JPH06275662A - Bonding method for semiconductor pellet and its executing device - Google Patents
Bonding method for semiconductor pellet and its executing deviceInfo
- Publication number
- JPH06275662A JPH06275662A JP6531493A JP6531493A JPH06275662A JP H06275662 A JPH06275662 A JP H06275662A JP 6531493 A JP6531493 A JP 6531493A JP 6531493 A JP6531493 A JP 6531493A JP H06275662 A JPH06275662 A JP H06275662A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- pellets
- semiconductor
- advance
- flexible tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体ペレット付け方
法及びその実施装置に関し、特に、ペレットをボンディ
ングするに際し、予め連続的に並べたペレットをボンデ
ィング点まで搬送する時間を短くすることにより、短時
間にペレットボンディングすることが可能な技術に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pellet attaching method and an apparatus for implementing the same, and in particular, in bonding pellets, it is possible to shorten the time for transporting pellets arranged in advance continuously to a bonding point. The present invention relates to a technology capable of pellet bonding in time.
【０００２】[0002]
【従来の技術】従来、ペレット付け装置として、例え
ば、レジンダイオード用ペレット付け装置においては、
コレットによりウェーハ内のペレットを１個ずつ取上げ
ペレット付けを行うというピックアンドプレイス動作の
繰返しであり、ペレットを前もって連続して並べてお
き、次に供給するペレットとボンディング点間の距離を
短くしておくことはない。すなわち、次に供給するペレ
ットとボンディング点との間隔時間を短くするという点
について配慮がなされていない。2. Description of the Related Art Conventionally, as a pelletizing apparatus, for example, in a resin diode pelletizing apparatus,
This is a pick-and-place operation in which the pellets in the wafer are picked up one by one by the collet and pelletized, and the pellets are arranged in series in advance and the distance between the next pellet to be supplied and the bonding point is shortened. There is no such thing. That is, no consideration is given to shortening the interval time between the pellet to be supplied next and the bonding point.
【０００３】[0003]
【発明が解決しようとする課題】本発明者は、前記従来
技術を検討した結果、以下の問題点を見い出した。The present inventor has found the following problems as a result of examining the above-mentioned prior art.
【０００４】次に、供給するペレットとボンディング点
との間隔を短くするという点について配慮がなされてい
ないため、ペレットの搬送距離が長いためペレットをボ
ンディング点まで供給するのに量産するためには時間が
かかりすぎるという問題があった。Next, since no consideration is given to shortening the interval between the pellets to be supplied and the bonding points, it takes time to mass-produce the pellets to supply them to the bonding points because the pellet conveying distance is long. There was a problem that it took too much.
【０００５】また、ペレットピックアップ点とボンディ
ング点とを無理に近づけようとするとウェーハとフレー
ムフィーダ部とが干渉し合い、特に、Ａu-Ｓi共晶ボン
ディングを行う場合、フレームフィーダは加熱されてお
り、ウェーハが貼られているエキスバンドシートが変
形、破損するという問題があった。If the pellet pick-up point and the bonding point are forcibly brought close to each other, the wafer and the frame feeder portion interfere with each other, and particularly when Au-Si eutectic bonding is performed, the frame feeder is heated, There is a problem that the extract band sheet to which the wafer is attached may be deformed or damaged.
【０００６】本発明の目的は、ペレット供給時間を短縮
することが可能な技術を提供することにある。An object of the present invention is to provide a technique capable of shortening the pellet supply time.
【０００７】本発明の他の目的は、Ａu-Ｓi共晶ボンデ
ィングを行う場合、ウェーハが貼られているエキスバン
ドシートとＡu-Ｓi共晶ボンディングとを無関係にする
ことが可能な技術を提供することにある。Another object of the present invention is to provide a technique capable of making the extract band sheet on which the wafer is adhered and the Au-Si eutectic bonding independent when performing the Au-Si eutectic bonding. Especially.
【０００８】本発明の前記ならびにその他の目的及び新
規な特徴は、本明細書の記述及び添付図面によって明ら
かになるであろう。The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.
