することができる。従って、この時点でチップ状回路
部品の有無を検査した後、部品収納孔からチップ状回路
部品を送ることができるため、供給先へ供給すべきチッ
プ状回路部品が欠品となるのが未然に防止される。この
ようなチップ状回路部品の供給装置では、前述のように
複数の部品収納孔からそれに収納したチップ状回路部品
を一斉に送り出す。このため、このチップ状回路部品の
有無を検査する時点では、部品収納孔の底部はシャッタ
等で閉じられている。本発明によるチップ状回路部品の
供給装置では、前記の検査手段として、検査位置に停止
した部品収納孔に向けてその上方から下降し、同収納孔
に収納されたチップ状回路部品への接触の有無により、
チップ状回路部品の有無を検知する触針式のものが用い
られているので、部品収納孔がシャッタ等により閉じら
れていても、確実にチップ状回路部品の有無を検知する
ことができる。
In the chip-shaped circuit component supply device according to the present invention, the inspection position for detecting the presence or absence of the chip-shaped circuit component when the component storage hole of the slider passes under the component discharge pipe.
, Where the inspection means checks the inside of the component storage hole.
-Up like circuit components because that whether the inspection of, while receiving the chip-like circuit component in the component accommodating hole from the component discharge pipe 49, it is possible to check whether reliably chip-like circuit component is accepted. Therefore, at this point in time, after the presence or absence of the chip-shaped circuit component is inspected, the chip-shaped circuit component can be sent from the component storage hole, so that the chip-shaped circuit component to be supplied to the supply destination is out of stock. To be prevented. this
In such a chip-shaped circuit component supply device, as described above,
Chip-shaped circuit components stored in multiple component storage holes
To send out all at once. Therefore, this chip-shaped circuit component
When inspecting for presence or absence, the bottom of the component storage hole is the shutter.
It is closed by etc. The chip-shaped circuit component according to the present invention
In the supply device, as the above-mentioned inspection means, stop at the inspection position
To the component storage hole,
Depending on the presence or absence of contact with the chip-shaped circuit components stored in
A stylus type that detects the presence or absence of chip-shaped circuit parts is used.
Since the component storage hole is closed by a shutter etc.
Even if it is present, the presence / absence of chip-shaped circuit components can be reliably detected.
be able to.

【0009】[0009]

【実施例】次に、図1と図2を参照しながら、本考案の
実施例について詳細に説明する。本考案の実施例による
部品供給装置が図1に示されている。この実施例におい
て、漏斗状の底面を有するベース部材38と、このベー
ス部材38の周辺部に嵌め込まれた筒形の筒状部材39
とから容器1が構成されている。ベース部材38の底面
が最も低くなった中央部に通孔が開設され、この通孔か
ら部品排出パイプ49の上端がスライド自在に嵌め込ま
れ、同パイプ49の上端が容器1の中に挿入されてい
る。図示の場合、部品排出パイプ49は、容器1の中心
軸にほぼ一致するよう挿入され、その上端は斜に開口し
ている。
Embodiments of the present invention will now be described in detail with reference to FIGS. A component feeder according to an embodiment of the present invention is shown in FIG. In this embodiment, a base member 38 having a funnel-shaped bottom surface and a cylindrical tubular member 39 fitted around the base member 38.
The container 1 is composed of A through hole is opened in the central portion where the bottom surface of the base member 38 is the lowest, and the upper end of the component discharge pipe 49 is slidably fitted into the through hole, and the upper end of the pipe 49 is inserted into the container 1. There is. In the illustrated case, the component discharge pipe 49 is inserted so as to substantially coincide with the central axis of the container 1, and the upper end thereof is obliquely opened.

【0010】前記ベース部材39の底面中央部から突設
されたスライド部材37がガイドベース38に固定され
たガイド部材36の凹部にスライド自在に嵌合してい
る。さらに、ガイドベース38は、フレーム35に取り
付けられている。また、容器1には、図示を省略した上
下駆動機構が連結される。これにより、前記ガイド部材
36に案内されて、容器1が上下に往復駆動される。
A slide member 37 protruding from the central portion of the bottom surface of the base member 39 is slidably fitted in a recess of a guide member 36 fixed to a guide base 38 . Further, the guide base 38 is attached to the frame 35. A vertical drive mechanism (not shown) is connected to the container 1. As a result, the container 1 is guided by the guide member 36 and is vertically reciprocally driven.

