JPH06275478A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPH06275478A JPH06275478A JP6437093A JP6437093A JPH06275478A JP H06275478 A JPH06275478 A JP H06275478A JP 6437093 A JP6437093 A JP 6437093A JP 6437093 A JP6437093 A JP 6437093A JP H06275478 A JPH06275478 A JP H06275478A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- capacitor element
- terminal
- welding
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、小形電子機器で使用
されるプリント基板等への表面実装用に適した固体電解
コンデンサの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a solid electrolytic capacitor suitable for surface mounting on a printed circuit board or the like used in small electronic equipment.
【0002】[0002]
【従来の技術】電子機器のより一層の小形化、携帯化に
より、抵抗器やセラミックコンデンサ等の電子部品は、
1.0mm×0.5mmの1005部品と呼ばれる大き
さにまで小形化されてプリント基板等への高密度実装を
可能にしている。電子部品の小形化が望まれる中で、比
較的大容量の特性を有する電解コンデンサも、従来の円
筒形リード端子付きのものから、より一層の小形化を図
ったものが要求されている。このため先に本出願人は、
図2に示すような表面実装に適したリードレスの角型固
体電解コンデンサを提案している(特開平4−1168
15号公報に開示されている)。2. Description of the Related Art Electronic components such as resistors and ceramic capacitors are becoming
The size is reduced to a size of 1005 parts of 1.0 mm x 0.5 mm, which enables high-density mounting on a printed circuit board or the like. While miniaturization of electronic parts is desired, an electrolytic capacitor having a relatively large capacity characteristic is required to be further miniaturized from the conventional one having a cylindrical lead terminal. Therefore, the applicant first
A leadless rectangular solid electrolytic capacitor suitable for surface mounting as shown in FIG. 2 has been proposed (JP-A-4-1168).
No. 15).
【0003】図3の(A)乃至(D)は、図2に示した
固体電解コンデンサの製造方法を説明する主要工程の概
略斜視図である。以下、簡単に従来の製造方法について
説明する。尚、図2および図3において同一構成部分に
ついては、同一の参照符号を付してある。FIGS. 3A to 3D are schematic perspective views of main steps for explaining the method of manufacturing the solid electrolytic capacitor shown in FIG. The conventional manufacturing method will be briefly described below. 2 and 3, the same components are designated by the same reference numerals.
【0004】図3の(A)において、参照符号10はコ
ンデンサ素子であり、陽極体および陰極体としての各金
属箔をセパレータを介して巻回したものである。この場
合各金属箔としてアルミ箔を用い、二酸化マンガン層を
電解質層とするコンデンサ素子を一例として説明する。
なお、この場合各アルミ箔に対しエッチングによる粗面
化処理を行ってもよく、またアルミ箔を巻回する際に
は、予めコンデンサ素子10の端子取出し口となる金属
端子(例えば、アルミ丸棒)12,14を各アルミ箔に
取付けておく。In FIG. 3A, reference numeral 10 is a capacitor element, which is formed by winding each metal foil as an anode body and a cathode body through a separator. In this case, a description will be given by taking an example of a capacitor element in which an aluminum foil is used as each metal foil and a manganese dioxide layer is used as an electrolyte layer.
In this case, each aluminum foil may be subjected to a surface roughening treatment by etching, and when the aluminum foil is wound, a metal terminal (for example, an aluminum round bar) to be a terminal outlet of the capacitor element 10 in advance is wound. ) Attach 12 and 14 to each aluminum foil.
【0005】図3の(B)は、上記コンデンサ素子10
を硝酸マンガンに含浸して焼成し二酸化マンガン層を形
成した後、角型樹脂ケース24内に挿入し、エポキシ樹
脂22により封口した状態である。FIG. 3B shows the capacitor element 10 described above.
Is impregnated with manganese nitrate and baked to form a manganese dioxide layer, which is then inserted into the rectangular resin case 24 and sealed with the epoxy resin 22.