【０００９】[0009]
【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
下記のとおりである。Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.
【００１０】本発明の半導体ペレット付け方法は、半導
体ペレットは伸びないフレキシブルなテープ上に所定の
間隔で連続的に並べられ、この予め連続的に並べられた
半導体ペレットを順次ボンディング位置に供給し、この
供給された半導体ペレットをリードフレームの所定位置
上に圧着でペレット付けする。According to the method of attaching semiconductor pellets of the present invention, the semiconductor pellets are continuously arranged on the flexible tape which does not extend at a predetermined interval, and the semiconductor pellets arranged in advance are sequentially supplied to the bonding position. The supplied semiconductor pellets are attached to predetermined positions of the lead frame by pressure bonding.
【００１１】本発明の半導体ペレット付け装置は、伸び
ないフレキシブルなテープ上に半導体ペレットが所定の
間隔で連続的に並べられた半導体ペレットキャリアテー
プと、該テープを移動させて予め連続的に並べられた半
導体ペレットを順次ボンディング位置に搬送し、リード
フレームをボンディング位置に搬送するヒータ内蔵スプ
ロケットと、半導体ペレットをリードフレームの所定位
置上に圧着でペレット付けする圧着ローラ及びボンディ
ング荷重調整用バネからなるボンディング装置とを備え
ている。The semiconductor pellet attaching apparatus of the present invention is a semiconductor pellet carrier tape in which semiconductor pellets are continuously arranged at a predetermined interval on a flexible tape which does not extend, and the tape is moved to be continuously arranged in advance. Bonding consisting of a sprocket with a built-in heater that sequentially transfers semiconductor pellets to the bonding position and then the lead frame to the bonding position, a pressure bonding roller that pressure-bonds the semiconductor pellets onto a predetermined position of the lead frame, and a bonding load adjustment spring. And a device.
【００１２】[0012]
【作用】上述した手段によれば、半導体ペレットは伸び
ないフレキシブルなテープ上に所定の間隔で連続的に並
べられ、この予め連続的に並べられた半導体ペレットを
順次ボンディング位置に搬送し、この搬送された半導体
ペレットをリードフレームの所定位置上に圧着でペレッ
ト付けすることにより、半導体ペレットが予め伸びない
フレキシブルなテープ上に所定の間隔で連続的に並べら
れているので、ペレットをボンディング位置に搬送する
時間を短縮することができる。According to the above-mentioned means, the semiconductor pellets are continuously arranged on the flexible tape which does not extend at a predetermined interval, and the semiconductor pellets which are arranged continuously in advance are successively conveyed to the bonding position. The semiconductor pellets are attached to a predetermined position of the lead frame by pressure bonding, and the semiconductor pellets are continuously arranged on the flexible tape that does not stretch in advance at a predetermined interval. The time to do can be shortened.
【００１３】また、半導体ペレットが予め伸びないフレ
キシブルなテープ上に所定の間隔で連続的に並べられ、
半導体ペレットが順次ボンディング位置に搬送されるの
で、ウェーハが貼られているエキスバンドシートとＡu-
Ｓi共晶ボンディングとを無関係にすることができる。Further, the semiconductor pellets are continuously arranged at a predetermined interval on a flexible tape which does not stretch in advance,
Since the semiconductor pellets are sequentially transported to the bonding position, the extract band sheet to which the wafer is attached and Au-
It can be independent of the Si eutectic bonding.
【００１４】以下、本発明の構成について、実施例とと
もに詳細に説明する。The structure of the present invention will be described in detail below with reference to examples.
【００１５】なお、実施例を説明するための全図におい
て、同一機能を有するものは同一符号を付け、その繰り
返しの説明は省略する。In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.
【００１６】[0016]
【実施例】図１は、本発明の半導体ペレット付け装置の
一実施例の概略構成を示す模式構成図、図２は、本実施
例により組み立てられた半導体装置の外観図、図３は、
図２の半導体装置の内部構成を示す上部封止部材を除去
した平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic configuration diagram showing a schematic configuration of an embodiment of a semiconductor pellet attaching apparatus of the present invention, FIG. 2 is an external view of a semiconductor device assembled according to this embodiment, and FIG.