【0011】前記部品排出パイプ49の下端には、ディ
ストリビュータ2の案内パイプ21、21…に通じる部
品搬送路10、10…へチップ状電子部品aを1つずつ
逃がすエスケープメント機構が設けられている。すなわ
ち、前記部品排出パイプ49の下端の下に円盤状のスラ
イダ54が配置され、このスライダ54は、その中心の
周りに矢印で示すように回転する。このスライダ54の
前記回転中心の周りには、チップ状電子部品aが縦に1
個だけ入る大きさの複数の部品収納孔64、64…が一
定の角度毎に開設されている。前記部品排出パイプ49
の下端は、スライダ54の回転により、前記部品収納孔
64、64…が通過する位置の真上に配置されている。
At the lower end of the component discharge pipe 49, an escapement mechanism is provided for letting out the chip-shaped electronic components a one by one to the component transfer paths 10, 10 ... Which communicate with the guide pipes 21, 21 ,. . That is, a disk-shaped slider 54 is arranged below the lower end of the component discharge pipe 49, and the slider 54 rotates around its center as indicated by the arrow. Around the rotation center of the slider 54, a chip-shaped electronic component a is vertically
A plurality of component storage holes 64, 64, ... The parts discharge pipe 49
The lower end of is placed directly above the position where the component storage holes 64, 64 ... Pass by the rotation of the slider 54.

【0012】さらに、スライダ54の回転により、前記
部品収納孔64、64…が通過する個所に、その中のチ
ップ状回路部品aの有無を検査する検査器が配置されて
いる。例えば図1及び図2で示した実施例では、ダンパ
53を介してソレノイド56に連結された触針52が部
品収納孔64、64…が通過する上に配置されている。
図示の場合は、この触針52が部品排出パイプ49の位
置からスライダ54が180°回転した位置に配置され
ている。さらに、この触針52からアーム58が突設さ
れ、その脇にこのアーム58を検知するセンサ57が配
置されている。
Further, by the rotation of the slider 54, an inspecting device for inspecting the presence or absence of the chip-shaped circuit component a therein is arranged at a position where the component storage holes 64, 64 ... Pass through. For example, in the embodiment shown in FIGS. 1 and 2, the stylus 52 connected to the solenoid 56 via the damper 53 is arranged above the component storage holes 64, 64 ...
In the illustrated case, the stylus 52 is arranged at a position where the slider 54 is rotated 180 ° from the position of the component discharge pipe 49. Further, an arm 58 is provided so as to project from the stylus 52, and a sensor 57 for detecting the arm 58 is arranged beside it.

【0013】この触針52の下に部品収納孔64が来た
とき、ソレノイド56が作動し、触針52が押し下げら
れるが、このとき部品収納孔64の中にチップ状回路部
品aがあると、触針52の先端がチップ状回路部品aに
当たってその下降が阻止され、ソレノイド56のストロ
ークがダンパ53で吸収される。この状態では、図2に
示すように、アーム58がセンサ57に達しないため、
同センサ57がアーム58を検知しない。他方、部品収
納孔64の中にチップ状回路部品aが無いと、触針52
の先端が部品収納孔64の深くまで挿入される。この状
態では、アーム58が図2に示す位置よりさらに下降
し、センサ57に達するため、同センサ57がアーム5
8を検知する。これにより、部品収納孔64にチップ状
回路部品aが無いことが検知される。なおこのチップ状
回路部品aの有無の検査は、部品排出パイプ49の下で
他の部品収納孔64がチップ状回路部品aを受け入れる
時に並行して行なわれる。
When the component storage hole 64 comes under the stylus 52, the solenoid 56 is actuated to push down the stylus 52. At this time, if the chip-shaped circuit component a exists in the component storage hole 64. The tip of the stylus 52 hits the chip-shaped circuit component a to prevent its descending, and the stroke of the solenoid 56 is absorbed by the damper 53. In this state, the arm 58 does not reach the sensor 57, as shown in FIG.
The sensor 57 does not detect the arm 58. On the other hand, if there is no chip-shaped circuit component a in the component storage hole 64, the stylus 52
Is inserted deep into the component storage hole 64. In this state, the arm 58 further descends from the position shown in FIG.
8 is detected. As a result, it is detected that the chip-shaped circuit component a does not exist in the component storage hole 64. It should be noted that the inspection of the presence or absence of the chip-shaped circuit component a is performed in parallel when the other component storage hole 64 receives the chip-shaped circuit component a under the component discharge pipe 49.

