JPH062764U - Device structure with light emitting element mounting substrate - Google Patents

Device structure with light emitting element mounting substrate

Info

Publication number
JPH062764U
JPH062764U JP4245992U JP4245992U JPH062764U JP H062764 U JPH062764 U JP H062764U JP 4245992 U JP4245992 U JP 4245992U JP 4245992 U JP4245992 U JP 4245992U JP H062764 U JPH062764 U JP H062764U
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
housing
circuit board
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4245992U
Other languages
Japanese (ja)
Inventor
篤 井坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP4245992U priority Critical patent/JPH062764U/en
Publication of JPH062764U publication Critical patent/JPH062764U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

(57)【要約】 【目的】 部品実装面と反対側に報知のための発光素子
を設けた機器において、回路基板の占める容積を低減す
る。 【構成】 ハウジング2bの内側面に一方基板面が隣接
して配設され、他方基板面に電子部品4,5が実装され
る回路基板3を有する。この回路基板3は、発光素子L
ED1が実装される位置に孔6が穿設され、この孔6内
に発光素子LED1が発光の向きをハウジング2b側に
して挿入される。また、ハウジング2bは、孔6に対面
する位置に表示窓2cが形成されている。
(57) [Abstract] [Purpose] To reduce the volume occupied by a circuit board in a device provided with a light emitting element for notification on the side opposite to the component mounting surface. A circuit board 3 is provided on the inner surface of a housing 2b so that one board surface is adjacently arranged and the other board surface has electronic components 4 and 5 mounted thereon. This circuit board 3 has a light emitting element L.
A hole 6 is formed at a position where the ED 1 is mounted, and the light emitting element LED1 is inserted into the hole 6 with the direction of light emission facing the housing 2b. A display window 2c is formed in the housing 2b at a position facing the hole 6.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

この考案は、発光素子が実装された回路基板を内設する機器の構造に関する。 The present invention relates to a structure of a device in which a circuit board on which a light emitting element is mounted is installed.

【0002】[0002]

【従来の技術】[Prior art]

従来、例えば電気ひげそり器のような電動機器等においては、その動作状態を 使用者が容易に確認し得るように、外部に動作状態を報知するようにしたものが 提供されている。この種の報知手段としては、一般的に発光ダイオード等の発光 素子が汎用されており、回路基板上に実装されている。 2. Description of the Related Art Conventionally, for example, electric devices such as an electric shaver have been provided with an external notification of the operating state so that the user can easily confirm the operating state. As this type of notification means, a light emitting element such as a light emitting diode is generally used and mounted on a circuit board.

【0003】 図3,図4は、従来における部品実装状態を示す回路基板の断面図である。 図3は発光ダイオードLED11を始め他部品21の全てが回路基板22の同 一面に実装されたものであり、発光ダイオードLED11の発光の向きは他部品 21の実装面側である。従って、上記報知手段は上記実装面側に設けられること となる。この場合、回路基板22の下面は、この機器のハウジングに隣接して配 設することができる。3 and 4 are cross-sectional views of a circuit board showing a conventional component mounting state. In FIG. 3, all the other components 21 including the light emitting diode LED11 are mounted on the same surface of the circuit board 22, and the light emission direction of the light emitting diode LED11 is the mounting surface side of the other component 21. Therefore, the notification means is provided on the mounting surface side. In this case, the lower surface of the circuit board 22 can be arranged adjacent to the housing of this device.

【0004】 また、図4は、発光ダイオードLED12が他部品23,24と反対側に実装 されたものであり、これにより発光ダイオードLED12の発光の向きを他部品 23,24の実装面側とは反対にしたものである。従って、上記報知手段を上記 実装面側と反対側に設けたいときは、図4に示すように実装されていた。In addition, FIG. 4 shows that the light emitting diode LED12 is mounted on the side opposite to the other components 23 and 24, so that the light emitting direction of the light emitting diode LED12 is different from the mounting surface side of the other components 23 and 24. It is the opposite. Therefore, when it is desired to provide the notification means on the side opposite to the mounting surface side, the notification means is mounted as shown in FIG.