FIG. 3 is a plan view showing an internal configuration of the semiconductor device of FIG. 2 with an upper sealing member removed.
【００１７】本実施例に係る半導体装置は、図２及び図
３に示すように、第１のリード１のインナーリード１Ａ
の上に０.２５mm2〜１mm2の大きさのダイオードからな
る半導体ペレット３を搭載し、この半導体ペレット３と
第２のリード２のインナーリード２Ａとをワイヤ４で電
気的に接続し、モールド樹脂５で封止したものである。As shown in FIGS. 2 and 3, the semiconductor device according to the present embodiment has an inner lead 1A of the first lead 1.
0.25 mm 2 ~ 1 mm by mounting a semiconductor pellet 3 consisting of the size of the diode 2, and electrically connect the semiconductor pellet 3 and the second lead 2 of the inner leads 2A at the wire 4 on top of the mold It is sealed with resin 5.
【００１８】そして、本実施例の半導体ペレット付け装
置は、図１に示すように、伸びないフレキシブルなテー
プ１１上に半導体ペレット３が所定の間隔、例えば、最
低距離間隔で連続的に並べられ、このテープ（半導体ペ
レットキャリアテープ）１１を移動させて、前記の予め
連続的に並べられた半導体ペレット３を順次ボンディン
グ位置に供給し、リードフレーム１３をボンディング位
置に搬送するヒータ内蔵スプロケット１２と、半導体ペ
レット３をリードフレーム１３の第１のリード１のイン
ナーリード１Ａ（図３に示す）の上に圧着でペレット付
けする圧着ローラ１４及びボンディング荷重調整用バネ
１５からなるボンディング装置とを備えている。In the semiconductor pellet attaching apparatus of this embodiment, as shown in FIG. 1, the semiconductor pellets 3 are continuously arranged on the inflexible flexible tape 11 at a predetermined interval, for example, a minimum distance interval, This tape (semiconductor pellet carrier tape) 11 is moved to sequentially supply the semiconductor pellets 3 arranged in advance in advance to the bonding position, and to feed the lead frame 13 to the bonding position. A bonding device including a pressure roller 14 and a bonding load adjusting spring 15 for pressure-bonding the pellet 3 onto the inner lead 1A (shown in FIG. 3) of the first lead 1 of the lead frame 13 is provided.
【００１９】前記伸びないフレキシブルなテープ１１と
しては、例えば、塩化ビニール上に粘着剤を塗布したも
の、あるいはスチレンとブタジエンからなるフィルムを
用いる。As the non-stretchable flexible tape 11, for example, a vinyl chloride coated with an adhesive or a film made of styrene and butadiene is used.
【００２０】また、伸びないフレキシブルなテープ１１
上に半導体ペレット３を所定の間隔で連続的に並べられ
る手段は、１台の装置でウェーハをエキスバンドシート
に貼られているウェーハから半導体ペレット３を順次取
り出し、所定の間隔、例えば最低距離間隔でテープ１１
上に連続的に並べられて貼り付られるものである。A flexible tape 11 that does not stretch
The means for continuously arranging the semiconductor pellets 3 on the upper side at a predetermined interval is to sequentially take out the semiconductor pellets 3 from the wafer attached to the extract band sheet by one device, and set a predetermined interval, for example, the minimum distance interval. With tape 11
It is one that is continuously lined up and attached.
【００２１】次に、本実施例の半導体ペレット付け装置
の動作を説明する。Next, the operation of the semiconductor pellet attaching apparatus of this embodiment will be described.
