JPH0627258Y2 - Soldering iron for electronic parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to an electronic component soldered in two directions, for example,
The present invention relates to a soldering iron used when removing various chip parts such as ICs and chip carriers.

(Prior art and its problems) When removing a chip that is soldered in two directions, grasp the chip body with tweezers etc. with one hand, and first with one hand, to the soldering part of one of the chip bodies. Apply a soldering iron, wait for the solder to melt, pull out the pin row from the board, and insert an interposition such as a metal piece between the chip component and the board to keep the pin row separated. Then, the tedious work of applying a trowel to the next row of pins, melting the solder, and removing it was performed.

Conventionally, various tools have been proposed in order to facilitate such troublesome work.

For example, the device disclosed in Japanese Utility Model Laid-Open No. 60-113877 is a tool for picking up a chip after the target chip is sandwiched by one hand to melt the solder.

However, with this tool, only one tool can be used for one target object, and the same number of tools must be used for each different shape of the target object. You have to select a tool that can handle it and replace it.

The device of Japanese Utility Model Laid-Open No. 52-106586 is also a tool for picking up a chip after the target chip is sandwiched with one hand to melt the solder and then pick up the chip. Since it is configured to be detachably attached to the main body, a single tool main body is required, but as for the parts that sandwich the tip, the same number of parts must be prepared for each different tip shape. During the tip removing work, it is necessary to select a component that can cope with each different tip, remove the component mounted on the tool body, and then mount the corresponding component again. Attaching / detaching work of the parts that sandwich the tip with respect to the tool body is quite troublesome.

Further, in the invention of Japanese Utility Model Application Laid-Open No. 57-194779, a pair of claws for contacting the solder on both sides of the chip are projected on a single iron tip, and the claws are formed in a square shape.

This tool does not have the function of sandwiching the chip, and when the chip is removed from the substrate, the melted solder fills the gap between the side surface of the chip and the side surface of the nail, and due to the surface tension and viscosity of the nail, The chip is pulled apart as it is lifted.

Therefore, in this tool, the gap between the side surface of the chip and the side surface of the claw must be a delicate space where the surface tension and viscous force of the solder can act, and again the tool with the claw interval according to the shape of the target chip. Must be prepared according to the shape of the tip, and a tool must be selected each time according to the target object.

In particular, the lifting of the chip due to the surface tension or viscosity of the melted solder is not reliable as a force for removing the chip, and there are not a few problems that the chip is removed and the wiring on the substrate or the chip is damaged.

On the other hand, in order to remove the tip lifted by surface tension or viscosity from the nail, there is no choice but to shake it off, but if you need to shake off the wrist one by one, it will cause a significant decrease in work efficiency,
Not practical.

The present invention is intended to solve such a problem.

(Means for Solving Problems) The soldering iron for electronic parts of the present invention forms a pair of trowels having a gripping portion, a heater portion, and a heating portion heated by the heater portion, and the pair of trowels is held by both gripping portions with one hand. The heating parts of the iron tip are connected so as to move closer to or away from each other by gripping or loosening with, and each heating part is provided with a plate-shaped heating piece that can be brought into contact with the target object. Is arranged so that its flat surface faces the flat surface of the other heating piece, and at the tip of each heating piece, two contact sides extending in the direction forming the two sides of the triangle are formed, and One of the abutting sides has a long length and the other has a short length, and it is possible to use any of the long and short abutting sides as a trowel by simply reversing the trowel according to the shape of the object. .

(Operation) Hold both holding parts of the trowel with one hand, and let the left and right heating pieces meet so that the detachable parts are sandwiched from both side surfaces, and the contact side of the heating piece with the soldering part of the pin row in two directions. After applying heat to melt the solder, sandwich the chip component as it is with the left and right heating pieces and remove it from the board.

By simply reversing while holding the trowel, either the long or short contact side can be used according to the length of the pin row of the chip.

(Embodiment) Hereinafter, the present invention will be described with reference to the drawings illustrating an embodiment.

In FIGS. 1 and 2, reference numerals 10a and 10b in the drawings denote heating portions of the soldering iron, and reference numerals 20a and 20b denote heater portions that support the heating portions and heat the heating portions, and reference numeral 30.
Reference numerals a and 30b are gripping portions that further support the heater portion.