【0014】スライダ54の下に配置されたフレーム3
5には、同スライダ54の部品収納孔64、64…と同
じ数の部品搬送路10、10…が連結され、この部品搬
送路10、10…の上端は、前記スライダ54の部品収
納孔64、64…が配列されたのと同径の同心円状に同
じ角度毎に配列されている。但しそれらの位置は、前記
スライダ54の部品収納孔64、64…に対して30°
ずれている。
The frame 3 placed under the slider 54
5 are connected with the same number of component transfer paths 10, 10 ... As the component storage holes 64, 64 ... Of the slider 54, and the upper ends of the component transfer paths 10, 10 ... , 64 ... Are arranged concentrically with the same diameter at the same angle. However, their positions are 30 ° with respect to the component storage holes 64, 64 ... Of the slider 54.
Deviated.

【0015】これらスライダ54とフレーム35との間
には、図1において左右にスライドする板状のシャッタ
50が配置されている。このシャッタ50には、前記部
品搬送路10、10…が配列されたのと同径の円上に同
じ間隔で部品通過孔51、51…が開設され、そのスラ
イドにより、この部品通過孔51、51…が前記部品搬
送路10、10…の上端と位置が合ったり、ずれたりす
る。
Between the slider 54 and the frame 35, a plate-like shutter 50 that slides left and right in FIG. 1 is arranged. In the shutter 50, component passage holes 51, 51 ... Are opened at the same intervals on a circle having the same diameter as the arrangement of the component conveyance paths 10, 10 ..., By sliding the component passage holes 51, 51. .. are aligned with the upper ends of the component transfer paths 10, 10 ...

【0016】この部品供給装置では、前記容器1の上下
動に伴い、その中に収納されたチップ状電子部品a、a
…が部品排出パイプ49の中に縦に一列になって取り出
される。スライダ54が回転するのに伴い、図2にも示
すように、部品収納孔64、64…が部品排出パイプの
下端を順次通過したところで、その中にチップ状電子部
品が1つずつ収納される。このとき、図1に示すよう
に、シャッタ50は、その部品通過孔51、51…がス
ライダ54の部品収納孔64、64…と部品搬送路1
0、10…の上端から何れもずれた位置にあり、従っ
て、スライダ54の部品収納孔64、64…の下端は閉
じている。
In this component supply device, as the container 1 moves up and down, the chip-shaped electronic components a, a housed therein are placed.
Are taken out vertically in a line in the component discharge pipe 49. As the slider 54 rotates, as shown in FIG. 2, when the component storage holes 64, 64, ... sequentially pass through the lower ends of the component discharge pipes, one chip-shaped electronic component is stored therein. . At this time, as shown in FIG. 1, in the shutter 50, the component passage holes 51, 51 ... And the component storage holes 64, 64.
0, 10, ... Are displaced from the upper ends, and therefore the lower ends of the component storage holes 64, 64 ... Of the slider 54 are closed.

【0017】その後スライダ54の回転により、部品収
納孔64が触針52の下に移動すると、そこで前述のよ
うにして部品収納孔64の中のチップ状回路部品aの有
無が検査される。そして、もし或る部品収納孔64の中
にチップ状回路部品aが無いことが発見されたときは、
スライダ54を回転させて、当該部品収納孔64を再び
部品排出パイプ49の下に移動させ、その中にチップ状
回路部品aを受け入れる。
After that, when the component housing hole 64 is moved below the stylus 52 by the rotation of the slider 54, the presence or absence of the chip-shaped circuit component a in the component housing hole 64 is inspected there as described above. Then, if it is found that the chip-shaped circuit component a is not present in the certain component storage hole 64,
The slider 54 is rotated to move the component storage hole 64 again below the component discharge pipe 49, and the chip-shaped circuit component a is received therein.