【0005】[0005]

【考案が解決しようとする課題】[Problems to be solved by the device]

ところが、図4に示す実装方法では、発光ダイオードLED12を他部品23 ,24と反対面に実装するため、回路基板22と機器のハウジング間に発光ダイ オードLED12の実装寸法が必要となり、特に厚さに制約がある等、装置の小 型化の要請に応えることが困難である。 However, in the mounting method shown in FIG. 4, since the light emitting diode LED12 is mounted on the surface opposite to the other components 23 and 24, the mounting dimension of the light emitting diode LED12 is required between the circuit board 22 and the housing of the device, and especially the thickness It is difficult to meet the demands for downsizing of equipment because of restrictions on the size.

【0006】 また、部品実装のためのはんだリフローを2回繰り返すことになり、これによ り部品の信頼性を低下させる虞れがある。Further, the solder reflow for mounting the component is repeated twice, which may reduce the reliability of the component.

【0007】 本考案は、上記課題に鑑みてなされたもので、部品実装面と反対側に報知のた めの発光素子を設けた機器において、回路基板の占める容積を低減した発光素子 実装基板を備えた機器構造を提供することを目的とする。The present invention has been made in view of the above problems, and in a device provided with a light emitting element for notifying on the side opposite to the component mounting surface, a light emitting element mounting board in which the volume occupied by the circuit board is reduced is provided. It is an object to provide a device structure provided with the device.

【0008】[0008]

【課題を解決するための手段】[Means for Solving the Problems]

上記目的を達成するために、本考案は、ハウジングと、このハウジングの内側 面に一方基板面が隣接して配設され、他方基板面に電子部品が実装される回路基 板とを有する機器において、上記回路基板は発光素子が実装される位置に孔が穿 設され、この孔内に上記発光素子が発光の向きを上記一方基板面側にして挿入さ れているとともに、上記ハウジングは上記孔に対面する位置に表示窓が形成され ている。 In order to achieve the above-mentioned object, the present invention provides an apparatus having a housing and a circuit board in which one board surface is disposed adjacent to the inner surface of the housing, and an electronic component is mounted on the other board surface. , The circuit board is provided with a hole at a position where the light emitting element is mounted, and the light emitting element is inserted into the hole so that the light emitting direction is the one board surface side, and the housing is provided with the hole. A display window is formed at a position facing the.

【0009】[0009]

【作用】[Action]

本考案によれば、発光素子は回路基板の孔内に挿入されるので、ハウジングの 内側面に一方基板面が隣接して配設されることとなる。また、表示窓により、発 光素子の点灯が使用者に報知される。 According to the present invention, since the light emitting device is inserted into the hole of the circuit board, one board surface is disposed adjacent to the inner surface of the housing. Further, the display window notifies the user that the light emitting element is turned on.

【0010】[0010]

【実施例】【Example】

図2は本考案に係る発光素子実装基板を備えた機器が適用される充電器の一例 を示す回路ブロック図である。 交流電源に整流ブリッジBDが接続され、この整流ブリッジBDの両端子間に 、トランスT1の1次巻線L1とトランジスタQ3のスイッチング端子とが直列 に接続されている。また、整流ブリッジBDは、抵抗R3を介して充電制御回路 11に電源供給をしている。充電制御回路11の出力端P1は、トランジスタQ 3のベースに接続され、トランジスタQ3のオン、オフを制御している。 FIG. 2 is a circuit block diagram showing an example of a charger to which a device including a light emitting device mounting substrate according to the present invention is applied. A rectifying bridge BD is connected to the AC power supply, and the primary winding L1 of the transformer T1 and the switching terminal of the transistor Q3 are connected in series between both terminals of the rectifying bridge BD. Further, the rectification bridge BD supplies power to the charging control circuit 11 via the resistor R3. The output terminal P1 of the charge control circuit 11 is connected to the base of the transistor Q3 and controls the on / off of the transistor Q3.

【0011】 トランスT1の2次巻線L2の両端間には、ダイオードD1と蓄電池12とが 直列接続されている。A diode D1 and a storage battery 12 are connected in series between both ends of the secondary winding L2 of the transformer T1.