【0006】図3の(C)は、角型樹脂ケース24の金
属端子12,14側の側面をエポキシ樹脂22及び金属
端子12,14と共に所定の長さに切断した状態であ
る。FIG. 3C shows a state in which the side surface of the rectangular resin case 24 on the side of the metal terminals 12 and 14 is cut into a predetermined length together with the epoxy resin 22 and the metal terminals 12 and 14.
【0007】図3の(D)は、この切断工程後、乾燥し
た後に、露出した金属端子12,14に対しそれぞれ外
部接続用端子の金属板片26,28を超音波溶接やレー
ザ溶接等の溶接30により取り付ける。最後に、図2に
示すように樹脂ケース24上に固体電解コンデンサの定
格や電極の極性等を印刷すれば、表面実装用の小形の固
体電解コンデンサの完成である。In FIG. 3D, after the cutting step and after drying, the metal plate pieces 26 and 28 of the external connection terminals are exposed to the exposed metal terminals 12 and 14 by ultrasonic welding or laser welding. Attach by welding 30. Finally, as shown in FIG. 2, by printing the rating of the solid electrolytic capacitor, the polarity of the electrodes and the like on the resin case 24, a small solid electrolytic capacitor for surface mounting is completed.
【0008】このような従来の固体電解コンデンサの製
造方法の主要工程を工程フロー図で示せば、図4の通り
である。すなわち、(A)コンデンサ素子形成工程、
(B)コンデンサ素子の樹脂ケースへの挿入後、エポキ
シ樹脂等の樹脂によるコンデンサ素子封口工程、(C)
金属端子と共に樹脂ケースを切断する樹脂切断工程、そ
して(D)外部接続用端子を取り付ける端子溶接工程の
順で製造される。FIG. 4 is a flow chart showing the main steps of the conventional method for manufacturing a solid electrolytic capacitor. That is, (A) capacitor element forming step,
(B) Capacitor element sealing step with resin such as epoxy resin after inserting the capacitor element into the resin case, (C)
It is manufactured in the order of a resin cutting step of cutting the resin case together with the metal terminal, and (D) a terminal welding step of attaching the external connection terminal.
【0009】[0009]
【発明が解決しようとする課題】しかしながら、前述し
た固体電解コンデンサの製造方法によれば、樹脂切断
後、乾燥してからコンデンサ素子の金属端子に外部接続
用端子を取り付ける端子溶接工程(D)において、端子
溶接強度のばらつきが大きく、端子溶接強度不良となる
低いものが出て製造歩留まりを低下させるという問題が
生じた。However, according to the method for manufacturing a solid electrolytic capacitor described above, in the terminal welding step (D) of attaching the external connection terminal to the metal terminal of the capacitor element after the resin is cut and dried. However, there is a problem in that the variation in the terminal welding strength is large and a low terminal welding strength is produced, which lowers the manufacturing yield.
【0010】そこで、本発明の目的は、樹脂切断工程後
のコンデンサ素子の露出した金属端子に外部接続用端子
を溶接する際、端子溶接強度のばらつきを抑え、端子溶
接強度を向上して製造歩留まりを上げることができる固
体電解コンデンサの製造方法を提供することにある。Therefore, an object of the present invention is to suppress variations in the terminal welding strength and improve the terminal welding strength when welding the external connection terminals to the exposed metal terminals of the capacitor element after the resin cutting step. It is to provide a method for manufacturing a solid electrolytic capacitor that can increase the temperature.