【００２２】テープ１１上に予め連続的に並べられた半
導体ペレット３は、当該テープ１１をヒータ内蔵スプロ
ケット１２により移動して、順次ボンディング位置に搬
送される。一方、リードフレーム１３はヒータ内蔵スプ
ロケット１２により移動して、順次ボンディング位置に
搬送される。そして、ボンディング位置に搬送された半
導体ペレット３は、リードフレーム１３の第１のリード
１のインナーリード１Ａ（図３に示す）の上に圧着ロー
ラ１４により圧着されてペレット付けされる。半導体ペ
レット３のボンディングが終ったテープ１１は巻き取ら
れる。The semiconductor pellets 3 arranged in advance on the tape 11 are moved to the bonding position by moving the tape 11 by the sprocket 12 with a built-in heater. On the other hand, the lead frame 13 is moved by the sprocket 12 with a built-in heater and is sequentially conveyed to the bonding position. Then, the semiconductor pellet 3 conveyed to the bonding position is pressure-bonded by the pressure roller 14 onto the inner lead 1A (shown in FIG. 3) of the first lead 1 of the lead frame 13 and pelletized. The tape 11 on which the semiconductor pellets 3 have been bonded is wound up.
【００２３】以上の説明からわかるように、本実施例に
よれば、供給される半導体ペレット３が予め伸びないフ
レキシブルなテープ１１上に所定の間隔、例えば、最低
距離間隔で連続的に並べられているので、半導体ペレッ
ト３がボンディング位置まで搬送される供給時間を短縮
することができる。As can be seen from the above description, according to the present embodiment, the semiconductor pellets 3 to be supplied are continuously arranged on the flexible tape 11 which does not extend in advance at a predetermined interval, for example, a minimum distance interval. Therefore, the supply time of the semiconductor pellet 3 conveyed to the bonding position can be shortened.
【００２４】また、Ａu-Ｓi共晶ボンディングを行う場
合、半導体ペレット３が予め伸びないフレキシブルなテ
ープ１１上に所定の最低距離間隔で連続的に並べられ、
半導体ペレット３が順次ボンディング位置に搬送される
ので、ウェーハが貼られているエキスバンドシートとＡ
u-Ｓi共晶ボンディングとを無関係にすることができ
る。In the case of Au-Si eutectic bonding, the semiconductor pellets 3 are continuously arranged on the flexible tape 11 which does not stretch in advance at a predetermined minimum distance.
Since the semiconductor pellets 3 are successively transferred to the bonding position, the extract band sheet and the A
It can be independent of u-Si eutectic bonding.
【００２５】以上、本発明者によってなされた発明を、
前記実施例に基づき具体的に説明したが、本発明は、前
記実施例に限定されるものではなく、その要旨を逸脱し
ない範囲において種々変更可能であることは勿論であ
る。As described above, the inventions made by the present inventor are
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.
【００２６】[0026]
【発明の効果】本願において開示される発明のうち代表
的なものによって得られる効果を簡単に説明すれば、下
記のとおりである。The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
【００２７】供給される半導体ペレットが予め伸びない
フレキシブルなテープ上に所定の間隔で連続的に並べら
れているので、半導体ペレットがボンディング位置まで
搬送される供給時間を短縮することができる。Since the semiconductor pellets to be supplied are continuously arranged on the flexible tape which does not stretch in advance at a predetermined interval, it is possible to shorten the supply time for transferring the semiconductor pellets to the bonding position.
【００２８】また、Ａu-Ｓi共晶ボンディングを行う場
合、半導体ペレットが予め伸びないフレキシブルなテー
プ上に所定の最低距離間隔で連続的に並べられ、半導体
ペレットが順次ボンディング位置に搬送されるので、ウ
ェーハが貼られているエキスバンドシートとＡu-Ｓi共
晶ボンディングとを無関係にすることができる。In the case of performing Au-Si eutectic bonding, the semiconductor pellets are continuously arranged on the flexible tape which does not stretch in advance at a predetermined minimum distance, and the semiconductor pellets are successively conveyed to the bonding position. It is possible to make the Au-Si eutectic bonding unrelated to the extract band sheet to which the wafer is attached.