【0018】こうしてその全ての部品収納孔64、64
…にチップ状電子部品a、a…が収納された後、スライ
ダ54がさらに30°だけ回転する。すると、スライダ
54の部品収納孔64、64…とその下にある部品搬送
路10、10…の上端とが上下に位置合わせされる。こ
の状態でシャッタ50をスライドさせ、その部品通過孔
51、51…を前記部品搬送路10、10…の上端と位
置合わせすると、スライダ54の部品収納孔64、64
…と部品搬送路10、10…とがシャッタの部品通過孔
51、51…を介して連通し、スライダ54の複数の部
品収納孔64、64…の中に各々収納されたチップ状電
子部品a、a…が部品搬送路10、10…に各々に送り
出される。その後スライダ54が30°回転して元の位
置に戻ると共に、シャッタ50も元位置に戻り、以下同
様の動作を繰り返しながら、チップ状電子部品a、a…
が送り出される。
Thus, all of the component storage holes 64, 64
After the chip-shaped electronic components a, a ... Are housed in the ..., The slider 54 is further rotated by 30 °. Then, the component storage holes 64, 64, ... Of the slider 54 and the upper ends of the component transport paths 10, 10 ,. In this state, the shutter 50 is slid to align the component passage holes 51, 51 ... With the upper ends of the component transport paths 10, 10 ,.
... and the component transfer paths 10, 10 ... Are communicated with each other through the component passage holes 51, 51 ... Of the shutter, and the chip-shaped electronic components a housed in the plurality of component storage holes 64, 64. , A ... Are sent to the component transport paths 10, 10 ,. Thereafter, the slider 54 rotates 30 ° to return to the original position, the shutter 50 also returns to the original position, and the same operation is repeated thereafter, and the chip-shaped electronic components a, a ...
Is sent out.

【0019】なお、前記の実施例においては、部品収納
孔64のチップ状回路部品aの有無を検査する手段とし
て、触針52とソレノイド56及びセンサ57を組み合
わせたものを使用したが、この他の検査手段を用いるこ
ともできる。例えば、触針52の挿入深さをリニアスケ
ールで直接測定するものや、部品収納孔64が通過する
上に発光器と受光器とを配置し、発光器から発射された
光がチップ状回路部品aの電極部分で反射される光を受
光器で受光できるか否かでチップ状回路部品の有無を判
断する手段等が挙げられる。
In the above embodiment, a combination of the stylus 52, the solenoid 56 and the sensor 57 is used as a means for inspecting the presence or absence of the chip-shaped circuit component a in the component storage hole 64. It is also possible to use the above inspection means. For example, one in which the insertion depth of the stylus 52 is directly measured with a linear scale, or a light emitter and a light receiver are arranged above the component storage hole 64, and the light emitted from the light emitter is chip-shaped circuit component. Means for determining the presence or absence of the chip-shaped circuit component based on whether or not the light reflected by the electrode portion of a can be received by the light receiver.

【0020】[0020]

【考案の効果】以上説明した通り、本考案によれば、部
品排出パイプからスライダの部品収納孔にチップ状回路
部品を受け入れながら、別の部品収納孔のチップ状回路
部品の有無を検査することができるため、部品収納孔の
チップ状回路部品を送り出す動作をする前にチップ状回
路部品が無いことを発見し、欠品を未然に防ぐことが
き、誤動作の少ないチップ状回路部品供給装置が提供で
きる。また、検査手段として、触針式のものを使用した
ことにより、部品収納孔の底部が閉じられている時で
も、チップ状回路部品の有無を確実に検査できる。
As described above, according to the present invention, it is possible to inspect a chip-shaped circuit component in another component storage hole while receiving the chip-shaped circuit component from the component discharge pipe into the component storage hole of the slider. that since it is discovered that there is no chip-like circuit component prior to the operation for feeding the chip-like circuit component parts receiving hole, prevent shortage
In this way, it is possible to provide a chip-shaped circuit component supply device with few malfunctions . A stylus type was used as the inspection means.
This ensures that the bottom of the component storage hole is closed.
Also, the presence or absence of chip-shaped circuit components can be reliably inspected.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の実施例であるチップ状回路部品供給装
置の要部縦断斜視図である。
FIG. 1 is a perspective view of a longitudinal section of a main part of a chip-shaped circuit component supply device according to an embodiment of the present invention.

