JPH0627346A - Assembling method for optical device - Google Patents

Assembling method for optical device

Info

Publication number
JPH0627346A
JPH0627346A JP4207446A JP20744692A JPH0627346A JP H0627346 A JPH0627346 A JP H0627346A JP 4207446 A JP4207446 A JP 4207446A JP 20744692 A JP20744692 A JP 20744692A JP H0627346 A JPH0627346 A JP H0627346A
Authority
JP
Japan
Prior art keywords
optical
optical device
spot
abutting
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4207446A
Other languages
Japanese (ja)
Other versions
JP3088855B2 (en
Inventor
Jun Miyokawa
純 三代川
Hiroshi Orito
博 折戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP04207446A priority Critical patent/JP3088855B2/en
Publication of JPH0627346A publication Critical patent/JPH0627346A/en
Application granted granted Critical
Publication of JP3088855B2 publication Critical patent/JP3088855B2/en
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Links

Abstract

PURPOSE:To provide an assembling method for an optical device with high optical coupling capability by welding the abutting plane of an optical component after applying smoothing finishing to it. CONSTITUTION:The abutting plane of the optical component is spot-welded after it is ground to a smooth plane with surface roughness of <=6.3S (JISB0601) in the assembling method for the optical device in which prescribed planes of the optical components 4, 5, and 6 which comprise the optical device are abutted on each other and spot-welding is applied to the outer periphery of the abutting plane. Since the abutting planes of the optical components 4, 5, and 6 are formed to smooth, solidification contraction after the spot welding is generated uniformly extending over the whole abutting plane, and no deviation of optical axes among the optical components 4, 5, and 6 occurs.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光結合性に優れた光デ
バイスの組立方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling an optical device having an excellent optical coupling property.

【0002】[0002]

【従来の技術】光デバイスとは、光導波路や半導体受発
光素子に光ファイバを直接又はレンズを介して光結合さ
せたもので、この光デバイスの組立は、前記光導波路等
の光部品の所定面を25S〜 100S(JIS B 0601) の表面
粗度に仕上げて相互に当接し、当接面の外周をレーザー
によりスポット溶接してなされていた。
2. Description of the Related Art An optical device is a device in which an optical fiber is optically coupled to an optical waveguide or a semiconductor light emitting / receiving element directly or through a lens, and this optical device is assembled by a predetermined optical component such as the optical waveguide. The surfaces were finished to have a surface roughness of 25S to 100S (JIS B 0601) and brought into contact with each other, and the outer periphery of the contact surfaces was spot-welded with a laser.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前述の
ようなレーザー溶接法により組立てた光デバイスには、
光部品間の光軸にズレを生じるものが多く、光結合性に
優れた光デバイスを安定して製造することができないと
いう問題があった。
However, in the optical device assembled by the laser welding method as described above,
There is a problem that the optical axes of the optical components are often deviated from each other, and an optical device excellent in optical coupling cannot be stably manufactured.

【0004】[0004]

【課題を解決する為の手段】本発明は、このような状況
に鑑み鋭意研究を行ない、光デバイスの光部品間に軸ズ
レが生じる原因は、光部品の当接面が粗面の場合は、当
接面の外周をスポット溶接した際の凝固収縮量が場所に
より異なる為であることを知見し、更に研究を重ねて本
発明を完成するに至ったものである。即ち、本発明は、
光デバイスを構成する光部品の各々の所定面を当接し、
前記当接面の外周をスポット溶接する光デバイスの組立
方法において、光部品の当接面を、粗度が 6.3S(JIS
B 0601) 以下の平滑な面に仕上加工したのち、スポット
溶接することを特徴とするものである。
The present invention has conducted intensive studies in view of such a situation, and the cause of axial misalignment between optical components of an optical device is that the contact surface of the optical components is rough. It was found that the amount of solidification shrinkage when spot welding the outer periphery of the contact surface differs depending on the location, and further research has been conducted to complete the present invention. That is, the present invention is
Abutting each predetermined surface of the optical component that constitutes the optical device,
In the method for assembling an optical device in which the outer periphery of the contact surface is spot-welded, the contact surface of the optical component has a roughness of 6.3S (JIS
B 0601) This is characterized in that spot finishing is performed after finishing the following smooth surface.