【図１】 本発明の半導体ペレット付け装置の一実施例
の概略構成を示す模式構成図、FIG. 1 is a schematic configuration diagram showing a schematic configuration of an embodiment of a semiconductor pellet attaching apparatus of the present invention,
【図２】 本実施例により組み立てられた半導体装置の
外観図、FIG. 2 is an external view of a semiconductor device assembled according to this embodiment,
【図３】 図２の半導体装置の内部構成を示す上部封止
部材を除去した平面図。FIG. 3 is a plan view showing an internal configuration of the semiconductor device of FIG. 2 from which an upper sealing member is removed.
１…第１のリード、１Ａ…第１のリードのインナーリー
ド、２…第２のリード、２Ａ…第２のリードのインナー
リード、３…半導体ペレット、４…ワイヤ、５…モール
ド樹脂、１１…テープ、１２…ヒータ内蔵スプロケッ
ト、１３…リードフレーム、１４…圧着ローラ、１５…
ボンディング荷重調整用バネ。DESCRIPTION OF SYMBOLS 1 ... 1st lead, 1A ... 1st lead inner lead, 2 ... 2nd lead, 2A ... 2nd lead inner lead, 3 ... Semiconductor pellet, 4 ... Wire, 5 ... Mold resin, 11 ... Tape, 12 ... Sprocket with built-in heater, 13 ... Lead frame, 14 ... Crimping roller, 15 ...
Bonding load adjustment spring.
Claims (2)
なテープ上に所定の間隔で連続的に並べられ、この予め
連続的に並べられた半導体ペレットを順次ボンディング
位置に供給し、この供給された半導体ペレットをリード
フレームの所定位置上に圧着でペレット付けすることを
特徴とする半導体ペレット付け方法。1. The semiconductor pellets are continuously arranged on a flexible tape which does not extend at a predetermined interval, and the semiconductor pellets arranged in advance are successively supplied to a bonding position. A method for pelletizing a semiconductor, comprising pelletizing the lead frame on a predetermined position by pressure bonding.
体ペレットが所定の間隔で連続的に並べられた半導体ペ
レットキャリアテープと、該テープを移動させて予め連
続的に並べられた半導体ペレットを順次ボンディング位
置に搬送し、リードフレームをボンディング位置に搬送
するヒータ内蔵スプロケットと、半導体ペレットをリー
ドフレームの所定位置上に圧着でペレット付けする圧着
ローラ及びボンディング荷重調整用バネからなるボンデ
ィング装置とを備えていることを特徴とする半導体ペレ
ット付け装置。2. A semiconductor pellet carrier tape in which semiconductor pellets are continuously arranged at a predetermined interval on a flexible tape which does not extend, and a semiconductor pellet carrier tape which is moved in advance and successively arranged in advance is sequentially bonded to a bonding position. A sprocket with a built-in heater for transporting the lead frame to the bonding position and a bonding device including a pressure bonding roller for bonding the semiconductor pellet onto the predetermined position of the lead frame by pressure bonding and a bonding load adjusting spring. A semiconductor pellet attaching device characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6531493A JPH06275662A (en) | 1993-03-24 | 1993-03-24 | Bonding method for semiconductor pellet and its executing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6531493A JPH06275662A (en) | 1993-03-24 | 1993-03-24 | Bonding method for semiconductor pellet and its executing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06275662A true JPH06275662A (en) | 1994-09-30 |
Family
ID=13283329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6531493A Pending JPH06275662A (en) | 1993-03-24 | 1993-03-24 | Bonding method for semiconductor pellet and its executing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06275662A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000014789A1 (en) * | 1998-09-03 | 2000-03-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Method for applying a circuit chip onto a support |
| US7370412B2 (en) | 2002-07-04 | 2008-05-13 | Kabushiki Kaisha Toshiba | Method for connecting electronic device |
-
1993
- 1993-03-24 JP JP6531493A patent/JPH06275662A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000014789A1 (en) * | 1998-09-03 | 2000-03-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Method for applying a circuit chip onto a support |
| US7370412B2 (en) | 2002-07-04 | 2008-05-13 | Kabushiki Kaisha Toshiba | Method for connecting electronic device |
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