【0012】 充電制御回路11は、この充電器を制御するもので、トランジスタQ3のオン 、オフを制御することにより1次巻線L1をスイッチングして、2次巻線L2に 誘起される電圧をダイオードD1で整流して蓄電池12に充電電流を供給し、充 電する。The charging control circuit 11 controls this charger, and controls the on / off of the transistor Q3 to switch the primary winding L1 to switch the voltage induced in the secondary winding L2. It rectifies by the diode D1 and supplies a charging current to the storage battery 12 to charge it.

【0013】 また、蓄電池12の両極間には、抵抗R1、発光ダイオードLED1、トラン ジスタQ1からなる直列回路及び抵抗R2、発光ダイオードLED2、トランジ スタQ2からなる直列回路が、それぞれ並列接続されている。そして、トランジ スタQ1,Q2のベースは、抵抗R4,R5を介して充電制御回路11の出力端 P2,P3に接続されている。Further, a series circuit including a resistor R1, a light emitting diode LED1, and a transistor Q1 and a series circuit including a resistor R2, a light emitting diode LED2, and a transistor Q2 are connected in parallel between both electrodes of the storage battery 12. . The bases of the transistors Q1 and Q2 are connected to the output terminals P2 and P3 of the charging control circuit 11 via the resistors R4 and R5.

【0014】 発光ダイオードLED1は、充電中であることを表示するもので、発光ダイオ ードLED2は、充電が完了したことを表示するものである。The light emitting diode LED1 indicates that charging is in progress, and the light emitting diode LED2 indicates that charging is complete.

【0015】 すなわち、充電中は、出力端P2から‘H’レベルを出力し、出力端P3から ‘L’レベルを出力して、トランジスタQ1をオン、トランジスタQ2をオフす ることにより発光ダイオードLED1のみを点灯させて、充電中表示が行われる 。That is, during charging, the output terminal P2 outputs the “H” level and the output terminal P3 outputs the “L” level to turn on the transistor Q1 and turn off the transistor Q2. Only the light is turned on, and the charging indication is displayed.

【0016】 一方、充電が完了すれば、出力端P2から‘L’レベルを出力し、出力端P3 から‘H’レベルを出力して、トランジスタQ2をオン、トランジスタQ1をオ フすることにより発光ダイオードLED2を点灯させ、発光ダイオードLED1 を消灯させて、充電完了表示が行われる。On the other hand, when the charging is completed, the output terminal P2 outputs the “L” level, the output terminal P3 outputs the “H” level, the transistor Q2 is turned on, and the transistor Q1 is turned off to emit light. The diode LED2 is turned on, the light emitting diode LED1 is turned off, and the charging completion display is performed.

【0017】 このとき、抵抗R1,R2で発生する損失は、蓄電池12の電池電圧が4V、 抵抗R1,R2を流れる電流が4mAとすると、0.01Wとなる。従って、抵 抗R1,R2として、チップ抵抗を使用することができ、充電回路の小型化と発 熱防止が可能となる。At this time, the loss generated in the resistors R1 and R2 is 0.01 W when the battery voltage of the storage battery 12 is 4 V and the current flowing through the resistors R1 and R2 is 4 mA. Therefore, the chip resistors can be used as the resistors R1 and R2, and the charging circuit can be downsized and heat generation can be prevented.

【0018】 このように、発光ダイオードLED1,LED2をトランスT1の1次側では なく、2次側に配設しているので、1次側に配設した場合に比して、許容損失の 小さい部品や低耐圧の部品で回路が構成でき、小型化、低価格化が図れる。また 、損失が小さいため、発光ダイオードLED1,LED2に供給する電流を比較 的容易に増加させて、点灯を明るくできる。As described above, since the light emitting diodes LED1 and LED2 are arranged not on the primary side of the transformer T1 but on the secondary side, the permissible loss is smaller than that in the case of arranging on the primary side. The circuit can be composed of parts and low withstand voltage parts, and it is possible to reduce the size and cost. Further, since the loss is small, it is possible to relatively easily increase the current supplied to the light emitting diodes LED1 and LED2 to brighten the lighting.

【0019】 なお、発光ダイオードLED2のアノードを抵抗R1と発光ダイオードLED 1間に接続して抵抗R2を除いた構成でもよい。The anode of the light emitting diode LED2 may be connected between the resistor R1 and the light emitting diode LED1 to remove the resistor R2.