【0005】本発明において、光部品の当接面を 6.3S
以下の粗度に仕上加工するには、例えば♯1200番の研磨
紙から研磨し始め、♯4000番以上の研磨紙で仕上研磨し
てなされる。他の仕上加工法としては、化学研磨法や電
解研磨法等、或いはダイヤモンドの砥粒径4μm以下の
切断用ブレードを用いて当接面を切断加工する方法等が
用いられる。当接面は仕上加工後必要に応じて脱脂洗浄
する。以下の実施例では研磨方式により仕上加工したも
のについて詳述する。本発明において、表面粗度の測定
は、触針式、光波干渉式等の任意の粗度計が用いられ
る。又当接させた光部品の当接面の外周をスポット溶接
する方法は、特に限定するものではないが、高出力のY
AGレーザーを用いるのが、短時間で精度よく溶接でき
て好ましい。
In the present invention, the contact surface of the optical component is 6.3S.
In order to finish the surface with the following roughness, for example, polishing is started from # 1200 abrasive paper and then finished with # 4000 or more abrasive paper. As another finishing method, a chemical polishing method, an electrolytic polishing method, or the like, or a method of cutting the contact surface with a cutting blade having a diamond abrasive grain size of 4 μm or less is used. After finishing, the contact surface is degreased and washed as necessary. In the following examples, those finished by the polishing method will be described in detail. In the present invention, for the measurement of the surface roughness, an arbitrary roughness meter such as a stylus type or a light wave interference type is used. The method of spot welding the outer circumference of the abutting surface of the abutted optical component is not particularly limited, but a high output Y
It is preferable to use an AG laser because welding can be performed accurately in a short time.

【0006】[0006]

【作用】本発明方法では、光デバイスを構成する光部品
の各々の所定面を当接し、前記当接面の外周をスポット
溶接する光デバイスの組立方法において、光部品の当接
面を、粗度が 6.3S(JIS B 0601) 以下の平滑な面に仕
上加工したのち、スポット溶接するので、溶接部の凝固
収縮が当接面全面にわたって均一になされ、光部品間の
光軸が精度よく合わされる。
According to the method of the present invention, in the method for assembling an optical device in which predetermined surfaces of optical components constituting the optical device are brought into contact with each other, and the outer periphery of the contact surface is spot-welded, the contact surfaces of the optical components are roughened. After finishing processing to a smooth surface with a degree of 6.3S (JIS B 0601) or less, spot welding is performed, so the solidification shrinkage of the welded part is made uniform over the entire abutting surface, and the optical axes between the optical parts are accurately aligned. It

【0007】[0007]

【実施例】以下に本発明を実施例により詳細に説明す
る。図1〜3に示した光デバイスを本発明方法により組
立てた。 実施例1 図1に示した光デバイスは、発光素子1からの光をレン
ズ2を介して光ファイバ3に結合させる為の発光素子モ
ジュールである。前記発光素子モジュールの組立ては、
各々の光部品、即ち発光素子ステム4,レンズホルダ
5,光ファイバフェルールガイド6の当接面を夫々研磨
紙により、粗度が 6.3S(JIS B 0601) 以下になるよう
に平滑に研磨したのち、各々の光部品を当接配置し、次
いで各々の当接面の外周をYAGレーザーによりスポッ
ト溶接して行った。
EXAMPLES The present invention will be described in detail below with reference to examples. The optical device shown in FIGS. 1 to 3 was assembled by the method of the present invention. Example 1 The optical device shown in FIG. 1 is a light emitting element module for coupling the light from the light emitting element 1 to the optical fiber 3 via the lens 2. Assembling the light emitting device module,
After abutting surfaces of the respective optical parts, that is, the light emitting element stem 4, the lens holder 5, and the optical fiber ferrule guide 6 are polished with polishing paper to a roughness of 6.3 S (JIS B 0601) or less, the surfaces are smoothed. The respective optical parts were arranged in contact with each other, and then the outer periphery of each contact surface was spot-welded with a YAG laser.