【0011】[0011]
【課題を解決するための手段】本発明に係る固体電解コ
ンデンサの製造方法は、プラス電極およびマイナス電極
用の各金属端子が取付けられたコンデンサ素子を形成す
るコンデンサ素子形成工程と、前記コンデンサ素子を樹
脂ケースに挿入し、前記金属端子が外部に突出する状態
で封口用樹脂により樹脂ケース内に封口するコンデンサ
素子封口工程と、前記樹脂ケースに封口されたコンデン
サ素子の、前記金属端子が外部に突出した側を樹脂ケー
スと共に所定の長さに切断する樹脂切断工程と、前記樹
脂切断工程で露出した切断面を化学研磨し洗浄後乾燥す
る化学研磨工程と、前記露出した切断面の各金属端子に
対して外部接続用端子をそれぞれ溶接する端子溶接工程
とからなることを特徴とする。A method for manufacturing a solid electrolytic capacitor according to the present invention comprises a capacitor element forming step of forming a capacitor element to which metal terminals for a positive electrode and a negative electrode are attached, and the capacitor element forming step. Capacitor element sealing step of inserting into a resin case and sealing the inside of the resin case with a sealing resin in a state where the metal terminal projects outside, and the metal terminal of the capacitor element sealed in the resin case projects outside The resin cutting step of cutting the cut side together with the resin case to a predetermined length, the chemical polishing step of chemically polishing the cut surface exposed in the resin cutting step, cleaning and drying after cleaning, and the metal terminals of the exposed cut surface. And a terminal welding step of welding the external connection terminals to each other.
【0012】また、前記製造方法において、化学研磨工
程は、水酸化ナトリウム水溶液を用いた化学研磨を行
い、研磨後水洗し、さらに硝酸水溶液に浸漬し、再度水
洗し、次いでエタノール洗浄し、その後乾燥すれば好適
である。Further, in the above-mentioned manufacturing method, in the chemical polishing step, chemical polishing using an aqueous solution of sodium hydroxide is carried out, after polishing, washed with water, further immersed in an aqueous solution of nitric acid, washed again with water, then washed with ethanol, and then dried. It is suitable if it does.
【0013】[0013]
【作用】本発明に係る固体電解コンデンサの製造方法に
よれば、コンデンサ素子形成工程およびコンデンサ素子
封口工程を経た後、化学研磨工程において樹脂切断工程
で露出した切断面を化学研磨し洗浄後乾燥する。この化
学研磨工程を追加したことにより、露出した金属端子の
切断部分は切断による傷で生じた表面の粗さが無くなる
と共に、切断面に付着した不純物や金属端子の酸化皮膜
が除去されてきれいな金属面となるため、次の端子溶接
工程での溶接部表面の欠陥が少なくなり溶接強度が向上
する。According to the method of manufacturing a solid electrolytic capacitor of the present invention, after the capacitor element forming step and the capacitor element sealing step, the cut surface exposed in the resin cutting step in the chemical polishing step is chemically polished, washed and dried. . With the addition of this chemical polishing step, the exposed metal terminal cut portion eliminates the roughness of the surface caused by scratches due to cutting, and removes the impurities adhering to the cut surface and the oxide film of the metal terminal to clean the metal terminal. Since the surface becomes a surface, defects on the surface of the welded portion in the next terminal welding step are reduced and the welding strength is improved.
【0014】[0014]
【実施例】次に本発明に係る固体電解コンデンサの製造
方法の実施例につき、添付図面を参照しながら以下詳細
に説明する。Embodiments of the method for manufacturing a solid electrolytic capacitor according to the present invention will be described below in detail with reference to the accompanying drawings.
【0015】図1は、本発明の一実施例を示す固体電解
コンデンサの製造方法における主要工程の工程フロー図
である。この図1における工程フロー図と、図4に示し
た従来の固体電解コンデンサの製造方法の主要工程の工
程フロー図との相違は、従来の樹脂切断工程(C)と端
子溶接工程(D)との間に、化学研磨工程(C*)が追
加されている点である。FIG. 1 is a process flow chart of main processes in a method of manufacturing a solid electrolytic capacitor showing an embodiment of the present invention. The difference between the process flow diagram in FIG. 1 and the process flow diagram of the main process of the conventional solid electrolytic capacitor manufacturing method shown in FIG. 4 is that a conventional resin cutting process (C) and a terminal welding process (D) are performed. The chemical polishing step (C * ) is added between the two.