【0020】 図1は本考案に係る発光素子実装基板を備えた機器の部品実装状態を示す断面 図である。 発光素子実装基板を備えた機器1本体はその外部が合成樹脂等のハウジング2 a,2bで形成されている。回路基板3には、前記充電制御回路11等を構成す る表面実装部品4,5が実装されている。回路基板3は、内蔵部材の効率的配置 やデザイン性により決定されるハウジング2aの形状に制約され、その形状に合 わせて各部品4,5等が実装されるように、それらの位置が設計されている。FIG. 1 is a sectional view showing a component mounting state of a device including a light emitting element mounting substrate according to the present invention. The outside of the main body of the device 1 including the light emitting element mounting substrate is formed of housings 2a and 2b made of synthetic resin or the like. On the circuit board 3, surface mount components 4 and 5 which constitute the charge control circuit 11 and the like are mounted. The circuit board 3 is constrained by the shape of the housing 2a determined by the efficient arrangement of the built-in members and the design, and the positions of the parts 4 and 5 are designed so that the respective parts 4 and 5 are mounted according to the shape. Has been done.

【0021】 発光ダイオードLED1は、表面実装部品であり、部品4,5と同一面側に実 装されている。孔6は、回路基板3の回路パターンの発光ダイオードLED1の 実装位置に設けられ、発光ダイオードLED1の本体部分がこの孔6に挿入され て、発光の向きがハウジング2b側に設定されている。The light emitting diode LED1 is a surface-mounted component, and is mounted on the same side as the components 4 and 5. The hole 6 is provided at the mounting position of the light emitting diode LED1 in the circuit pattern of the circuit board 3, and the main body of the light emitting diode LED1 is inserted into the hole 6 so that the direction of light emission is set to the housing 2b side.

【0022】 そして、ハウジング2bの発光ダイオードLED1に対向する位置に表示窓2 cを形成すれば、この発光素子実装基板を備えた機器1の表示部を、ハウジング 2b側に設けることができる。By forming the display window 2c at a position facing the light emitting diode LED1 of the housing 2b, the display portion of the device 1 including this light emitting element mounting substrate can be provided on the housing 2b side.

【0023】 また、発光ダイオードLED1は、他の部品4,5と同一面側に実装されてい るので、1回のはんだリフローで済み、部品の信頼性が低下することはない。Further, since the light emitting diode LED1 is mounted on the same surface side as the other components 4 and 5, the solder reflow only needs to be performed once, and the reliability of the components does not deteriorate.

【0024】 なお、表示窓2cは、その部分に孔を穿設してもよいし、透明部材で蔽ったも のでもよい。The display window 2c may be provided with a hole in that portion or may be covered with a transparent member.

【0025】[0025]

【考案の効果】[Effect of device]

以上、本考案は、ハウジングと、このハウジングの内側面に一方基板面が隣接 して配設され、他方基板面に電子部品が実装される回路基板とを有する機器にお いて、上記回路基板は発光素子が実装される位置に孔が穿設され、この孔内に上 記発光素子が発光の向きを上記一方基板面側にして挿入されているとともに、上 記ハウジングは上記孔に対面する位置に表示窓が形成されているので、厚さが制 約された小型の機器において、部品の実装面と反対側の面をハウジングの内側面 に隣接させつつ発光素子による報知手段を設けることができる。 As described above, the present invention relates to an apparatus having a housing and a circuit board in which one board surface is adjacently arranged on the inner side surface of the housing, and an electronic component is mounted on the other board surface. A hole is formed at a position where the light emitting element is mounted, and the above light emitting element is inserted into the hole so that the light emitting direction is the one substrate surface side, and the housing is at a position facing the hole. Since the display window is formed in the device, in a small-sized device whose thickness is restricted, it is possible to provide the notification means by the light emitting element while the surface opposite to the mounting surface of the component is adjacent to the inner surface of the housing. .

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案に係る発光素子実装基板を備えた機器の
部品実装状態を示す断面図である。
FIG. 1 is a cross-sectional view showing a component mounting state of a device including a light emitting element mounting substrate according to the present invention.