【0008】実施例2 図2に示した光デバイスは、先球加工した光ファイバ3
の前記先球部分7からの光を受光素子8にて受光するよ
うにした受光素子モジュールである。前記受光素子モジ
ュールの組立ては、受光素子キャリア9をベース10上に
ろう付けし、次いで光ファイバフェルールガイド6とベ
ース10の当接面を研磨紙により粗度が 6.3S(JIS B 06
01) 以下になるように平滑に研磨したのち、光ファイバ
フェルールガイド6をベース10上の所定位置に当接配置
し、次いで、各々の当接面の外周をYAGレーザーによ
りスポット溶接して行った。
Example 2 The optical device shown in FIG.
The light receiving element module is configured such that the light from the front spherical portion 7 is received by the light receiving element 8. In assembling the light-receiving element module, the light-receiving element carrier 9 is brazed onto the base 10, and then the abutting surfaces of the optical fiber ferrule guide 6 and the base 10 are polished to a roughness of 6.3S (JIS B 06).
01) After polishing the surface as follows, the optical fiber ferrule guide 6 was placed in contact with a predetermined position on the base 10, and then the outer circumference of each contact surface was spot welded with a YAG laser. .

【0009】実施例3 図3に示した光デバイスは、光ファイバ3間に光導波路
11を配置し、光ファイバ3間で光の分波や合波を行う、
光導波路型の光カプラである。この光カプラの組立て
は、光ファイバフェルールガイド6と光導波路ベース12
の当接面を研磨紙により粗度が 6.3S(JIS B 0601) 以
下になるように平滑に研磨したのち、各々の光部品を所
定位置に当接配置し、当接面の外周をYAGレーザーに
よりスポット溶接して行った。
Example 3 The optical device shown in FIG. 3 has an optical waveguide between the optical fibers 3.
11 are arranged to split or combine light between the optical fibers 3.
It is an optical waveguide type optical coupler. This optical coupler is assembled by the optical fiber ferrule guide 6 and the optical waveguide base 12
After polishing the contact surface of the product with polishing paper to a roughness of 6.3S (JIS B 0601) or less, place each optical component in the specified position and place the contact surface on the outer periphery of the YAG laser. Spot welding was performed.

【0010】上記実施例のうちから発光素子モジュール
(実施例1)を選び、光の結合効率比を測定した。前記
結合効率比は、光軸を合わせて当接配置した状態で光フ
ァイバに伝送される光量Aを測定しておき、スポット溶
接後の伝送光量Bを、前記伝送光量Aで除して求めた。
比較の為光部品の当接面の粗度を25S(JIS B 0601)に
仕上げて組み立てた発光素子モジュールについても、同
様の方法により結合効率比を求めた。結果を図4に示し
た。図4より明らかなように、本発明方法品は、結合効
率比1のもの、つまりスポット溶接後も光軸に狂いを生
じなかったものが全体の87%を占めた。これに対し、比
較例品はスポット溶接後半数以上が光軸に狂いを生じ
た。以上発光素子モジュールの光結合性について説明し
たが、実施例2及び3の光デバイスにおいても良好な光
結合性が得られることを確認した。
A light emitting device module (Example 1) was selected from the above examples, and the light coupling efficiency ratio was measured. The coupling efficiency ratio was obtained by measuring the light amount A transmitted to the optical fiber in a state where the optical axes were aligned and abuttingly arranged, and dividing the transmitted light amount B after spot welding by the transmitted light amount A. .
For comparison, the coupling efficiency ratio was determined by the same method for the light emitting element module assembled by finishing the contact surface roughness of the optical component to 25S (JIS B 0601). The results are shown in Fig. 4. As is clear from FIG. 4, in the product of the present invention, those having a coupling efficiency ratio of 1, that is, those having no deviation in the optical axis even after spot welding accounted for 87% of the whole. On the other hand, in the comparative example product, the optical axis was distorted in the latter half or more of the spot welding. Although the optical coupling property of the light emitting element module has been described above, it has been confirmed that good optical coupling property can be obtained also in the optical devices of Examples 2 and 3.