【0016】以下、従来例と同様に、陽極体および陰極
体としての各金属箔がセパレータを介して巻回され、各
金属箔としてはアルミ箔を用い、二酸化マンガン層を電
解質層とするコンデンサ素子を一例として説明するが、
エッチングによる粗面化処理を施した陽極体に酸化皮膜
処理を行い、有機固体電解質層としてポリピロールを用
い、陽極体と陰極体とを重ねてコンデンサ素子を形成す
る場合(図示しない)はセパレータを不要にできる。従
来例の図3の製造方法で示した(A)乃至(D)の各工
程毎の外観斜視図は、本願発明に係る図1の製造方法の
工程フロー図に示す(A)乃至(C)および(D)と対
応するので、説明の便宜上、同一の参照符号を用いて詳
細な説明は省略する。Thereafter, similarly to the conventional example, each metal foil as an anode body and a cathode body is wound via a separator, an aluminum foil is used as each metal foil, and a manganese dioxide layer is used as an electrolyte layer in a capacitor element. Will be explained as an example,
Oxide film treatment is applied to the anode body that has been roughened by etching, and when polypyrrole is used as the organic solid electrolyte layer to form a capacitor element by stacking the anode body and the cathode body (not shown), a separator is not required. You can 3A to 3D of a conventional example are external perspective views of respective steps shown in FIGS. 3A to 3D, and FIGS. 1A to 1C are process flow diagrams of the manufacturing method of FIG. 1 according to the present invention. Since it corresponds to (D) and (D), the same reference numerals are used for convenience of description, and detailed description will be omitted.
【0017】前述したように従来、樹脂切断工程(C)
において、コンデンサ素子10を樹脂ケース24内にエ
ポキシ樹脂22等により封口した状態で、アルミ丸棒か
らなる金属端子12,14と共に樹脂ケース24を所定
長さに切断し、乾燥後、端子溶接工程(D)において外
部接続用端子の金属板片26,28を溶接していた。従
って、溶接30は、樹脂切断工程(C)において傷付け
られた粗面状態の、しかも不純物や、アルミの酸化皮膜
が付いた状態の金属端子12,14の表面に対して行わ
れていた。このため、溶接強度にばらつきが生じ易くな
っていた。As described above, the resin cutting step (C) is conventionally used.
In the above, in the state where the capacitor element 10 is sealed in the resin case 24 with the epoxy resin 22 or the like, the resin case 24 is cut to a predetermined length together with the metal terminals 12 and 14 made of aluminum round bars, and after drying, the terminal welding step ( In D), the metal plate pieces 26 and 28 of the external connection terminals were welded. Therefore, the welding 30 is performed on the surfaces of the metal terminals 12 and 14 which are damaged in the resin cutting step (C) and which are in a roughened state and have impurities or an oxide film of aluminum. Therefore, the welding strength tends to vary.
【0018】そこで、本願発明に係る製造工程では、化
学研磨工程(C*)を端子溶接工程(D)の前に追加挿
入して、樹脂切断工程(C)により露出した金属端子1
2,14の溶接部表面の平滑化と清浄化を図った。この
化学研磨工程(C*)の内容の一例を示せば、次の通り
である。Therefore, in the manufacturing process according to the present invention, the chemical polishing step (C * ) is additionally inserted before the terminal welding step (D) to expose the metal terminal 1 exposed by the resin cutting step (C).
The smoothing and cleaning of the surfaces of the welded parts 2 and 14 were attempted. An example of the content of this chemical polishing step (C * ) is as follows.