【図2】同発光素子実装基板を備えた機器が適用される
充電器の一例を示す回路ブロック図である。
FIG. 2 is a circuit block diagram showing an example of a charger to which a device including the light emitting element mounting substrate is applied.

【図3】従来における部品実装状態を示す回路基板の断
面図である。
FIG. 3 is a cross-sectional view of a circuit board showing a conventional component mounting state.

【図4】従来における部品実装状態を示す回路基板の断
面図である。
FIG. 4 is a cross-sectional view of a circuit board showing a conventional component mounting state.

【符号の説明】[Explanation of symbols]

1 発光素子実装基板を備えた機器 2a,2b ハウジング 2c 表示窓 3 回路基板 4,5 表面実装部品 6 孔 11 充電制御回路 12 蓄電池 BD 整流ダイオード D1 ダイオード L1 1次巻線 L2 2次巻線 LED1,LED2 発光ダイオード Q1〜Q3 トランジスタ R1〜R5 抵抗 T1 トランス 1 Equipment equipped with light emitting element mounting substrate 2a, 2b Housing 2c Display window 3 Circuit board 4, 5 Surface mounting component 6 Hole 11 Charging control circuit 12 Storage battery BD Rectifying diode D1 Diode L1 Primary winding L2 Secondary winding LED1, LED2 Light emitting diode Q1 to Q3 Transistor R1 to R5 Resistor T1 Transformer

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 ハウジングと、このハウジングの内側面
に一方基板面が隣接して配設され、他方基板面に電子部
品が実装される回路基板とを有する機器において、上記
回路基板は発光素子が実装される位置に孔が穿設され、
この孔内に上記発光素子が発光の向きを上記一方基板面
側にして挿入されているとともに、上記ハウジングは上
記孔に対面する位置に表示窓が形成されていることを特
徴とする発光素子実装基板を備えた機器構造。
1. A device comprising: a housing; and a circuit board in which one board surface is disposed adjacent to an inner side surface of the housing, and an electronic component is mounted on the other board surface, wherein the circuit board includes a light emitting element. Holes are drilled at the mounting position,
The light emitting element is mounted in the hole so that the direction of light emission is directed to the one substrate surface side, and the housing has a display window formed at a position facing the hole. A device structure with a substrate.
JP4245992U 1992-06-19 1992-06-19 Device structure with light emitting element mounting substrate Pending JPH062764U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4245992U JPH062764U (en) 1992-06-19 1992-06-19 Device structure with light emitting element mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4245992U JPH062764U (en) 1992-06-19 1992-06-19 Device structure with light emitting element mounting substrate

Publications (1)

Publication Number Publication Date
JPH062764U true JPH062764U (en) 1994-01-14

Family

ID=12636660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4245992U Pending JPH062764U (en) 1992-06-19 1992-06-19 Device structure with light emitting element mounting substrate

Country Status (1)

Country Link
JP (1) JPH062764U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262309A (en) * 1984-06-07 1985-12-25 株式会社フジクラ Method of producing flat cable and producing apparatus
JPH01122078U (en) * 1988-02-13 1989-08-18
JPH01207438A (en) * 1988-02-13 1989-08-21 Masaru Yoshida Method for jacquard weaving with regulable warp yarn density and apparatus therefor
JP2014192330A (en) * 2013-03-27 2014-10-06 Tdk Corp Power supply device
JP2014195381A (en) * 2013-03-29 2014-10-09 Tdk Corp Power supply device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262309A (en) * 1984-06-07 1985-12-25 株式会社フジクラ Method of producing flat cable and producing apparatus
JPH0415965B2 (en) * 1984-06-07 1992-03-19 Fujikura Ltd
JPH01122078U (en) * 1988-02-13 1989-08-18
JPH01207438A (en) * 1988-02-13 1989-08-21 Masaru Yoshida Method for jacquard weaving with regulable warp yarn density and apparatus therefor
JP2014192330A (en) * 2013-03-27 2014-10-06 Tdk Corp Power supply device
JP2014195381A (en) * 2013-03-29 2014-10-09 Tdk Corp Power supply device

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