The soldering iron for electronic parts of the present embodiment is composed of one soldering iron A composed of a heating part 10a, a heater part 20a and a gripping part 30a, and similarly, a heating part 10b, a heater part 20b and a gripping part 30b. The two soldering irons A and B together with the other soldering iron B are formed into a pair of soldering irons.

The soldering iron A and the soldering iron B are the grip portion 30a and the grip portion 3 respectively.
The rear end side of 0b is rotatably pivoted by a shaft 31,
The heating portion 10a on the iron tip side and the heating portion 1 are provided by the spring 32 interposed between the grip portion 30a and the grip portion 30b.
0b is always urged to face each other with a constant distance.

Therefore, both heating units 10a and 10b are connected to the gripping units 30a and 30b.
You can approach or leave by simply tightening or loosening b. That is, if you squeeze it with one hand, both heating parts 10a,
10b met and both heating sections 10a that they met when loosened,
10b are separated from each other by a spring 32.

Reference numerals 33a and 33b in the figure are guide pieces that are formed by projecting from opposite inner side surfaces of the grip portions 30a and 30b in the opposite direction. The guide pieces 33a, 33b are soldering irons A,
When B opens and closes around the shaft 31, the heating unit 10 at the tip
It is guided so that the encounters of a and 10b are the same.

That is, the guide pieces 33a and 33b regulate the loci when the soldering irons A and B are opened and closed.

The guide pieces 33a and 33b of the embodiment are formed in parallel with two strips, respectively. For example, the two guide strips 33a (33) are arranged so that the guide strips 33a and 33b are engaged with each other.
Between b), one piece of the other guide piece 33b (33a) is engaged so as to fit (not shown).

The heater portion 20a has a double-cylinder structure in which the heater 22 of the inner cylinder is inserted into the heat pipe 21 of the outer cylinder, and the open end of the heater 22 of the inner cylinder on the heating unit 10a side is the heat pipe 21 of the outer cylinder. It is located slightly inside the open end.

The base of the heating unit 10a is detachably mounted inside the cylinder of the heater unit 20a.

The structure of the heater portion 20b in the soldering iron B is the same as the structure of the heater portion 20b in the soldering iron A (not shown).

Further, reference numerals 40 and 40 in the drawing are heat insulating spacers interposed between the heater portions 20a and 20b and the grip portions 30a and 30b.

In FIGS. 3 to 6, the heating portions 10a and 10b are provided with flat plate-shaped heating pieces 11a and 11b, respectively, which are brought into contact with the target chip component.

The one heating piece 11a (11b) is arranged and fixed in such a manner that its plane faces the plane of the other heating piece 11b (11a) in the encountering direction. The object is the above plane of both heating pieces 11a, 11b,
It is pinched from both sides.

The heating pieces 11a and 11b are fixed to the heating portions 10a and 10b when the gripping portions 30a and 30b are gripped and the soldering irons A and B are closed, and the heating pieces 11a and 11b are opposed to each other at a certain distance. It is designed to be substantially parallel.

The certain distance referred to here is the heating pieces 11a and 11b.
The width of the object to be sandwiched, that is, the width of the soldered chip component.

It should be noted that the heating pieces 11a and 11b do not need to be correctly parallel when sandwiching the target object, and heating pieces 11a and 11b to be described later are not required to be parallel.
It suffices that the contact side 13a or the contact side 13b can contact the soldering portion of the object so as to be melted.

4 to 6, each heating piece 11a, 11b is
Abutment side 1 whose tip extends so as to form two sides of a triangle
3a and 13b are formed, and further these two sides (13a and 1
The lengths of 3b) are not equal, one long and the other short.

Both the long and short contact sides 13a, 13b are applied to the soldering portion of the pin row of the chip component. By forming the two contact sides 13a, 13b having different side lengths, the soldering portion, Alternatively, it can be used for two types of electronic components having different pin row lengths.

In this case, both grips 30a and 30b held by one hand
By reversing the trowel so as to change the grip, it is possible to easily use the contact sides 13a and 13b on either the long side or the short side.

In the embodiment, the inner angle formed by the two contact sides 13a, 13b is about 70 to 90 degrees, and the line that bisects the inner angle is parallel to the respective longitudinal axes of the soldering irons A, B. It is set (not shown).

This is so that when the contact sides 13a and 13b are applied to the object, the angle between the substrate and the trowel is 35 to 45 degrees, which is the angle at which the hand holding the grips 30a and 30b is least fatigued. This is because.