【0011】[0011]

【効果】以上述べたように、本発明によれば、光部品同
士を、光軸を狂わすことなく、スポット溶接することが
でき、従って得られる光デバイスの光結合性が良好で、
工業上顕著な効果を奏する。
As described above, according to the present invention, optical components can be spot-welded without deviating the optical axis, and the optical coupling property of the obtained optical device is good.
It has a remarkable industrial effect.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明方法にて組立てた発光素子モジュールの
態様例を示す縦断面図である。
FIG. 1 is a vertical cross-sectional view showing an example of a mode of a light emitting device module assembled by the method of the present invention.

【図2】本発明方法にて組立てた受光素子モジュールの
態様例を示す縦断面図である。
FIG. 2 is a vertical cross-sectional view showing a mode example of a light receiving element module assembled by the method of the present invention.

【図3】本発明方法にて組立てた光カプラの態様例を示
す縦断面図である。
FIG. 3 is a vertical sectional view showing an example of an embodiment of an optical coupler assembled by the method of the present invention.

【図4】本発明方法にて組立てた発光素子モジュールの
光の結合効率比を示す度数分布図である。
FIG. 4 is a frequency distribution diagram showing a light coupling efficiency ratio of a light emitting device module assembled by the method of the present invention.

【符号の説明】[Explanation of symbols]

1 発光素子 2 レンズ 3 光ファイバ 4 発光素子ステム 5 レンズホルダ 6 光ファイバフェルールガイド 7 先球部分 8 受光素子 9 受光素子キャリア 10 ベース 11 光導波路 12 光導波路ベース 1 Light-Emitting Element 2 Lens 3 Optical Fiber 4 Light-Emitting Element Stem 5 Lens Holder 6 Optical Fiber Ferrule Guide 7 Tip Sphere 8 Light-Receiving Element 9 Light-Receiving Element Carrier 10 Base 11 Optical Waveguide 12 Optical Waveguide Base

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 光デバイスを構成する光部品の各々の所
定面を当接し、前記当接面の外周をスポット溶接する光
デバイスの組立方法において、光部品の当接面を、粗度
が 6.3S(JIS B 0601) 以下の平滑な面に仕上加工した
のち、スポット溶接することを特徴とする光デバイスの
組立方法。
1. A method for assembling an optical device in which predetermined surfaces of optical components constituting an optical device are brought into contact with each other, and the outer periphery of the contact surface is spot-welded, and the contact surface of the optical components has a roughness of 6.3. S (JIS B 0601) A method for assembling an optical device, which comprises spot-welding after finishing to a smooth surface of the following.
JP04207446A 1992-07-10 1992-07-10 Optical device assembly method Expired - Lifetime JP3088855B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04207446A JP3088855B2 (en) 1992-07-10 1992-07-10 Optical device assembly method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04207446A JP3088855B2 (en) 1992-07-10 1992-07-10 Optical device assembly method

Publications (2)

Publication Number Publication Date
JPH0627346A true JPH0627346A (en) 1994-02-04
JP3088855B2 JP3088855B2 (en) 2000-09-18

Family

ID=16539910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04207446A Expired - Lifetime JP3088855B2 (en) 1992-07-10 1992-07-10 Optical device assembly method

Country Status (1)

Country Link
JP (1) JP3088855B2 (en)

Also Published As

Publication number Publication date
JP3088855B2 (en) 2000-09-18

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