JPH0627318Y2 - Processing device having a work heating device - Google Patents

Description

[Detailed Description of the Invention] <Industrial field of application> The present invention relates to a processing apparatus having a workpiece heating device for processing a workpiece made of a brittle material and at the same time eliminating cracks generated by the processing. Is.

<Prior Art> For example, when a workpiece made of ceramics is ground by a grinder, a crack is generated on the machined surface of the workpiece. In order to eliminate this crack, precision cutting has been conventionally performed by reducing the cutting amount of the grindstone.

<Problems to be Solved by the Invention> However, there is a problem that fine cracks are generated even by this precision processing and the cracks cannot be completely removed. There is a problem that the strength of the work is inevitably reduced due to the cracks.

<Means for Solving Problems> The present invention has been made in order to solve the above-mentioned problems, and irradiates a laser beam to a processed portion of a workpiece on a bed in front of feeding the workpiece to a tool. A laser light irradiation port is installed, and a laser oscillator having a heat capacity capable of eliminating a crack of a workpiece is connected to the laser light irradiation port.

<Operation> When the tool and the workpiece are relatively moved by the feeding device, the workpiece is machined by the tool, and the laser beam irradiation port irradiates the machined portion with the laser beam. As a result,
The cracks generated by processing can be eliminated, and the mechanical strength of the workpiece is improved. Further, since the machining of the workpiece and the elimination of cracks are performed on the same machine, productivity is improved.

<Embodiment> An embodiment of the present invention will be described below with reference to FIG. 10
Is a bed, and the bed 10 has a first position in the left-right direction.
The guide surface 11 is formed with a second guide surface 12 in the front-rear direction. A table 13 is slidably guided on the first guide surface 11, and a grindstone base 14 is slidably guided on the second guide surface 12. A headstock 20 and a tailstock 30 are installed on the table 13 so as to face each other. A spindle 21 is rotatably supported by the spindle stock 20.
Is driven to rotate by a motor 22, and a chuck 23 is attached to the tip of the main shaft 21. A center 31 is attached to the tailstock 30. A round bar-shaped workpiece W made of fine ceramics is supported by the chuck 23 and the center 31. The workpiece W may be glass as long as it is a brittle material.

A grindstone shaft 32 is rotatably supported on the grindstone base 14,
A diamond grindstone (cutting tool) 33 is detachably attached to the tip of the grindstone shaft 32, and the grindstone shaft 32 is rotationally driven by a motor 34.

The table 13 and the grindstone base 14 are respectively provided with the servo motor 3
5, 36 and a ball screw mechanism (not shown) feed and move them.

Reference numeral 40 denotes a YAG laser oscillator installed outside the bed 10. Laser light emitted from the YAG laser oscillator 40 is guided to a laser light irradiation port 42 via an optical fiber 41. The laser beam irradiation port 42 is located in front of the machining feed in the workpiece axis direction with respect to the grindstone 33, that is, the table 13
If the machining feed direction is leftward, the headstock 2 against the grindstone 33
It is attached to the bed 10 via a bracket 43 on the 0 side. Further, the laser light irradiation port 42 is directed to the outer periphery of the workpiece W, and the laser light irradiation port 42 has a condenser lens for converging the laser light. Laser oscillator 40
May be any as long as it has a heat capacity capable of eliminating cracks on the outer periphery of the workpiece W.

Next, the operation will be described based on the configuration described above. The workpiece W is supported by the chuck 23 and the center 31 with the grindstone base 14 retracted and the table 13 moved to the right. In this state, the workpiece W and the grindstone 33 are rotationally driven. Next, the grindstone base 14 is advanced to make a cut in the workpiece W,
Then, the table 13 is moved to the left in the axial direction of the workpiece W to grind the outer periphery of the workpiece W. Simultaneously with the leftward movement of the table 13, a laser beam is sent from the laser oscillator 40 to the laser beam irradiation port 42 via the optical fiber 41, and the laser beam is irradiated toward the outer periphery of the workpiece W to heat the ground portion. Eliminates cracks generated during grinding. When the workpiece W is ground up to the right end and heated, the grindstone base 14
Moves backward, the table 13 moves to the right, and the grindstone 33 and the workpiece W
Stops rotating.

Although the laser light irradiation port 42 is mounted on the bed 13 in the above-described embodiment, if a known grindstone cover is mounted on the grindstone base 14, the laser light irradiation port is formed on the side surface of the grindstone cover on the spindle side. May be attached. Further, the heating device using the laser of the present invention may be applied not only to a grinder but also to a lathe. A lathe of the type that moves the cutting tool in the axial direction of the workpiece has a laser beam irradiation port attached to the tool rest with the cutting tool attached.

<Effects of the Invention> As described above, the present invention provides a laser light irradiation port for irradiating a laser beam to a processed part of a workpiece on the bed in front of the feeding of the workpiece to the tool. Since the laser oscillator having a heat capacity capable of eliminating the crack of the workpiece is connected to the workpiece, the crack of the workpiece generated during processing can be eliminated, and the strength of the workpiece can be increased. Moreover, since the workpiece can be processed and cracks can be removed on the same machine, the advantage of improving productivity can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view of a processing apparatus having a work heating device according to the present invention. 13 ... table, 14 ... grinding head, 20 ... headstock,
30 ... tailstock, 33 ... grindstone (tool), 40 ... YA
G laser oscillator, 41 ... Optical fiber, 42 ... Laser light irradiation port, W ... Workpiece.

Claims (1)

[Scope of utility model registration request] 1. A workpiece and a tool made of a brittle material are installed on a bed so as to be movable relative to each other, and a workpiece is machined by the tool by moving the workpiece and the tool relative to each other by a feeding device. In the processing device described above, a laser light irradiation port for irradiating a laser beam to the processed portion of the workpiece is installed on the bed in front of the feeding of the workpiece to the tool, and the crack of the workpiece can be eliminated at this laser light irradiation port A processing device having a workpiece heating device, to which a laser oscillator having a heat capacity is connected.