FIG. 5 shows the usage state of the short side contact side 13a, and FIG. 6 shows the usage state of the long side contact side 13b.

A pin (lead wire) 42 extending in two directions along the short contact side 13a of the left and right heating pieces 11a and 11b so as to sandwich the chip parts by grasping both grip portions 30a and 30b of the iron with one hand.
When heat is applied to the row of., Waiting for the melting of the solder, and the object is separated from the substrate by sandwiching the object as it is, it is possible to easily remove the object while securely sandwiching the object (5th step).
Figure).

Further, for the pin row 42, that is, for a component having a long soldering portion, the long contact side 13b on the other side can be used in the same manner as described above by simply reversing the trowel. (FIG. 6), it can be used for at least two types of chip parts having different soldering part lengths with a single iron.

Further, the trowel of the present invention can be used not only for removing electronic components but also for mounting.

That is, the object can be carried by being sandwiched between the heating pieces 11a and 11b, and can be directly placed on a predetermined position on the substrate and soldered.

(Effect of the Invention) According to the present invention, the left and right heating pieces are brought into contact with each other so that both grip portions of the iron are grasped by one hand and the chip parts are sandwiched from both side surfaces.
Apply the heat to the soldering portion of the pin row in the direction to apply heat to melt the solder, and then pull the chip part from the board with the left and right heating pieces securely sandwiched. It can be removed.

In addition, since it can be removed from the board while it is firmly sandwiched, there is no risk of dropping it on the board during the removal and damaging electronic components, wiring, etc. on the board. Can be done

In addition, there are some areas where the solubility of soldering is insufficient.
Alternatively, even if a pin or lead wire of the electronic component is caught in the hole of the substrate, it can be easily removed.

Also, by simply flipping the iron while holding it, either the short or long contact side can be used according to the length of the pin row of the chip, and by changing the degree of grip within the palm, both heating pieces can be used. Since the interval of can be freely adjusted, it can be widely used for electronic components having different lengths of soldering portions such as pin rows and chip widths, that is, electronic components having different spacing between two pin rows. .

Therefore, the conventional tool requires the same number of tools for each different shape of the electronic component such as a chip, and needs to replace the tool for each different shape. In that case, the number of tools that should be prepared in the past can be reduced to at least half or less, and the frequency of changing tools during work can be reduced, which can greatly improve work efficiency and make it practical. The effect is extremely large.

Furthermore, the tool of the present invention is not limited to the above-described removal, but is also a single tool for mounting several kinds of electronic parts having different widths between pin rows of chip parts, lengths of pin rows, etc. It also has the great advantage that it can be widely used in the conventional tools, which could not be achieved by conventional tools.

[Brief description of drawings]

1 is a plan view, FIG. 2 is a side view, FIG. 3 is a partially enlarged plan view, FIG. 4 is a partially enlarged side view, and FIG. FIG. 6 and FIG. 6 are partially enlarged perspective views showing usage states. 10a, 10b ... Heating part 11a, 11b ... Heating piece 13a, 13b ... Abutting side 20a, 20b ... Heater part 30a, 30b ... Gripping part 31 ... Shaft, 32 ... Spring 41 ... Chip (electronic component) 42 ... Pin (lead) line)

Continuation of the front page (56) References Open 60-113877 (JP, U) Open 52-106586 (JP, U) Open 57-194779 (JP, U) Open 53-13775 (JP) , Y1) Sukeko 56-53976 (JP, Y1)

Claims (1)

[Scope of utility model registration request] 1. A trowel tip formed by forming a pair of trowels having a grip portion, a heater portion, and a heating portion heated by the heater portion, and gripping or loosening the pair of trowels with both hands with one hand. Both heating parts are connected so that they approach each other or move away from each other, and each heating part is provided with a plate-shaped heating piece that is brought into contact with an object, and the plane of each heating piece is the same as the plane of the other heating piece. Two abutting sides, which are arranged relative to each other in the meeting direction and extend in a direction forming two sides of a triangle, are formed at the tip of each heating piece, and one of the two abutting sides has a longer length and the other has a longer length. Is a soldering iron for electronic parts, characterized in that it can be used as a soldering iron with either long or short contact sides only by reversing the soldering iron according to the shape of the object.