【図2】同部品供給装置のエスケープメント部分の要部
縦断側面図である。
FIG. 2 is a vertical sectional side view of a main part of an escapement portion of the component supply device.

【図3】従来例であるチップ状回路部品供給装置の要部
縦断斜視図である。
FIG. 3 is a vertical cross-sectional view of a main portion of a conventional chip-shaped circuit component supply device.

【図4】同部品供給装置のエスケープメント部分の部品
通路の配置関係を示す要部平面図である。
FIG. 4 is a plan view of relevant parts showing the arrangement relationship of component passages in the escapement portion of the component supply device.

【図5】図4のB−B部拡大断面図である。 1 容器 10 部品搬送路 49 部品排出パイプ 52 触針 53 ダンパ 54 スライダ 56 ソレノイド 57 センサ 58 触針のアーム 64 スライダの部品収納孔 a チップ状回路部品5 is an enlarged cross-sectional view taken along the line BB in FIG. 1 Container 10 Component Transport Path 49 Component Discharge Pipe 52 Stylus 53 Damper 54 Slider 56 Solenoid 57 Sensor 58 Stylus Arm 64 Slider Component Storage Hole a Chip-shaped Circuit Component

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of utility model registration request] 【請求項1】 チップ状回路部品がバルク状に収納され
る容器と、該容器の中からチップ状回路部品が一列に排
出される部品排出パイプと、該部品排出パイプの下に配
置された部品搬送路と、チップ状回路部品を部品排出パ
イプから部品搬送路へ分配するスライダとを備えたチッ
プ状回路部品供給装置において、前記スライダが回転す
る板体であり、該スライダの回転中心の周りに前記チッ
プ状回路部品が収納される複数の部品収納孔が配列さ
れ、前記部品収納孔はスライダの回転に伴い部品排出パ
イプの下端の下と、その中のチップ状回路部品の有無を
検知する検査位置とを通過し、この検査位置の上方に
は、そこに停止した部品収納孔に向けて下降し、同収納
孔に収納されたチップ状回路部品への接触の有無によ
り、チップ状回路部品の有無を検知する触針式の検知手
段を配置したことを特徴とするチップ状回路部品供給装
置。
1. A container in which chip-shaped circuit components are stored in a bulk shape, a component discharge pipe from which the chip-shaped circuit components are discharged in a row, and a component which is arranged under the component discharge pipe. In a chip-shaped circuit component supply device including a transport path and a slider for distributing the chip-shaped circuit component from a component discharge pipe to the component transport path, the slider is a plate that rotates, and a slider is provided around a rotation center of the slider. A plurality of component storage holes in which the chip-shaped circuit components are stored are arranged, and the component storage holes are under the lower end of the component discharge pipe according to the rotation of the slider and an inspection for detecting the presence or absence of the chip-shaped circuit components therein. Position and above this inspection position
Lowers toward the parts storage hole stopped there,
Depending on the presence or absence of contact with the chip-shaped circuit components housed in the holes
, A stylus-type detector that detects the presence or absence of chip-shaped circuit components.
A chip-shaped circuit component supply device characterized by arranging steps .
JP1991040310U 1991-04-30 1991-04-30 Chip circuit component supply device Expired - Lifetime JP2517844Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991040310U JP2517844Y2 (en) 1991-04-30 1991-04-30 Chip circuit component supply device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991040310U JP2517844Y2 (en) 1991-04-30 1991-04-30 Chip circuit component supply device

Publications (2)

Publication Number Publication Date
JPH0627746U JPH0627746U (en) 1994-04-12
JP2517844Y2 true JP2517844Y2 (en) 1996-11-20

Family

ID=12577048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991040310U Expired - Lifetime JP2517844Y2 (en) 1991-04-30 1991-04-30 Chip circuit component supply device

Country Status (1)

Country Link
JP (1) JP2517844Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100649448B1 (en) * 2003-07-08 2006-11-29 아사히세이키 가부시키가이샤 Thin part-feeding device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832334A (en) * 1971-08-28 1973-04-28
JPS5997919A (en) * 1982-11-22 1984-06-06 Rohm Co Ltd Lining-up supplier for tip parts
JPS60197513A (en) * 1984-03-17 1985-10-07 Nitto Kogyo Kk Solid feeding device

Also Published As

Publication number Publication date
JPH0627746U (en) 1994-04-12

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