【0019】樹脂切断工程(C)の終了後、先ず水酸化
ナトリウム水溶液を研磨剤として用いて切断面に対し化
学研磨を行う。これにより、樹脂ケース24と金属端子
12,14の切断面は平滑になると共に、金属端子1
2,14の露出したアルミ表面に形成された酸化皮膜が
溶解除去される。After the completion of the resin cutting step (C), first, the sodium hydroxide aqueous solution is used as an abrasive to chemically polish the cut surface. As a result, the cut surfaces of the resin case 24 and the metal terminals 12 and 14 become smooth and the metal terminal 1
The oxide film formed on the exposed aluminum surfaces 2 and 14 is dissolved and removed.
【0020】次に、化学研磨時に使用した水酸化ナトリ
ウム水溶液を十分に流水洗浄し、この後、短時間の間硝
酸水溶液に浸漬して切断時に表面に付着した微細な金属
性屑等の不純物を溶解除去する。Next, the sodium hydroxide aqueous solution used at the time of chemical polishing is thoroughly washed with running water, and then immersed in a nitric acid aqueous solution for a short time to remove impurities such as fine metallic debris attached to the surface during cutting. Dissolve and remove.
【0021】再び流水洗浄により硝酸水溶液を十分に除
去し、エタノール洗浄により有機系の付着物等を溶かし
て除去した後、乾燥すれば化学研磨工程は終わりであ
る。The chemical polishing step is completed when the nitric acid aqueous solution is sufficiently removed by washing with running water again and the organic deposits are dissolved and removed by washing with ethanol, and then dried.
【0022】このような化学研磨工程(C*)を切断面
に対して施した後に、外部接続用端子の金属板片26,
28をそれぞれ露出した金属端子12,14に超音波溶
接またはレーザ溶接等の溶接30により接続する。After the chemical polishing process (C * ) is performed on the cut surface, the metal plate piece 26 of the external connection terminal,
28 is connected to the exposed metal terminals 12 and 14 by welding 30 such as ultrasonic welding or laser welding.
【0023】[0023]
【発明の効果】前述した実施例から明らかなように、本
発明によれば、化学研磨工程において樹脂切断工程で露
出した切断面を化学研磨し、洗浄後乾燥する。この化学
研磨工程を追加したことにより、露出した金属端子の切
断部分は切断工程による傷で生じた表面を平滑にすると
共に、切断面に付着した不純物や金属端子上の酸化皮膜
が除去されきれいな金属面となるため、次の端子溶接工
程での溶接部表面の欠陥が少なくなり溶接強度が向上す
る。この結果、端子溶接強度のばらつきが抑えられて、
端子溶接強度を向上し、製造歩留まりを上げることがで
きる。As is apparent from the above-described embodiments, according to the present invention, the cut surface exposed in the resin cutting step is chemically polished in the chemical polishing step, washed and dried. By adding this chemical polishing step, the exposed cut portion of the metal terminal smoothes the surface caused by the scratches caused by the cutting step, and the impurities adhering to the cut surface and the oxide film on the metal terminal are removed to clean the metal terminal. Since the surface becomes a surface, defects on the surface of the welded portion in the next terminal welding step are reduced and the welding strength is improved. As a result, variations in terminal welding strength are suppressed,
The terminal welding strength can be improved and the manufacturing yield can be increased.
【0024】以上、本発明の好適な実施例について説明
したが、本発明は前記実施例に限定されることなく、本
発明の精神を逸脱しない範囲内において種々の設計変更
をなし得ることは勿論である。Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various design changes can be made without departing from the spirit of the present invention. Is.
【図1】本発明に係る固体電解コンデンサの製造方法の
一実施例を示す主要工程の工程フロー図である。FIG. 1 is a process flow chart of main processes showing an embodiment of a method for manufacturing a solid electrolytic capacitor according to the present invention.
【図2】本発明に係る固体電解コンデンサの製造方法を
適用するリードレスの角型固体電解コンデンサの外観斜
視図である。FIG. 2 is an external perspective view of a leadless rectangular solid electrolytic capacitor to which the method for manufacturing a solid electrolytic capacitor according to the present invention is applied.
【図3】図2に示した固体電解コンデンサの従来の製造
方法を説明する主要工程の概略斜視図である。3 is a schematic perspective view of main steps for explaining a conventional method for manufacturing the solid electrolytic capacitor shown in FIG.
【図4】従来の固体電解コンデンサの製造方法の例を示
す主要工程の工程フロー図である。FIG. 4 is a process flow chart of main processes showing an example of a conventional method for manufacturing a solid electrolytic capacitor.
10 コンデンサ素子 12 金属端子 14 金属端子 22 エポキシ樹脂 24 角型樹脂ケース 26 金属板片 28 金属板片 30 溶接 10 Capacitor element 12 Metal terminal 14 Metal terminal 22 Epoxy resin 24 Rectangular resin case 26 Metal plate piece 28 Metal plate piece 30 Welding
Claims (2)
属端子が取付けられたコンデンサ素子を形成するコンデ
ンサ素子形成工程と、 前記コンデンサ素子を樹脂ケースに挿入し、前記金属端
子が外部に突出する状態で封口用樹脂により樹脂ケース
内に封口するコンデンサ素子封口工程と、 前記樹脂ケースに封口されたコンデンサ素子の、前記金
属端子が外部に突出した側を樹脂ケースと共に所定の長
さに切断する樹脂切断工程と、 前記樹脂切断工程で露出した切断面を化学研磨し洗浄後
乾燥する化学研磨工程と、 前記露出した切断面の各金属端子に対して外部接続用端
子をそれぞれ溶接する端子溶接工程とからなることを特
徴とする固体電解コンデンサの製造方法。1. A capacitor element forming step of forming a capacitor element to which respective metal terminals for a plus electrode and a minus electrode are attached, and a step of inserting the capacitor element into a resin case and projecting the metal terminals to the outside. Capacitor element sealing step of sealing the inside of the resin case with a sealing resin, and resin cutting step of cutting the side of the capacitor element sealed in the resin case to the outside with the resin case to a predetermined length And a chemical polishing step of chemically polishing the cut surface exposed in the resin cutting step, followed by cleaning and drying, and a terminal welding step of welding the external connection terminal to each metal terminal of the exposed cut surface. A method of manufacturing a solid electrolytic capacitor, comprising:
水溶液を用いた化学研磨を行い、研磨後水洗し、さらに
硝酸水溶液に浸漬し、再度水洗し、次いでエタノール洗
浄し、その後乾燥することからなる請求項1に記載の固
体電解コンデンサの製造方法。2. The chemical polishing step comprises performing chemical polishing using an aqueous solution of sodium hydroxide, rinsing with water after polishing, further immersing in an aqueous solution of nitric acid, rinsing again with water, then rinsing with ethanol, and then drying. The method for manufacturing the solid electrolytic capacitor according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06437093A JP3446233B2 (en) | 1993-03-23 | 1993-03-23 | Method for manufacturing solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06437093A JP3446233B2 (en) | 1993-03-23 | 1993-03-23 | Method for manufacturing solid electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
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JPH06275478A true JPH06275478A (en) | 1994-09-30 |
JP3446233B2 JP3446233B2 (en) | 2003-09-16 |
Family
ID=13256335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP06437093A Expired - Fee Related JP3446233B2 (en) | 1993-03-23 | 1993-03-23 | Method for manufacturing solid electrolytic capacitor |
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JP (1) | JP3446233B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19714544B4 (en) * | 1996-04-09 | 2004-04-01 | Rohm Co. Ltd. | Method of mounting a solid electrolytic capacitor on a printed circuit board and arrangement of the capacitor and the board |
-
1993
- 1993-03-23 JP JP06437093A patent/JP3446233B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19714544B4 (en) * | 1996-04-09 | 2004-04-01 | Rohm Co. Ltd. | Method of mounting a solid electrolytic capacitor on a printed circuit board and arrangement of the capacitor and the board |
Also Published As
Publication number | Publication date |
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JP3446233B2 (en) | 2003-09-16 |
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